A laser cutting device for aluminum substrates for backlighting

Abstract

This invention discloses a laser cutting device for aluminum substrates used in backlight sources, belonging to the technical field of laser cutting devices. The device includes an operating table, a movable frame on top of the operating table, a laser cutting device installed inside the movable frame, a first support plate movably connected to the upper surface of the operating table below the laser cutting device, a first slot on the inner side of the first support plate, a movable plate movably connected inside the first slot, a second slot on one side of the movable plate, a pressure plate movably connected to the inner wall of the second slot, a screw threaded inside the movable plate, the bottom end of the screw rotatably connected to the pressure plate, and a gear on the outer surface of the screw above the movable plate. This laser cutting device for aluminum substrates used in backlight sources avoids corrosion of the supporting components during laser cutting. The operator moves the movable plate with a handle, and the connection of the gear and gear plate allows the pressure plate to limit the backlight aluminum substrate, achieving debris collection.

Description

Technical Field

[0001] This invention relates to the field of laser cutting equipment technology, and more specifically, to a laser cutting device for backlight aluminum substrates. Background Technology

[0002] CN202122177810.2 provides a laser cutting and positioning device for LED backlights. The device includes: a positioning frame plate; two hydraulic cylinders, both fixedly mounted on the top inner wall of the positioning frame plate; a connecting plate fixedly mounted on the output shafts of the two hydraulic cylinders; two compression springs fixedly mounted on the bottom of the connecting plate; a movable U-shaped plate fixedly mounted on the bottom ends of the two compression springs; and a rotating rod rotatably mounted inside the movable U-shaped plate, with one end extending outside the movable U-shaped plate. The laser cutting and positioning device for LED backlights provided by this invention has the advantages of convenient use, simple operation, automatic feeding, and improved work efficiency.

[0003] The aforementioned technology uses bullseye beads and friction strips to limit the material's position. However, for laser cutting, although laser cutting can accurately calculate the cutting depth, it has a certain degree of error regarding the thickness of the material. During cutting, it is inevitable that the bullseye beads or even the friction strips will be encountered, leading to corrosion of the bullseye beads and friction strips. Furthermore, the existing technology is not stable enough in limiting the material's position. The material may be affected by collisions with other components during cutting, causing displacement of the material and resulting in errors in the cutting pattern. Moreover, this limiting method requires moving the material, which may not be able to support small materials. Additionally, debris generated during the cutting process may enter the interior of the laser cutting device, affecting the normal operation of the equipment. Summary of the Invention

[0004] 1. Technical problems to be solved

[0005] The purpose of this invention is to provide a laser cutting device for aluminum substrates in backlights, so as to solve the problems mentioned in the background art.

[0006] While laser cutting can accurately calculate the cutting depth, it has a certain margin of error regarding the thickness of the sheet material. During cutting, it is inevitable to encounter bullseye beads or even friction strips, which can lead to corrosion of these components. Furthermore, current technology does not provide stable sheet material positioning, and the sheet material may be displaced due to collisions with other parts during cutting, resulting in errors in the cutting pattern. This positioning method requires moving the sheet material, which may not be sufficient to support smaller sheets. Additionally, debris generated during the cutting process may enter the laser cutting device, affecting its normal operation.

[0007] 2. Technical Solution

[0008] A laser cutting device for aluminum substrates in backlights includes an operating table. A movable frame is provided on the top of the operating table, and a laser cutting device is installed inside the movable frame. A first support plate is movably connected to the upper surface of the operating table below the laser cutting device. A first slot is provided on the inner side of the first support plate, and a movable plate is movably connected inside the first slot. A second slot is provided on one side of the movable plate, and a pressure plate is movably connected to the inner wall of the second slot. A screw is threadedly connected inside the movable plate, and the bottom end of the screw is rotatably connected to the pressure plate. A gear is provided on the outer surface of the screw above the movable plate. A support rod is provided on the upper surface of the first support plate, and a toothed plate matching the gear is provided on the surface of the support rod.

[0009] Preferably, a second fixing plate is provided on the side surface of the operating table, a first bidirectional lead screw is provided on the side of the second fixing plate, and a screw hole matching the first bidirectional lead screw is provided at the end of the first support plate. The first support plate is connected to the first bidirectional lead screw through the screw hole.

[0010] Preferably, the top of the operating table is provided with a guide rod, and the interior of the first support plate is provided with a movable hole that matches the guide rod. The first support plate is movably connected to the operating table through the guide rod provided in the movable hole.

[0011] Preferably, the inner wall of the first slot is provided with a second sliding groove, and both ends of the movable plate are provided with sliders that match the second sliding groove. The movable plate is slidably connected to the inner wall of the first slot through the sliders provided in the second sliding groove.

[0012] Preferably, the upper surface of the movable plate is provided with a handle.

[0013] Preferably, the pressure plate has a connecting hole inside that matches the screw, and a rubber pad is provided on the lower surface of the pressure plate.

[0014] Preferably, the upper surface of the operating table is provided with a first sliding groove that matches the movable frame, and a baffle is provided on the upper surface of the operating table inside the first sliding groove.

[0015] Preferably, the first support plate has a first movable groove inside, the first movable groove has a second support plate inside, the end of the second support plate has a fixing block, the upper surface of the operating table has a first fixing plate, and the inner side of the first fixing plate has a second bidirectional lead screw connected to the fixing block.

[0016] Preferably, the upper surface of the operating platform below the second bidirectional lead screw is provided with a second movable groove that matches the fixed block.

[0017] Preferably, a sliding plate is provided below the operating table, a storage box is provided at the rear end of the sliding plate, and a vacuum cleaner is installed on the inner wall of the operating table.

[0018] 3. Beneficial effects

[0019] Compared with the prior art, the advantages of this invention are:

[0020] 1) In use, the laser cutting device for backlight aluminum substrates drives the first support plates to move in opposite directions or in opposite directions via the first bidirectional lead screw, so that the distance between the first support plates matches the backlight aluminum substrate. Moving the movable plate causes the toothed plate to drive the gear to rotate, which in turn drives the screw to rotate. The screw drives the pressure plate to press down, thereby limiting the backlight aluminum substrate. The operator only needs to move the movable plate by the handle, and the pressure plate can limit the backlight aluminum substrate through the connection of the gear and the toothed plate. It is convenient and quick, making the backlight aluminum substrate more stable during the cutting process and preventing the backlight aluminum substrate from moving due to collisions with other parts during the cutting process, which would cause errors in the cutting pattern.

[0021] 2) When using the laser cutting device for backlight aluminum substrate, the second bidirectional lead screw is rotated, which causes the fixed block to drive the second support plate to move in opposite directions or in opposite directions, so that the spacing between the second support plates matches the backlight aluminum substrate. Then, the backlight aluminum substrate is placed on the second support plate to achieve support for the backlight aluminum substrate, thereby increasing the cutting range of the backlight aluminum substrate by the laser cutting device.

[0022] 3) When the laser cutting device for backlight aluminum substrate is in use, the debris generated during the cutting process of the backlight aluminum substrate is absorbed by a vacuum cleaner. The scraps that the vacuum cleaner cannot absorb fall directly onto the slide plate and are stored in the storage box through the slide plate, thus realizing the collection of debris. Attached Figure Description

[0023] Figure 1This is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the first support plate structure of the present invention;

[0025] Figure 3 for Figure 2 A magnified view of part A in the image;

[0026] Figure 4 This is a schematic diagram of the pressure plate structure of the present invention;

[0027] Figure 5 This is a schematic diagram of the second support plate structure of the present invention.

[0028] The following are the labels in the diagram: 1. Operating table; 2. Movable frame; 3. Laser cutting device; 4. First bidirectional lead screw; 5. First support plate; 6. Second support plate; 7. Guide rod; 8. First slot; 9. Movable plate; 10. Second slot; 11. Pressure plate; 12. Handle; 13. First movable slot; 14. Support rod; 15. Toothed plate; 16. Screw; 17. Gear; 18. First fixed plate; 19. Second bidirectional lead screw; 20. Fixed block; 21. Baffle; 22. Slide plate; 23. Storage box; 24. Vacuum cleaner; 25. Second movable slot; 26. Connecting hole; 27. Screw hole; 28. First slide groove; 29. ​​Second slide groove; 30. Slider; 31. Movable hole; 32. Second fixed plate; 33. Rubber pad. Detailed Implementation

[0029] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0030] In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0031] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] Example 1:

[0033] While laser cutting can accurately calculate the cutting depth, it has a certain degree of error regarding the thickness of the sheet material. During cutting, it is inevitable to encounter bullseye beads or even friction strips, which can lead to corrosion of the bullseye beads and friction strips. Furthermore, the current technology is not stable enough in terms of limiting the sheet material, and the sheet material may be affected by collisions with other components during cutting, causing displacement of the sheet material and resulting in errors in the cutting pattern. The following solutions are proposed to address these issues.

[0034] Please see Figures 1 to 5A laser cutting device for backlight aluminum substrates includes an operating table 1. A movable frame 2 is mounted on top of the operating table 1 and can move on the operating table 1. A laser cutting device 3 is installed inside the movable frame 2 and can move within the movable frame 2. The laser cutting device 3 is a conventional laser cutting device in the prior art. A first support plate 5 is movably connected to the upper surface of the operating table 1 below the laser cutting device 3. A first slot 8 is provided on the inner side of the first support plate 5 for placing the backlight aluminum substrate. A movable plate 9 is movably connected inside the first slot 8. A second slot 10 is formed on one side of the movable plate 9. A pressure plate 11 is movably connected to the inner wall of the second slot 10 and can move up and down within the inner wall of the second slot 10. A screw 16 is threadedly connected inside the movable plate 9, and the bottom end of the screw 16 is rotatably connected to the pressure plate 11. A gear 17 is provided on the outer surface of the screw 16 above the movable plate 9, and a support rod 14 is provided on the upper surface of the first support plate 5. A toothed plate 15 matching the gear 17 is provided on the surface of the support rod 14. The first bidirectional lead screw 4 drives the first support plates to move in opposite directions or in opposite directions, so that the distance between the first support plates matches the backlight aluminum substrate. Moving the movable plate 9 causes the toothed plate 15 to drive the gear 17 to rotate, which in turn drives the screw 16 to rotate. The screw 16 drives the pressure plate 11 to press down, thereby limiting the backlight aluminum substrate. The operator only needs to move the movable plate 9 by the handle 12. The connection between the gear 17 and the toothed plate 15 can realize the limiting of the pressure plate 11 on the backlight aluminum substrate. It is convenient and quick, making the backlight aluminum substrate more stable during the cutting process and preventing the backlight aluminum substrate from moving due to collisions with other parts during the cutting process, which would cause errors in the cutting pattern.

[0035] As a further embodiment of the present invention: a second fixing plate 32 is provided on the side surface of the operating table 1, a first bidirectional lead screw 4 is provided on the side of the second fixing plate 32, and a screw hole 27 matching the first bidirectional lead screw 4 is provided at the end of the first support plate 5. The first support plate 5 is connected to the first bidirectional lead screw 4 through the screw hole 27, thereby realizing the opposite movement or back movement of the first support plate 5.

[0036] As a further embodiment of the present invention: a guide rod 7 is provided on the top of the operating table 1, and an movable hole 31 matching the guide rod 7 is provided inside the first support plate 5. The first support plate 5 is movably connected to the operating table 1 through the guide rod 7 provided in the movable hole 31, thereby realizing the stability of the first support plate 5 when moving on the operating table 1.

[0037] As a further embodiment of the present invention: a second sliding groove 29 is provided on the inner wall of the first slot 8, and sliders 30 matching the second sliding groove 29 are provided at both ends of the movable plate 9. The movable plate 9 is slidably connected to the inner wall of the first slot 8 through the sliders 30 provided in the second sliding groove 29. A handle 12 is provided on the upper surface of the movable plate 9, thereby realizing the movement of the movable plate 9. The movable plate 9 can be moved by the handle 12.

[0038] As a further aspect of the present invention: the pressure plate 11 is provided with a connecting hole 26 that matches the screw 16, thereby realizing the rotational connection between the pressure plate 11 and the screw 16. The lower surface of the pressure plate 11 is provided with a rubber pad 33, which can increase the friction between the pressure plate 11 and the backlight aluminum substrate.

[0039] As a further embodiment of the present invention: the upper surface of the operating table 1 is provided with a first sliding groove 28 that matches the movable frame 2, thereby realizing the movement of the movable frame 2 on the operating table 1. The upper surface of the operating table 1 inside the first sliding groove 28 is provided with a baffle 21, which can prevent cutting debris from entering the first sliding groove 28.

[0040] The invention's usage steps are as follows: When using this laser cutting device for backlight aluminum substrates, the operator first rotates the first bidirectional lead screw 4 according to the dimensions of the backlight aluminum substrate, causing the first support plates 5 to move in opposite directions or in opposite directions, so that the spacing between the first support plates 5 matches the backlight aluminum substrate. Then, the backlight aluminum substrate is placed on the first slot 8. Next, the operator moves the movable plate 9 by the handle 12, causing the toothed plate 15 to drive the gear 17 to rotate, which in turn drives the screw 16 to rotate. The screw 16 drives the pressure plate 11 to press down, thus limiting the position of the backlight aluminum substrate. Then, the required... The cutting pattern is input to the control terminal, which drives the laser cutting device 3 to cut the backlight aluminum substrate. This solution only requires the operator to move the movable plate 9 through the handle 12. The connection between the gear 17 and the toothed plate 15 can realize the limiting of the pressure plate 11 on the backlight aluminum substrate, which is convenient and quick. It makes the backlight aluminum substrate more stable during the cutting process and prevents the backlight aluminum substrate from moving due to collisions with other parts during the cutting process, which would cause errors in the cutting pattern. In addition, the first support plate 5 supports the backlight aluminum substrate and avoids the corrosion of the support components by laser cutting.

[0041] Example 2:

[0042] When the sheet material is small, it may not be able to provide support. The following solutions can be used to address this issue.

[0043] Please see Figures 1 to 5The difference from Embodiment 1 lies in that the first support plate 5 has a first movable groove 13 inside, and a second support plate 6 is disposed inside the first movable groove 13. The second support plate 6 is movably connected to the first support plate 5 through the first movable groove 13. A fixing block 20 is disposed at the end of the second support plate 6. A first fixing plate 18 is disposed on the upper surface of the operating table 1. A second bidirectional lead screw 19 connected to the fixing block 20 is disposed on the inner side of the first fixing plate 18. A second movable groove 25 matching the fixing block 20 is disposed on the upper surface of the operating table 1 below the second bidirectional lead screw 19. By rotating the second bidirectional lead screw, the fixing block drives the second support plates to move towards each other or away from each other, so that the spacing between the second support plates matches the backlight aluminum substrate. Then, the backlight aluminum substrate is placed on the second support plate to achieve support for the backlight aluminum substrate, thereby increasing the cutting range of the backlight aluminum substrate laser cutting device.

[0044] The steps of using this invention are as follows: When the size of the backlight aluminum substrate is small, i.e., the first support plate 5 supporting the backlight aluminum substrate may affect the operation of the laser cutting device 3, the second bidirectional lead screw 19 can be rotated to make the fixing block 20 drive the second support plates 6 to move towards each other or away from each other, so that the spacing between the second support plates 6 matches the backlight aluminum substrate. Then, the backlight aluminum substrate can be placed on the second support plate 6 to achieve support of the backlight aluminum substrate, and then cutting can be performed. This increases the cutting range of the backlight aluminum substrate laser cutting device.

[0045] Example 3:

[0046] Debris generated during the cutting process may enter the interior of the laser cutting device, affecting the normal operation of the equipment. The following solutions can be used to address this issue.

[0047] Please see Figures 1 to 5 The difference from embodiments 1 and 2 is that a sliding plate 22 is provided below the operating table 1, and the sliding plate 22 is tilted at a 45-degree angle to facilitate the sliding of block-shaped scraps into the storage box 23. The storage box 23 is provided at the tail end of the sliding plate 22. A vacuum cleaner 24 is installed on the inner wall of the operating table 1. The vacuum cleaner 24 is a conventional vacuum cleaner in the prior art. During the cutting process of the backlight aluminum substrate, the generated debris is absorbed by the vacuum cleaner. The scraps that the vacuum cleaner cannot absorb after cutting fall directly into the sliding plate 22 and enter the storage box 23 for storage, thus realizing the collection of debris.

[0048] The steps of using this invention are as follows: When the laser cutting device for backlight aluminum substrate is in use, the debris generated during the cutting process of the backlight aluminum substrate is absorbed by the vacuum cleaner 24. The scraps that the vacuum cleaner 24 cannot absorb are directly dropped into the slide plate 22 and stored in the storage box 23 through the slide plate 22, thus realizing the collection of debris.

[0049] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A laser cutting device for aluminum substrates for backlight sources, comprising an operating table (1), characterized in that: The top of the operating table (1) is provided with a movable frame (2), and a laser cutting device (3) is installed inside the movable frame (2). A first support plate (5) is movably connected to the upper surface of the operating table (1) below the laser cutting device (3). A first slot (8) is provided on the inner side of the first support plate (5). A movable plate (9) is movably connected inside the first slot (8). A second slot (10) is provided on one side of the movable plate (9). A pressure plate (11) is movably connected to the inner wall of the second slot (10). A screw (16) is threaded inside the movable plate (9). The bottom end of the screw (16) is rotatably connected to the pressure plate (11). A gear (17) is provided on the outer surface of the screw (16) above the movable plate (9). A support rod (14) is provided on the upper surface of the first support plate (5). A toothed plate (15) matching the gear (17) is provided on the surface of the support rod (14). The side surface of the operating table (1) is provided with a second fixing plate (32), the side of the second fixing plate (32) is provided with a first bidirectional lead screw (4), the end of the first support plate (5) is provided with a screw hole (27) that matches the first bidirectional lead screw (4), and the first support plate (5) is connected to the first bidirectional lead screw (4) through the screw hole (27). The first support plate (5) is provided with a first movable groove (13), the first movable groove (13) is provided with a second support plate (6), the end of the second support plate (6) is provided with a fixing block (20), the upper surface of the operating table (1) is provided with a first fixing plate (18), and the inner side of the first fixing plate (18) is provided with a second bidirectional lead screw (19) connected to the fixing block (20).

2. The laser cutting device for backlight aluminum substrate according to claim 1, characterized in that: The top of the operating table (1) is provided with a guide rod (7), and the interior of the first support plate (5) is provided with a movable hole (31) that matches the guide rod (7). The first support plate (5) is movably connected to the operating table (1) through the guide rod (7) provided in the movable hole (31).

3. The laser cutting device for backlight aluminum substrate according to claim 1, characterized in that: The inner wall of the first slot (8) is provided with a second sliding groove (29), and the two ends of the movable plate (9) are provided with sliders (30) that match the second sliding groove (29). The movable plate (9) is slidably connected to the inner wall of the first slot (8) through the sliders (30) provided in the second sliding groove (29).

4. The laser cutting device for backlight aluminum substrate according to claim 1, characterized in that: The upper surface of the movable plate (9) is provided with a handle (12).

5. The laser cutting device for backlight aluminum substrate according to claim 1, characterized in that: The pressure plate (11) has a connecting hole (26) inside that matches the screw (16), and a rubber pad (33) is provided on the lower surface of the pressure plate (11).

6. The laser cutting device for backlight aluminum substrate according to claim 1, characterized in that: The upper surface of the operating table (1) is provided with a first slide groove (28) that matches the movable frame (2), and a baffle (21) is provided on the upper surface of the operating table (1) inside the first slide groove (28).

7. The laser cutting device for backlight aluminum substrate according to claim 1, characterized in that: The upper surface of the operating table (1) below the second bidirectional lead screw (19) is provided with a second movable groove (25) that matches the fixed block (20).

8. The laser cutting device for backlight aluminum substrate according to claim 1, characterized in that: A slide plate (22) is provided below the operating table (1), and a storage box (23) is provided at the tail end of the slide plate (22). A vacuum cleaner (24) is installed on the inner wall of the operating table (1).

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