Wafer clamping mechanism

Abstract

The utility model discloses a wafer clamping mechanism, which relates to the technical field of wafer clamping and comprises a main body support, the main body support is composed of a main plate and a plurality of connecting plates, the connecting plates are symmetrically and fixedly installed on the outer wall of the main plate, an installation support is fixedly installed at the upper end of the main plate, a clamping assembly is installed on every two adjacent connecting plates, and the main plate is fixedly installed on the installation support. The clamping assembly is composed of an arc-shaped clamping plate, an arc-shaped rubber plate, an installation sliding plate and a reset spring, the arc-shaped rubber plate is fixedly installed in the arc-shaped clamping plate, the wafer clamping mechanism composed of the main body support, the installation support, the clamping assembly and the pushing assembly is arranged, and the wafer clamping mechanism can directly clamp a wafer; according to the wafer clamping mechanism, on one hand, the wafer does not need to be clamped by means of a patch ring, practicability is good, diversified transmission and transfer requirements of the wafer can be met, on the other hand, the wafer clamping mechanism can clamp the wafer in all directions, clamping stability is good, and the wafer is not prone to falling off and being damaged in the clamped transmission process.

Description

Technical Field

[0001] This utility model relates to the field of wafer clamping technology, and in particular to a wafer clamping mechanism. Background Technology

[0002] A wafer is a fundamental material in the semiconductor industry, typically made of high-purity silicon or other semiconductor materials, and is a thin, circular sheet. It is a core component in the manufacture of electronic devices such as integrated circuits and microprocessors. During production, wafers undergo multiple precision processes, such as photolithography, etching, and ion implantation, to form tiny circuit patterns on their surface. These circuits are extremely complex and dense, containing hundreds of millions of transistors, resistors, capacitors, and other components. In the production of large-scale integrated circuits, wafers need to undergo multiple processes such as thin-film deposition, etching, and polishing to ultimately form the product. Clamping mechanisms are used to hold the wafer in place during each process and during wafer transport.

[0003] The existing patent application CN202320183362.3 proposes a wafer clamping mechanism. However, it uses clamping claws to press the chip ring to fix the wafer. Therefore, if the chip ring is not provided on the wafer during the wafer production and transfer process, the clamping mechanism cannot transfer the wafer, which makes the wafer clamping mechanism less practical and difficult to meet the diverse transfer needs of wafers. Therefore, it needs to be improved. Utility Model Content

[0004] The main objective of this invention is to provide a wafer clamping mechanism that can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A wafer clamping mechanism includes a main support, which is composed of a motherboard and connecting plates. Several connecting plates are symmetrically and fixedly mounted on the outer wall of the motherboard. A mounting bracket is fixedly mounted on the upper end of the motherboard. A clamping assembly is mounted on two adjacent connecting plates. The clamping assembly consists of an arc-shaped clamping plate, an arc-shaped rubber plate, a mounting slide plate, and a return spring. The arc-shaped rubber plate is fixedly mounted inside the arc-shaped clamping plate. Two mounting slide plates are symmetrically and fixedly mounted at both ends of the arc-shaped clamping plate. Two return springs are respectively fixedly mounted on the inner ends of two mounting slide plates. A pushing assembly is fixedly mounted on the upper end of the motherboard. The pushing assembly consists of a cylinder, a mounting plate, an L-shaped connecting plate, and an arc-shaped push plate. The mounting plate is fixedly mounted on the upper end of the piston rod of the cylinder. Several L-shaped connecting plates are symmetrically and fixedly mounted on the outer wall of the mounting plate. Several arc-shaped push plates are respectively fixedly mounted on the lower ends of several L-shaped connecting plates. The inner wall of the arc-shaped push plate contacts the outer wall of the arc-shaped clamping plate.

[0007] Preferably, the connecting plate on the main support has two guide rail grooves symmetrically opened at both ends.

[0008] Preferably, the mounting bracket consists of an L-shaped connecting rod and a main rod. Several L-shaped connecting rods are symmetrically fixedly installed on the main rod, and the L-shaped connecting rods are also fixedly installed on the upper end of the main board.

[0009] Preferably, the arc-shaped clamping plate on the clamping assembly is slidably installed between two adjacent connecting plates, and an arc-shaped groove is provided on the lower inner wall of the arc-shaped clamping plate, and the arc-shaped rubber plate is fixedly installed in the arc-shaped groove.

[0010] Preferably, the reset spring and the mounting slide plate on the clamping assembly are both installed in the guide rail groove opened on the connecting plate, and the mounting slide plate can slide in the guide rail groove.

[0011] Preferably, the cylinder on the pushing assembly is fixedly mounted on the upper end of the main board, and the mounting plate is located below the main rod on the mounting bracket.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] By setting up a wafer clamping mechanism consisting of a main support, a mounting bracket, a clamping component, and a pushing component, the wafer clamping mechanism can directly clamp the wafer. On the one hand, it does not require the use of a chip ring to clamp the wafer, which is more practical and can meet the diverse transmission and transfer needs of wafers. On the other hand, the wafer clamping mechanism can clamp the wafer from all directions, thus providing good clamping stability and making the wafer less likely to fall and be damaged during the clamping and transfer process. Attached Figure Description

[0014] Figure 1 This is a top view of the overall structure of this utility model;

[0015] Figure 2 This is a bottom view of the overall structure of this utility model;

[0016] Figure 3 This is a structural schematic diagram of the main support and mounting bracket of this utility model;

[0017] Figure 4 This is a schematic diagram of the clamping assembly of this utility model;

[0018] Figure 5 This is a schematic diagram of the structure of the pushing component of this utility model.

[0019] In the diagram: 1. Main support; 2. Mounting support; 3. Clamping assembly; 4. Pushing assembly; 5. Main board; 6. Connecting plate; 7. Guide rail groove; 8. L-shaped connecting rod; 9. Main rod; 10. Arc-shaped clamping plate; 11. Arc-shaped groove; 12. Arc-shaped rubber plate; 13. Mounting slide plate; 14. Return spring; 15. Cylinder; 16. Mounting plate; 17. L-shaped connecting plate; 18. Arc-shaped push plate. Detailed Implementation

[0020] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0021] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5As shown, a wafer clamping mechanism includes a main support 1, which consists of a main board 5 and connecting plates 6. Several connecting plates 6 are symmetrically and fixedly mounted on the outer wall of the main board 5. A mounting bracket 2 is fixedly mounted on the upper end of the main board 5. A clamping assembly 3 is mounted on two adjacent connecting plates 6. The clamping assembly 3 consists of an arc-shaped clamping plate 10, an arc-shaped rubber plate 12, a mounting slide plate 13, and a return spring 14. The arc-shaped rubber plate 12 is fixedly mounted inside the arc-shaped clamping plate 10. Two mounting slide plates 13 are symmetrically and fixedly mounted on the arc-shaped clamping plate 10. At both ends of 0, there are two return springs 14, which are respectively fixedly installed on the inner ends of two mounting slides 13. The upper end of the main board 5 is fixedly installed with a push assembly 4, which consists of a cylinder 15, a mounting plate 16, an L-shaped connecting plate 17, and an arc-shaped push plate 18. The mounting plate 16 is fixedly installed on the upper end of the piston rod of the cylinder 15. There are several L-shaped connecting plates 17, which are symmetrically fixedly installed on the outer wall of the mounting plate 16. There are several arc-shaped push plates 18, which are respectively fixedly installed on the lower ends of several L-shaped connecting plates 17. The inner wall of the arc-shaped push plate 18 is connected to the arc-shaped clamp. The outer wall of plate 10 contacts the wafer. Two guide rail grooves 7 are symmetrically opened at both ends of the connecting plate 6 on the main support 1. When it is necessary to clamp and transfer the wafer, the main rod 9 on the mounting bracket 2 can be connected to the moving mechanism first. Then, the moving mechanism is used to put the clamping mechanism on the outside of the wafer, so that the wafer is between several clamping components 3. Then, the pushing component 4 is activated, thereby using the pushing component 4 to push the arc-shaped clamping plate 10, arc-shaped rubber plate 12 and mounting slide plate 13 on the clamping component 3 inward, so that the arc-shaped rubber plate 12 contacts the edge of the wafer. At this point, the wafer is clamped and fixed. Then, the moving mechanism can be used in conjunction with the clamping mechanism to transfer and transport the wafer. When the wafer is moved to the appropriate position, it is released. During this process, the pushing component 4 can stop pushing the arc-shaped clamping plate 10, arc-shaped rubber plate 12 and mounting slide plate 13 on the clamping component 3 inward. At this time, under the force of the return spring 14, the arc-shaped clamping plate 10, arc-shaped rubber plate 12 and mounting slide plate 13 will slide outward, so that the arc-shaped rubber plate 12 will disengage from the wafer, and the wafer is released.

[0022] Finally, by setting up a wafer clamping mechanism consisting of a main support 1, a mounting support 2, a clamping component 3, and a pushing component 4, the wafer clamping mechanism can directly clamp the wafer. On the one hand, it does not require the use of a chip ring to clamp the wafer, which is more practical and can meet the diverse transmission and transfer needs of wafers. On the other hand, the wafer clamping mechanism can clamp the wafer from all directions, thus providing good clamping stability and making the wafer less likely to fall and be damaged during the clamping and transfer process.

[0023] Specifically, the mounting bracket 2 consists of L-shaped connecting rods 8 and main rods 9. Several L-shaped connecting rods 8 are symmetrically fixedly mounted on the main rods 9. The L-shaped connecting rods 8 are also fixedly mounted on the upper end of the main board 5. The arc-shaped clamping plate 10 on the clamping assembly 3 is slidably mounted between two adjacent connecting plates 6. An arc-shaped groove 11 is opened on the lower inner wall of the arc-shaped clamping plate 10, and an arc-shaped rubber plate 12 is fixedly mounted in the arc-shaped groove 11. The return spring 14 and the mounting slide plate 13 on the clamping assembly 3 are both installed in the guide rail groove 7 opened on the connecting plate 6, and the mounting slide plate 13 can slide in the guide rail groove 7. When it is necessary to clamp the wafer, the wafer needs to be positioned between several clamping assemblies 3. Between these steps, the arc-shaped clamping plate 10, arc-shaped rubber plate 12, and mounting slide plate 13 on the clamping assembly 3 need to be moved closer to the wafer. At this time, the arc-shaped clamping plate 10, arc-shaped rubber plate 12, and mounting slide plate 13 will move towards the motherboard 5 until the arc-shaped rubber plate 12 contacts the edge of the wafer. At this time, the wafer is clamped, and the reset spring 14 will be compressed by the mounting slide plate 13. When it is necessary to release the wafer, the pushing of the arc-shaped clamping plate 10, arc-shaped rubber plate 12, and mounting slide plate 13 towards the wafer can be stopped. At this time, under the elastic force of the reset spring 14, the arc-shaped clamping plate 10, arc-shaped rubber plate 12, and mounting slide plate 13 will gradually move away from the wafer.

[0024] Specifically, the cylinder 15 on the push assembly 4 is fixedly mounted on the upper end of the motherboard 5, and the mounting plate 16 is located below the main rod 9 on the mounting bracket 2. When it is necessary to push the arc-shaped clamping plate 10, the arc-shaped rubber plate 12, and the mounting slide plate 13 inward to clamp the wafer, the cylinder 15 can be activated, so that the piston rod of the cylinder 15 drives the arc-shaped push plate 18 to move downward through the L-shaped connecting plate 17. At this time, the arc-shaped push plate 18 will push the arc-shaped clamping plate 10, the arc-shaped rubber plate 12, and the mounting slide plate 13 inward. When it is necessary to stop pushing the arc-shaped clamping plate 10, the arc-shaped rubber plate 12, and the mounting slide plate 13 inward, the cylinder 15 can be activated, so that the piston rod of the cylinder 15 drives the arc-shaped push plate 18 to move upward through the L-shaped connecting plate 17.

[0025] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer clamping mechanism, characterized by: The utility model provides a kind of main body support (1), the main body support (1) is by main plate (5) and connecting plate (6), the connecting plate (6) has several and is symmetrically fixedly installed on the outer wall of main plate (5), the upper end of main plate (5) is fixedly installed with mounting bracket (2), one clamping assembly (3) is installed on the two adjacent connecting plate (6), the clamping assembly (3) is by arc clamping plate (10), arc rubber plate (12), installation slide plate (13) and reset spring (14) are formed, the arc rubber plate (12) is fixedly installed in arc clamping plate (10), the installation slide plate (13) has two and is symmetrically fixedly installed at the two ends of arc clamping plate (10), the reset spring (14) has two and is respectively fixedly installed at the inner end of two installation slide plates (13), the upper end of main plate (5) is fixedly installed with push assembly (4), the push assembly (4) is by cylinder (15), mounting plate (16), L-shaped connecting plate (17) and arc push plate (18) are formed, the mounting plate (16) is fixedly installed on the upper end of piston rod of cylinder (15), the L-shaped connecting plate (17) has several and is symmetrically fixedly installed on the outer wall of mounting plate (16), the arc push plate (18) has several and is respectively fixedly installed at the lower end of several L-shaped connecting plates (17), the inner wall of arc push plate (18) is in contact with the outer wall of arc clamping plate (10).

2. The wafer chucking mechanism of claim 1, wherein: Two guide rail grooves (7) are symmetrically arranged at the two ends of the connecting plate (6) on the main body support (1).

3. The wafer chucking mechanism of claim 2, wherein: The mounting bracket (2) is composed of L-shaped connecting rods (8) and a main rod (9), the L-shaped connecting rods (8) are symmetrically fixedly installed on the main rod (9), and the L-shaped connecting rods (8) are also fixedly installed on the upper end of the main plate (5).

4. The wafer chucking mechanism of claim 3, wherein: The arc clamping plate (10) on the clamping assembly (3) is slidingly installed between the two adjacent connecting plates (6), and an arc groove (11) is formed in the inner wall of the lower side of the arc clamping plate (10).

5. The wafer chucking mechanism of claim 4, wherein: The reset spring (14) and the installation slide plate (13) on the clamping assembly (3) are installed in the guide rail groove (7) formed in the connecting plate (6), and the installation slide plate (13) can slide in the guide rail groove (7).

6. The wafer chucking mechanism of claim 5, wherein: The cylinder (15) on the push assembly (4) is fixedly installed on the upper end of the main plate (5), and the mounting plate (16) is located below the main rod (9) on the mounting bracket (2).

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