FTTR-B device

Abstract

The utility model provides an FTTR-B device, a vapor chamber is detachably installed in an FTTR-B housing through a connecting structure, and a mainboard is installed in the FTTR-B housing through a fastener. At least one convex hull is arranged on the vapor chamber, at least one chip is arranged on the mainboard, and each convex hull is opposite to the corresponding chip, so that the distance between the vapor chamber and the chip on the mainboard is shortened, heat generated by the chips can be effectively and uniformly discharged through the convex hulls, the FTTR-B equipment is prevented from being overheated, the heat dissipation performance of the FTTR-B equipment is improved, and the service life of the FTTR-B equipment is prolonged. Therefore, the heat dissipation requirement of the product is met, stable operation of the FTTR-B equipment is ensured, and the service life of the FTTR-B equipment is prolonged. According to the FTTR-B equipment, heat generated by the mainboard is released in three modes by designing the vapor chamber, the air inlet holes and the heat dissipation holes, so that the purpose of dissipating heat in the FTTR-B equipment is achieved, the heat dissipation performance of the FTTR-B equipment is improved, the heat dissipation requirement of a product is met, it is ensured that the FTTR-B equipment can operate stably, and the service life of the FTTR-B equipment is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of FTTR-B technology, and in particular to an FTTR-B device. Background Technology

[0002] With the rapid development of enterprise-grade Fiber to the Room-Business (FTTR-B) technology, FTTR-B equipment has become a crucial component in meeting enterprises' demands for high-speed, stable network connections. Chips on the motherboard (such as the main chip and Wi-Fi chip) are key components of FTTR-B equipment. Since FTTR-B equipment generates heat during operation, its heat dissipation design is critical to its performance and lifespan. However, existing FTTR-B equipment has poor heat dissipation performance, which affects its stable operation and reduces its lifespan. Summary of the Invention

[0003] This invention provides an FTTR-B device to solve the problem of poor heat dissipation performance of existing FTTR-B devices.

[0004] An FTTR-B device includes an FTTR-B housing, a heat spreader, and a mainboard;

[0005] The heat spreader is detachably installed inside the FTTR-B housing via a connecting structure, and the main board is installed inside the FTTR-B housing via fasteners;

[0006] The motherboard and the heat spreader are arranged at intervals along the height direction of the FTTR-B housing. The heat spreader is provided with at least one protrusion, and the motherboard is provided with at least one chip. Each protrusion is arranged opposite to a chip.

[0007] The bottom of the FTTR-B housing is provided with an air intake hole, and the top of the FTTR-B housing is provided with a heat dissipation hole.

[0008] Preferably, the FTTR-B device further includes a heat-conducting component disposed between the convex hull and the chip.

[0009] Preferably, at least one of the convex hulls includes a first convex hull and a second convex hull arranged at intervals; at least one of the chips includes a main chip and a WIFI chip arranged at intervals.

[0010] The first convex hull is disposed opposite to the main chip, and the second convex hull is disposed opposite to the WIFI chip.

[0011] Preferably, the FTTR-B housing includes a housing base and a housing cover, the housing cover being snapped onto the housing base;

[0012] The air inlet is located on the cover, and the heat dissipation hole is located on the base.

[0013] Preferably, the cover is provided with a foot pad, which is used to install at the installation position so that a ventilation channel communicating with the air inlet is formed between the cover and the installation position.

[0014] Preferably, the heat dissipation holes are provided around the top of the housing, and the heat dissipation holes are arranged in a ring-shaped stripe pattern.

[0015] Preferably, the connection structure includes a guide and positioning component and a snap-fit ​​component;

[0016] The guiding and positioning component is disposed inside the FTTR-B housing and is used to provide guiding and positioning for the heat spreader.

[0017] The snap-fit ​​component is disposed inside the FTTR-B housing and is used to snap-fit ​​with the heat spreader plate.

[0018] Preferably, the guiding and positioning component includes a guiding and positioning post and a guiding and positioning groove;

[0019] The guide positioning post is disposed inside the FTTR-B housing or the heat spreader, the guide positioning groove is disposed inside the heat spreader or the FTTR-B housing, and the guide positioning post is inserted into the guide positioning groove.

[0020] Preferably, the number of the guiding and positioning components is four, and the four guiding and positioning components are arranged in a rectangular pattern;

[0021] Of the four guiding and positioning components, two of the guiding and positioning components have open grooves for guiding and positioning, while the other two guiding and positioning components have circular grooves for guiding and positioning.

[0022] Preferably, the FTTR-B housing has a support column inside, which is used to support the motherboard;

[0023] The length of the support column in the height direction of the FTTR-B housing is greater than the length of the connecting structure in the height direction of the FTTR-B housing.

[0024] In the FTTR-B device provided in this embodiment, at least one bump is provided on the heat spreader plate, and at least one chip is provided on the motherboard. Each bump is positioned opposite to a chip, thus reducing the distance between the heat spreader plate and the chip on the motherboard. The bump can effectively and evenly dissipate the heat generated by the chip, preventing the FTTR-B device from overheating, thereby improving the heat dissipation performance of the FTTR-B device to meet the product's heat dissipation requirements, ensuring stable operation of the FTTR-B device, and extending its service life. An air inlet is provided at the bottom of the FTTR-B housing, allowing outside air to flow into the FTTR-B housing and exchange heat with the hot air inside the FTTR-B housing to dissipate heat. Additionally, a heat dissipation hole is provided at the top of the FTTR-B housing. Utilizing the principle that hot air rises, the heat dissipation hole can effectively expel hot air, significantly improving the heat dissipation performance of the FTTR-B device. This example of the FTTR-B device utilizes a heat spreader, air intake vents, and heat dissipation vents to release heat generated by the motherboard in three ways. This achieves the purpose of cooling the internal components of the FTTR-B device, improving its heat dissipation performance to meet product cooling requirements, ensuring stable operation, and extending its service life. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is an axonometric view of the internal structure of the FTTR-B device in one embodiment of this utility model;

[0027] Figure 2 yes Figure 1 A sectional view;

[0028] Figure 3 This is an axonometric view of the FTTR-B device from a first perspective in one embodiment of this utility model;

[0029] Figure 4 This is an axonometric view of the FTTR-B device from a second perspective in one embodiment of this utility model.

[0030] The components include: 1. FTTR-B housing; 11. Air inlet; 12. Heat dissipation hole; 13. Housing base; 14. Housing cover; 2. Heat spreader; 3. Main board; 4. Connection structure; 41. Guide positioning assembly; 411. Guide positioning post; 412. Guide positioning groove; 42. Snap-fit ​​component; 5. Protrusion; 51. First protrusion; 52. Second protrusion; 6. Chip; 61. Main chip; 62. WIFI chip; 7. Heat-conducting component; 8. Foot pad; 9. Support post. Detailed Implementation

[0031] To make the technical problems, technical solutions, and beneficial effects solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0032] In the description of this application, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0033] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] This utility model embodiment provides an FTTR-B device, referring to... Figure 1 , Figure 2 , Figure 3 and Figure 4The FTTR-B device includes an FTTR-B housing 1, a heat spreader 2, and a main board 3. The heat spreader 2 is detachably installed inside the FTTR-B housing 1 via a connecting structure 4, and the main board 3 is installed inside the FTTR-B housing 1 via fasteners. The main board 3 and the heat spreader 2 are arranged at intervals along the height direction of the FTTR-B housing 1. The heat spreader 2 is provided with at least one protrusion 5, and the main board 3 is provided with at least one chip 6. Each protrusion 5 is arranged opposite to a chip 6. The bottom of the FTTR-B housing 1 is provided with an air inlet 11, and the top of the FTTR-B housing 1 is provided with a heat dissipation hole 12.

[0035] As an example, the FTTR-B device includes an FTTR-B housing 1, a heat spreader 2, and a main board 3. During installation, the heat spreader 2 is installed inside the FTTR-B housing 1 via a connecting structure 4, facilitating its installation and removal. The heat spreader 2 is made of aluminum, a material with high thermal conductivity, and is filled with a working fluid (such as pure water). When the FTTR-B device generates heat, the working fluid evaporates into steam. The steam rapidly diffuses to the cooling area under pressure difference, condenses upon contact with the cold air, and releases heat. It then flows back to the heat source through capillary action, forming a cycle. This process utilizes phase change (liquid → gas → liquid) to absorb and release a large amount of heat, achieving efficient heat conduction and improving the heat dissipation performance of the FTTR-B device. The main board 3 is installed inside the FTTR-B housing 1 using fasteners, specifically screws or bolts that pass through the main board 3 and the FTTR-B housing 1, thus fixing the main board 3 inside the FTTR-B housing 1. The motherboard 3 and the heat spreader 2 are spaced apart along the height of the FTTR-B housing 1, allowing the heat spreader 2 to effectively release the heat generated by the motherboard 3. At least one protrusion 5 is provided on the heat spreader 2, and at least one chip 6 is provided on the motherboard 3. Each protrusion 5 is positioned opposite a chip 6, thus reducing the distance between the heat spreader 2 and the chip 6 on the motherboard 3. The protrusion 5 effectively and evenly distributes the heat generated by the chip 6, preventing overheating of the FTTR-B device and improving its heat dissipation performance to meet product heat dissipation requirements, ensuring stable operation and extending its service life. An air inlet 11 is provided at the bottom of the FTTR-B housing 1, allowing outside air to flow into the FTTR-B housing 1 and exchange heat with the hot air inside, thus dissipating heat from the FTTR-B device. Additionally, a heat dissipation hole 12 is provided at the top of the FTTR-B housing 1. Utilizing the principle that hot air rises, the heat dissipation hole 12 effectively exhausts hot air, significantly improving the heat dissipation performance of the FTTR-B device. The FTTR-B device in this example uses a heat spreader 2, an air inlet 11, and a heat dissipation hole 12 to release the heat generated by the motherboard 3 in three ways, thereby achieving the purpose of heat dissipation of the internal components of the FTTR-B device, improving the heat dissipation performance of the FTTR-B device, meeting the product's heat dissipation requirements, ensuring the stable operation of the FTTR-B device, and extending its service life.

[0036] In one embodiment, reference is made to Figure 2 The FTTR-B device also includes a heat-conducting element 7, which is disposed between the convex hull 5 and the chip 6.

[0037] As an example, the FTTR-B device also includes a heat-conducting component 7. During installation, the heat-conducting component 7 is positioned between the bump 5 and the chip 6. This allows the heat generated by the chip 6 to be conducted to the bump 5, which in turn effectively and evenly dissipates the heat, preventing the FTTR-B device from overheating. This improves the heat dissipation performance of the FTTR-B device, meeting product heat dissipation requirements, ensuring stable operation, and extending its lifespan. The heat-conducting component 7 is made of thermally conductive silicone.

[0038] In one embodiment, reference is made to Figure 1 and Figure 2 At least one convex hull 5 includes a first convex hull 51 and a second convex hull 52 spaced apart; at least one chip 6 includes a main chip 61 and a WIFI chip 62 spaced apart; the first convex hull 51 is disposed opposite to the main chip 61, and the second convex hull 52 is disposed opposite to the WIFI chip 62.

[0039] As an example, at least one convex hull 5 includes a first convex hull 51 and a second convex hull 52, which are spaced apart; at least one chip 6 includes a main chip 61 and a WIFI chip 62, which are spaced apart; the first convex hull 51 is positioned opposite to the main chip 61, and the second convex hull 52 is positioned opposite to the WIFI chip 62; this arrangement, through the first convex hull 51 and the second convex hull 52, can effectively and evenly dissipate the heat generated by the main chip 61 and the WIFI chip 62, preventing the FTTR-B device from overheating, thereby improving the heat dissipation performance of the FTTR-B device, meeting the product's heat dissipation requirements, ensuring the stable operation of the FTTR-B device, and extending its service life.

[0040] In one embodiment, reference is made to Figure 3 and Figure 4 The FTTR-B housing 1 includes a housing base 13 and a housing cover 14, with the housing cover 14 snapped onto the housing base 13; an air inlet 11 is provided on the housing cover 14, and a heat dissipation hole 12 is provided on the housing base 13.

[0041] As an example, the FTTR-B housing 1 includes a housing base 13 and a housing cover 14. During installation, the housing cover 14 is snapped onto the housing base 13, and the two cooperate to form an accommodating space for installing the heat spreader 2 and the mainboard 3. Specifically, the heat spreader 2 is detachably installed in the housing base 13 via a connecting structure 4, and the mainboard 3 is installed in the housing base 13 via fasteners. The heat spreader 2 can effectively release the heat generated by the mainboard 3, preventing the FTTR-B device from overheating. An air inlet 11 is provided on the housing cover 14, allowing outside air to flow into the FTTR-B housing 1 through the air inlet 11 and exchange heat with the hot air inside the FTTR-B housing 1 to dissipate heat from the FTTR-B device. A heat dissipation hole 12 is provided on the housing base 13. Utilizing the principle that hot air rises, the heat dissipation hole 12 can effectively expel hot air, significantly improving the heat dissipation performance of the FTTR-B device. The number of air inlets 11 is multiple, and the multiple air inlets 11 are evenly spaced on the shell cover 14; the heat dissipation holes 12 are provided in multiple layers, and the multiple layers of heat dissipation holes 12 are arranged along the height direction of the FTTR-B shell 1. The number of heat dissipation holes 12 in each layer is multiple, and the multiple heat dissipation holes 12 are arranged at intervals along the circumference of the FTTR-B shell 1.

[0042] In one embodiment, reference is made to Figure 3 and Figure 4 The cover 14 is provided with a foot pad 8, which is used to install at the installation position so that a ventilation channel communicating with the air inlet 11 is formed between the cover 14 and the installation position.

[0043] As an example, the cover 14 is provided with feet 8. During installation, the feet 8 are installed at the installation location (such as a desktop, ground, etc.) so that a ventilation channel is formed between the cover 14 and the installation location, which is connected to the air inlet 11. This allows outside air to flow into the FTTR-B housing 1 through the ventilation channel from the air inlet 11 and exchange heat with the hot air inside the FTTR-B housing 1 to dissipate heat from the FTTR-B device.

[0044] In one embodiment, reference is made to Figure 3 and Figure 4 The top of the housing 13 is provided with heat dissipation holes 12 around its perimeter, and the heat dissipation holes 12 are arranged in a ring stripe pattern.

[0045] As an example, the top of the housing 13 is provided with heat dissipation holes 12 around the perimeter, which can ensure that the heat inside the FTTR-B housing 1 can be evenly dissipated and avoid local overheating. The heat dissipation holes 12 are arranged in a ring stripe pattern, which can ensure a large heat dissipation area. By utilizing the basic principle that heat rises, the heat can be discharged effectively and maximized, significantly improving the heat dissipation performance of the FTTR-B device.

[0046] In one embodiment, reference is made to Figure 1 and Figure 2The connection structure 4 includes a guide and positioning component 41 and a snap-fit ​​component 42. The guide and positioning component 41 is disposed inside the FTTR-B housing 1 and is used to provide guide and positioning for the heat spreader 2. The snap-fit ​​component 42 is disposed inside the FTTR-B housing 1 and is used to snap-fit ​​with the heat spreader 2.

[0047] As an example, the connection structure 4 includes a guide positioning component 41 and a snap-fit ​​component 42. During installation, the guide positioning component 41 is placed inside the FTTR-B housing 1 to provide guidance and positioning for the installation of the heat spreader 2. Then, the snap-fit ​​component 42, located inside the FTTR-B housing 1, snaps into the heat spreader 2 to lock it in place. In this example, the heat spreader 2 is pre-installed using the guide positioning component 41, allowing for fine-tuning of its position. Simultaneously, the snap-fit ​​component 42 locks the heat spreader 2 in place. The guide positioning component 41 and the snap-fit ​​component 42 work together to facilitate the installation and removal of the heat spreader 2, ensuring a stable and secure installation. There are three snap-fit ​​components 42: two are located on the first side of the heat spreader 2, and one is located on the second side. The first and second sides are opposite to each other.

[0048] In one embodiment, reference is made to Figure 1 The guide positioning component 41 includes a guide positioning post 411 and a guide positioning groove 412. The guide positioning post 411 is disposed in the FTTR-B housing 1 or the heat spreader 2, and the guide positioning groove 412 is disposed in the heat spreader 2 or the FTTR-B housing 1. The guide positioning post 411 is inserted into the guide positioning groove 412.

[0049] As an example, the guide positioning assembly 41 includes a guide positioning post 411 and a guide positioning groove 412. During installation, the guide positioning post 411 is placed inside the FTTR-B housing 1, and the guide positioning groove 412 is placed inside the heat spreader 2. The guide positioning post 411 is inserted into the guide positioning groove 412, which provides guide positioning for the installation of the heat spreader 2, enabling pre-installation of the heat spreader 2 and facilitating fine-tuning of the position of the heat spreader 2 by the user.

[0050] In one example, the guide positioning post 411 is disposed inside the FTTR-B housing 1 or the heat spreader 2, and the guide positioning groove 412 is disposed inside the heat spreader 2 or the FTTR-B housing 1. The guide positioning post 411 is inserted into the guide positioning groove 412, which can also achieve the above function.

[0051] In one embodiment, reference is made to Figure 1 There are four guide positioning components 41, which are arranged in a rectangular shape. Among the four guide positioning components 41, the guide positioning grooves 412 of two guide positioning components 41 are open grooves, and the guide positioning grooves 412 of the other two guide positioning components 41 are circular grooves.

[0052] As an example, there are four guide positioning components 41 arranged in a rectangular pattern, which ensures more precise and stable installation of the heat spreader 2. Two of the guide positioning components 41 have open guide positioning grooves 412, while the other two have circular guide positioning grooves 412. This ensures that the heat spreader 2 is not locked during installation, guaranteeing that the protrusions 5 on the heat spreader 2 correspond to the chips 6 on the motherboard 3. This allows for effective and even heat dissipation from the chips 6, preventing overheating of the FTTR-B device and improving its heat dissipation performance.

[0053] In one embodiment, reference is made to Figure 1 and Figure 2 The FTTR-B housing 1 is provided with a support column 9, which is used to support the main board 3; the length of the support column 9 in the height direction of the FTTR-B housing 1 is greater than the length of the connecting structure 4 in the height direction of the FTTR-B housing 1.

[0054] As an example, the FTTR-B housing 1 includes a support column 9 for supporting the motherboard 3. Specifically, the support column 9 has a first fixing hole at its upper end, and the motherboard 3 has a second fixing hole. Fasteners pass through the first and second fixing holes to fix the motherboard 3 to the support column 9, thus allowing the motherboard 3 to be installed inside the FTTR-B housing 1. The length of the support column 9 in the height direction of the FTTR-B housing 1 is greater than the length of the connecting structure 4 in the height direction of the FTTR-B housing 1. This ensures that the motherboard 3 and the heat spreader 2 are not at the same height, preventing interference between them.

[0055] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. An FTTR-B device, characterized by, The FTTR-B shell, the vapor chamber and the mainboard are included; The vapor chamber is detachably installed in the FTTR-B shell through a connecting structure, and the mainboard is installed in the FTTR-B shell through a fastener; The mainboard and the vapor chamber are arranged in a spaced manner along the height direction of the FTTR-B shell, at least one convex block is arranged on the vapor chamber, and at least one chip is arranged on the mainboard, each convex block is arranged opposite to a chip; The bottom of the FTTR-B shell is provided with an air inlet hole, and the top of the FTTR-B shell is provided with a heat dissipation hole.

2. The FTTR-B device of claim 1, wherein, The FTTR-B device further comprises a heat-conducting member arranged between the convex block and the chip.

3. The FTTR-B device of claim 1, wherein, The at least one convex block comprises a first convex block and a second convex block arranged in a spaced manner, and the at least one chip comprises a main chip and a WIFI chip arranged in a spaced manner. The first convex block is arranged opposite to the main chip, and the second convex block is arranged opposite to the WIFI chip.

4. The FTTR-B device of claim 1, wherein, The FTTR-B shell comprises a shell base and a shell cover, and the shell cover is clamped on the shell base. The air inlet hole is arranged on the shell cover, and the heat dissipation hole is arranged on the shell base.

5. The FTTR-B device of claim 4, wherein, A foot pad is arranged on the shell cover, and the foot pad is arranged on a to-be-installed position to form a ventilation channel communicating with the air inlet hole between the shell cover and the to-be-installed position.

6. The FTTR-B device of claim 4, wherein, The top of the shell base is provided with the heat dissipation hole around the shell base, and the heat dissipation hole is arranged in an annular stripe shape.

7. The FTTR-B device of claim 1, wherein, The connecting structure comprises a guide positioning assembly and a clamping piece. The guide positioning assembly is arranged in the FTTR-B shell to provide guide positioning for the vapor chamber. The clamping piece is arranged in the FTTR-B shell to clamp the vapor chamber.

8. The FTTR-B device of claim 7, wherein, The guide positioning assembly comprises a guide positioning column and a guide positioning groove. The guide positioning column is arranged in the FTTR-B shell or the vapor chamber, and the guide positioning groove is arranged in the vapor chamber or the FTTR-B shell, and the guide positioning column is inserted into the guide positioning groove.

9. The FTTR-B device of claim 8, wherein, The number of the guide positioning assemblies is four, and the four guide positioning assemblies are distributed in a rectangular shape. Among the four guide positioning assemblies, the guide positioning grooves of two guide positioning assemblies are open grooves, and the guide positioning grooves of the other two guide positioning assemblies are circular grooves.

10. The FTTR-B device of claim 1, wherein, The FTTR-B shell is provided with a support column for supporting the mainboard. The length of the support column in the height direction of the FTTR-B shell is greater than the length of the connecting structure in the height direction of the FTTR-B shell.

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