High-thermal-conductivity silicon carbide device packaging structure

Abstract

The utility model relates to the technical field of silicon carbide device packaging, in particular to a high-thermal-conductivity silicon carbide device packaging structure which comprises a metal top cover installed on the top of a metal shell, an anti-lost rope is fixedly connected to the inner side of the metal shell, and the other end of the anti-lost rope is fixedly connected with the inner side of the metal top cover. Through threaded installation of the inner hexagon bolt and the metal top cover, the inner hexagon bolt can be reserved on the inner side of the metal top cover and is not completely separated in the dismounting process, the metal shell and the metal top cover are connected together in cooperation with an anti-lost rope, and the metal top cover and the inner hexagon bolt can be prevented from being lost in the overhauling process; the position of the chip is limited through the positioning rods arranged at the four corners of the first heat dissipation plate, the chip can be protected when shaking and collision occur, displacement is avoided, and heat of the chip is transmitted to the first heat dissipation plate and the second heat dissipation plate through the first heat conduction silica gel sheet and the second heat conduction silica gel sheet to improve the heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of silicon carbide device packaging technology, specifically a silicon carbide device packaging structure with high thermal conductivity. Background Technology

[0002] Packaging refers to connecting the circuit pins on a silicon wafer to external connectors using wires, so that they can be connected to other devices. The package form refers to the shell used to mount semiconductor integrated circuit chips. It not only plays a role in mounting, fixing, sealing, protecting the chip and enhancing its electrothermal performance, but also connects the chip's contacts to the pins of the package shell through wires. These pins are then connected to other devices through wires on the printed circuit board, thereby realizing the connection between the internal chip and the external circuit. Because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing a decline in electrical performance, the packaged chip is also easier to install and transport.

[0003] In existing technologies, such as the "A Novel High-Temperature Resistant Silicon Carbide Device Packaging Structure" with Chinese announcement number CN221486482U, the structure is simple. The shell is made of metal material, which makes it resistant to high temperatures and has a fast heat dissipation effect. Moreover, the chip and pins are detachable and can be quickly replaced and repaired after the cover is opened, which increases convenience.

[0004] In the aforementioned prior art, although the top cover of the packaging structure can be disassembled and the internal components can be quickly replaced and inspected, the disassembled top cover and bolts are easily left aside. Since the parts are small, once lost, they will cause trouble for subsequent assembly and maintenance. Moreover, the chip is not securely fixed and is prone to displacement when shaken during transportation. Summary of the Invention

[0005] The purpose of this invention is to provide a high thermal conductivity silicon carbide device packaging structure with a non-lossable metal top cover and easy maintenance features.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high thermal conductivity silicon carbide device packaging structure, comprising a metal top cover mounted on the top of a metal casing, an anti-loss rope fixedly connected to the inner side of the metal casing, the other end of the anti-loss rope being fixedly connected to the inner side of the metal top cover, an internal hexagon bolt threaded onto the inner side of the metal top cover, an internal threaded sleeve fixedly mounted onto the inner side of the metal casing, the internal hexagon bolt and the internal threaded sleeve being threadedly engaged, a first heat sink fixedly mounted onto the inner side of the metal casing, a chip mounted on the top of the first heat sink, a first thermally conductive silicone pad in contact between the first heat sink and the chip, a second heat sink fixedly mounted onto the inner side of the metal top cover, a second thermally conductive silicone pad in contact between the second heat sink and the chip, heat sinks on the outer sides of both the metal casing and the metal top cover, and positioning rods fixedly mounted at the four corners of the upper surface of the first heat sink, the positioning rods corresponding to the positions of the chip.

[0007] To facilitate heat conduction, in a preferred embodiment of the high thermal conductivity silicon carbide device packaging structure of this utility model, both the first heat sink and the second heat sink are coated with thermally conductive silicone grease for contact mounting with their adjacent corresponding heat sinks.

[0008] For ease of positioning, in a preferred embodiment of the high thermal conductivity silicon carbide device packaging structure of this utility model, two connectors are fixedly installed on the inner side of the metal shell, and the two connectors are symmetrically distributed on the inner side wall of the metal shell. Two mating seats are fixedly installed on the inner side of the metal top cover, and the two mating seats correspond one-to-one with the two connectors. The mating seats are inserted into the connectors.

[0009] For ease of insulation, in a preferred embodiment of the high thermal conductivity silicon carbide device packaging structure of this utility model, an insulating sleeve is provided between the metal shell and the metal top cover, and pins are fixedly installed on the inner side of the insulating sleeve.

[0010] To facilitate conductive connection, in a preferred embodiment of the high thermal conductivity silicon carbide device packaging structure of this utility model, a first connecting seat is fixedly installed on one side of the insulating sleeve, the first connecting seat is electrically connected to the pin, and a conductive rod is sleeved on the inner side of the first connecting seat.

[0011] For ease of connection, in a preferred embodiment of the high thermal conductivity silicon carbide device packaging structure of this utility model, a second connector is fixedly mounted on the top of the chip, the inner side of the second connector is sleeved with the conductive rod, and the second connector is electrically connected to the first connector through the conductive rod.

[0012] To facilitate positioning and fixation, in a preferred embodiment of the high thermal conductivity silicon carbide device packaging structure of this utility model, an insulating positioning block is fixedly installed on the inner side of the metal top cover, and the bottom of the insulating positioning block is pressed against the conductive rod.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] The internal hex bolts are threaded onto the metal top cover, allowing the bolts to remain inside the metal top cover during disassembly, preventing complete detachment. When used with an anti-loss rope to connect the metal casing to the metal top cover, this prevents the loss of both the metal top cover and the internal hex bolts during maintenance. Positioning rods at the four corners of the first heat sink restrict the chip's position, protecting it from displacement during shaking or collisions. The first and second thermally conductive silicone pads transfer the chip's heat to the first and second heat sinks respectively, improving heat dissipation. Attached Figure Description

[0015] Figure 1 This is a complete three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a three-dimensional structural diagram of the internal structure of this utility model;

[0017] Figure 3 This is one of the partially exploded structural diagrams of this utility model;

[0018] Figure 4 This is the second partially exploded structural diagram of this utility model.

[0019] In the diagram: 1. Metal casing; 2. Metal top cover; 3. Heat sink; 4. Hex socket head cap screw; 5. Insulating sleeve; 6. Pin; 7. First connector; 8. Second connector; 9. Chip; 10. First thermally conductive silicone pad; 11. First heat sink; 12. Positioning rod; 13. Second heat sink; 14. Second thermally conductive silicone pad; 15. Conductive rod; 16. Insulating positioning block; 17. Anti-loss rope; 18. Connecting seat; 19. Connecting socket; 20. Internal threaded sleeve. Detailed Implementation

[0020] Please see Figures 1 to 4A high thermal conductivity silicon carbide device packaging structure includes a metal top cover 2 mounted on top of a metal casing 1. An anti-loss rope 17 is fixedly connected to the inner side of the metal casing 1, and the other end of the anti-loss rope 17 is fixedly connected to the inner side of the metal top cover 2. An internal hexagon bolt 4 is threadedly installed on the inner side of the metal top cover 2. An internal threaded sleeve 20 is fixedly installed on the inner side of the metal casing 1. The internal hexagon bolt 4 and the internal threaded sleeve 20 are threadedly engaged. A first heat sink 11 is fixedly installed on the inner side of the metal casing 1. A chip 9 is mounted on the top of the first heat sink 11. A first thermally conductive silicone pad 10 is disposed in contact between the first heat sink 11 and the chip 9. A second heat sink 13 is fixedly installed on the inner side of the metal top cover 2. A second thermally conductive silicone pad 14 is disposed in contact between the second heat sink 13 and the chip 9. Heat sinks 3 are disposed on the outer sides of both the metal casing 1 and the metal top cover 2. Positioning rods 12 are fixedly installed at the four corners of the upper surface of the first heat sink 11, and the positioning rods 12 are matched and correspond to the positions of the chip 9.

[0021] In this embodiment: the internal hex bolt 4 is threadedly installed on the metal top cover 2, allowing the internal hex bolt 4 to remain inside the metal top cover 2 during disassembly, preventing complete detachment. An anti-loss rope 17 is provided to connect the metal outer shell 1 to the metal top cover 2, preventing the loss of the metal top cover 2 and the internal hex bolt 4 during maintenance. Positioning rods 12 at the four corners of the first heat sink 11 are used to restrict the position of the chip 9, better protecting it from displacement due to shaking. The heat from the chip 9 is transferred from the first thermally conductive silicone pad 10 to the first heat sink 11 and the second heat sink 13, respectively, through the first and second heat sinks 11 and 13. The heat is then quickly transferred to the corresponding heat sink 3 for heat dissipation, improving the heat dissipation effect.

[0022] As a technical optimization of this utility model, both the first heat sink 11 and the second heat sink 13 are coated with thermally conductive silicone grease between themselves and the adjacent corresponding heat sink 3 for contact installation.

[0023] In this embodiment, by setting the heat sink 3, the heat transferred from the first heat sink 11 and the second heat sink 13 can be dissipated, thereby improving the heat dissipation effect of the heat sink 3.

[0024] As a technical optimization of this utility model, two sockets 19 are fixedly installed on the inner side of the metal shell 1. The two sockets 19 are symmetrically distributed on the inner side wall of the metal shell 1. Two docking seats 18 are fixedly installed on the inner side of the metal top cover 2. The two docking seats 18 correspond one-to-one with the two sockets 19. The docking seats 18 and the sockets 19 are connected by insertion.

[0025] In this embodiment: by setting the docking seat 18 and the socket 19, when assembling the metal top cover 2 and the metal outer shell 1, the docking seat 18 provided on the inner side of the metal top cover 2 and the socket 19 provided on the inner side of the metal outer shell 1 can be inserted into each other, which plays a role in limiting the position of the metal top cover 2 and preventing the assembly from being offset.

[0026] As a technical optimization of this utility model, an insulating sleeve 5 is provided between the metal shell 1 and the metal top cover 2, and a pin 6 is fixedly installed on the inner side of the insulating sleeve 5; a first connecting seat 7 is fixedly installed on one side of the insulating sleeve 5, the first connecting seat 7 is electrically connected to the pin 6, and a conductive rod 15 is sleeved on the inner side of the first connecting seat 7; a second connecting seat 8 is fixedly installed on the top of the chip 9, and the inner side of the second connecting seat 8 is sleeved with the conductive rod 15, and the second connecting seat 8 is electrically connected to the first connecting seat 7 through the conductive rod 15.

[0027] In this embodiment: by setting the insulating sleeve 5, the pin 6 can be insulated from the metal shell 1 and the metal top cover 2. The conductive rod 15 can electrically connect the second connector 8 to the first connector 7. It also facilitates disassembly and assembly and avoids the situation where the wires break due to pulling during welding.

[0028] As a technical optimization of this utility model, an insulating positioning block 16 is fixedly installed on the inner side of the metal top cover 2, and the bottom of the insulating positioning block 16 is pressed and abutted against the conductive rod 15.

[0029] In this embodiment: by setting an insulating positioning block 16, when the metal top cover 2 and the metal outer shell 1 are assembled, the insulating positioning block 16 on the inner side of the metal top cover 2 can press and position the conductive rod 15, so that the conductive rod 15 can stably connect the second connector 8 on the top of the chip 9 and the first connector 7 at one end of the pin 6.

[0030] Working principle: During use, when maintenance is required, the hex bolt 4 is loosened to disengage from the internal thread sleeve 20, while retaining the threaded connection between the hex bolt 4 and the metal top cover 2. The metal top cover 2 is then removed from the metal outer shell 1. The anti-loss rope 17 allows the metal top cover 2 to be hung on one side of the metal outer shell 1, preventing the loss of the metal top cover 2 and the hex bolt 4. This facilitates the reconnection and installation of the metal top cover 2 to the metal outer shell 1 after maintenance. The heat from the chip 9 is transferred to the first heat sink 11 and the second heat sink 13 through the first thermally conductive silicone pad 10 and the second thermally conductive silicone pad 14, respectively. The heat is then quickly transferred to the adjacent heat sink 3 for heat dissipation, resulting in better heat dissipation. Thermal grease is applied between the heat sink 3 and the corresponding first heat sink 11 and second heat sink 13 for contact installation, which can better improve thermal conductivity.

[0031] All standard parts used in this utility model can be purchased from the market. Irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as riveting and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to those skilled in the art. All electrical equipment in this utility model is powered by an external power source.

[0032] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high thermal conductivity silicon carbide device package structure comprising a metal top cap (2) mounted on top of a metal housing (1), characterized in that: The inner side of the metal shell (1) is fixedly connected with an anti-lost rope (17), the other end of the anti-lost rope (17) is fixedly connected with the inner side of the metal top cover (2), the inner side of the metal top cover (2) is threadedly installed with an internal hexagonal bolt (4), the inner side of the metal shell (1) is fixedly installed with an internal threaded sleeve (20), the internal hexagonal bolt (4) is matched with the internal threaded sleeve (20) to be threadedly sleeved, the inner side of the metal shell (1) is fixedly installed with a first heat dissipation plate (11), the top of the first heat dissipation plate (11) is installed with a chip (9), the first heat dissipation plate (11) and the chip (9) are in contact with each other and are provided with a first heat-conducting silica gel sheet (10), the inner side of the metal top cover (2) is fixedly installed with a second heat dissipation plate (13), the second heat dissipation plate (13) and the chip (9) are in contact with each other and are provided with a second heat-conducting silica gel sheet (14), the outer sides of the metal shell (1) and the metal top cover (2) are provided with heat dissipation fins (3), the upper surface of the first heat dissipation plate (11) is fixedly installed with a positioning rod (12) at four corners, and the positioning rod (12) is positionally matched with the chip (9).

2. The high thermal conductivity silicon carbide device package structure of claim 1, wherein: The first heat dissipation plate (11) and the second heat dissipation plate (13) are in contact with each other and are provided with heat-conducting silicon grease between the adjacent corresponding heat dissipation fins (3).

3. The high thermal conductivity silicon carbide device package structure of claim 1, wherein: The inner side of the metal shell (1) is fixedly installed with two connector sockets (19), and the two connector sockets (19) are symmetrically distributed on the inner side wall of the metal shell (1); the inner side of the metal top cover (2) is fixedly installed with two counter sockets (18), and the two counter sockets (18) are positionally corresponding to the two connector sockets (19); and the counter socket (18) and the connector socket (19) are insertedly arranged.

4. The high thermal conductivity silicon carbide device package structure of claim 1, wherein: The metal shell (1) and the metal top cover (2) are provided with an insulating sleeve (5), and the inner side of the insulating sleeve (5) is fixedly installed with a pin (6).

5. The high thermal conductivity silicon carbide device package structure of claim 4, wherein: One side of the insulating sleeve (5) is fixedly installed with a first connecting seat (7), the first connecting seat (7) is electrically connected with the pin (6), and the inner side of the first connecting seat (7) is sleeved with a conductive rod (15).

6. The high thermal conductivity silicon carbide device package structure of claim 5, wherein: The top of the chip (9) is fixedly installed with a second connecting seat (8), the inner side of the second connecting seat (8) is sleeved with the conductive rod (15), and the second connecting seat (8) is electrically connected with the first connecting seat (7) through the conductive rod (15).

7. The high thermal conductivity silicon carbide device package structure of claim 5, wherein: The inner side of the metal top cover (2) is fixedly installed with an insulating positioning block (16), and the bottom of the insulating positioning block (16) is extruded against the conductive rod (15).

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