Separating device and laser processing equipment

Abstract

The utility model belongs to the technical field of laser processing, and particularly relates to a separating device and laser processing equipment. The separating device comprises a mounting part, a bearing assembly, a turning-up attaching assembly and a turning-up driving part. The bearing assembly is used for fixing a workpiece with machining marks. The turning-up attaching assembly is used for being attached to the upper surface of the workpiece in the thickness direction and is arranged on the mounting component; the turning-up driving piece can be in transmission connection with the turning-up attaching assembly so as to drive the turning-up attaching assembly to turn up relative to the bearing assembly, and the part, used for being attached to the upper surface of the workpiece, of the turning-up attaching assembly can elastically deform. The utility model further provides laser processing equipment. The laser processing equipment comprises the separation device. According to the invention, the wafer can be protected.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of laser processing, and more particularly relates to a separating device and a laser processing equipment. BACKGROUND

[0002] After laser slicing, a crystal ingot needs to be subjected to a separating process to obtain a wafer. At present, a conventional separating process is to fix the crystal ingot on a carrier, then adsorb the upper surface of the crystal ingot by an adsorption plate of a vacuum adsorption device, and separate the wafer from the crystal ingot along the processing trace on the crystal ingot in the vertical direction. When the separating process is performed, the local wafer may be adhered to the crystal ingot, and the adsorption plate continues to pull the wafer in the vertical direction, which may easily cause the wafer to be broken. CONTENT OF THE UTILITY MODEL

[0003] The application embodiment provides a separating device and a laser processing equipment, which can protect the wafer.

[0004] The technical scheme adopted by the application embodiment is as follows: a separating device is provided, which comprises:

[0005] a mounting component;

[0006] a placing assembly for placing a workpiece with a processing trace;

[0007] a turning-up and attaching assembly for being attached to the upper surface of the workpiece in the thickness direction, which is arranged on the mounting component;

[0008] a turning-up driving member, which is in transmission connection with the turning-up and attaching assembly, so as to drive the turning-up and attaching assembly to turn up relative to the placing assembly, and make the part of the turning-up and attaching assembly for being attached to the upper surface of the workpiece to be elastically deformed.

[0009] A separating device comprises:

[0010] a mounting component;

[0011] a placing assembly for placing a workpiece with a processing trace;

[0012] a turning-up and attaching assembly for being attached to the upper surface of the workpiece in the thickness direction, which is rotatably arranged on the mounting component;

[0013] a turning-up driving member, which is in transmission connection with the turning-up and attaching assembly, so as to drive the turning-up and attaching assembly to turn up relative to the placing assembly, and make the part of the turning-up and attaching assembly for being attached to the upper surface of the workpiece to be elastically deformed.

[0014] A separating device comprises:

[0015] a mounting component;

[0016] A holding assembly for holding a workpiece having a machining trace;

[0017] A flip-up attaching assembly for attaching to an upper surface of the workpiece in a thickness direction, provided on the mounting member;

[0018] A flip-up driving member, which is in driving connection with the flip-up attaching assembly to drive the flip-up attaching assembly to flip up relative to the holding assembly and to cause a portion of the flip-up attaching assembly for attaching to the upper surface of the workpiece to elastically deform;

[0019] A fulcrum of the flip-up attaching assembly relative to the holding assembly is at a connection between the flip-up attaching assembly and the mounting member, and the fulcrum is located at the portion of the flip-up attaching assembly for attaching to the upper surface of the workpiece.

[0020] Optionally, a fulcrum of the flip-up attaching assembly relative to the holding assembly is at a connection between the flip-up attaching assembly and the mounting member, and the fulcrum is located at the portion of the flip-up attaching assembly for attaching to the upper surface of the workpiece.

[0021] Optionally, the flip-up attaching assembly is detachably connected with the mounting member.

[0022] Optionally, the flip-up driving member is in plurality, and each of the flip-up driving members is in driving connection with different positions of the flip-up attaching assembly to drive the flip-up attaching assembly to flip up relative to the holding assembly at different positions.

[0023] Optionally, the fulcrum is located at a middle of the portion of the flip-up attaching assembly for attaching to the upper surface of the workpiece, and each of the flip-up driving members is circumferentially distributed around the fulcrum.

[0024] Optionally, the flip-up attaching assembly comprises:

[0025] A flip-up member, which is provided on the mounting member and is in driving connection with the flip-up driving member;

[0026] An attaching member for attaching to the upper surface of the workpiece in the thickness direction and capable of elastically deforming, which is provided on the flip-up member.

[0027] Optionally, the flip-up member is rotatably provided on the mounting member.

[0028] Optionally, the attaching member comprises a cover portion and an adhesive layer for attaching to the upper surface of the workpiece, the cover portion is mounted on the flip-up member, and the adhesive layer is provided on a side of the cover portion close to the upper surface of the workpiece.

[0029] Optionally, the adhesive attachment further includes an adsorption part for eliminating air bubbles between the cover and the adhesive layer, wherein the cover is provided with suction holes and the adsorption part communicates with the suction holes of the cover.

[0030] Optionally, the flip-up attachment assembly further includes a fixing member. The flip-up member is provided with a limiting groove, the attachment is disposed in the limiting groove, the fixing member is installed on the flip-up member, and the fixing member abuts against the attachment to fix the attachment.

[0031] Optionally, the fixing member includes a hinged mounting part and a pressing part. The hinged mounting part is mounted on the flip-up member and is hinged to the pressing part. The pressing part is used to press the adhesive attachment to fix the adhesive attachment.

[0032] Optionally, the mounting component is provided with a horizontal adjustment element, which is used to support the flipping component.

[0033] Optionally, the mounting component is provided with an angle limiting member, and the angle limiting member is provided with an inclined surface, which is used to abut against the flipping component to control the flipping angle of the flipping component.

[0034] Optionally, the flipping drive includes a push drive and a push part. The push part is used to abut against the flipping member. The push drive is connected to the push part in a transmission manner to drive the push part to push the flipping member, so that the flipping member flips up relative to the supporting component.

[0035] Optionally, the flip-up attachment component is rotatably disposed on the mounting component.

[0036] Optionally, the supporting assembly includes a lifting component and a support component for supporting and fixing the workpiece, wherein the lifting component is throttledly connected to the support component to drive the support component to move along the height direction of the separating device.

[0037] This application also provides a laser processing apparatus, including the separation device described in any of the above embodiments.

[0038] The beneficial effects of the separation device and laser processing equipment provided in this application are as follows: In the separation device implemented in this application, the flip-up attachment component adheres to the upper surface of the ingot. Then, the flip-up drive component drives the flip-up attachment component to flip up relative to the supporting component. During this process, a portion of the flip-up attachment component that adheres to the upper surface of the ingot undergoes elastic deformation. The flip-up attachment component drives the portion of the ingot surface up to the processing mark from the edge to flip up and undergo elastic deformation, thereby peeling off the sheet-like wafer from the ingot along the processing mark. In this process, the flip-up attachment component can undergo elastic deformation together with the wafer, providing support for the wafer during elastic deformation, preventing damage to the wafer, and protecting the wafer.

[0039] The laser processing equipment of this application embodiment includes the separation device described above, and therefore has the beneficial effects brought about by the separation device, which will not be repeated here. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a three-dimensional structural schematic diagram of the separation device provided in the embodiments of this application;

[0042] Figure 2 A front view of the separation device provided in the embodiments of this application;

[0043] Figure 3 This is a three-dimensional structural schematic diagram of a separation device provided in another embodiment of this application;

[0044] Figure 4 A front view of a separation device provided in another embodiment of this application;

[0045] Figure 5 for Figure 4 A cross-sectional view along the AA direction.

[0046] The following are the labeling elements in the figure:

[0047] 1. Mounting components; 100. Workpiece; 11. Horizontal adjustment components; 12. Angle limiting components; 121. Inclined surface;

[0048] 2. Supporting components; 21. Lifting components; 22. Supporting components;

[0049] 3. Flip-up attachment component; 31. Flip-up part; 32. Attachment part; 320. Support point; 321. Cover part; 322. Adsorption part; 33. Flip-up drive part; 331. Push drive part; 332. Push part; 34. Fixing part; 341. Hinge mounting part; 342. Pressing part. Detailed Implementation

[0050] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0051] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0052] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0053] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0054] Please see Figures 1 to 5 The separation device provided in the embodiments of this application will now be described.

[0055] The separation device provided in this application includes an installation component 1, a support component 2, a flip-up attachment component 3, and a flip-up drive component 33.

[0056] The support assembly 2 is used to support the workpiece 100 with processing marks. The aforementioned workpiece 100 can be a crystal ingot (such as a silicon carbide crystal ingot) or a stacked wafer, or it can be a workpiece 100 formed by stacking other sheet-like or block-like materials to be separated. The separation device provided in the embodiments of this application can be used in the stripping process after crystal ingot peeling.

[0057] After processing (such as laser processing), a silicon carbide ingot (i.e., workpiece 100) will have processing marks, which may contain multiple cracks. These processing marks can be located within a specified depth range of the silicon carbide ingot.

[0058] Processing marks are used to divide a silicon carbide ingot into multiple parts (i.e., sub-components). It should be understood that although the silicon carbide ingot has been processed and processing marks have been formed, the parts are still connected together and require subsequent stripping processes.

[0059] A flip-up attachment assembly 3, designed to adhere to the upper surface of the workpiece 100 in the thickness direction H (which is also the height direction H of the separating device), is disposed on the mounting component 1. A flip-up drive 33 is driveably connected to the flip-up attachment assembly 3 to drive the flip-up attachment assembly 3 to flip relative to the supporting component 2, causing elastic deformation of the portion of the flip-up attachment assembly 3 used to adhere to the upper surface of the workpiece 100. Specifically, the flip-up attachment assembly 3 flipping relative to the supporting component 2 can be either the entire flip-up attachment assembly 3 flipping relative to the supporting component 2, or a portion of the flip-up attachment assembly 3 flipping relative to the supporting component 2. If the mounting component 1 remains stationary relative to the supporting component 2, then the flip-up attachment assembly 3 flipping relative to the supporting component 2 is also considered a flipping relative to the mounting component 1.

[0060] The mounting component 1 in this embodiment may include a tray and several support columns. The support columns are connected to the tray to support the tray. The tray is used to support the flip-up attachment component 3. The flip-up attachment component 3 can be hinged to the tray via a hinge to enable the flip-up attachment component 3 to be rotatably mounted on the mounting component 1, so that the flip-up attachment component 3 can be flipped up relative to the supporting component 2 as a whole.

[0061] The mounting component 1 may also include several pillars and several telescopic guides. The pillars are connected to the flip-up attachment component 3 through the telescopic guides. The flip-up drive component 33 is connected to the flip-up attachment component 3 in a transmission connection to drive a part of the flip-up attachment component 3 to flip up relative to the support component 2.

[0062] The support component 2 is located below the flip-up attachment component 3 and is used to support the workpiece 100. The support component 2 can be a worktable connected to an external vacuum device, which fixes the workpiece 100 by vacuum adsorption. Of course, the support component 2 can also be a clamping component, which fixes the workpiece 100 by clamping.

[0063] The flip-up attachment component 3 can be a plate with adhesive on its surface, and the adhesive side of the plate is attached to the upper surface of the workpiece 100.

[0064] The flip-up attachment assembly 3 has a portion for attaching to the upper surface of the workpiece 100, which is capable of elastic deformation and can be a glass plate, a sapphire plate, or a spring steel plate.

[0065] For silicon carbide or sapphire ingots, the portion of their surface extending to the processing marks is thin and can undergo elastic deformation as they are flipped up and attached to component 3.

[0066] After the workpiece 100 is placed on the support component 2, the support component 2 fixes the lower surface of the workpiece 100. The flip-up attachment component 3 is moved to the upper surface of the workpiece 100 so that the flip-up attachment component 3 is attached to the upper surface of the workpiece 100. The flip-up drive component 33 drives the flip-up attachment component 3 to flip up. The flip-up attachment component 3 will cause the surface of the workpiece 100 to the part of the machining mark to flip up from the edge and undergo elastic deformation, thereby peeling off the sheet-like sub-component (such as a wafer) from the workpiece 100 along the machining mark. In this process, the flip-up attachment component 3 can undergo elastic deformation together with the sub-component, play a supporting role for the sub-component in elastic deformation, prevent the sub-component from being damaged, and protect the sub-component.

[0067] Please see Figure 1 , Figure 2 When the entire flip-up attachment component 3 is flipped up relative to the support component 2, the flip-up attachment component 3 is rotatably mounted on the mounting component 1.

[0068] The flip-up attachment component 3 is rotatably mounted on the mounting component 1, that is, the flip-up attachment component 3 is rotatably connected to the mounting component 1. The flip-up attachment component 3 will rotate around the connection point of the mounting component 1, which can prevent the components on the flip-up attachment component 3 from crushing the edge of the sub-component after the sub-component (such as a wafer) is peeled off, thus protecting the sub-component and improving product quality.

[0069] Please see Figures 3 to 5 When a portion of the flip-up attachment component 3 is flipped up relative to the support component 2, the connection point between the flip-up attachment component 3 and the mounting component 1 is the fulcrum 320 for the flip-up attachment component 3 to flip up relative to the support component 2. The fulcrum 320 is located on the portion of the flip-up attachment component 3 used to adhere to the upper surface of the workpiece 100.

[0070] The flipping drive 33 drives the flipping attachment assembly 3 to rotate around the pivot point 320, thereby flipping up a part of the flipping attachment assembly 3. The flipping attachment assembly 3 will cause the surface of the workpiece 100 to be flipped up from the edge of the machining mark and undergo elastic deformation, thereby peeling off the sheet-like sub-component (such as a wafer) from the workpiece 100 along the machining mark.

[0071] The attachment component 3 is detachably connected to the mounting component 1.

[0072] The flip-up attachment component 3 and the mounting component 1 can be detachably connected by bolts or by inserting a rod, so that after the sub-component is peeled off from the workpiece 100, the flip-up attachment component 3 can be removed from the mounting component 1, and the sub-component can be removed from the flip-up attachment component 3.

[0073] There are multiple flip-up drive components 33, and each flip-up drive component 33 can be connected to different positions of the flip-up attachment component 3 to drive the flip-up attachment component 3 to flip up relative to the support component 2 at different positions.

[0074] By driving the flipping and attaching assembly 3 relative to the supporting assembly 2 with multiple flipping drive components 33, the efficiency of the separation process can be improved. The flipping drive component 33 can be a linear motor, a cylinder, or an electric cylinder, and its drive shaft is connected to the flipping and attaching assembly 3 to drive the flipping and attaching assembly 3 to flip relative to the supporting assembly 2.

[0075] The pivot point 320 is located in the middle of the part of the flip-up attachment assembly 3 that is used to attach to the upper surface of the workpiece 100, and each flip-up drive member 33 is distributed in a circumferential array around the pivot point 320.

[0076] Multiple flipping drive units 33 are arranged in a circumferential array around the fulcrum 320. The multiple flipping drive units 33 drive the edge of the flipping attachment component 3 to flip up, thereby flipping up the edge of the sub-component from the workpiece 100, and then separating the sub-component from the workpiece 100. It can flip up the surface of the workpiece 100 to the part with the processing marks at various positions at the same time, which can improve the quality of the obtained sheet-like sub-components (such as wafers).

[0077] The circumferential array distribution of the flipping drive component 33 around the fulcrum 320 can make the upper surface of the workpiece 100 more uniformly stressed, preventing uneven local stress on the workpiece 100 from causing sub-components to break and reducing the yield rate of production.

[0078] Flip-up attachment component 3 includes:

[0079] The flipping component 31 is disposed on the mounting component 1 and can be connected to the flipping drive component 33 in a transmission manner;

[0080] An attachment 32, which is used to adhere to the upper surface of the workpiece 100 in the thickness direction and is capable of elastic deformation, is provided on the flip-up part 31.

[0081] In this embodiment, the flip-up component 31 can be a plate with mounting holes or limiting grooves for mounting the attachment 32. The attachment 32 can be a glass plate, sapphire plate, or spring steel plate with adhesive coating. The attachment 32 is detachably engaged in the limiting groove or mounting hole of the flip-up component 31, which facilitates the removal and replacement of the attachment 32, making it easier to remove the separated sub-components from the workpiece 100.

[0082] Please see Figure 1 , Figure 2 When the entire flip-up attachment component 3 is flipped up relative to the support component 2, the flip-up component 31 is rotatably mounted on the mounting component 1.

[0083] The lifting component 31 can be rotatably mounted on the mounting component 1 via a hinge, and the lifting component 31 can also be connected to the mounting component 1 via a rotary motor.

[0084] The attachment 32 includes a cover portion 321 and an adhesive layer (not shown) for adhering to the upper surface of the workpiece 100. The cover portion 321 is mounted on the flip-up part 31, and the adhesive layer is disposed on the side of the cover portion 321 near the upper surface of the workpiece 100.

[0085] The adhesive layer can be a double-sided pyrolytic film, a UV film, etc. The double-sided pyrolytic film can be removed from the cover part 321 by heating, and the UV film can be removed from the cover part 321 by UV irradiation to destroy the internal properties of the film.

[0086] The cover portion 321 can be a glass plate, a sapphire plate, a spring steel plate, an aluminum plate, or a ceramic substrate. The adhesive layer is the part of the flip-up attachment assembly 3 used to adhere to the upper surface of the workpiece 100.

[0087] Compared to peeling the sub-component from the workpiece 100 by adhering it to the upper surface of the workpiece 100 through vacuum adsorption, peeling the sub-component from the workpiece 100 by adhering it to the upper surface of the workpiece 100 through an adhesive layer can prevent damage to the sub-component caused by vacuum breaking.

[0088] The attachment 32 also includes an adsorption part 322 for eliminating air bubbles between the cover part 321 and the adhesive layer. The cover part 321 is provided with a suction hole, and the adsorption part 322 communicates with the suction hole of the cover part 321.

[0089] Air bubbles are easily generated during the process of the adhesive layer adhering to the cover portion 321. During the separation of the workpiece 100, these air bubbles may cause the adhesive layer to separate from the cover portion 321, resulting in the failure of the workpiece 100 separation process.

[0090] The suction hole of the cover portion 321 extends from the outer side wall of the cover portion 321 to the side of the cover portion 321 that is in contact with the adhesive layer.

[0091] The adsorption unit 322 can be a suction cup or suction tube that is connected to an external vacuum device.

[0092] The adsorption section 322 eliminates air bubbles between the cover section 321 and the adhesive layer, which can improve the success rate of the workpiece 100 separation process.

[0093] Preferably, the flip-up attachment assembly 3 further includes a fixing member 34. The flip-up member 31 is provided with a limiting groove, the attachment 32 is disposed in the limiting groove, the fixing member 34 is installed on the flip-up member 31, and the fixing member 34 abuts against the attachment 32 to fix the attachment 32.

[0094] After the separation process of workpiece 100 is completed, the attachment 32 needs to be separated from the separated sub-component. Therefore, the attachment 32 needs to be removed from the lifting part 31 to separate the attachment 32 from the separated sub-component. The attachment 32 is fixed to the limiting groove in the lifting part 31 by the fastener 34 to facilitate the removal of the attachment 32.

[0095] The fixing member 34 may include a lifting drive and a contact part. The lifting drive is mounted on the flipping member 31, and the contact part is used to abut against the side of the attachment 32 facing away from the workpiece 100. The lifting drive is driven to move the contact part closer to or away from the attachment 32. The lifting drive moves the contact part closer to the attachment 32 to press and fix the attachment 32 in the limiting groove of the flipping member 31, and vice versa, to release the attachment 32. The lifting drive can be a cylinder, a hydraulic cylinder, or a linear motor.

[0096] Preferably, the fastener 34 includes a hinged mounting portion 341 and a pressing portion 342. The hinged mounting portion 341 is mounted on the flip-up member 31, and the hinged mounting portion 341 is hinged to the pressing portion 342. The pressing portion 342 is used to press the attachment 32 to fix the attachment 32.

[0097] The pressing part 342 uses the hinged mounting piece as a flipping fulcrum. The pressing part 342 can fix the attachment 32 by its own weight or by the pressure of the hinged mounting piece. When the pressing part 342 flips to the side of the attachment 32 facing away from the workpiece 100, the pressing part 342 can fix the attachment 32 in the limiting groove of the flipping part 31. When the pressing part 342 flips in the opposite direction, the attachment 32 can be released.

[0098] Preferably, the mounting component 1 is provided with a horizontal adjustment component 11, which is used to support the flipping component 31.

[0099] The horizontal adjustment component 11 can maintain the parallelism between the attachment 32 and the upper surface of the workpiece 100 when the flip-up component 31 covers the upper surface of the workpiece 100, so as to improve the adhesion effect between the attachment 32 and the upper surface of the workpiece 100 and increase the success rate of the workpiece 100 separation process.

[0100] The horizontal adjustment component 11 can be a number of linear motors supporting the tilting component 31, or it can be a number of screws threadedly connected to the mounting component 1.

[0101] Please see Figure 1 , Figure 2When the entire flip-up attachment component 3 is flipped up relative to the support component 2, an angle limiting component 12 may be provided on the mounting component 1. An inclined surface 121 is provided on the angle limiting component 12. The inclined surface 121 is used to abut against the flip-up component 31 to control the flip-up angle of the flip-up component 31.

[0102] The angle limiting member 12 prevents the flip-up member 31 from interfering with other devices after it flips up relative to the supporting component 2. The angle limiting member 12 can be installed on the leveling member 11.

[0103] The flipping drive 33 includes a push drive part 331 and a push part 332. The push part 332 is used to abut against the flipping member 31. The push drive part 331 and the push part 332 are connected in a transmission manner to drive the push part 332 to push the flipping member 31, so that the flipping member 31 flips up relative to the supporting component 2.

[0104] The drive unit 331 is located below the tilting member 31, and can be a cylinder, an electric cylinder, or a linear motor. The push unit 332 can be a push rod connected to the drive shaft of the drive unit 331.

[0105] The drive unit 331 drives the drive unit 332 to approach the flip-up part 31, which can push the flip-up part 31 to flip it up, thereby allowing the attachment 32 to separate the sub-part from the workpiece 100.

[0106] Preferably, the supporting component 2 includes a lifting member 21 and a supporting member 22 for supporting and fixing the workpiece 100. The lifting member 21 is connected to the supporting member 22 in a transmission manner to drive the supporting member 22 to move along the height direction of the separation device.

[0107] The lifting component 21 can be a cylinder, an electric cylinder, or a linear motor. The supporting component 22 can adopt the same structure as the attached accessory 32.

[0108] The lifting component 21 can drive the supporting component 22 to move along the thickness direction H of the workpiece 100 (which is also the height direction H of the separation device) according to the thickness of the workpiece 100, so as to keep the height of the upper surface of the workpiece 100 consistent, which facilitates the attachment 32 to be attached to the upper surface of the workpiece 100. The lifting component 21 improves the compatibility of the separation device.

[0109] In some other embodiments, the flip-up attachment component 3 is placed directly on the mounting component 1, and the edge of the flip-up attachment component 3 is directly supported by the mounting component 1. This can also prevent the edge of the fragmented sub-component (such as the wafer) from being crushed by the flip-up attachment component 3 after the wafer is peeled off.

[0110] The separation device provided in the embodiments of this application can protect the sub-components separated from the workpiece 100 and improve product quality.

[0111] This application also provides a laser processing device, including the separation device described above.

[0112] The laser processing equipment of this application includes the separation device in any of the above embodiments, and therefore has the beneficial effects brought by the separation device in any of the above embodiments, which will not be repeated here.

[0113] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A separating device, characterized in that The utility model relates to a workpiece processing device, comprising: a mounting component; a placing assembly for placing a workpiece with machining traces; a flip-attached assembly for abutting against an upper surface of the workpiece in a thickness direction, which is arranged on the mounting component; a flip driving component, which is in driving connection with the flip-attached assembly to drive the flip-attached assembly to flip relative to the placing assembly and cause the part of the flip-attached assembly for abutting against the upper surface of the workpiece to elastically deform.

2. The separation device of claim 1, wherein, The connection between the flip-attached assembly and the mounting component is the fulcrum of the flip-attached assembly relative to the placing assembly, and the fulcrum is located in the part of the flip-attached assembly for abutting against the upper surface of the workpiece.

3. The separation device of claim 2, wherein, The number of the flip driving components is plural, and each flip driving component is in driving connection with different positions of the flip-attached assembly to drive the flip-attached assembly to flip relative to the placing assembly at different positions.

4. The separation device of claim 3, wherein, The fulcrum is located in the middle of the part of the flip-attached assembly for abutting against the upper surface of the workpiece, and each flip driving component is distributed in a circumferential array around the fulcrum.

5. The separation device of claim 1, wherein, The flip-attached assembly comprises: a flip component, which is arranged on the mounting component and in driving connection with the flip driving component; a attaching component for abutting against the upper surface of the workpiece in the thickness direction and capable of elastically deforming, which is arranged on the flip component.

6. The separation device of claim 5, wherein, The flip component is rotatably arranged on the mounting component.

7. The separation device of claim 5, wherein, The attaching component comprises a cover part and an adhesive layer for abutting against the upper surface of the workpiece, the cover part is mounted on the flip component, and the adhesive layer is arranged on the side of the cover part close to the upper surface of the workpiece.

8. The separation device of claim 7, wherein, The attaching component further comprises a suction part for eliminating air bubbles between the cover part and the adhesive layer, the cover part is provided with suction holes, and the suction part is in communication with the suction holes of the cover part.

9. The separation device of claim 5, wherein, The flip-attached assembly further comprises a fixing component, the flip component is provided with a limiting groove, the attaching component is arranged in the limiting groove, and the fixing component is mounted on the flip component and in abutment with the attaching component to fix the attaching component.

10. The separation device of claim 9, wherein, The fixing component comprises a hinged mounting part and a pressing part, the hinged mounting part is mounted on the flip component, the hinged mounting part is hinged with the pressing part, and the pressing part is used for pressing the attaching component to fix the attaching component.

11. The separation device of claim 5, wherein, The mounting component is provided with a horizontal adjusting component for supporting the flip component.

12. The separation device of claim 5, wherein, The mounting component is provided with an angle limiting component, the angle limiting component is provided with an inclined surface for abutting against the flip component to control the flip angle of the flip component.

13. The separation device of claim 5, wherein, The flip driving component comprises a pushing driving part and a pushing part, the pushing part is used for abutting against the flip component, and the pushing driving part is in driving connection with the pushing part to drive the pushing part to push the flip component to flip relative to the placing assembly.

14. The separation device of claim 2, wherein, The flip-attached assembly is detachably connected with the mounting component.

15. The separation device of claim 1, wherein, The flip-attached assembly is rotatably arranged on the mounting component.

16. The separation device according to any one of claims 1 to 15, characterized in that The supporting assembly comprises a lifting member and a supporting member for supporting and fixing the workpiece, and the lifting member is in transmission connection with the supporting member to drive the supporting member to move along the height direction of the separating device.

17. A laser processing apparatus characterized by comprising: The separating device comprises the supporting assembly according to any one of claims 1-16.

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