Chip punching device

Abstract

The utility model discloses a chip punching device, which belongs to the technical field of chip punching and comprises a positioning part, the positioning part comprises a positioning substrate, a mounting bottom block, a buffer cushion block and a cover plate, an adjusting part is arranged on the positioning substrate, the mounting bottom block is positioned on the adjusting part, and the buffer cushion block is positioned on the cover plate. The buffer cushion block is an elastic block and is arranged on the mounting bottom block, a containing cavity is formed in the buffer cushion block, and the cover plate is mounted on the buffer cushion block; the punching part comprises a driver, a power head and a drill bit, the driver drives the power head to enable the drill bit to be close to the chip, and the power head drives the drill bit. According to the chip punching device, precise punching processing of the chip is achieved, the positioning structure is simple, the stable positioning effect on the chip can be achieved, the punching precision of the chip is improved, punching buffering can be conducted on the chip, the problem of hard contact with the chip in the punching process is avoided, and the situation that the chip is damaged is effectively avoided.

Description

Technical Field

[0001] This utility model belongs to the field of chip punching technology, and in particular relates to a chip punching device. Background Technology

[0002] With the rapid development of electronic technology, automotive powertrain chips, as one of the core components of automobiles, face increasingly higher requirements for manufacturing precision and efficiency. During chip manufacturing, micro-holes are often punched into the chip substrate or lead frame to enable circuit connections or heat dissipation.

[0003] Currently, the punching process for chips requires the use of multiple positioning structures to position the chip before punching to ensure punching accuracy. Furthermore, the current method often uses hard contact to punch the chip, which lacks a buffering effect and can affect the chip, potentially leading to chip damage in severe cases. Utility Model Content

[0004] This invention overcomes the shortcomings of the prior art by providing a chip punching device to solve the problems existing in the prior art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: a chip punching device, comprising...

[0006] The positioning part includes a positioning substrate, a mounting base, a buffer pad, and a cover plate. The positioning substrate is provided with an adjustment part, the mounting base is located on the adjustment part, the buffer pad is an elastic block and is provided on the mounting base, the buffer pad is provided with a receiving cavity to receive the chip, and the cover plate is installed on the buffer pad to position the chip located in the receiving cavity.

[0007] The punching section includes a driver, a power head, and a drill bit. The driver drives the power head to bring the drill bit close to the chip, and the power head drives the drill bit to punch a hole in the chip.

[0008] In a preferred embodiment of the present invention, a base plate is further included, and the positioning part and the punching part are both mounted on the base plate, and the positioning part and the punching part are located on the same straight line.

[0009] In a preferred embodiment of this utility model, a guide rail is provided on the base plate to guide the power head.

[0010] In a preferred embodiment of the present invention, the positioning substrate is an L-shaped structure, and the adjustment part is mounted laterally on the positioning substrate.

[0011] In a preferred embodiment of the present invention, the adjustment unit includes a first adjustment platform, a second adjustment platform, and a third adjustment platform, which are stacked sequentially, and the mounting base is located on the third adjustment platform.

[0012] In a preferred embodiment of this utility model, a buffer spring is provided on the mounting base block, and the buffer spring corresponds to the position of the receiving cavity to buffer the chip.

[0013] In a preferred embodiment of this utility model, the cover plate is connected to the buffer pad block by a nut to fix the receiving cavity.

[0014] This utility model solves the defects existing in the background technology, and has the following beneficial effects:

[0015] The chip punching device of this utility model achieves precise punching of chips. Its positioning structure is simple and can provide a stable positioning effect for the chip, thereby improving the punching accuracy. It can also buffer the chip during punching to avoid hard contact with the chip and effectively prevent chip damage. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0017] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present invention;

[0018] Figure 2 This is a front view of a preferred embodiment of the present invention;

[0019] Figure 3 This is a partial structural schematic diagram of a preferred embodiment of the present invention;

[0020] Figure 4 for Figure 3 The main view;

[0021] In the figure: 10, positioning part; 11, positioning base plate; 12, mounting base block; 13, buffer pad; 131, receiving cavity; 14, cover plate; 20, punching part; 21, driver; 22, power head; 23, drill bit; 30, adjustment part; 31, first adjustment platform; 32, second adjustment platform; 33, third adjustment platform; 40, base plate; 41, guide rail; 50, buffer spring. Detailed Implementation

[0022] The following drawings will disclose several embodiments of this utility model. For clarity, many physical details will be described in the following description. However, it should be understood that these physical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these physical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0023] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described with the same technical terms and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0024] This embodiment provides a chip punching device that enables precise punching of chips. Its positioning structure is simple and can provide a stable positioning effect for the chip, thereby improving the punching accuracy. It can also buffer the chip during punching to avoid hard contact with the chip and effectively prevent chip damage.

[0025] Combination Figures 1 to 4 As shown, the chip punching device of this embodiment includes a positioning part 10 and a punching part 20. The positioning part 10 completes the positioning process of the chip, and then the punching part 20 punches holes in the chip.

[0026] In this embodiment, the chip punching device further includes a base plate 40, a positioning part 10 and a punching part 20, both of which are mounted on the base plate 40, and the positioning part 10 and the punching part 20 are located on the same straight line so that the punching part 20 can punch the chip.

[0027] Combination Figure 1 and Figure 3As shown, the positioning part 10 of this embodiment includes a positioning base plate 11, a mounting base 12, a buffer pad 13, and a cover plate 14. An adjustment part 30 is provided on the positioning base plate 11, the mounting base 12 is located on the adjustment part 30, the buffer pad 13 is an elastic block and is provided on the mounting base 12, and the buffer pad 13 is provided with a receiving cavity 131 to receive the chip. The cover plate 14 is installed on the buffer pad 13 to position the chip located in the receiving cavity 131. In this embodiment, the chip is placed in the receiving cavity 131. A buffer spring 50 is provided on the mounting base 12. The buffer spring 50 corresponds to the position of the receiving cavity 131. The buffer spring 50 presses and positions the chip, and the buffer spring 50 can buffer the chip during the punching process. In this embodiment, the buffer pad 13 is an elastic block, which can further buffer the chip during punching, thus further protecting the chip during punching.

[0028] In this embodiment, the cover plate 14 is connected to the buffer pad 13 by a nut to fix the receiving cavity 131, thereby fixing one side of the chip and buffering the other side by the buffer pad 13, making it more stable during the punching process.

[0029] Combination Figure 1 and Figure 2 As shown, the punching section 20 of this embodiment includes a driver 21, a power head 22, and a drill bit 23. The driver 21 drives the power head 22 to bring the drill bit 23 close to the chip, and the power head 22 drives the drill bit 23 to punch a hole in the chip. A guide rail 41 is provided on the base plate 40 to guide the power head 22. After the chip is positioned, the driver 21 drives the power head 22 to bring the drill bit 23 close to the chip. At this time, the power head 22 drives the drill bit 23 to rotate at high speed. During the continuous movement of the driver 21, the drill bit 23 punches the chip. In this embodiment, the driver 21 is a hydraulic cylinder, and the power head 22 is a drive motor to realize high-speed driving of the drill bit 23.

[0030] In this embodiment, the positioning substrate 11 is an L-shaped structure, and the adjustment part 30 is mounted laterally on the positioning substrate 11. The adjustment part 30 includes a first adjustment platform 31, a second adjustment platform 32, and a third adjustment platform 33, which are stacked sequentially. The mounting base 12 is located on the third adjustment platform 33. In this embodiment, the first adjustment platform 31, the second adjustment platform 32, and the third adjustment platform 33 are all manually adjustable slides. The positions of the first adjustment platform 31, the second adjustment platform 32, and the third adjustment platform 33 are manually adjusted to adjust the position of the mounting base 12, thereby changing the position of the overall positioning part 10 to meet the punching requirements of the chip.

[0031] In actual use, the chip punching device of this embodiment places the chip in the receiving cavity 131 of the buffer pad 13, and the cover plate 14 blocks the chip. Then, the driver 21 of the punching part 20 drives the power head 22 to bring the drill bit 23 close to the chip. The power head 22 drives the drill bit 23 to punch the chip. During the punching process of the drill bit 23, the buffer pad 13 and the buffer spring 50 buffer the chip to avoid hard contact between the drill bit 23 and the chip, thus achieving protection during the chip punching process.

[0032] While the present invention has been described above with reference to various embodiments, it should be understood that many changes and modifications can be made without departing from the scope of the present invention. That is, the methods, systems, or devices discussed above are merely examples. Various configurations can be appropriately omitted, substituted, or added to various processes or components. For example, in alternative configurations, methods can be performed in a different order than described, and / or various stages can be added, omitted, and / or combined. Moreover, features described with respect to certain configurations can be combined in various other configurations. Different aspects and elements of the configuration can be combined in a similar manner. Furthermore, as technology develops, many elements are merely examples and do not limit the scope of this disclosure or the claims.

[0033] Specific details are provided in the specification to offer a thorough understanding of exemplary configurations, including implementations. However, configurations can be practiced without these specific details; for example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary detail to avoid obscuring the configuration. This description provides only exemplary configurations and does not limit the scope, applicability, or configuration of the claims. Rather, the foregoing description of the configurations will provide those skilled in the art with an enabling description for implementing the described techniques. Various changes can be made to the function and arrangement of the elements without departing from the spirit or scope of this disclosure.

[0034] Furthermore, although each operation can be described as a sequential process, many operations can be executed in parallel or simultaneously. Additionally, the order of operations can be rearranged. A process may have additional steps. Moreover, examples of methods can be implemented using hardware, software, firmware, middleware, code, hardware description languages, or any combination thereof. When implemented in software, firmware, middleware, or code, the program code or code segments used to perform the necessary tasks can be stored in a non-transitory computer-readable medium such as a storage medium and executed by a processor.

[0035] In summary, the above detailed description is intended to be exemplary and not restrictive, and it should be understood that the claims (including all equivalents) are intended to define the spirit and scope of this invention. These embodiments should be understood as illustrative only and not as limiting the scope of protection of this invention. After reading the description of this invention, those skilled in the art can make various alterations or modifications to it, and these equivalent changes and modifications also fall within the scope defined by the claims of this invention.

Claims

1. A chip punching device, characterized by Comprising A positioning part (10) comprising a positioning base plate (11), an installation bottom block (12), a buffer cushion block (13) and a cover plate (14), the positioning base plate (11) is provided with an adjusting part (30), the installation bottom block (12) is located on the adjusting part (30), the buffer cushion block (13) is an elastic block and is provided on the installation bottom block (12), the buffer cushion block (13) is provided with a containing cavity (131) for containing a chip, and the cover plate (14) is installed on the buffer cushion block (13) to position the chip in the containing cavity (131); A punching part (20) comprising a driver (21), a power head (22) and a drill bit (23), the driver (21) drives the power head (22) to drive the drill bit (23) to punch a chip.

2. A chip punching device according to claim 1, characterized in that Further comprising a bottom plate (40), the positioning part (10) and the punching part (20) are installed on the bottom plate (40), and the positioning part (10) and the punching part (20) are located on the same straight line.

3. A chip punching device according to claim 2, characterized in that The bottom plate (40) is provided with a guide rail (41) to guide the power head (22).

4. The chip punching apparatus of claim 1, wherein The positioning base plate (11) is an L-shaped structure, and the adjusting part (30) is installed on the positioning base plate (11) laterally.

5. A chip punching device according to claim 4, wherein The adjusting part (30) comprises a first adjusting table (31), a second adjusting table (32) and a third adjusting table (33), the first adjusting table (31), the second adjusting table (32) and the third adjusting table (33) are sequentially stacked, and the installation bottom block (12) is located on the third adjusting table (33).

6. The chip punching apparatus of claim 1, wherein The installation bottom block (12) is provided with a buffer spring (50) corresponding to the containing cavity (131) to buffer the chip.

7. The chip punching apparatus of claim 1, wherein The cover plate (14) is connected with the buffer cushion block (13) through a nut to fix the containing cavity (131).

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