Vacuum drawer mold

Abstract

The utility model relates to the technical field of mold injection molding, and discloses a vacuum drawer mold which comprises a vacuum box body, and the upper end and the lower end of the vacuum box body are provided with a lower injection molding assembly and an upper injection molding assembly used for injection molding of the vacuum box body. A first cooling assembly and a second cooling assembly which are used for accelerating cooling of the lower injection molding assembly and the upper injection molding assembly to promote solidification of the vacuum box body are arranged in the lower injection molding assembly and the upper injection molding assembly correspondingly, the lower injection molding module is included, and the cooling efficiency is effectively improved through the first cooling assembly and the second cooling assembly; the vacuum box body is ensured to be rapidly solidified and keep a stable shape in the injection molding process, and the lower injection molding assembly and the upper injection molding assembly effectively improve the injection molding precision and ensure the quality of a finished product through precise matching and a cooling technology. The cooperation among the components not only improves the production efficiency, but also reduces the production risk caused by inaccurate temperature control.

Description

Technical Field

[0001] This utility model relates to the field of mold injection technology, specifically to vacuum drawer molds. Background Technology

[0002] Injection molds are tools used to produce plastic products. Molten plastic is injected into the mold cavity, and after cooling and solidification, the desired shape is obtained. Injection molds consist of several parts, mainly including the mold plate, mold cavity, core, mold guide, and cooling system. The design and manufacturing of the mold directly affect the product's precision, surface quality, and production efficiency. Injection molds are widely used in the automotive, home appliance, electronics, and daily necessities industries. Their manufacturing process requires consideration of plastic flow, cooling rate, and product molding requirements during injection molding. Through precise mold design and processing, injection molds can ensure the stability and consistency of mass production.

[0003] In traditional injection mold production, water cooling is commonly used to control mold temperature. Water cooling is cost-effective and easy to operate, hence its widespread application. However, water cooling is relatively slow, primarily due to the limited heat conduction capacity of the water cooling system. The cooling rate is affected by water flow and temperature, leading to uneven mold cooling and impacting the molding cycle. Insufficient cooling can cause significant temperature fluctuations in the mold, resulting in incomplete cooling or premature solidification of the plastic during molding, leading to defects such as shrinkage and warping. Furthermore, the slow cooling effect of water cooling can reduce production efficiency, especially in large-scale production. Prolonged cooling cycles extend overall production time, affecting output and delivery time. Longer cooling times also extend the mold's working cycle, increasing energy consumption and production costs. Therefore, those skilled in the art provide vacuum drawer molds to address the problems mentioned in the background. Utility Model Content

[0004] The purpose of this invention is to provide a vacuum drawer mold that solves the problem in the prior art where insufficient cooling can cause large temperature fluctuations in the mold, resulting in incomplete cooling or premature solidification of the plastic during the molding process, leading to defects such as shrinkage and warping. In addition, the slow effect of water cooling may also reduce production efficiency, especially in large-scale production. Long cooling cycles will extend the overall production time, affecting output and delivery time. Longer cooling times will also lead to longer mold working cycles, increasing energy consumption and production costs.

[0005] This utility model provides the following technical solution: a vacuum drawer mold, including a vacuum box body. Both the upper and lower ends of the vacuum box body are provided with a lower injection molding assembly and an upper injection molding assembly for injection molding the vacuum box body. The interiors of the lower and upper injection molding assemblies are respectively provided with a first cooling assembly and a second cooling assembly for accelerating the cooling of the lower and upper injection molding assemblies to promote the solidification of the vacuum box body. The lower injection molding assembly includes a lower injection molding module. Multiple lower sleeve holes are arranged and opened through the lower part of the lower injection molding module. Guide holes are opened at the four diagonal points inside the lower injection molding module. A lower injection molding cavity is opened at the upper center of the lower injection molding module.

[0006] As a preferred embodiment of the above technical solution, the first cooling component includes a first semiconductor cooling module, which is fixedly connected to the lower side of the lower injection molding module. The lower injection molding module has multiple first heat pipes arranged and fixedly connected inside, and the outer ends of the multiple first heat pipes are respectively sleeved inside multiple lower sleeve holes.

[0007] As a preferred embodiment of the above technical solution, the upper injection molding assembly includes an upper support plate, which is disposed on the upper end of the lower injection molding module. The upper support plate and the lower injection molding module are detachably connected. Guide rods are fixedly connected to the four diagonal corners of the lower end of the upper support plate. The four guide rods are slidably sleeved inside the four guide holes. The four guide rods and the four guide holes are detachably connected. An inner wall module is fixedly connected to the center of the lower end of the upper support plate.

[0008] As a preferred embodiment of the above technical solution, the upper support plate is fixedly connected to four diagonal corners, and multiple upper sleeve holes are arranged in a ring inside the upper support plate and the inner wall module. An injection tube sleeve hole is opened through the center of the upper support plate and the inner wall module.

[0009] As a preferred embodiment of the above technical solution, the vacuum box body is injection molded between the lower injection mold cavity and the inner wall module.

[0010] As a preferred embodiment of the above technical solution, the second cooling component includes a second semiconductor cooling module, which is fixedly connected to the center of the upper end of the upper support plate. Multiple second heat pipes are arranged in a ring inside the upper support plate and fixedly sleeved thereon. The lower outer sides of the multiple second heat pipes are respectively sleeved inside multiple upper sleeve holes.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] The lower injection molding assembly, upper injection molding assembly, first cooling assembly, and second cooling assembly each perform their respective functions. Through efficient collaborative work, they ensure the high precision and high quality production of the vacuum box body. The first cooling assembly achieves rapid cooling during the injection molding process through the combination of the first semiconductor cooling module and the heat pipe. The combination of the upper injection molding assembly and the inner wall module ensures the stability and accuracy of the vacuum box during molding. The second cooling assembly further optimizes the overall cooling system, ensuring that the temperature of the vacuum box body is uniform during the cooling process, effectively avoiding deformation problems caused by uneven cooling.

[0013] This device addresses the shortcomings of traditional water-cooling systems. The first and second cooling components effectively improve cooling efficiency, ensuring the vacuum box body solidifies rapidly and maintains a stable shape during injection molding. The lower and upper injection molding components, through precise matching and cooling technology, effectively improve injection molding accuracy, ensuring the quality of the finished product. The collaboration between these components not only improves production efficiency but also reduces production risks caused by inaccurate temperature control. Attached Figure Description

[0014] Figure 1 A three-dimensional structural diagram of a vacuum drawer mold;

[0015] Figure 2 A three-dimensional structural diagram of a vacuum drawer mold from another perspective;

[0016] Figure 3 A three-dimensional disassembled structural diagram of a vacuum drawer mold;

[0017] Figure 4 This is a schematic diagram of the three-dimensional disassembled structure of a vacuum drawer mold from another perspective.

[0018] 1. Lower injection molding assembly; 101. Lower injection molding module; 102. Lower sleeve hole; 103. Guide hole; 104. Lower injection mold cavity; 2. First cooling assembly; 201. First semiconductor cooling module; 202. First heat pipe; 3. Upper injection molding assembly; 301. Upper support plate; 302. Guide rod; 303. Inner wall module; 304. Demolding ring; 305. Upper sleeve hole; 306. Injection tube sleeve hole; 4. Vacuum box body; 5. Second cooling assembly; 501. Second semiconductor cooling module; 502. Second heat pipe. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0020] Please see Figures 1-4As shown, this utility model provides a technical solution: a vacuum drawer mold, including a vacuum box body 4. Both the upper and lower ends of the vacuum box body 4 are provided with a lower injection molding assembly 1 and an upper injection molding assembly 3 for injection molding the vacuum box body 4. The lower injection molding assembly 1 and the upper injection molding assembly 3 are respectively provided with a first cooling assembly 2 and a second cooling assembly 5 for accelerating the cooling of the lower injection molding assembly 1 and the upper injection molding assembly 3 to promote the solidification of the vacuum box body 4. The lower injection molding assembly 1 includes a lower injection molding module 101. Multiple lower sleeve holes 102 are arranged and opened through the lower part of the lower injection molding module 101. Guide holes 103 are provided at the four diagonal corners of the lower injection module 101. Lower injection mold cavities 104 are provided at the upper center of the lower injection module 101. The lower injection assembly 1 provides the initial injection mold for the vacuum box body 4. When the multiple lower sleeve holes 102 and guide holes 103 within the lower injection module 101 cooperate, the vacuum box body 4 is accurately guided into the lower injection mold cavity 104. To improve production efficiency and ensure the quality of the vacuum box, the lower injection assembly 1 accelerates the cooling process through a built-in first cooling component 2, promoting the solidification of the vacuum box body 4. The first semiconductor cooling module 2... 01, as the core component of the cooling system, provides efficient heat exchange through semiconductor technology, solving the shortcomings of traditional water-cooling systems, ensuring temperature control accuracy during injection molding, and avoiding molding defects caused by uneven cooling. The lower injection molding component 1, upper injection molding component 3, first cooling component 2, and second cooling component 5 each perform their respective functions, ensuring high-precision and high-quality production of the vacuum box body 4 through efficient collaborative work. The first cooling component 2, through the combination of the first semiconductor cooling module 201 and the heat pipe, achieves rapid cooling during the injection molding process. The upper injection molding component 3 and the inner wall module 30... The combination of components 3 ensures the stability and precision of the vacuum box molding process. The second cooling component 5 further optimizes the overall cooling system, ensuring a uniform temperature of the vacuum box body 4 during cooling, effectively avoiding deformation caused by uneven cooling, and solving the shortcomings of traditional water cooling systems. The first cooling component 2 and the second cooling component 5 effectively improve cooling efficiency, ensuring that the vacuum box body 4 solidifies quickly and maintains a stable shape during injection molding. The lower injection molding component 1 and the upper injection molding component 3, through precise matching and cooling technology, effectively improve the precision of injection molding and ensure the quality of the finished product. The collaboration between the components not only improves production efficiency but also reduces the production risks caused by inaccurate temperature control.

[0021] As one implementation method in this embodiment, please refer to Figures 3-4As shown, the first cooling component 2 includes a first semiconductor cooling module 201, which is fixedly connected to the lower side of the lower injection molding module 101. Multiple first heat pipes 202 are arranged and fixedly connected inside the lower injection molding module 101. The outer ends of the multiple first heat pipes 202 are respectively fitted into multiple lower sleeve holes 102. The first cooling component 2 is composed of multiple first heat pipes 202 arranged along the interior of the lower injection molding module 101. During heat exchange, one outer end of the first heat pipe 202 is inserted into the lower sleeve hole 102 of the lower injection molding module 101, forming thermal contact with the lower sleeve hole 102. When the lower injection molding component 1 performs injection molding, the vacuum box body 4 gradually cools and forms in the lower injection molding cavity 104. The first semiconductor cooling module 201, through interaction with the heat pipes, rapidly conducts and dissipates the heat generated during the injection molding process, avoiding material quality problems caused by excessive temperature and significantly improving injection molding efficiency.

[0022] As one implementation method in this embodiment, please refer to Figures 3-4 As shown, the upper injection molding assembly 3 includes an upper support plate 301, which is disposed on the upper end of the lower injection molding module 101. The upper support plate 301 and the lower injection molding module 101 are detachably connected. Guide rods 302 are fixedly connected to the four diagonal points of the lower end of the upper support plate 301. The four guide rods 302 are slidably sleeved inside the four guide holes 103. The four guide rods 302 and the four guide holes 103 are detachably connected. An inner wall module 303 is fixedly connected to the center of the lower end of the upper support plate 301. Demolding rings 304 are fixedly connected to the four diagonal points of the upper end of the upper support plate 301. Multiple upper sleeve holes 305 are arranged in a ring inside the upper support plate 301 and the inner wall module 303. A through hole is formed at the center of the upper support plate 301 and the inner wall module 303. The vacuum box body 4 is injection molded between the lower injection mold cavity 104 and the inner wall module 303, with an injection tube sleeve hole 306. The upper injection assembly 3 is mainly responsible for forming the upper part of the vacuum box body 4. During operation, the upper support plate 301 and the lower injection module 101 are fixed by a detachable connection. The guide rod 302 at the lower end of the upper support plate 301 cooperates with the lower sleeve hole 102 through the guide hole 103, making the connection between the upper support plate 301 and the lower injection module 101 tighter and more precise. During the molding process, the inner wall module 303 is located at the center of the lower end of the upper support plate 301. The material is injected through the injection tube sleeve hole 306 of this module, and it provides strong support when the vacuum box body 4 is molded, so that the molded vacuum box has higher structural stability.

[0023] As one implementation method in this embodiment, please refer to Figures 3-4As shown, the second cooling component 5 includes a second semiconductor cooling module 501, which is fixedly connected to the center of the upper end of the upper support plate 301. Multiple second heat pipes 502 are arranged in a ring inside the upper support plate 301, and the lower outer sides of the multiple second heat pipes 502 are respectively fitted into multiple upper sleeve holes 305. The second cooling component 5 is located at the upper end of the upper support plate 301 and works in conjunction with the second semiconductor cooling module 501. The main function of the second cooling component 5 is to further accelerate the cooling process at the upper end during the solidification of the vacuum box body 4. The second heat pipes 502 are tightly connected to the multiple upper sleeve holes 305, effectively transferring heat from the upper injection molding component 3 to the external environment. The second semiconductor cooling module 501 provides continuous heat management capabilities for the second cooling component 5, ensuring uniform cooling of the entire vacuum box body 4 and avoiding quality defects caused by excessively high or low local temperatures.

[0024] Working Principle: The lower injection molding assembly 1 provides the initial injection mold for the vacuum box body 4. When the multiple lower sleeve holes 102 and guide holes 103 within the lower injection molding module 101 cooperate with each other, the vacuum box body 4 is accurately guided into the lower injection mold cavity 104. To improve production efficiency and ensure the quality of the vacuum box, the lower injection molding assembly 1 accelerates its cooling process through the built-in first cooling assembly 2, promoting the solidification of the vacuum box body 4. The first semiconductor cooling module 201, as the core component of the cooling assembly, provides efficient heat exchange through semiconductor technology, solving the shortcomings of traditional water-cooled cooling systems, ensuring temperature control accuracy during the injection molding process, and avoiding molding defects caused by uneven cooling. The first cooling assembly 2 consists of multiple first heat pipes 202, which are arranged along the interior of the lower injection molding module 101. During the heat exchange process, one end of the first heat pipe 202 is inserted into the lower sleeve hole 102 of the lower injection molding module 101, forming thermal contact with the lower sleeve hole 102. When the lower injection molding assembly 1 performs injection molding, the vacuum box body 4 is in the lower injection molding... The material gradually cools and solidifies in the mold cavity 104. The first semiconductor cooling module 201 interacts with the heat pipe to quickly conduct and dissipate the heat generated during the injection process, avoiding material quality problems caused by excessive temperature and significantly improving injection efficiency. The upper injection assembly 3 is mainly responsible for forming the upper part of the vacuum box body 4. During operation, the upper support plate 301 and the lower injection module 101 are fixed by a detachable connection. The guide rod 302 at the lower end of the upper support plate 301 cooperates with the guide hole 103 and the lower sleeve hole 102 to make the connection between the upper support plate 301 and the lower injection module 101 tighter and more precise. During the molding process, the inner wall module 303 is located at the center of the lower end of the upper support plate 301. The material is injected through the injection tube sleeve hole 306 of this module and provides strong support when the vacuum box body 4 is formed, so that the vacuum box after molding has higher structural stability. The second cooling assembly 5 is located at the upper end of the upper support plate 301 and works in conjunction with the second semiconductor cooling module 501. The main function of the second cooling component 5 is to further accelerate the cooling process at the upper end of the vacuum box body 4 during solidification. The second heat pipe 502 is tightly connected with multiple upper sleeve holes 305, effectively transferring heat from the upper injection molding component 3 to the external environment. The second semiconductor cooling module 501 provides continuous heat management capability for the second cooling component 5, ensuring uniform cooling of the entire vacuum box body 4 and avoiding quality defects caused by excessively high or low local temperatures.

[0025] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. Vacuum drawer mold comprising a vacuum box body (4), characterized in that: The lower injection molding assembly (1) and the upper injection molding assembly (3) are arranged at the upper and lower ends of the vacuum box body (4) and are used for injection molding the vacuum box body (4), the inside of the lower injection molding assembly (1) and the inside of the upper injection molding assembly (3) are respectively provided with a first cooling assembly (2) and a second cooling assembly (5) used for accelerating the cooling of the lower injection molding assembly (1) and the upper injection molding assembly (3) to promote the solidification of the vacuum box body (4), the lower injection molding assembly (1) comprises a lower injection molding module (101), a plurality of lower sleeve holes (102) are arranged and penetratively formed at the lower end of the inside of the lower injection molding module (101), guide holes (103) are formed at the four diagonal corners of the inside of the lower injection molding module (101), and lower injection molding cavities (104) are formed at the upper center of the inside of the lower injection molding module (101).

2. The vacuum drawer mold of claim 1, wherein: The first cooling assembly (2) comprises a first semiconductor cooling module (201), the first semiconductor cooling module (201) is fixedly connected to the lower end of one side of the lower injection molding module (101), a plurality of first heat pipes (202) are fixedly connected and arranged in the inside of the lower injection molding module (101), and the outer side of one end of each of the plurality of first heat pipes (202) is sleeved in the inside of each of the plurality of lower sleeve holes (102).

3. The vacuum drawer mold of claim 1, wherein: The upper injection molding assembly (3) comprises an upper supporting plate (301), the upper supporting plate (301) is arranged at the upper end of the lower injection molding module (101), the upper supporting plate (301) and the lower injection molding module (101) are detachably connected, guide rods (302) are fixedly connected to the four diagonal corners of the lower end of the upper supporting plate (301), the four guide rods (302) are slidably sleeved in the four guide holes (103), the four guide rods (302) and the four guide holes (103) are detachably connected, and an inner wall module (303) is fixedly connected to the center of the lower end of the upper supporting plate (301).

4. The vacuum drawer mold of claim 3, wherein: Demolding lifting rings (304) are fixedly connected to the four diagonal corners of the upper end of the upper supporting plate (301), a plurality of upper sleeve holes (305) are annularly arranged and formed in the inside of the upper supporting plate (301) and the inner wall module (303), and an injection pipe sleeve hole (306) is penetratively formed in the center of the inside of the upper supporting plate (301) and the inner wall module (303).

5. The vacuum drawer mold of claim 4, wherein: The vacuum box body (4) is injection molded between the lower injection molding cavities (104) and the inner wall module (303).

6. The vacuum drawer mold of claim 3, wherein: The second cooling assembly (5) comprises a second semiconductor cooling module (501), the second semiconductor cooling module (501) is fixedly connected to the upper end center of the upper supporting plate (301), a plurality of second heat pipes (502) are fixedly and annularly sleeved in the inside of the upper supporting plate (301), and the outer side of the lower end of each of the plurality of second heat pipes (502) is sleeved in the inside of each of the plurality of upper sleeve holes (305).

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