Rivet gluing equipment for circuit board

Abstract

The utility model relates to rivet gluing equipment for a circuit board. The rivet gluing equipment comprises a rivet device, a transfer device and a gluing device which are arranged in sequence, the riveting device comprises a first conveying line, a positioning table arranged on the first conveying line and a riveting machine erected above the first conveying line, and the first conveying line can drive the positioning table to move to the position under a riveting station of the riveting machine. The transfer device comprises a second conveying line, a transfer mechanical arm arranged above the second conveying line and an adsorption part installed at the output end of the transfer mechanical arm. The second conveying line can be in butt joint with the positioning table and receive the riveted circuit board from the positioning table. The gluing device comprises a gluing machine table, a limiting table and a gluing mechanism, wherein the limiting table and the gluing mechanism are arranged on the gluing machine table, and the gluing mechanism is movably arranged on the side of the limiting table. After the circuit board is riveted, the surface of the rivet position can be glued, and scraps around the rivet position are adhered to the circuit board, so that the problem of short circuit of the inner layer of the circuit board is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the rivet field of circuit board, specifically, especially relates to rivet gluing equipment of circuit board. BACKGROUND

[0002] Multi-layer circuit board usually needs riveting through riveting machine, and the riveting machine needs to press rivets into the circuit board through huge impact force in the riveting operation, so it is difficult to avoid rivet debris, and the rivet debris can pollute the inner layer circuit and easily cause the inner layer short circuit of the circuit board. At present, there is no good method for treating rivet debris, and most manufacturers do not treat the debris because the debris is small and not all debris will pollute the inner layer circuit, so it is inevitable to increase the probability of inner layer short circuit of the circuit board, resulting in the increase of the defective rate of the product. SUMMARY

[0003] Therefore, the utility model provides a rivet gluing equipment for circuit board which can improve the inner layer short circuit of the circuit board after riveting.

[0004] The utility model discloses a rivet gluing equipment for circuit board which can improve the inner layer short circuit of the circuit board after riveting.

[0005] A rivet gluing equipment for circuit board, comprising a riveting device, a transfer device and a gluing device arranged in sequence along the horizontal conveying direction.

[0006] The riveting device comprises a first conveying line, a positioning table arranged on the first conveying line, and a riveting machine arranged above the first conveying line, and the first conveying line can drive the positioning table to move to the riveting position of the riveting machine.

[0007] The transfer device comprises a second conveying line, a transfer manipulator arranged above the second conveying line, and a suction accessory mounted on the output end of the transfer manipulator, and the second conveying line can be connected with the positioning table and receive the riveted circuit board from the positioning table.

[0008] The gluing device comprises a gluing machine table, a limiting table and a gluing mechanism arranged on the gluing machine table, and the gluing mechanism is movably arranged on the side of the limiting table.

[0009] In the technical scheme, the circuit board to be riveted is first placed on the positioning table, the first conveying line can ensure that the circuit board can be accurately moved below the riveting position of the riveting machine, and the riveting machine can ensure the accuracy and consistency of the rivets; the transfer device can stably and quickly receive the riveted circuit board by the combination of the second conveying line and the transfer manipulator, and convey the riveted circuit board to the gluing device, thereby playing a role of transferring and storing the circuit board, and the process is efficient and seamlessly connected, thereby reducing the waiting time and potential damage risk; the transfer manipulator moves the riveted circuit board to the limiting table, and the gluing mechanism is used for gluing the riveting position to fix and protect the riveting position.

[0010] The rivet device, the transfer device and the gluing device are arranged in sequence, and a full-automatic process from riveting to gluing of the circuit board is realized, after the circuit board is riveted by the riveting machine, the surface of the riveting position can be quickly glued, and the debris around the riveting position is adhered to the circuit board, so that the riveting debris is fixed and cannot contaminate the inner layer circuit and the glue sheet of the impurity, thereby improving the problem of short circuit of the inner layer of the circuit board and improving the production quality of the circuit board.

[0011] Optionally, in a possible implementation manner, the positioning table comprises a base, a top plate, and side plates connecting the base and the top plate, a containing space is formed between the base and the top plate, and a liftable material transferring mechanism is arranged in the containing space, and the material transferring mechanism has a jacking state of extending above the top plate.

[0012] In the technical scheme, the top plate can be used as a positioning surface of the positioning table and is used for placing and positioning the circuit board to be riveted, and when the riveting of the circuit board is completed, the material transferring mechanism in the containing space can be lifted above the top plate, so that the circuit board is lifted and moved to the second positioning conveying line for the next process, thereby effectively reducing the moving distance of the first conveying line, the transfer manipulator and other devices, and significantly improving the work efficiency.

[0013] Optionally, in a possible implementation manner, the material transferring mechanism comprises a lifting plate, a jacking driving element arranged below the lifting plate, and a plurality of conveying rollers arranged above the lifting plate and a driving unit for driving the plurality of conveying rollers to rotate, and the top plate is further provided with a slot corresponding to the conveying rollers.

[0014] In the technical scheme, the jacking driving element and the driving unit of the conveying rollers are integrated, the automatic lifting and conveying of the material are realized, the control of the jacking driving element can ensure that the lifting plate, the conveying rollers and the driving unit reach a predetermined height, and the rotation of the conveying rollers can lift the circuit board and convey the circuit board to the second conveying line. In addition, the rolling contact of the conveying rollers can greatly reduce the damage to the circuit board compared with the sliding friction, and the stability of the circuit board in the conveying process is ensured.

[0015] Optionally, in a possible implementation manner, the driving unit comprises a feeding motor, a driving wheel arranged on an output shaft of the feeding motor, a driven wheel arranged on an end of the conveying roller, and a transmission belt for connecting the driving wheel and all the driven wheels.

[0016] In the technical scheme, the power of the feeding motor is transmitted to all the driven wheels through the transmission belt, so that synchronous rotation of all the conveying rollers is ensured, and bumping or jamming of the material during conveying due to different rotation speeds of the rollers is avoided, thereby improving the stability and continuity of conveying.

[0017] Optionally, in a possible implementation manner, the conveying roller is rotatably arranged above the lifting plate through a support column.

[0018] In the technical scheme, the support column serves as a mounting base of the conveying roller, and can provide stable support to ensure that the conveying roller does not shake or deviate during operation, thereby improving the stability and precision of material conveying.

[0019] Optionally, in a possible implementation manner, the transfer manipulator comprises a horizontal linear module and a vertical linear module arranged at an output end of the horizontal linear module, the suction accessory is arranged at an output end of the vertical linear module, and the horizontal linear module extends above the limiting table.

[0020] In the technical scheme, the horizontal linear module and the vertical linear module are combined to realize high-precision movement control in two-dimensional space, so that the suction accessory can accurately transfer the circuit board on the second conveying line to the limiting table, meet the demand of precise operation, and maintain the consistency and stability of operation.

[0021] Optionally, in a possible implementation manner, the suction accessory comprises a mounting frame and a plurality of vacuum suction cups arranged on the mounting frame, and the mounting frame is detachably arranged at the output end of the vertical linear module.

[0022] In the technical scheme, the plurality of vacuum suction cups not only increase the suction area, but also realize multi-point suction, thereby improving the suction stability and carrying capacity of the circuit board, and ensuring the safety and reliability during carrying.

[0023] Optionally, in a possible implementation manner, the gluing mechanism comprises a sliding table, a fixed support arranged on the sliding table, a gluing roller rotatably arranged on the fixed support, and a gluing driving member, and the gluing driving member can drive the sliding table to move close to or away from the limiting table.

[0024] In the technical scheme, the cooperation of the sliding table and the glue applying driving member can accurately control the moving track and speed of the glue applying roller on the surface of the circuit board, ensure uniform glue applying and consistent thickness, meet the requirement of high-precision glue applying operation, and improve the consistency and quality of products.

[0025] Optionally, in a possible implementation, a glue feeding roller is further rotatably installed on the fixing support, and the glue feeding roller is located on the side of the glue applying roller away from the limiting table.

[0026] In the technical scheme, the glue feeding roller and the glue applying roller work in cooperation to form a continuous glue feeding and applying process, ensure that the glue can be continuously and stably transferred from the glue feeding roller to the glue applying roller, avoid the phenomenon of uneven glue applying or missed glue applying due to insufficient or interrupted glue supply during the glue applying process, and ensure the continuity and stability of the glue applying operation.

[0027] Optionally, in a possible implementation, the glue feeding roller and the glue applying roller are arranged in an up-down staggered manner, and the glue applying roller is located at a low position.

[0028] In the technical scheme, the up-down arrangement of the glue feeding roller and the glue applying roller can optimize the flow path of the glue and avoid the problem that the glue feeding roller directly contacts the circuit board when following the movement of the sliding table, thereby causing secondary glue applying of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical schemes of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0030] Figure 1 It is an overall structural schematic diagram of an embodiment.

[0031] Figure 2 It is a sectional view of a positioning table of an embodiment.

[0032] Figure 3 It is a variation state schematic diagram of a material transferring mechanism of an embodiment.

[0033] Reference numerals: 1-Riveting device; 11-First conveyor line; 12-Positioning platform; 121-Base; 122-Side plate; 123-Top plate; 13-Riveting machine; 2-Transfer device; 21-Second conveyor line; 22-Transfer robot; 221-Horizontal linear module; 222-Vertical linear module; 23-Adsorption component; 231-Mounting frame; 232-Vacuum suction cup; 3-Glue applicator; 31-Glue applicator platform; 32-Limiting platform; 33-Glue applicator mechanism; 331-Slide table; 332-Fixed bracket; 333-Glue applicator roller; 334-Glue feeding roller; 335-Glue applicator drive component; 4-Transfer mechanism; 41-Lifting plate; 42-Lifting drive component; 43-Transfer roller; 44-Feeding drive component; 441-Feeding motor; 442-Transmission belt. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0036] Please refer to Figure 1 This embodiment provides a riveting and gluing device for circuit boards, including a riveting device 1, a transfer device 2, and a gluing device 3 arranged sequentially along a horizontal conveying direction. The riveting device 1 includes a first conveyor line 11, a positioning platform 12 disposed on the first conveyor line 11, and a riveting machine 13 mounted above the first conveyor line 11. The first conveyor line 11 can drive the positioning platform 12 to move directly below the riveting station of the riveting machine 13. The transfer device 2 includes a second conveyor line 21, a transfer robot 22 disposed above the second conveyor line 21, and an adsorption component 23 installed at the output end of the transfer robot 22. The second conveyor line 21 can dock with the positioning platform 12 and receive the riveted circuit boards from the positioning platform 12. The gluing device 3 includes a gluing machine platform 31, a limiting platform 32 disposed on the gluing machine platform 31, and a gluing mechanism 33. The gluing mechanism 33 is movably disposed on the side of the limiting platform 32.

[0037] It should be noted that the first conveyor line 11, the second conveyor line 21, and the riveting machine 13 are all conventional structures in the prior art. The function of the first conveyor line 11 is to accurately move the positioning table 12 to below the work station of the riveting machine 13. It can be a conveyor belt structure or a conveyor roller 43 structure. At the same time, the first conveyor line 11 is also equipped with a positioning sensor to detect whether the positioning table 12 has moved to the preset position. Similarly, the second conveyor line 21 can also be a conveyor belt or a conveyor roller 43 structure. The function of the second conveyor line 21 is to store and transfer circuit boards, so that the riveted circuit boards can be stored on the second conveyor line 21. In this way, the transfer robot 22 does not need to wait for the riveting machine 13 to finish riveting before it can directly transfer the circuit boards located on the second conveyor line 21 to the limiting table 32, thereby improving the continuity and efficiency of processing.

[0038] In this embodiment, the circuit board to be riveted is first placed on the positioning table 12. The first conveyor line 11 ensures that the circuit board can be accurately moved to the riveting position of the riveting machine 13. In conjunction with the riveting machine 13, the accuracy and consistency of the riveting can be guaranteed. The transfer device 2, by combining the second conveyor line 21 and the transfer robot 22, can smoothly and quickly receive the riveted circuit board and transport it to the gluing device 3, which serves as a transfer and storage device for the circuit board. This process is efficient and seamless, reducing waiting time and potential damage risks. The transfer robot 22 moves the riveted circuit board to the limiting table 32 and applies glue to the riveting position through the gluing mechanism 33 to fix and protect the riveting position.

[0039] This embodiment achieves a fully automated process from riveting to gluing of the circuit board by sequentially arranging the riveting device 1, the transfer device 2, and the gluing device 3. After the circuit board is riveted by the riveting machine 13, the surface of the rivet position can be quickly glued to adhere the debris around the rivet position to the circuit board, thereby fixing the rivet debris and preventing it from contaminating the inner layer circuits and the insulating film, thus improving the problem of short circuits in the inner layer of the circuit board and improving the production quality of the circuit board.

[0040] Please refer to Figure 2 and Figure 3 In this embodiment, the positioning platform 12 includes a base 121, a top plate 123, and a side plate 122 connecting the base 121 and the top plate 123. An accommodating space is formed between the base 121 and the top plate 123. A lifting material transfer mechanism is provided in the accommodating space. The material transfer mechanism has a lifting state that extends above the top plate 123.

[0041] The top plate 123 can serve as the positioning surface of the positioning table 12 and be used to place and position the circuit board to be riveted. When the circuit board is riveted, the transfer mechanism located in the accommodating space can rise above the top plate 123, thereby lifting the circuit board and transferring it to the second positioning conveyor line for entry into the next process. This can effectively reduce the moving distance of the first conveyor line 11 and the transfer robot 22, and significantly improve work efficiency.

[0042] Specifically, the material transfer mechanism 4 includes a lifting plate 41, a lifting drive 42 located below the lifting plate 41, multiple conveying rollers 43 located above the lifting plate 41, and a drive unit 44 for driving the multiple conveying rollers 43 to rotate. The top plate 123 also has slots corresponding to the conveying rollers 43. The lifting drive 42 is a cylinder, and the output end of the lifting drive 42 is connected to the lifting plate 41 through a connecting plate. The base 121 has a space for placing the lifting drive 42. In addition, the slots correspond one-to-one with the conveying rollers 43. When the lifting drive 42 drives the conveying rollers 43 to rise, the conveying rollers 43 only need to extend partially from the slots to lift the circuit board off the surface of the top plate 123.

[0043] The drive unit 44, which integrates the lifting drive 42 and the conveying roller 43, realizes automatic lifting and conveying of materials. The control of the lifting drive 42 ensures that the lifting plate 41 and the conveying roller 43 and drive unit 44 on it reach the predetermined height. With the rotation of the conveying roller 43, the circuit board can be lifted and conveyed to the second conveyor line 21. In addition, the rolling contact of the conveying roller 43 can greatly reduce the damage to the circuit board compared with sliding friction, while ensuring the stability of the circuit board during the conveying process.

[0044] The drive unit 44 in this embodiment includes a feeding motor 441, a driving wheel (not shown in the figure) located on the output shaft of the feeding motor 441, a driven wheel (not shown in the figure) located at the end of the conveyor roller 43, and a transmission belt 442 for connecting the driving wheel and all the driven wheels. The conveyor roller 43 is rotatably mounted above the lifting plate 41 via support columns. Specifically, each conveyor roller 43 may correspond to two support columns, with both ends of the conveyor roller 43 rotatably mounted on the two support columns respectively, and the driven wheel fixed to one end of the conveyor roller 43. Furthermore, both the driving wheel and the driven wheel are gears, and the transmission belt 442 is a toothed belt.

[0045] The power of the feeding motor 441 is transmitted to all driven pulleys via the drive belt 442, ensuring that all conveying rollers 43 rotate synchronously. This avoids bumps or jams caused by uneven roller speeds during material conveying, improving the stability and continuity of the conveying process. Furthermore, the support columns, serving as the mounting base for the conveying rollers 43, provide stable support, ensuring that the conveying rollers 43 do not wobble or shift during operation, thus improving the stability and accuracy of material conveying.

[0046] In this embodiment, the transfer robot 22 includes a horizontal linear module 221 and a vertical linear module 222 disposed at the output end of the horizontal linear module 221. The adsorption member 23 is disposed at the output end of the vertical linear module 222, and the horizontal linear module 221 extends above the limiting platform 32. Both the horizontal linear module 221 and the vertical linear module 222 are conventional technologies in the prior art, such as lead screw transmission mechanisms and cylinder transmission mechanisms, and their specific structures will not be described in detail here.

[0047] By combining the horizontal linear module 221 and the vertical linear module 222, high-precision movement control in two-dimensional space is achieved, ensuring that the adsorption component 23 can accurately transfer the circuit board located on the second conveyor line 21 to the limiting stage 32, meeting the requirements of precision operation, while maintaining the consistency and stability of the operation.

[0048] In this embodiment, the adsorption component 23 includes a mounting frame 231 and a plurality of vacuum suction cups 232 disposed on the mounting frame 231. The mounting frame 231 is detachably disposed at the output end of the vertical linear module 222. The plurality of vacuum suction cups 232 are all connected to a vacuum generator, that is, the adsorption action of the vacuum suction cups 232 is controlled by the vacuum generator.

[0049] The multiple vacuum suction cups 232 not only increase the adsorption area but also achieve multi-point adsorption, improving the adsorption stability and load-bearing capacity of the circuit board and ensuring safety and reliability during handling. Furthermore, the vacuum suction cups 232 employ non-contact adsorption, reducing the risk of scratches, deformation, and other damage to the circuit board during handling.

[0050] The glue application mechanism 33 of this embodiment includes a slide table 331, a fixed bracket 332 disposed on the slide table 331, a glue application roller 333 rotatably mounted on the fixed bracket 332, and a glue application drive component 335. The glue application drive component 335 can drive the slide table 331 to move closer to or further away from the limiting platform 32. The glue application drive component 335 includes a motor and a lead screw disposed on the output shaft of the motor. One end of the lead screw is fixedly connected to the motor, and the other end is rotatably mounted on the glue application machine platform 31. The lead screw is also threadedly connected to the slide table 331. The slide table 331 is slidably engaged on the glue application machine platform 31. Thus, when the motor drives the lead screw to rotate, it can drive the slide table 331 to slide on the glue application machine platform 31.

[0051] By working together with the slide table 331 and the glue application drive 335, the movement trajectory and speed of the glue application roller 333 on the circuit board surface can be precisely controlled, ensuring uniform glue application and consistent thickness, meeting the requirements of high-precision glue application, and improving product consistency and quality.

[0052] It should be noted that, in this embodiment, a glue-feeding roller 334 is also rotatably mounted on the fixed bracket 332. The glue-feeding roller 334 is located on the side of the glue-applying roller 333 away from the limiting platform 32. The glue-feeding roller 334 and the glue-applying roller 333 are vertically offset, with the glue-applying roller 333 located at the lower position. Specifically, the glue on the glue-feeding roller 334 can be added by the worker at regular intervals, or by adding it through a glue-dispensing tube. For example, the glue outlet of the glue-dispensing tube can be connected to the glue-feeding roller 334, so that the glue-feeding roller 334 can always be covered with glue and transfer the glue to the glue-applying roller 333.

[0053] It should be noted that the surface of the glue-applying roller 333 is an elastic structure, and the glue-applying roller 333 can contact the surface of the circuit board during glue application. Since the rivet positions on the circuit board are usually located at the edges, the glue-applying roller 333 can directly apply glue from the edge of the circuit board towards the rivet positions. Furthermore, the glue-applying mechanism 33 can be configured with several units corresponding to the actual number of rivet positions.

[0054] In this embodiment, the glue-feeding roller 334 and the glue-applying roller 333 work together to form a continuous glue-feeding and applicating process. This ensures that the glue can be continuously and stably transferred from the glue-feeding roller 334 to the glue-applying roller 333, avoiding uneven or missed application due to insufficient or interrupted glue supply during the applicating process. This guarantees the continuity and stability of the applicating operation. Furthermore, the vertical design of the glue-feeding roller 334 and the glue-applying roller 333 optimizes the glue flow path and prevents the glue-feeding roller 334 from directly contacting the circuit board while moving with the slide table 331, thus avoiding the problem of secondary glue application to the circuit board.

[0055] In the description of this utility model, it should be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0056] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0057] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A riveting adhesive application device for circuit boards, characterized in that, The rivet device, the transfer device and the glue coating device are arranged in sequence along a horizontal conveying direction; The rivet device comprises a first conveying line, a positioning table arranged on the first conveying line, and a riveting machine arranged above the first conveying line, and the first conveying line is capable of driving the positioning table to move to a position directly below a riveting station of the riveting machine; The transfer device comprises a second conveying line, a transfer mechanical arm arranged above the second conveying line, and a suction accessory arranged at an output end of the transfer mechanical arm, and the second conveying line is capable of being connected with the positioning table and receiving a riveted circuit board from the positioning table; The glue coating device comprises a glue coating machine table, a limiting table and a glue coating mechanism arranged on the glue coating machine table, and the glue coating mechanism is movably arranged at a side of the limiting table.

2. The rivet gumming apparatus for a wiring board according to claim 1, wherein The positioning table comprises a base, a top plate, and a side plate connecting the base and the top plate, and a containing space is formed between the base and the top plate, and a lifting material mechanism is arranged in the containing space, and the lifting material mechanism has a top lifting state extending above the top plate.

3. The rivet gumming apparatus for a wiring board according to claim 2, wherein The lifting material mechanism comprises a lifting plate, a top lifting driving member arranged below the lifting plate, a plurality of conveying rollers arranged above the lifting plate, and a driving unit for driving the plurality of conveying rollers to rotate, and a notch corresponding to the conveying rollers is further arranged on the top plate.

4. The rivet gumming apparatus for a wiring board according to claim 3, wherein The driving unit comprises a feeding motor, a driving wheel arranged on an output shaft of the feeding motor, a driven wheel arranged at an end of the conveying roller, and a transmission belt for connecting the driving wheel and all the driven wheels.

5. The rivet gumming apparatus for a circuit board according to claim 3, wherein The conveying roller is rotatably arranged above the lifting plate through a supporting column.

6. The rivet gumming apparatus for a circuit board according to claim 1, wherein The transfer mechanical arm comprises a horizontal linear module and a vertical linear module arranged at an output end of the horizontal linear module, and the suction accessory is arranged at an output end of the vertical linear module, and the horizontal linear module extends above the limiting table.

7. The rivet gumming apparatus for a circuit board according to claim 6, wherein The suction accessory comprises a mounting frame and a plurality of vacuum suction cups arranged on the mounting frame, and the mounting frame is detachably arranged at the output end of the vertical linear module.

8. The rivet gumming apparatus for a circuit board according to claim 1, wherein The glue coating mechanism comprises a sliding table, a fixed support arranged on the sliding table, a glue coating roller rotatably arranged on the fixed support, and a glue coating driving member, and the glue coating driving member is capable of driving the sliding table to move and approach or move away from the limiting table.

9. The rivet gumming apparatus for a circuit board according to claim 8, wherein A glue feeding roller is further rotatably arranged on the fixed support, and the glue feeding roller is located at a side away from the limiting table of the glue coating roller.

10. The rivet gumming apparatus for a circuit board according to claim 9, wherein The glue feeding roller and the glue coating roller are arranged in a staggered manner, and the glue coating roller is located at a lower position.

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