Feeding device of semiconductor substrate mold

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to a feeding device for semiconductor substrate molds, which comprises a base, two side walls are symmetrically mounted at the top of the base, a lifting table is arranged in the center of the base and used for controlling the stacked semiconductor substrate molds to rise, and the lifting table is used for lifting the stacked semiconductor substrate molds. A pushing mechanism used for horizontally sending out the semiconductor substrate molds is arranged on the machine base, a separating mechanism used for separating the adjacent molds is installed on the side wall, and after the stacked semiconductor substrate molds are lifted by the lifting table, the separating mechanism separates the top mold from the second adjacent mold. And the pushing mechanism pushes out the top mold to complete feeding. According to the utility model, through the arrangement of the separating mechanism, when the die group is lifted by the lifting platform, the die at the top can be separated from the adjacent die through the lifting of the separating mechanism, so that the feeding of the semiconductor substrate die can be realized in cooperation with the material pushing mechanism, and the processing is more convenient and faster.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a feeding device for a semiconductor substrate mold. Background Technology

[0002] The semiconductor manufacturing process consists of wafer fabrication, wafer testing, chip packaging, testing, and final warehousing. In chip packaging, the packaging substrate provides electrical connections (transitions) between the chip and different circuits on a conventional printed circuit board (usually a motherboard, motherboard, or backplane). It also provides protection, support, and a heat dissipation channel for the chip, ensuring it meets standard mounting dimensions. Its advantages include enabling multi-pin configurations, reducing package size, improving electrical performance and heat dissipation, and achieving high density.

[0003] When processing semiconductor substrates, semiconductor substrate molds (such as...) are required. Figure 1 As shown, the upper and lower surfaces of the mold are usually provided with protruding positioning posts 901 and matching insertion holes to facilitate the stacking and positioning of the mold. Currently, conventional feeding mechanisms often only have the function of pushing out the individually placed molds during feeding, and cannot efficiently and quickly separate the mold group 9 connected by the positioning posts 901, thus making it difficult to realize the feeding process of the stacked mold group 9. Therefore, a convenient and fast feeding device for semiconductor substrate molds is proposed here. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, the present invention provides a feeding device for a semiconductor substrate mold.

[0005] The technical implementation of this utility model is as follows: a feeding device for a semiconductor substrate mold, comprising: a base, on which two side walls are symmetrically installed on the top of the base, and a lifting platform is provided at the center of the base. The lifting platform is used to control the lifting of stacked semiconductor substrate molds. A pushing mechanism is provided on the base for horizontally feeding the semiconductor substrate molds. A separation mechanism for separating adjacent molds is installed on the side walls. When the lifting platform lifts the stacked semiconductor substrate molds, the separation mechanism separates the top mold from the adjacent second mold, and the pushing mechanism pushes out the top mold to complete the feeding. The separation mechanism includes: a lifting frame, on which the lifting frame is slidably connected; and support blocks, on which at least three support blocks with arc-shaped ends are provided at the end of the lifting frame away from the side wall. An elastic element connects the support blocks and the lifting frame.

[0006] Optionally, it also includes an intermittent mechanism, which includes a first rotating shaft, a rocker arm, a second rotating shaft, and a cam. The first rotating shaft is rotatably mounted on the side wall, and the rocker arm is fixedly connected to the first rotating shaft. One end of the rocker arm is rotatably connected to the lifting frame. The second rotating shaft is rotatably mounted on the side wall, and the second rotating shaft is provided with a cam. The surface of the cam contacts the other end of the rocker arm.

[0007] Optionally, the cam's protrusion has a flat end. When the cam rotates 90 degrees, the rocker arm rotates to a horizontal state, and the flat end of the cam is in contact with the top surface of the rocker arm.

[0008] Optionally, the pushing mechanism includes a mounting platform, a cylinder, an adjusting frame, a screw slider, and a push block. The mounting platform is fixedly mounted on one side of the machine base. A horizontally oriented cylinder is provided on the mounting platform. An adjusting frame is connected to the end of the cylinder. A screw is rotatably connected inside the adjusting frame. A slider is slidably connected inside the adjusting frame. The slider is threadedly connected to the screw. A push block is fixedly mounted on the slider.

[0009] Optionally, the screw's front and rear halves rotate in opposite directions, and at least two sliders are symmetrically arranged, so that when the screw rotates clockwise, the two sliders move closer to each other.

[0010] Optionally, it also includes a linkage mechanism, which includes a connecting rod, a rack and a gear. Connecting rods are symmetrically installed on both sides of the adjusting frame. A rack is provided on the connecting rod. A synchronously rotating gear is connected to the second rotating shaft. The gear meshes with the rack.

[0011] Compared with the prior art, the present invention has the following advantages: 1. The present invention is equipped with a separation mechanism, which can separate the top mold from the adjacent mold when the lifting platform raises the mold group. In this way, the pushing mechanism can be used to load the semiconductor substrate mold, making the processing more convenient and faster.

[0012] 2. This utility model, through the design of an intermittent mechanism, can control the frequency of the lifting of the separation mechanism, thereby enabling effective adjustment of the feeding speed according to processing requirements;

[0013] 3. This utility model, by providing a linkage mechanism, can drive the intermittent mechanism to make the separation mechanism perform intermittent reciprocating linear motion when the pushing mechanism is working, without the need to adjust the pushing mechanism and the separation mechanism to match their frequency;

[0014] 4. This utility model has two sets of sliders in the adjustment frame, which can flexibly adjust the spacing and position of the push blocks, thereby adapting to molds of different lengths and effectively improving the applicability of the equipment. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a semiconductor substrate mold.

[0016] Figure 2 This is a schematic diagram of the three-dimensional mechanism of this utility model.

[0017] Figure 3 This is a three-dimensional schematic diagram of the separation mechanism of this utility model.

[0018] Figure 4 This is a three-dimensional schematic diagram of the intermittent mechanism of this utility model.

[0019] Figure 5 This is a three-dimensional schematic diagram of the material pushing mechanism of this utility model.

[0020] Figure 6 This is an enlarged view of the feeding mechanism of this utility model.

[0021] Figure 7 This is a three-dimensional schematic diagram of the linkage mechanism of this utility model.

[0022] Figure 8 This is a schematic diagram of the working state of this utility model.

[0023] The meanings of the reference numerals in the figure are as follows: 1: base, 2: side wall, 3: mounting platform, 401: cylinder, 402: adjusting frame, 403: screw, 404: slider, 405: push block, 5: lifting platform, 601: lifting frame, 602: support block, 603: first rotating shaft, 604: swing arm, 605: second rotating shaft, 606: cam, 607: gear, 608: connecting rod, 609: rack, 9: mold assembly, 901: positioning column. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] A feeding device for a semiconductor substrate mold, such as Figures 1-8As shown, it includes: a base 1, with two symmetrical side walls 2 mounted on the top of the base 1, and a lifting platform 5 at the center of the base 1. The lifting platform 5 can be a scissor lift structure or other conventional lifting structures (this part is prior art and will not be described in detail here). The lifting platform 5 is used to control the lifting of stacked semiconductor substrate molds. The base 1 is provided with a pushing mechanism for horizontally feeding the semiconductor substrate molds. The side walls 2 are equipped with a separation mechanism for separating adjacent molds. When the lifting platform 5 lifts the stacked semiconductor substrate molds, the separation mechanism separates the top mold from the adjacent second mold, and the pushing mechanism pushes out the top mold to complete the feeding. The separation mechanism includes: a lifting frame 601, with vertical grooves on the side walls 2, and sliding connections within the grooves. A lifting frame 601 is provided, which consists of a bottom support rod and a top E-shaped frame. The opening of the E-shaped frame faces the lifting platform 5. Three support blocks 602 with arc-shaped ends are provided at the end of the lifting frame 601 away from the side wall 2. An elastic element is connected between the support blocks 602 and the lifting frame 601. The elastic element can be a stainless steel compression spring. When the end of the support block 602 is subjected to upward pressure, the arc-shaped part at its end will push the support block 602 to move horizontally towards the lifting frame 601. In one embodiment, the driving mechanism can be directly connected to the lifting frame 601, so that the driving mechanism works intermittently. Through the timing coordination between the driving mechanism, the lifting platform and the pushing mechanism, the mold can be lifted, separated and pushed out for feeding in sequence.

[0026] In one embodiment, an intermittent mechanism is also included, comprising a first rotating shaft 603, a rocker arm 604, a second rotating shaft 605, and a cam 606. The first rotating shaft 603 is rotatably mounted on the side wall 2, and the rocker arm 604 is fixedly connected to the first rotating shaft 603. One end of the rocker arm 604 is rotatably connected to the lifting frame 601. The second rotating shaft 605 is rotatably mounted on the side wall 2, and the second rotating shaft 605 is provided with a cam 606. The center of gravity of the cam 606 is designed to remain vertical when not subjected to external force (i.e., the protrusion is located on the vertical axis). The surface of the cam 606 contacts the other end of the rocker arm 604, and the protrusion of the cam 606 has a flat end. When the cam 606 rotates 90 degrees, the rocker arm 604 rotates to a horizontal state, and the flat end of the cam 606 is in contact with the top surface of the rocker arm 604. The intermittent operation of the separation mechanism can be conveniently achieved by connecting a motor to the end of the second rotating shaft 605 via a coupling.

[0027] The feeding mechanism includes a mounting platform 3, a cylinder 401, an adjusting frame 402, a screw 403, a slider 404, and a pusher block 405. The mounting platform 3 is fixedly installed on one side of the machine base 1. The mounting platform 3 is equipped with a horizontally oriented cylinder 401. The end of the cylinder 401 is connected to the adjusting frame 402. The screw 403 is rotatably connected inside the adjusting frame 402. The adjusting frame 402 is equipped with a convex rail. The slider 404 is slidably connected to the convex rail. The slider 404 is threadedly connected to the screw 403. The pusher block 405 is fixedly installed on the slider 404. The pusher block 405 is a cylinder with a flat end. The screw 403 has opposite thread rotation directions in the front and rear halves. Two sliders 404 are symmetrically arranged. When the screw 403 rotates clockwise, the two sliders 404 move closer to each other.

[0028] It also includes a linkage mechanism, which includes a connecting rod 608, a rack 609 and a gear 607. The connecting rod 608 is symmetrically installed on both sides of the adjusting frame 402. The rack 609 is provided on the connecting rod 608. The gear 607 that rotates synchronously is connected to the second rotating shaft 605. The gear 607 meshes with the rack 609.

[0029] When using this device, first place the neatly stacked mold assembly 9 in the center of the lifting platform 5 (or a transfer container with an opening on the side, such as a turnover frame). At this time, the top mold of the mold assembly 9 is located under the support block 602. Then, control the lifting platform 5 to lift the mold assembly 9. The top mold presses against the arc-shaped part at the end of the support block 602, causing the support block 602 to move horizontally towards the lifting frame 601. The elastic element between the support block 602 and the lifting frame 601 is compressed until the top mold moves to the top of the support block 602. The support block 602 then returns to its original position as the elastic element returns to its original position. Under the action, it extends again, supporting the first mold piece at the top. The lifting platform 5 stops rising. Then, the control cylinder 401 pushes the adjusting frame 402 to move closer to the mold assembly 9. The connecting rods 608 on both sides of the adjusting frame 402 drive the rack 609 to move. Since the rack 609 and the gear 607 are in a meshing state, the gear 607 is rotated by force, causing the second gear 607 to rotate synchronously. The number of teeth of the rack 609 is just enough to make the cam 606 rotate 90 degrees. The flat end of the protrusion of the cam 606 rotates to a vertical state, and the rocker arm 604 moves down near the end of the cam 606. Under the squeezing action of cam 606, it gradually rotates from an inclined state to a horizontal state. The top surface of rocker arm 604 is flush with the flat end of cam 606. Rocker arm 604 rises away from cam 606 and pushes lifting frame 601 to rise. Then, through the synchronous upward movement of lifting frames 601 and support blocks 602 on both sides, the first mold at the top is separated from the second mold. The positioning pin 901 of the second mold is pulled out from the insertion hole of the first mold. Then, cylinder 401 continues to push adjusting frame 402 closer to mold group 9 until the push block 405 on slider 404 is in contact with the mold. When the first mold is lifted by the support block 602, the push block 405 pushes the first mold at the top outward to complete the feeding. During the pushing process, the support block 602 can maintain the stability of the mold and provide a guiding function. After the first mold is fed, the cylinder 401 drives the adjusting frame 402 to retract, the rack 609 drives the gear 607 to reverse, the second rotating shaft 605 drives the cam 606 to rotate in the opposite direction to return to the initial state, the rocker arm 604 moves away from the end of the cam 606 and moves down, and the lifting frame 601 falls down. Then, the above steps are repeated to realize the continuous automatic feeding of the mold group 9.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that variations may be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A feeding device for semiconductor substrate molds, comprising: a base (1) having two side walls (2) symmetrically installed on the top of the base (1); a lifting platform (5) provided at the center of the base (1) and used to lift the stacked semiconductor substrate molds; a pushing mechanism provided on the base (1) and used to horizontally push out the semiconductor substrate molds, and a separating mechanism installed on the side walls (2) and used to separate adjacent molds, wherein, after the lifting platform (5) lifts the stacked semiconductor substrate molds, the separating mechanism separates the top mold from the second mold, and the pushing mechanism pushes out the top mold to complete the feeding; characterized in that the separating mechanism comprises: a lifting frame (601) slidably connected to the side walls (2); at least three arc-shaped supporting blocks (602) provided at the end of the lifting frame (601) away from the side walls (2), and an elastic member connected between the supporting blocks (602) and the lifting frame (601).

2. The semiconductor substrate mold loading apparatus according to claim 1, wherein: The feeding device further comprises an intermittent mechanism, which comprises a first rotating shaft (603), a swing lever (604), a second rotating shaft (605), and a cam (606), wherein the first rotating shaft (603) is rotatably installed on the side walls (2), the swing lever (604) is fixedly connected to the first rotating shaft (603), one end of the swing lever (604) is rotatably connected to the lifting frame (601), the second rotating shaft (605) is rotatably installed on the side walls (2), the cam (606) is provided on the second rotating shaft (605), and the surface of the cam (606) is in contact with the other end of the swing lever (604).

3. The semiconductor substrate mold loading apparatus according to claim 2, wherein: The protruding part of the cam (606) is provided with a flat end, when the cam (606) rotates by 90 degrees, the swing lever (604) rotates to a horizontal state, and the flat end of the cam (606) is attached to the top surface of the swing lever (604).

4. The apparatus according to claim 3, wherein the apparatus is characterized by: The pushing mechanism comprises a mounting table (3), a gas cylinder (401), an adjusting frame (402), a screw rod (403), a sliding block (404), and a pushing block (405), wherein the mounting table (3) is fixedly installed on one side of the base (1), the gas cylinder (401) is horizontally provided on the mounting table (3), the adjusting frame (402) is connected to the end of the gas cylinder (401), the screw rod (403) is rotatably connected in the adjusting frame (402), the sliding block (404) is slidably connected in the adjusting frame (402), the sliding block (404) is threadedly connected with the screw rod (403), and the pushing block (405) is fixedly installed on the sliding block (404).

5. The apparatus according to claim 4, wherein the apparatus is characterized by: The screw threads of the front half and the rear half of the screw rod (403) are in opposite directions, and at least two symmetric sliding blocks (404) are provided, when the screw rod (403) rotates clockwise, the two sliding blocks (404) move closer to each other.

6. The apparatus according to claim 5, wherein the apparatus is characterized by: The linkage mechanism comprises a connecting rod (608), a rack (609) and a gear (607), the connecting rod (608) is symmetrically arranged on both sides of the adjusting frame (402), the rack (609) is arranged on the connecting rod (608), the gear (607) in synchronous rotation is connected to the second rotating shaft (605), and the gear (607) is meshed with the rack (609).

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