PCB copper layer thickness detection device

Abstract

The utility model discloses a PCB copper layer thickness detection device. The PCB copper layer thickness detection device comprises a rack; the detection station is arranged on the upper end face of the rack; the multi-frequency probe array is provided with a plurality of groups of multi-frequency probes and is arranged above the detection station; the control panel is arranged on one side of the rack; the rotating assembly is used for driving the multi-frequency probe array to rotate and is arranged on the multi-frequency probe array, the rotating assembly comprises a supporting plate, the supporting plate is arranged above the multi-frequency probe array, and a rotating piece is arranged between the supporting plate and the multi-frequency probe array; by arranging the rotating assembly composed of the supporting plate and the rotating piece, the multi-frequency probe array can be driven to rotate, so that the multi-frequency probe array can carry out multi-directional thickness detection on the detected workpiece, the accuracy of thickness detection of the detected workpiece is improved, and the situation that the thickness of the detected workpiece cannot be detected in all directions is avoided. And the detection accuracy of the thickness of the workpiece is reduced.

Description

Technical Field

[0001] This utility model relates to the field of PCB manufacturing quality inspection technology, specifically a PCB copper layer thickness detection device. Background Technology

[0002] With the rapid development of electronic technology, PCB boards are widely used in various fields, and almost all electronic devices contain corresponding PCB boards. In the production process of PCB boards, the thickness of copper-clad laminates is subject to very high requirements. Copper-clad laminates with unqualified thickness will be scrapped directly during the manufacturing process and will affect production efficiency. Therefore, it is necessary to check the thickness of copper-clad laminates in intermediate processes and reject copper-clad laminates with unqualified thickness.

[0003] However, existing inspection devices cannot perform comprehensive thickness inspection of the workpiece, which reduces the accuracy of the thickness inspection and thus reduces the efficiency of the workpiece thickness inspection. Therefore, we propose a PCB copper layer thickness inspection device to solve the above-mentioned problems. Utility Model Content

[0004] The purpose of this invention is to provide a PCB copper layer thickness detection device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A PCB copper layer thickness detection device, comprising:

[0007] frame;

[0008] The inspection station is located on the upper surface of the frame;

[0009] A multi-frequency probe array, which is equipped with multiple sets of multi-frequency probes and is positioned above the testing station;

[0010] The control panel is located on one side of the rack;

[0011] A rotating assembly is used to drive a multi-frequency probe array to rotate and is disposed on the multi-frequency probe array. The rotating assembly includes a support plate, which is disposed above the multi-frequency probe array, and a rotating component is disposed between the support plate and the multi-frequency probe array.

[0012] As a further embodiment of this utility model: the rotating component includes a rotary motor, which is disposed on the upper surface of the support plate. The output end of the rotary motor passes through the support plate and is connected to a rotating rod. A rotating plate is disposed at the lower end of the rotating rod. The rotating plate is connected to a multi-frequency probe array. An annular groove is disposed on the upper surface of the rotating plate. Two sets of sliders are slidably disposed inside the annular groove. A first vertical rod is disposed on the upper surface of each of the two sets of sliders. A first fixing block is disposed on the upper surface of each of the two sets of first vertical rods. A connecting plate is disposed on each of the two sets of first fixing blocks. A second fixing block is disposed at the other end of each of the two sets of connecting plates. A second vertical rod is disposed on the lower surface of the second fixing block. The lower surface of the second vertical rod is disposed on the upper surface of the support plate.

[0013] As a further embodiment of this utility model: a circular block is provided on one side of the support plate, an electric push rod is provided on the lower end surface of the circular block, and a movable plate is provided on the lower end surface of the electric push rod.

[0014] As a further embodiment of this utility model: the lower end face of the movable plate is slidably disposed on the upper end face of the fixed frame, and the lower end face of the fixed frame is disposed on the upper end face of the frame.

[0015] As a further embodiment of this utility model: a threaded rod is provided on the inner wall of the fixed frame, one end of the threaded rod is connected to the output end of the rotating motor, and the rotating motor is provided on one side wall of the fixed frame.

[0016] As a further embodiment of this utility model: a threaded block is threadedly sleeved on the outer side of the threaded rod, and the threaded block is connected to the movable plate.

[0017] As a further improvement of this utility model, an X-ray calibration workpiece is provided on one side of the upper surface of the movable plate.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] This PCB copper layer thickness detection device, through a rotating assembly consisting of a support plate and a rotating component, can drive a multi-frequency probe array to rotate, enabling the multi-frequency probe array to perform multi-directional thickness detection on the workpiece. This improves the accuracy of workpiece thickness detection, avoids the problem of not being able to perform omnidirectional thickness detection on the workpiece, which reduces the accuracy of workpiece thickness detection, and improves the work efficiency of workpiece thickness detection. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of this utility model.

[0021] Figure 2This is a side view of the structure of this utility model.

[0022] Figure 3 for Figure 2 A magnified structural diagram of A.

[0023] The components include: 1. Frame; 2. Inspection station; 3. Multi-frequency probe array; 4. Control panel; 5. Support plate; 6. Rotary motor; 7. Rotating rod; 8. Rotating plate; 9. Circular groove; 10. Slider; 11. First vertical rod; 12. First fixing block; 13. Connecting plate; 14. Second fixing block; 15. Second vertical rod; 16. Circular block; 17. Electric push rod; 18. Moving plate; 19. Fixed frame; 20. Threaded rod; 21. Rotary motor; 22. Threaded block; 23. X-ray calibration workpiece. Detailed Implementation

[0024] In one embodiment, such as Figures 1-3 As shown, a PCB copper layer thickness detection device includes:

[0025] Rack 1;

[0026] Inspection station 2 is located on the upper surface of frame 1;

[0027] The multi-frequency probe array 3 is equipped with multiple sets of multi-frequency probes and is positioned above the detection station 2.

[0028] Control panel 4 is located on one side of rack 1;

[0029] A rotating assembly is used to drive the multi-frequency probe array 3 to rotate and is disposed on the multi-frequency probe array 3. The rotating assembly includes a support plate 5, which is disposed above the multi-frequency probe array 3, and a rotating component is disposed between the support plate 5 and the multi-frequency probe array 3.

[0030] The rotating component includes a rotary motor 6, which is mounted on the upper surface of the support plate 5. The output end of the rotary motor 6 passes through the support plate 5 and is connected to a rotating rod 7. A rotating plate 8 is mounted on the lower end of the rotating rod 7. The rotating plate 8 is connected to the multi-frequency probe array 3. An annular groove 9 is mounted on the upper surface of the rotating plate 8. Two sets of sliders 10 are slidably mounted inside the annular groove 9. A first vertical rod 11 is mounted on the upper surface of each set of sliders 10. A first fixing block 12 is mounted on the upper surface of each set of first vertical rods 11. A connecting plate 13 is mounted on each set of first fixing blocks 12. A second fixing block 14 is mounted on the other end of each set of connecting plates 13. A second vertical rod 15 is mounted on the lower surface of the second fixing block 14. The lower surface of the second vertical rod 15 is mounted on the upper surface of the support plate 5.

[0031] Specifically, in use, the workpiece is placed on the inspection station 2, and the multi-frequency probe array 3 performs thickness detection on the workpiece. Then, the rotary motor 6 is started, which drives the rotating rod 7 to rotate. The rotating rod 7 drives the rotating plate 8 to rotate, which in turn drives the multi-frequency probe array 3 to rotate. This allows the multi-frequency probe array 3 to perform omnidirectional thickness detection on the workpiece, improving the accuracy of thickness detection. By setting up a rotating assembly consisting of a support plate 5 and rotating parts, the multi-frequency probe array 3 can be driven to rotate, enabling it to perform multi-directional thickness detection on the workpiece. This improves the accuracy of workpiece thickness detection, avoids the problem of not being able to perform omnidirectional thickness detection, and reduces the accuracy of workpiece thickness detection, thus improving the efficiency of workpiece thickness detection.

[0032] like Figures 1-3 As shown, a circular block 16 is provided on one side of the support plate 5, an electric push rod 17 is provided on the lower end surface of the circular block 16, and a movable plate 18 is provided on the lower end surface of the electric push rod 17; the height of the multi-frequency probe array 3 can be adjusted by setting the electric push rod 17.

[0033] like Figures 1-3 As shown, the lower end face of the movable plate 18 is slidably mounted on the upper end face of the fixed frame 19, and the lower end face of the fixed frame 19 is mounted on the upper end face of the frame 1. A threaded rod 20 is provided on the inner wall of the fixed frame 19, one end of which is connected to the output end of the rotating motor 21, which is mounted on one side wall of the fixed frame 19. A threaded block 22 is threadedly fitted on the outer side of the threaded rod 20, and the threaded block 22 is connected to the movable plate 18. An X-ray calibration workpiece 23 is provided on one side of the upper end face of the movable plate 18. The position of the workpiece can be detected by the X-ray calibration workpiece 23, and the rotating motor 21 can be started. The rotating motor 21 drives the threaded block 22 to move through the threaded rod 20, so that the threaded block 22 can drive the movable plate 18 to move, thereby making the multi-frequency probe array 3 located above the workpiece, which is quite convenient.

[0034] The above embodiment discloses a PCB copper layer thickness detection device. In use, the workpiece to be detected is placed on the detection station 2, and then the multi-frequency probe array 3 detects the thickness of the workpiece. Then, the rotary motor 6 is started, which drives the rotating rod 7 to rotate. The rotating rod 7 drives the rotating plate 8 to rotate, which in turn drives the multi-frequency probe array 3 to rotate. This allows the multi-frequency probe array 3 to perform omnidirectional thickness detection on the workpiece, improving the accuracy of the thickness detection. At the same time, the position of the workpiece can be detected by calibrating the workpiece 23 with X-rays. The rotary motor 21 can be started, and the rotary motor 21 drives the threaded block 22 to move through the threaded rod 20. The threaded block 22 can then drive the moving plate 18 to move, thereby positioning the multi-frequency probe array 3 above the workpiece, which is quite convenient.

[0035] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A PCB copper layer thickness detection device, characterized in that, Include: Rack (1); Detection station (2) is arranged on the upper end surface of rack (1); Multi-frequency probe array (3) is provided with multiple groups of multi-frequency probes, and is arranged above the detection station (2); Control panel (4) is arranged on one side of rack (1); Rotary assembly for driving multi-frequency probe array (3) to rotate, and is arranged on multi-frequency probe array (3), the rotary assembly includes support plate (5), the support plate (5) is arranged above multi-frequency probe array (3), and the rotary member is arranged between support plate (5) and multi-frequency probe array (3).

2. The PCB copper layer thickness detection device according to claim 1, wherein, The rotary member includes rotary motor (6), the rotary motor (6) is arranged on the upper end surface of support plate (5), the output end of rotary motor (6) passes through support plate (5), and is connected with rotating rod (7), the lower end of rotating rod (7) is provided with rotating plate (8), the rotating plate (8) is connected with multi-frequency probe array (3), the upper end surface of rotating plate (8) is provided with circular groove (9), two groups of sliding blocks (10) are arranged in the inside of circular groove (9), a group of first vertical rods (11) is arranged on the upper end surface of two groups of sliding blocks (10), a group of first fixing blocks (12) is arranged on the upper end surface of two groups of first vertical rods (11), a group of connecting plates (13) is arranged on two groups of first fixing blocks (12), the other end of two groups of connecting plates (13) is provided with second fixing block (14), the lower end surface of second fixing block (14) is provided with second vertical rod (15), the lower end surface of second vertical rod (15) is arranged on the upper end surface of support plate (5).

3. The PCB copper layer thickness detection device according to claim 1, wherein, One side of the support plate (5) is provided with a circular block (16), and the lower end surface of the circular block (16) is provided with an electric push rod (17).

4. The PCB copper layer thickness detection device according to claim 3, characterized in that, The lower end surface of the moving plate (18) is slidably arranged on the upper end surface of the fixed frame (19), and the lower end surface of the fixed frame (19) is arranged on the upper end surface of the rack (1).

5. The PCB copper layer thickness detection device according to claim 4, characterized in that, The inner wall of the fixed frame (19) is provided with a threaded rod (20), one end of the threaded rod (20) is connected with the output end of the rotating motor (21), and the rotating motor (21) is arranged on one side wall of the fixed frame (19).

6. The PCB copper layer thickness detection device according to claim 5, wherein, The outer side of the threaded rod (20) is threadedly sleeved with a threaded block (22), and the threaded block (22) is connected with the moving plate (18).

7. The PCB copper layer thickness detection device according to claim 4, wherein, One side of the upper end surface of the moving plate (18) is provided with an X-ray calibration workpiece (23).

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