Anti-static socket for memory chip test
By introducing a plasma static eliminator into the memory chip test socket, directional static electricity elimination of the chip surface and surrounding space is achieved, solving the problem of insufficient static electricity protection in the prior art and improving the reliability and yield of chip testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-02
- Publication Date
- 2026-03-10
AI Technical Summary
Existing memory chip test sockets have limited effectiveness in eliminating spatial static charges or residual static electricity suspended in the air around the chip and attached to the chip's insulating package surface, which may cause the chip to be damaged by electrostatic discharge during testing.
An anti-static socket was designed, which uses a plasma static elimination component. A detachable and reversible air blower box blows clean ion air onto the chip surface and the surrounding space to eliminate static electricity.
It effectively eliminates static electricity on the chip surface and in the surrounding space, reduces the risk of chip damage due to electrostatic discharge during testing, and improves product yield and reliability.
Smart Images
Figure CN223986155U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip test socket technical field especially relates to a kind of anti-static socket for storage chip test. BACKGROUND
[0002] Storage chip test socket is the key fixture in semiconductor post-process, for establishing the precision, reliable electrical and mechanical connection between it and automatic test equipment after chip packaging is completed, its core role is under the condition of simulating real working environment electrical signal, the data read-write function, speed, power consumption and stability of storage chip are comprehensively detected, and the products meeting performance standards are screened out, it is necessary link to guarantee chip factory quality and reliability, in the testing process, static protection is crucial, storage chip is integrated with extremely fine transistor and storage unit inside, its gate oxide layer is very thin, is highly sensitive to static electricity, existing test socket generally uses ground wire to connect socket main body into ground, to discharge static charge generated by operator or environment.
[0003] The anti-static socket for storage chip test in the prior art still has some problems in use, such as: the ground mainly eliminates the charge on the conductor directly contacted with the socket, and the effect of eliminating the space static charge suspended in the air around the chip and attached to the surface of the insulating package of the chip is limited. These residual static electricity can form a high potential difference and cause instantaneous discharge when the chip pin contacts the socket contact. Although the discharge energy is small, it is enough to break the fragile gate oxide layer or metal wire inside the chip, causing permanent damage to the circuit, resulting in functional failure, parameter drift or potential reliability decline, leading to product yield loss and cost increase. UTILITY MODEL CONTENTS
[0004] The utility model aims at providing an anti-static socket for storage chip test, which solves the problem of limited effect of eliminating space static charge suspended in the air around the chip and attached to the surface of the insulating package of the chip in the anti-static socket for storage chip test in the prior art by providing an electrostatic elimination mechanism.
[0005] The technical scheme of the utility model is as follows: an anti-static socket for storage chip test, comprising a detection box, a cover plate movably connected to the top of the detection box through a rotating shaft, an electrostatic elimination mechanism arranged on the top of the cover plate, the electrostatic elimination mechanism comprising a supporting frame arranged on the top of the cover plate, a mounting plate fixedly connected around the supporting frame, a mounting hole formed in the mounting plate, a mounting rod inserted into the mounting hole, a contact plate fixedly connected to one end of the mounting rod, a plasma electrostatic elimination assembly fixedly connected to one side of the contact plate, and a fixing assembly arranged at the bottom of the cover plate.
[0006] Preferably, the support frame is rectangular in shape, and the top and bottom of the support frame are open.
[0007] Preferably, two mounting holes are formed in the mounting plate.
[0008] Preferably, the plasma static electricity removing assembly comprises a blowing box, a plasma emitting needle, a high-voltage generator, an airflow driving device, and a control and sensing unit, the blowing box is fixedly connected to one side of the contact plate, and the plasma emitting needle, the high-voltage generator, the airflow driving device, and the control and sensing unit are fixedly connected inside the blowing box.
[0009] Preferably, the plasma static electricity removing assembly is provided with an air inlet and an air outlet at two ends along the airflow direction of the plasma static electricity removing assembly, a dust filter screen is detachably mounted at the air inlet by magnetic attraction, and the air outlet is aligned with the chip detection area in the detection box and at the bottom of the detection box.
[0010] Preferably, two contact plates are fixedly connected to the side and the top of the plasma static electricity removing assembly.
[0011] Preferably, the fixing assembly comprises a fixing socket formed in the top of the cover plate and a fixing rod arranged in the fixing socket.
[0012] The utility model discloses a kind of anti-static sockets for chip testing, which comprises a support frame, a mounting plate, a plurality of contact plates, a plasma static electricity removing assembly and a fixing assembly.The support frame is rectangular in shape, and the top and bottom of the support frame are open.The mounting plate is fixedly connected to the top of the support frame, and the mounting plate is provided with two groups of mounting holes.The plurality of contact plates are fixedly connected to the side and the top of the plasma static electricity removing assembly.The plasma static electricity removing assembly comprises a blowing box, a plasma emitting needle, a high-voltage generator, an airflow driving device, and a control and sensing unit, the blowing box is fixedly connected to one side of the contact plate, and the plasma emitting needle, the high-voltage generator, the airflow driving device, and the control and sensing unit are fixedly connected inside the blowing box.The fixing assembly comprises a fixing socket formed in the top of the cover plate and a fixing rod arranged in the fixing socket. BRIEF DESCRIPTION OF DRAWINGS
[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description.
[0014] Figure 1 It is a perspective view of an anti-static socket for chip testing.
[0015] Figure 2 It is an installation process diagram of a support frame in an anti-static socket for chip testing.
[0016] Figure 3This is an installation diagram of the bottom blowing state of the ion static eliminator component in an anti-static socket used for memory chip testing.
[0017] Figure 4 This is a side-blowing diagram of a plasma eliminator component in an anti-static socket used for memory chip testing.
[0018] Figure 5 This is a cross-sectional view of the support frame in an anti-static socket used for testing memory chips.
[0019] Explanation of reference numerals in the attached drawings: 1. Detection box; 2. Cover plate; 3. Static elimination mechanism; 31. Support frame; 32. Mounting plate; 33. Mounting through hole; 34. Mounting rod; 35. Contact plate; 36. Plasma static elimination assembly; 37. Fixing assembly; 371. Fixing hole; 372. Fixing rod; 4. Dust filter. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. The described embodiments are only some embodiments of the present utility model, and not all embodiments. Example 1
[0021] Please see Figures 1-5 This is the first embodiment of the present invention, which provides an anti-static socket for testing memory chips, including a test box 1. A cover plate 2 is movably connected to the top of the test box 1 via a pivot. An anti-static mechanism 3 is provided on the top of the cover plate 2. The anti-static mechanism 3 includes a support frame 31 disposed on the top of the cover plate 2, a mounting plate 32 fixedly connected around the support frame 31, a mounting through hole 33 opened inside the mounting plate 32, a mounting rod 34 inserted into the mounting through hole 33, a contact plate 35 fixedly connected to one end of the mounting rod 34, and a plasma destatic device fixedly connected to one side of the contact plate 35. The electrical component 36, the plasma static elimination component 36 includes a blower box, a plasma emitting needle, a high-voltage generator, an airflow driving device, and a control and sensing unit. The blower box is fixedly connected to one side of the contact plate 35. The plasma emitting needle, the high-voltage generator, the airflow driving device, and the control and sensing unit are all fixedly connected inside the blower box. There is also a fixing component 37 set at the bottom of the cover plate 2. The fixing component 37 includes a fixing hole 371 opened at the top of the cover plate 2 and a fixing rod 372 set inside the fixing hole 371. The fixing rod 372 is fixedly connected to the inner top of the support frame 31.
[0022] During operation, the support frame 31 is fitted onto the top of the cover plate 2, and the fixing rod 372 at the bottom of the support frame 31 is aligned and inserted into the fixing hole 371 on the cover plate 2, thereby fixing the support frame 31 onto the cover plate 2. The installation direction is selected according to the test requirements. If it is necessary to blow ion air into the inner cavity of the test box 1, the mounting rod 34 on the contact plate 35 connected to the side of the plasma static elimination component 36 is inserted into the mounting through hole 33 on the mounting plate 32 on the side of the support frame 31. If it is necessary to blow ion air into the bottom of the test box 1, the mounting rod 34 on the contact plate 35 connected to the top of the component is inserted into the mounting through hole 33 on the mounting plate 32 at the top of the support frame 31, thus completing the orientation and fixation of the plasma static elimination component 36.
[0023] Then, the control and sensing unit is manually started, and the airflow drive device starts working. External air enters the blower box after being filtered by the dust filter 4 at the air inlet. The high-voltage generator drives the plasma emission needle to generate ions. The clean airflow carries positive and negative ions to form an ion wind, which is blown from the air outlet to the corresponding chip detection area, thereby effectively neutralizing the static charge on the surface and around the chip before it is placed.
[0024] After static electricity elimination, open cover 2, place the chip under test into the chip test area, close cover 2, and cover 2 is fully closed via a pivot. The internal mechanical pressure mechanism is triggered, pressing the chip evenly and stably against the test area of test box 1. At this time, the precision elastic probe array on test box 1 establishes reliable electrical contact with all pins of the memory chip, forming a complete electrical test path. The automatic test equipment applies preset power, signals, and test commands to the chip through this path, and receives and analyzes the chip's response data, thereby completing a comprehensive test of the memory chip's function. After the test, open cover 2 to safely remove the chip. This is existing technology, and this solution will not be described in detail. Moreover, those skilled in the art can clearly understand the working principle.
[0025] By setting up multiple plasma static elimination components 36, plasma air can be blown from the side into the storage chip test area inside the test box 1, or blown downwards to the test plate, to eliminate static electricity before testing. By setting up the fixing components 37, the fixing rods 372 on the support frame 31 can be inserted from top to bottom into the corresponding fixing holes 371 to complete the fixing of the support frame 31. Example 2
[0026] Please see Figures 1-4 This is the second embodiment of the present invention, which is based on the previous embodiment.
[0027] Specifically, the support frame 31 is rectangular in shape, and both the top and bottom of the support frame 31 are open. The open support frame 31, together with the fixing component 37, is directly fitted onto the top of the cover plate 2, providing an installation base for the plasma static elimination component 36. The two mounting through holes 33 are set in a group inside the mounting plate 32. The two mounting through holes 33 are used to improve the stability after the mounting rod 34 is inserted, and to prevent the plasma static elimination component 36 from deflecting after installation. Example 3
[0028] Please see Figures 1-5 This is the third embodiment of the present invention, which is based on the first two embodiments.
[0029] Specifically, the plasma static eliminator 36 has an air inlet and an air outlet at both ends along its airflow direction. A dust filter 4 is detachably installed at the air inlet via magnetic attraction to filter dust from the air before it enters. The air outlet is aligned with the chip detection area inside and at the bottom of the detection box 1. Through this structure, the external airflow, driven by the device, passes through the dust filter 4 and enters the blower box, carrying positive and negative ions generated by the plasma emission needle to form a clean ionized airflow, which is then blown from the air outlet onto the surface of the chip under test. In the current static electricity neutralization process, two contact plates 35 are fixedly connected to the side and top of the plasma static eliminator 36. When the mounting rod 34 on the side contact plate 35 is inserted into the mounting through hole 33, the blower box is in a vertical state and is used to blow plasma air into the memory chip testing area inside the test box 1. When the mounting rod 34 on the top contact plate 35 is inserted into the mounting through hole 33, the blower box is in a horizontal state and is used to blow plasma air into the memory chip testing area at the bottom of the test box 1. The corresponding static electricity elimination method can be selected according to the chip testing requirements.
[0030] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.
Claims
1. An anti-static socket for storing chip testing, comprising a detection box (1), a cover plate (2) movably connected to the top of the detection box (1) through a rotating shaft, characterized in that: The cover plate (2) is provided with an electrostatic elimination mechanism (3) on the top, which comprises a supporting frame (31) provided on the top of the cover plate (2), a mounting plate (32) fixedly connected around the supporting frame (31), mounting through holes (33) opened in the mounting plate (32), mounting rods (34) inserted into the mounting through holes (33), contact plates (35) fixedly connected to one end of the mounting rods (34), plasma electrostatic elimination assemblies (36) fixedly connected to one side of the contact plates (35), and fixing assemblies (37) provided on the bottom of the cover plate (2).
2. An anti-static socket for storing chip testing according to claim 1, characterized in that: The supporting frame (31) is rectangular in shape, and the top and bottom of the supporting frame (31) are both open.
3. The anti-static socket for storage chip testing of claim 1, wherein: Two of the mounting through holes (33) are opened in the mounting plate (32) as a group.
4. The anti-static socket for storage chip testing of claim 1, wherein: The plasma electrostatic elimination assembly (36) comprises a blowing box, a plasma emission needle, a high-voltage generator, an airflow driving device, and a control and sensing unit, the blowing box is fixedly connected to one side of the contact plate (35), and the plasma emission needle, the high-voltage generator, the airflow driving device, and the control and sensing unit are all fixedly connected in the blowing box.
5. The anti-static socket for storage chip testing of claim 1, wherein: The plasma electrostatic elimination assembly (36) is provided with an air inlet and an air outlet at two ends along the airflow direction, respectively, a dust filter screen (4) is detachably mounted at the air inlet by magnetic attraction, and the air outlet is aligned with the chip detection area in the detection box (1).
6. The anti-static socket for storage chip testing of claim 1, wherein: Two of the contact plates (35) are fixedly connected to the side and the top of the plasma electrostatic elimination assembly (36) as a group.
7. The anti-static socket for storage chip testing of claim 1, wherein: The fixing assembly (37) comprises a fixing jack (371) opened on the top of the cover plate (2), and a fixing jack rod (372) provided in the fixing jack (371).