Network card structure and server
By incorporating adjustable heat dissipation components and airflow guides into the network interface card (NIC) structure, the problem of uneven heat dissipation in dual-layer NICs is solved, achieving efficient utilization of heat dissipation space and chip temperature control, thereby improving server stability and performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-02
- Publication Date
- 2026-03-10
AI Technical Summary
In existing technologies, the heat dissipation effect of dual-layer network cards is uneven, resulting in poor utilization of heat dissipation space. In particular, heat near high-power chips is difficult to dissipate effectively, affecting the overall heat dissipation efficiency and server stability.
An adjustable heat dissipation component, including adjustable heat dissipation fins and air guide baffles, is set between the first and second circuit boards to form an independent heat dissipation area. The airflow distribution is optimized through the air guide component to achieve dynamic heat dissipation support for chips with different power consumption.
This achieves a balanced distribution of heat dissipation capacity, improves the utilization rate of heat dissipation space, significantly reduces chip temperature, and enhances the overall operational stability and data processing capabilities of the server.
Smart Images
Figure CN223986326U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of servers, and in particular to a network card structure and a server. BACKGROUND
[0002] In the current intelligent network card design, a double-layer PCB board architecture is usually used, in which the lower layer board PCB carries high-power service chips such as logic chips or data exchange chips, and the upper layer board PCB carries relatively low-power management chips such as CPU chips. This layered design leads to uneven heat dissipation requirements of the upper and lower layer boards, and the heat near the high-power chips is difficult to effectively dissipate, while the heat dissipation capacity at the low-power chips is relatively excessive.
[0003] However, due to the presence of medium-height chips on the board, the space above them cannot be fully utilized by the heat sink, resulting in a coexistence of wasted heat dissipation space and low heat dissipation efficiency, further exacerbating the heat dissipation problem. Moreover, the difference in the number of devices and power consumption of the upper and lower layer PCB boards leads to uneven heat dissipation, affecting the heat dissipation efficiency, especially the difference in the number of devices at the backboard position, causing inconsistent air flow resistance; at the same time, the design of the heat sink is limited by the manufacturing process, and the heat dissipation fins cannot be arranged in the space above the chips, resulting in insufficient effective utilization of the heat dissipation space, which cannot meet the heat dissipation requirements of high-power chips. SUMMARY
[0004] The present application provides a network card structure and a server to at least solve the technical problem of poor heat dissipation effect of the double-layer network card in the related art, which leads to poor utilization of heat dissipation space.
[0005] The present application provides a network card structure, comprising: a first circuit board comprising a first main chip; a second circuit board comprising a second main chip; a heat dissipation assembly located between the first circuit board and the second circuit board, the heat dissipation assembly comprising a mounting frame and a heat dissipation structure arranged in the mounting frame, the mounting frame comprising a first mounting plate and a second mounting plate arranged oppositely, the first main chip being in contact with the first mounting plate, and the second main chip being in contact with the second mounting plate; the heat dissipation structure comprising a first heat dissipation part and a second heat dissipation part arranged at intervals, the first heat dissipation part being connected with the first mounting plate, and the first heat dissipation part being connected with the second mounting plate; wherein the heat dissipation area of the first heat dissipation part and the second heat dissipation part is adjustably arranged.
[0006] Further, the heat dissipation structure comprises: a plurality of heat dissipation fins arranged at intervals in the mounting frame, each heat dissipation fin comprising a first fin segment and a second fin segment, the first fin segment being connected with the first mounting plate, and the second fin segment being connected with the second mounting plate, the plurality of first fin segments forming the first heat dissipation part, and the plurality of second fin segments forming the second heat dissipation part; wherein the size or shape of the first fin segment and the second fin segment is adjustably arranged.
[0007] Furthermore, the heat dissipation assembly also includes: an air guide component, disposed within the mounting frame and connected to the first heat dissipation part and the second heat dissipation part respectively, so that at least part of the airflow flowing through the first heat dissipation part and the second heat dissipation part converges at the air guide component and flows out from the gap between the first heat dissipation part and the second heat dissipation part.
[0008] Furthermore, the first heat dissipation part is provided extending along a first direction, and the air guiding component includes: a first air guiding baffle, which is disposed on the first mounting plate and located near the first main chip, the first air guiding baffle extends along a second direction and is at least partially connected to the first heat dissipation part; wherein the first direction and the second direction are arranged perpendicular to each other; and / or, the length and height of the first air guiding baffle are adjustable.
[0009] Furthermore, the second heat dissipation section is provided extending along the first direction, and the air guiding component includes: a second air guiding baffle, which is disposed on the second mounting plate and located near the second main chip, the second air guiding baffle extends along the second direction and is at least partially connected to the second heat dissipation section; wherein the first direction and the second direction are arranged perpendicular to each other; and / or, the length and height of the second air guiding baffle are adjustable.
[0010] Furthermore, the first circuit board also includes: a first substrate, a first main chip disposed on the bottom surface of the first substrate, the bottom surface of the first substrate facing the first mounting plate and connected to the first mounting plate; a functional device, a first data interaction interface, and a power chip, the functional device and the first data interaction interface being disposed on the bottom surface of the first substrate respectively, the first data interaction interface being connected to the first main chip, and the power chip being disposed on the top surface of the first substrate; wherein at least a portion of the first mounting plate and at least a portion of the first heat dissipation portion are respectively disposed to avoid the functional device and the first data interaction interface.
[0011] Furthermore, the network card structure also includes: a housing located above the first circuit board, the housing being connected to the first substrate and the heat dissipation assembly respectively, the power chip being in contact with the inner wall of the housing, and a heat dissipation component being provided on the top wall of the housing.
[0012] Furthermore, the second circuit board also includes: a second substrate, a second main chip disposed on the top surface of the second substrate, the top surface of the second substrate facing the second mounting plate and connected to the second mounting plate; an external interface, a second data interaction interface, and a backplate, the external interface and the second data interaction interface being disposed on the top surface of the second substrate respectively, the second data interaction interface being connected to the second main chip, and the backplate being disposed on the bottom surface of the second substrate; wherein at least a portion of the second mounting plate and at least a portion of the second heat dissipation portion are respectively disposed to avoid the external interface and the second data interaction interface.
[0013] Furthermore, the heat dissipation component also includes: a bracket, with the opposite ends of the mounting frame connected to the bracket respectively; and a baffle, which is set on the bracket and located at one end of the mounting frame. The baffle is provided with multiple ventilation holes and interface holes at intervals. The ventilation holes are used for ventilation and heat dissipation of the heat dissipation structure, and the interface holes are used for connection between external devices and the network card structure.
[0014] This application also provides a server, including the network interface card (NIC) structure mentioned above.
[0015] This application places a heat dissipation component between a first circuit board and a second circuit board, with the intermediate heat dissipation structure simultaneously cooling the main chips on both PCBs. This structure achieves balanced heat dissipation and effectively improves the utilization rate of the heat dissipation space. Therefore, it can at least solve the technical problem in related technologies where the heat dissipation effect of dual-layer network cards is not balanced, resulting in poor utilization of the heat dissipation space.
[0016] Furthermore, the heat dissipation areas of the first and second heat dissipation sections are adjustable, enabling dynamic allocation of heat dissipation resources based on the actual power consumption of the main chip. This feature ensures that main chips with different power consumption levels receive adequate heat dissipation support, avoiding waste or insufficiency of heat dissipation resources. This achieves a balanced distribution of heat dissipation performance among different chips, enhancing the overall heat dissipation capacity of the system. Compared to traditional heat dissipation methods, this approach can more directly and efficiently handle the heat generated by high-power chips, significantly reducing chip temperature and improving the overall operational stability of the network card and server. Attached Figure Description
[0017] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of a network interface card (NIC) structure provided in an embodiment of this application;
[0019] Figure 2 An exploded view of a network interface card (NIC) structure provided in an embodiment of this application;
[0020] Figure 3 This is a schematic diagram of the structure of a first circuit board for a network interface card (NIC) structure provided in an embodiment of this application;
[0021] Figure 4 This is a schematic diagram of the structure of a second circuit board for a network interface card (NIC) provided in an embodiment of this application;
[0022] Figure 5 This is a cross-sectional view of a network interface card (NIC) structure provided in an embodiment of this application.
[0023] The above figures include the following reference numerals:
[0024] 10. First circuit board; 11. First main chip; 12. First substrate; 13. Functional device; 14. First data interaction interface; 15. Power chip; 16. Housing; 160. Heat sink;
[0025] 20. Second circuit board; 21. Second main chip; 22. Second substrate; 23. External interface; 24. Second data interaction interface; 25. Backplane;
[0026] 30. Heat dissipation assembly; 31. Mounting frame; 310. First mounting plate; 311. Second mounting plate; 32. Heat dissipation structure; 320. First heat dissipation section; 321. Second heat dissipation section; 33. Heat dissipation fins; 330. First fin segment; 331. Second fin segment; 34. Bracket; 35. Baffle;
[0027] 40. Air guide component; 41. First air guide baffle; 42. Second air guide baffle. Detailed Implementation
[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.
[0029] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.
[0030] To address the technical problem of uneven heat dissipation in dual-layer network interface cards (NICs) leading to poor heat dissipation space utilization, a NIC structure and server are provided.
[0031] Please refer to Figures 1 to 5As shown, this application provides a network interface card (NIC) structure, including a first circuit board 10, a second circuit board 20, and a heat dissipation assembly 30. The first circuit board 10 includes a first main chip 11; the second circuit board 20 includes a second main chip 21; the heat dissipation assembly 30 is located between the first circuit board 10 and the second circuit board 20, and includes a mounting frame 31 and a heat dissipation structure 32 disposed within the mounting frame 31. The mounting frame 31 includes a first mounting plate 310 and a second mounting plate 311 disposed opposite to each other. The first main chip 11 is in contact with the first mounting plate 310, and the second main chip 21 is in contact with the second mounting plate 311; the heat dissipation structure 32 includes a first heat dissipation part 320 and a second heat dissipation part 321 disposed at intervals. The first heat dissipation part 320 is connected to the first mounting plate 310, and the first heat dissipation part 320 is connected to the second mounting plate 311; wherein the heat dissipation area of the first heat dissipation part 320 and the second heat dissipation part 321 is adjustable.
[0032] This application places the heat dissipation component 30 between the first circuit board 10 and the second circuit board 20, with the intermediate heat dissipation structure 32 simultaneously cooling the main chips on both PCBs. This structure achieves balanced heat dissipation capacity and effectively improves the utilization rate of the heat dissipation space. Therefore, it can at least solve the technical problem in related technologies where the heat dissipation effect of dual-layer network cards is not balanced, resulting in poor utilization of the heat dissipation space.
[0033] Furthermore, the heat dissipation areas of the first heat dissipation unit 320 and the second heat dissipation unit 321 are adjustable, enabling dynamic allocation of heat dissipation resources based on the actual power consumption of the main chip. This feature ensures that main chips with different power consumption levels receive matching heat dissipation support, avoiding waste or insufficiency of heat dissipation resources. This achieves a balanced distribution of heat dissipation performance among different chips, enhancing the overall heat dissipation capacity of the system. Compared to traditional heat dissipation methods, this approach can more directly and efficiently handle the heat generated by high-power chips, significantly reducing chip temperature and improving the overall operational stability of the network card and server.
[0034] In this embodiment, the first circuit board 10 is a management board, and the second circuit board 20 is a service mainboard.
[0035] In this embodiment, the heat dissipation structure 32 includes a plurality of heat dissipation fins 33, which are arranged sequentially and at intervals within the mounting frame 31. Each heat dissipation fin 33 includes a first fin segment 330 and a second fin segment 331. The first fin segment 330 is connected to the first mounting plate 310, and the second fin segment 331 is connected to the second mounting plate 311. The plurality of first fin segments 330 form a first heat dissipation part 320, and the plurality of second fin segments 331 form a second heat dissipation part 321. The size or shape of the first fin segment 330 and the second fin segment 331 can be adjusted.
[0036] By arranging multiple sequentially spaced heat dissipation fins 33 within the mounting frame 31, and dividing these fins 33 into a first fin segment 330 and a second fin segment 331, which are respectively connected to the first mounting plate 310 and the second mounting plate 311, two independent but collaborative heat dissipation areas are formed: the first heat dissipation section 320 and the second heat dissipation section 321. This partitioned design effectively increases the area for heat exchange with the air, accelerates the diffusion of heat energy to the external environment, and thus significantly improves heat dissipation efficiency.
[0037] The size or shape of the first fin segment 330 and the second fin segment 331 can be adjusted, allowing the heat dissipation structure 32 to be flexibly configured to meet the heat dissipation needs of different main chips. High-power chips naturally require more heat dissipation, while low-power chips require less heat dissipation at lower temperatures, thus achieving a balanced heat dissipation. This adjustability allows the heat dissipation area to be dynamically matched according to the actual power consumption level of the main chip, optimizing the cooling effect, preventing the formation of localized hot spots, and ensuring that the chip operates within a safe temperature range.
[0038] Furthermore, heat dissipation fins 33 of different sizes (heights) or shapes can guide and optimize the airflow path, making the airflow distribution more uniform and improving the balance of heat dissipation. This design reduces heat dissipation dead zones caused by uneven airflow, improves the utilization efficiency of the internal space of the radiator, and ensures that every part receives sufficient cooling.
[0039] To achieve better heat dissipation, more airflow passes over the heat source chip. The heat dissipation assembly 30 also includes an air guide component 40, which is disposed within the mounting frame 31 and connected to the first heat dissipation part 320 and the second heat dissipation part 321 respectively. This allows at least a portion of the airflow passing through the first heat dissipation part 320 and the second heat dissipation part 321 to converge at the air guide component 40 and flow out from the gap between the first heat dissipation part 320 and the second heat dissipation part 321.
[0040] The design of the air guide component 40 effectively guides and controls the airflow passing through the first heat sink 320 and the second heat sink 321, ensuring that the cooling air can conduct heat exchange more concentratedly and efficiently when passing over the first main chip 11 and the second main chip 21. By converging the airflow, the air guide component 40 promotes the formation of a more optimized cooling path, reduces disordered airflow and heat dissipation dead zones, and improves heat dissipation efficiency.
[0041] As can be seen, the air guide component 40 not only guides airflow but also dynamically balances the heat load of different main chips by adjusting the distribution of airflow between the first heat sink 320 and the second heat sink 321. Especially when the power consumption of the main chips is different, the air guide component 40 can specifically increase the airflow intensity above the high-power chips, ensuring that each chip can be effectively cooled according to its actual heat generation, avoiding local overheating, and balancing the heat dissipation performance of the entire network card structure.
[0042] In this embodiment, the first heat dissipation part 320 is provided to extend along a first direction, and the air guiding component 40 includes a first air guiding baffle 41. The first air guiding baffle 41 is disposed on the first mounting plate 310 and located near the first main chip 11. The first air guiding baffle 41 extends along a second direction and is connected to at least a portion of the first heat dissipation part 320. The first direction and the second direction are perpendicular to each other. The length and height of the first air guiding baffle 41 are adjustable.
[0043] The first air guide baffle 41 extends along the second direction and partially connects with the first heat dissipation section 320. Since the first and second directions are perpendicular to each other, the airflow is forced downwards, causing it to blow over the heat dissipation fins 33 near the chip side, rapidly increasing the flow velocity and creating an airflow impact effect. This design ensures that the airflow can be precisely guided above the first main chip 11 for effective heat exchange through the first heat dissipation section 320. Furthermore, the perpendicularly intersecting directions facilitate vertical airflow penetration, allowing air to contact the chip more directly and improving heat dissipation efficiency.
[0044] The length and height of the first air guide baffle 41 can be adjusted, allowing the airflow coverage and intensity to be dynamically adjusted according to the actual power consumption or operating status of the first main chip 11. For example, when the first main chip 11 is under heavy load, the length and height of the first air guide baffle 41 can be increased to expand the area guiding the airflow and enhance its cooling effect; conversely, when the chip load is low, the baffle size can be appropriately reduced to save heat dissipation resources and reduce unnecessary energy consumption.
[0045] As can be seen, by precisely controlling the airflow, the first air guide baffle 41 can effectively prevent localized overheating and keep the chip within a suitable operating temperature range. This not only improves the overall stability of the system but also reduces the failure rate and corresponding maintenance costs caused by chip overheating. At the same time, reasonable airflow control also helps to reduce the speed of the cooling fan, reducing noise and energy consumption, and further improving the comfort and energy efficiency of the server's working environment.
[0046] In this embodiment, the second heat dissipation part 321 is provided extending along the first direction, and the air guide component 40 includes two air guide baffles. The second air guide baffle 42 is disposed on the second mounting plate 311 and located near the second main chip 21. The second air guide baffle 42 extends along the second direction and is connected to at least a portion of the second heat dissipation part 321. The first direction and the second direction are arranged perpendicular to each other. The length and height of the second air guide baffle 42 are adjustable.
[0047] Similar to the first air guide baffle 41, the length and height of the second air guide baffle 42 can be adjusted, so that the size of the second air guide baffle 42 can be flexibly adjusted according to the real-time power consumption and thermal status of the second main chip 21 to increase or decrease the coverage and intensity of the airflow, thereby achieving precise matching of the heat dissipation requirements of the second main chip 21 and avoiding over-cooling or under-cooling.
[0048] Furthermore, the vertical extension and dimensional adjustability of the second air guide baffle 42 help optimize the internal spatial layout of the heat dissipation assembly 30, ensuring that airflow can circulate in the most efficient manner while avoiding interference with other electronic components. Properly adjusting the length and height of the baffle can promote uniform airflow distribution within the heat sink, reduce heat dissipation blind spots, and improve overall heat dissipation performance.
[0049] In this embodiment, the first air guide baffle 41 and the second air guide baffle 42 are both metal plates, and are respectively located in front of the first main chip 11 and the second main chip 21.
[0050] like Figure 3 As shown, in this embodiment, the first circuit board 10 further includes a first substrate 12, a functional device 13, a first data interaction interface 14, and a power chip 15. The first main chip 11 is disposed on the bottom surface of the first substrate 12, and the bottom surface of the first substrate 12 faces the first mounting plate 310 and is connected to the first mounting plate 310. The functional device 13 and the first data interaction interface 14 are respectively disposed on the bottom surface of the first substrate 12, and the first data interaction interface 14 is connected to the first main chip 11. The power chip 15 is disposed on the top surface of the first substrate 12. At least a portion of the first mounting plate 310 and at least a portion of the first heat dissipation part 320 are respectively disposed to avoid the functional device 13 and the first data interaction interface 14.
[0051] The first main chip 11 is directly disposed on the bottom surface of the first substrate 12, and the bottom surface of the first substrate 12 faces and is connected to the first mounting plate 310. This design ensures that the heat generated by the first main chip 11 can be quickly and directly conducted to the heat dissipation assembly 30. The first mounting plate 310, as part of the heat dissipation assembly 30, is in direct contact with the first main chip 11, which improves the heat conduction efficiency.
[0052] Furthermore, portions of the first mounting plate 310 and the first heat sink 320 avoid the placement of the functional device 13 and the first data interface 14, ensuring that the heat sink 30 does not obstruct or directly contact these sensitive devices. This design avoids potential thermal interference to the functional device 13 and the data interface during heat dissipation, ensuring the normal operation of these critical components and the stability of data transmission.
[0053] The power chip 15 is located on the top surface of the first substrate 12, rather than on the bottom surface of the critical heat dissipation area. This layout optimizes the space utilization of the circuit board and avoids high-heat-generating components obstructing the heat dissipation path. At the same time, the power chip 15 located on the top surface can be cooled by natural ventilation or additional heat dissipation measures above the circuit board, reducing reliance on the first heat sink 320 and achieving a reasonable allocation of heat dissipation resources.
[0054] As can be seen, this design of the first circuit board 10 provides a highly efficient, stable and easy-to-manage thermal solution for the server technology field by optimizing the heat conduction path, avoiding thermal interference, making reasonable use of space, enhancing structural stability, simplifying maintenance and upgrade processes, and improving data processing efficiency.
[0055] In this embodiment, the network card structure further includes a housing 16, which is located above the first circuit board 10. The housing 16 is connected to the first substrate 12 and the heat dissipation assembly 30, respectively. The power chip 15 is in contact with the inner wall of the housing 16, and a heat sink 160 is provided on the top wall of the housing 16. The heat sink 160 is a fin.
[0056] The housing 16 provides physical protection for the first circuit board 10 and its electronic components, preventing damage from external mechanical shocks and environmental factors such as dust and humidity. Simultaneously, the connection between the housing 16 and the first substrate 12 enhances the mechanical strength of the entire network card structure, ensuring stable installation and operation of the network card in the dense environment inside the server, unaffected by structural deformation.
[0057] The power chip 15 is in direct contact with the inner wall of the casing 16, allowing the heat generated by the power chip 15 to be directly conducted to the casing 16. The heat sink 160 on the top wall of the casing 16 further improves heat dissipation efficiency, effectively dissipating the heat from the power chip 15 to the outside through heat exchange with the air. This design not only improves the heat dissipation performance of the power chip 15 but also avoids conflicts with the heat dissipation path of the first main chip 11, ensuring a reasonable allocation of heat dissipation resources.
[0058] It is evident that the inclusion of the outer casing 16 in the network card structure not only strengthens the physical protection of the network card but also optimizes the heat dissipation design, especially the heat dissipation of the power chip 15, thereby improving the reliability of the network card and the overall performance of the server.
[0059] In this embodiment, the top and side surfaces of the housing 16 are provided with multiple sets of threaded holes for connection with the first substrate 12 and the heat dissipation assembly 30.
[0060] like Figure 4 As shown, in this embodiment, the second circuit board 20 further includes a second substrate 22, an external interface 23, a second data interaction interface 24, and a backplate 25. The second main chip 21 is disposed on the top surface of the second substrate 22, and the top surface of the second substrate 22 faces the second mounting plate 311 and is connected to the second mounting plate 311. The external interface 23 and the second data interaction interface 24 are respectively disposed on the top surface of the second substrate 22, and the second data interaction interface 24 is connected to the second main chip 21. The backplate 25 is disposed on the bottom surface of the second substrate 22. At least a portion of the second mounting plate 311 and at least a portion of the second heat dissipation part 321 are respectively disposed to avoid the external interface 23 and the second data interaction interface 24.
[0061] The second main chip 21 is disposed on the top surface of the second substrate 22, and the top surface faces and is connected to the second mounting plate 311. This design ensures that the heat generated by the second main chip 21 can be quickly and directly transferred to the heat dissipation assembly 30. The second mounting plate 311, as part of the heat dissipation path, has good contact with the second main chip 21, which improves the heat conduction efficiency and helps to maintain the stable operation of the second main chip 21 under high load.
[0062] The backplate 25 is disposed on the bottom surface of the second substrate 22. The backplate 25 can not only enhance the structural stability of the second circuit board 20 and prevent board deformation caused by mechanical stress or thermal expansion, but also protect the external interface 23 and the second data interaction interface 24 located on the top surface from physical damage, ensuring the long-term reliability of the circuit board and the security of the interface.
[0063] In this embodiment, the heat dissipation assembly 30 also includes a bracket 34 and a baffle 35. The two ends of the mounting frame 31 are respectively connected to the bracket 34. The baffle 35 is disposed on the bracket 34 and located at one end of the mounting frame 31. The baffle 35 is provided with a plurality of ventilation holes and interface holes at intervals. The ventilation holes are used for ventilation and heat dissipation of the heat dissipation structure 32, and the interface holes are used for external devices to connect to the network card structure.
[0064] The bracket 34, as part of the heat dissipation assembly 30, is connected to the opposite ends of the mounting frame 31. Its main function is to provide structural stability and support. This ensures that the heat dissipation assembly 30 is securely installed inside the network card, avoiding structural deformation caused by internal server vibration or temperature changes, thereby protecting the integrity of the heat dissipation structure 32 and the continuity of the heat dissipation path.
[0065] The connection between the bracket 34 and the mounting frame 31 provides a stable framework for the entire heat dissipation assembly 30, which helps optimize the internal airflow path and ensures that air can flow smoothly through the heat dissipation structure 32, thereby improving heat dissipation efficiency. The design of the bracket 34 can also support the heat dissipation fins 33 or heat sinks, allowing them to exchange heat at the optimal angle and position, avoiding a decrease in heat dissipation performance due to vibration or physical pressure.
[0066] Furthermore, the ventilation holes and interface holes on the baffle 35 are designed with fire protection and electromagnetic compatibility (EMC) requirements in mind. They can effectively isolate the network card from other electronic devices inside the server, reduce electromagnetic interference, and ensure that ventilation requirements are met without introducing fire risks due to airflow.
[0067] In this embodiment, screw holes are provided on the side of the mounting frame 31 for connecting it to the bracket 34 with screws. Screw holes are also provided on the first mounting plate 310, allowing the first main chip 11 on the first circuit board 10 to be locked in place, thus attaching the first main chip 11 to the first substrate 12 and ensuring heat dissipation for the first main chip 11. Screw holes are also provided on the second mounting plate 311, allowing the second main chip 21 on the second circuit board 20 to be locked in place, thus attaching the second main chip 21 to the second mounting plate 311 and ensuring effective heat dissipation for the second main chip 21.
[0068] This application also provides a server, including the network interface card (NIC) structure mentioned above.
[0069] The network card structure of this application can significantly improve the thermal management efficiency of the server. By optimizing the heat dissipation path and balancing the heat distribution between the two-layer PCB, the server's key components, such as the CPU, GPU and smart network card, can be kept within the ideal operating temperature range, avoiding performance degradation or system failure due to overheating, and improving the stability and reliability of the server.
[0070] Furthermore, the intelligent network interface card's efficient heat dissipation design ensures that it maintains high performance even under heavy loads, directly improving the server's data processing capabilities and network transmission efficiency. This is especially true for applications such as cloud computing, artificial intelligence, and big data analytics, which have extremely high demands for computing performance and network speed; the overall performance of the server will be significantly enhanced.
[0071] The foregoing has provided a detailed description of a network interface card (NIC) structure and server provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.
Claims
1. A network card structure, characterized by, The application relates to a heat dissipation assembly. The heat dissipation assembly comprises: a first circuit board (10) comprising a first main chip (11); a second circuit board (20) comprising a second main chip (21); a heat dissipation assembly (30) located between the first circuit board (10) and the second circuit board (20), wherein the heat dissipation assembly (30) comprises a mounting frame (31) and a heat dissipation structure (32) arranged in the mounting frame (31), the mounting frame (31) comprises a first mounting plate (310) and a second mounting plate (311) arranged oppositely, the first main chip (11) is in contact with the first mounting plate (310), and the second main chip (21) is in contact with the second mounting plate (311); the heat dissipation structure (32) comprises a first heat dissipation part (320) and a second heat dissipation part (321) arranged at intervals, the first heat dissipation part (320) is connected with the first mounting plate (310), and the first heat dissipation part (320) is connected with the second mounting plate (311); 2. The net card structure of claim 1, wherein, wherein the heat dissipation areas of the first heat dissipation part (320) and the second heat dissipation part (321) are adjustably arranged. The heat dissipation structure (32) comprises: a plurality of heat dissipation fins (33) arranged at intervals in the mounting frame (31) in sequence, each heat dissipation fin (33) comprises a first fin segment (330) and a second fin segment (331), the first fin segment (330) is connected with the first mounting plate (310), the second fin segment (331) is connected with the second mounting plate (311), a plurality of the first fin segments (330) form the first heat dissipation part (320), and a plurality of the second fin segments (331) form the second heat dissipation part (321); 3. The net card structure of claim 1, wherein, wherein the sizes or shapes of the first fin segments (330) and the second fin segments (331) are adjustably arranged. The heat dissipation assembly (30) further comprises:
4. The net card structure of claim 3, wherein, an air guide component (40) arranged in the mounting frame (31) and connected with the first heat dissipation part (320) and the second heat dissipation part (321) respectively, so that at least part of air flow flowing through the first heat dissipation part (320) and the second heat dissipation part (321) converges at the air guide component (40) and flows out from the gap between the first heat dissipation part (320) and the second heat dissipation part (321). The first heat dissipation part (320) is arranged in extension along a first direction, and the air guide component (40) comprises: a first air guide partition plate (41) arranged on the first mounting plate (310) and located close to the first main chip (11), the first air guide partition plate (41) extends along a second direction and is connected with at least part of the first heat dissipation part (320); 5. The net card structure of claim 3, wherein, wherein the first direction and the second direction are arranged perpendicularly to each other; and / or the length and height of the first air guide partition plate (41) are adjustably arranged. The second heat dissipation part (321) is arranged in extension along a first direction, and the air guide component (40) comprises: A second air guide partition (42) is arranged on the second mounting plate (311) and located close to the second main chip (21), the second air guide partition (42) extends along a second direction and is connected with at least part of the second heat dissipation part (321); Wherein, the first direction and the second direction are arranged perpendicularly to each other; and / or, the length and height of the second air guide partition (42) are adjustably arranged.
6. The net card structure of claim 1, wherein, The first circuit board (10) further comprises: A first substrate (12), the first main chip (11) is arranged on the bottom surface of the first substrate (12), the bottom surface of the first substrate (12) is arranged towards the first mounting plate (310) and connected with the first mounting plate (310); A functional device (13), a first data interaction interface (14) and a power chip (15), the functional device (13) and the first data interaction interface (14) are respectively arranged on the bottom surface of the first substrate (12), the first data interaction interface (14) is connected with the first main chip (11), and the power chip (15) is arranged on the top surface of the first substrate (12); Wherein, at least part of the first mounting plate (310) and at least part of the first heat dissipation part (320) are arranged to avoid the functional device (13) and the first data interaction interface (14) respectively.
7. The net card structure of claim 6, wherein, The network card structure further comprises: An outer shell (16) located above the first circuit board (10), the outer shell (16) is connected with the first substrate (12) and the heat dissipation assembly (30) respectively, the power chip (15) is in contact with the inner wall of the outer shell (16), and a heat dissipation piece (160) is arranged on the top wall of the outer shell (16).
8. The net card architecture of claim 1, wherein, The second circuit board (20) further comprises: A second substrate (22), the second main chip (21) is arranged on the top surface of the second substrate (22), the top surface of the second substrate (22) is arranged towards the second mounting plate (311) and connected with the second mounting plate (311); An external interface (23), a second data interaction interface (24) and a backboard (25), the external interface (23) and the second data interaction interface (24) are respectively arranged on the top surface of the second substrate (22), the second data interaction interface (24) is connected with the second main chip (21), and the backboard (25) is arranged on the bottom surface of the second substrate (22); Wherein, at least part of the second mounting plate (311) and at least part of the second heat dissipation part (321) are arranged to avoid the external interface (23) and the second data interaction interface (24) respectively.
9. The net card architecture of claim 1, wherein, The heat dissipation assembly (30) further comprises: A support (34), the opposite ends of the mounting frame (31) are respectively connected with the support (34); A baffle plate (35) is arranged on the support (34) and located at one end of the mounting frame (31), a plurality of ventilation holes and interface holes are arranged on the baffle plate (35) at intervals, the ventilation holes are used for the heat dissipation structure (32) to ventilate and dissipate heat, and the interface holes are used for external equipment to be connected with the network card structure.
10. A server, characterized by The network card structure according to any one of claims 1 to 9.