Storage chip test fixture convenient for heat dissipation

Abstract

The utility model relates to the technical field of chip testing, in particular to a memory chip testing clamp convenient for heat dissipation, which comprises a detection circuit board, a memory arranged at the top of the detection circuit board, a base fixedly connected to the bottom of the detection circuit board, and a fixing mechanism arranged above the base. The fixing mechanism comprises a support fixedly connected to the top of the base, a limiting shell arranged below the support and air inlets formed in the two sides of the limiting shell correspondingly. According to the utility model, by arranging the fixing mechanism, the turbofan radiator and the heat conduction assembly, efficient active heat dissipation in the test process of the memory chip is realized, the limiting shell in the fixing mechanism can be driven by the electric telescopic rod to stably press the chip, and reliable contact between the pin and the detection circuit board is ensured; the turbofan radiator is matched with air inlets in the two sides of the limiting shell to form a forced convection air channel, and heat accumulated on the back of the chip is discharged in time.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a memory chip testing fixture that facilitates heat dissipation. Background Technology

[0002] A memory chip is a semiconductor integrated circuit used to store and preserve data information. It is the core hardware for data storage in computers and electronic devices. During the production process, memory chips generally need to undergo wafer testing, packaging testing, and system-level testing. Among them, packaging testing usually involves placing the memory chip on a circuit board specifically for testing, and during testing, the pins of the memory chip need to correspond one-to-one with the contacts on the circuit board.

[0003] A utility model patent application with publication number CN220357815U discloses an SSD storage chip testing fixture, including a test circuit board. A fixture base is provided on the outside of the test circuit board, and a clamping mechanism for positioning and holding the chip is provided inside the fixture base. An ejection mechanism for ejecting the chip is also provided inside the fixture base. By controlling the upper drive board to push the movable clamping plate to move, the movable clamping plate pushes the chip to move. With the help of two rotating jaws, the chip is positioned and clamped so that the position of the chip corresponds to the position of the test circuit board. At the same time, the pressure bar on the rotating jaws cooperates with the upper pressure plate on the movable clamping plate to prevent the chip from springing off during the clamping process. That is, the chip is pressed down from above, so that the chip is in close contact with the test circuit board for easy testing. When the clamping mechanism is reset, the ejector rod in the ejection mechanism automatically lifts the chip.

[0004] Although the above technical solution achieves contact alignment and good fixation between the memory chip and the test circuit board through the clamping mechanism, in actual testing, the memory chip will generate significant heat accumulation on the back of the memory chip when it is powered on. The above solution relies on natural heat dissipation, which is not convenient to dissipate the heat in a timely and effective manner, which can easily lead to an increase in chip temperature and affect the detection of the memory chip. Utility Model Content

[0005] The purpose of this invention is to provide a memory chip test fixture that facilitates heat dissipation. By setting up a fixing mechanism, it solves the problem that existing memory chip test fixtures are not conducive to heat dissipation of memory chips during use, which affects the testing of memory chips.

[0006] The technical solution of this utility model is as follows: a memory chip test fixture for easy heat dissipation, including a test circuit board, a memory chip disposed on the top of the test circuit board, a base fixedly connected to the bottom of the test circuit board, a fixing mechanism disposed on the top of the base, the fixing mechanism including a bracket fixedly connected to the top of the base, a limiting shell disposed below the bracket, air inlets respectively opened on both sides of the limiting shell, a turbine fan heat sink disposed above the memory chip, a heat-conducting component disposed below the bracket, an electric telescopic rod fixedly connected to the bottom of the bracket, a connecting frame fixedly connected to the output end of the electric telescopic rod and fixedly connected to the limiting shell at its bottom, anti-slip pads disposed on both sides of the memory chip, a positioning plate fixedly connected to the side of the anti-slip pad away from the memory chip, a limiting slider fixedly connected to the bottom of the positioning plate, the bottom of the limiting slider being slidably connected to the base, a threaded rod rotatably connected to the side of the positioning plate near the bracket, the threaded rod being threadedly connected to the bracket, adjustment holes being opened on both sides of the bracket, and a handwheel fixedly connected to the end of the threaded rod away from the bracket.

[0007] Preferably, the heat-conducting assembly includes heat-conducting plates fixedly connected to the front and rear sides of the inside of the limiting shell, and an array of heat-conducting columns fixedly connected to the top of the heat-conducting plates and extending to the top of the limiting shell.

[0008] Preferably, guide rods are fixedly connected to all four sides of the top of the limiting shell, with the top of the guide rods extending through to the top of the bracket.

[0009] Preferably, the turbine fan radiator is bolted to the center of the top of the limiting housing.

[0010] Preferably, dustproof nets are provided on both sides of the limiting shell.

[0011] The beneficial effects of this utility model are as follows: By setting up a fixing mechanism, a turbine fan heat sink, and a heat conduction component, efficient active heat dissipation is achieved during the testing process of the memory chip. The limiting shell in the fixing mechanism can stably press the chip under the drive of the electric telescopic rod, ensuring reliable contact between the pins and the test circuit board. The turbine fan heat sink, together with the air inlets on both sides of the limiting shell, forms a forced convection airflow channel, which promptly dissipates the heat accumulated on the back of the chip. The heat conduction plate and heat conduction pillar increase the contact area with the back of the chip, further improving the heat conduction efficiency. In addition, the adjustable anti-slip pads and positioning plate structure on both sides can adapt to the positioning of chips of different sizes, enhance the testing stability, and effectively dissipate heat while ensuring the normal operation of the testing, thereby improving the reliability and safety of the test. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0013] Figure 1 A perspective view of a memory chip test fixture designed for easy heat dissipation;

[0014] Figure 2 A cross-sectional view of the base in a memory chip test fixture designed for easy heat dissipation;

[0015] Figure 3 A cross-sectional view of the limiting shell in a memory chip test fixture designed for easy heat dissipation;

[0016] Figure 4 A cross-sectional view of a turbine fan heatsink in a memory chip test fixture designed for efficient heat dissipation;

[0017] Figure 5 A memory chip test fixture for easy heat dissipation Figure 2 A magnified view of A in the middle.

[0018] Explanation of reference numerals in the attached drawings: 1. Detection circuit board; 2. Memory; 3. Base; 4. Fixing mechanism; 41. Bracket; 42. Limiting shell; 43. Air inlet; 44. Turbine fan radiator; 45. Electric telescopic rod; 46. Connecting frame; 47. Heat conduction component; 471. Heat conduction plate; 472. Heat conduction column; 5. Anti-slip pad; 6. Positioning plate; 7. Limiting slider; 8. Threaded rod; 9. Adjustment hole; 10. Handwheel; 11. Dustproof net. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. The described embodiments are only some embodiments of the present utility model, and not all embodiments. Example 1

[0020] Please see Figure 1 , Figure 3 and Figure 4This is the first embodiment of the present invention. This embodiment provides a memory chip test fixture that facilitates heat dissipation, including a test circuit board 1, a memory chip 2 disposed on the top of the test circuit board 1, a base 3 fixedly connected to the bottom of the test circuit board 1, a fixing mechanism 4 disposed on the top of the base 3, the fixing mechanism 4 including a bracket 41 fixedly connected to the top of the base 3, a limiting shell 42 disposed below the bracket 41, air inlets 43 respectively opened on both sides of the limiting shell 42, a turbine fan heat sink 44 disposed above the memory chip 2, a heat conducting component 47 disposed below the bracket 41, an electric telescopic rod 45 fixedly connected to the bottom of the bracket 41, and a bottom fixedly connected to the output end of the electric telescopic rod 45 and the limiting shell 42. The fixed connection bracket 46 has anti-slip pads 5 on both sides of the memory 2. A positioning plate 6 is fixedly connected to the side of the anti-slip pads away from the memory 2. A limit slider 7 is fixedly connected to the bottom of the positioning plate 6. The bottom of the limit slider 7 is slidably connected to the base 3. A threaded rod 8 is rotatably connected to the side of the positioning plate 6 near the bracket 41. The threaded rod 8 is threadedly connected to the bracket 41. An adjustment hole 9 is opened on both sides of the bracket 41. A handwheel 10 is fixedly connected to the end of the threaded rod 8 away from the bracket 41. Guide rods are fixedly connected to the top of the limiting shell 42 around its perimeter. The top of the guide rods extends through to the top of the bracket 41. The turbine fan radiator 44 is bolted to the center of the top of the limiting shell 42. Dustproof nets 11 are provided on both sides of the limiting shell 42.

[0021] During operation, the memory 2 is formed by packaging a memory chip. Pins are fixedly connected to both sides of the memory 2, which serves as the test object. The test circuit board 1 provides electrical connection and test interface to realize the test of the memory 2. The base 3 provides the structural foundation, and fixing holes are opened on all four sides of its top for installation.

[0022] The fixing mechanism 4 is used to position, fix, and dissipate heat for the memory 2. The bracket 41 is used to support and connect the various components of the fixing mechanism 4. The limiting shell 42 physically fixes the memory 2 by pressing down, and at the same time, it is equipped with an internal air duct to assist in heat dissipation. The air inlet 43 is used to introduce external air to form an airflow circulation for heat dissipation. The turbine fan radiator 44 drives the turbine blades through airflow to actively draw in cold air and expel hot air, realizing forced convection heat dissipation. The turbine fan radiator 44 consists of a frame, a support plate fixedly connected inside the frame, and turbine blades rotatably connected to the top of the support plate through bearings. Its components are existing mature technologies and will not be described in detail here. The electric telescopic rod 45 controls the up and down movement of the limiting shell 42, realizing the automatic clamping and release of the memory 2. The connecting frame 46 connects the electric telescopic rod 45 and the limiting shell 42, transmitting power to realize the lifting and lowering of the limiting shell 42. The guide rod is used to guide and stabilize the movement trajectory of the limiting shell 42. The dustproof net 11 prevents dust from being sucked in during the heat dissipation process. The dustproof nets 11 on both sides of the limiting shell 42 are fixedly connected to the air inlet 43. The top of the turbine fan radiator 44 is the exhaust end, and a dustproof net 11 is also fixedly connected inside the exhaust end. When no testing is being performed, the limiting shell 42 can be pressed tightly against the testing circuit board 1 by the electric telescopic rod 45 to protect the internal components of the limiting shell 42 from dust.

[0023] The anti-slip pad 5 is in close contact with both sides of the memory 2 and is located between the memory 2 and the pins to prevent the chip from sliding during testing. The positioning plate 6 is used to assist in positioning the memory 2 and ensure pin alignment. The limiting slider 7 limits the positioning plate 6. The top of the base 3 has a limiting groove that matches the limiting slider 7. The threaded rod 8 is rotatably connected to the positioning plate 6 through a bearing. The rotatable connection section between the threaded rod 8 and the positioning plate 6 is a smooth surface. When the threaded rod 8 rotates, it can push or pull the positioning plate 6 to achieve spacing adjustment. The adjustment hole 9 matches the threaded rod 8 and allows the threaded rod 8 to pass through and be fixed, achieving adjustable fixation of the positioning plate 6. The handwheel 10 facilitates manual rotation of the threaded rod 8 to adjust the position of the positioning plate 6.

[0024] Before testing, the threaded rod 8 is rotated by handwheel 10 and screwed into adjustment hole 9 to adjust the distance between the two anti-slip pads 5 according to the required size of the memory 2. After adjustment, positioning plate 6 can be used as a quick positioning interface for testing. Simply place memory 2 between the two anti-slip pads 5 and make the back of memory 2 in close contact with bracket 41. At this time, the pins of memory 2 correspond one-to-one with the contacts on the testing circuit board 1. At the same time, during the testing process, the anti-slip pads 5 and positioning plate 6 can effectively limit the movement of memory 2, improve the stability of the limiting shell 42 pressing down to fix memory 2, and ensure the normal operation of memory 2 testing.

[0025] Align the pins of memory 2 with the contacts of detection circuit board 1, and the electric telescopic rod 45 will move the connecting frame 46 and all the structures on the connecting frame 46 downwards. The memory 2 will be pressed down and fixed by the limiting shell 42, and the memory 2 can be detected. During the detection, the heat generated will accumulate on the back of memory 2. At this time, the hot airflow will rise and drive the turbine fan heat sink 44 to work. The turbine fan heat sink 44 will continuously draw the external cold air into the limiting shell 42 to form air convection, which will quickly dissipate the heat on the back of memory 2 to ensure the normal detection of memory 2. Example 2

[0026] Please see Figure 1 and Figure 3 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0027] Specifically, the heat-conducting component 47 includes heat-conducting plates 471 that are fixedly connected to the front and rear sides of the inside of the limiting shell 42, and heat-conducting columns 472 that are fixedly connected to the top of the heat-conducting plates 471 and whose top ends extend to the top of the limiting shell 42.

[0028] The heat-conducting component 47 is used to increase the contact area with the memory 2, improve the heat conduction efficiency, and accelerate heat dissipation. The bottom of the heat-conducting plate 471 is flush with the limiting shell 42, and the heat-conducting pillar 472 is fixedly connected to the limiting shell 42. When the limiting shell 42 moves down and presses down to fix the memory 2, the heat-conducting plate 471 increases the contact area between the limiting shell 42 and the memory 2, making the pressing and fixing more stable. At the same time, the heat-conducting plate 471 is in close contact with the back of the memory 2, and the heat on the back of the memory 2 will also be dissipated from the heat-conducting plate 471 and the heat-conducting pillar 472, making the heat dissipation faster and further ensuring the normal operation of the memory 2 testing.

[0029] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A storage chip test fixture facilitating heat dissipation, comprising a detection circuit board (1), a memory (2) arranged on the top of the detection circuit board (1), and a base (3) fixedly connected to the bottom of the detection circuit board (1), characterized in that: The base (3) is provided with a fixing mechanism (4) above it, the fixing mechanism (4) includes a support (41) fixedly connected to the top of the base (3), a limiting shell (42) arranged below the support (41), air inlets (43) respectively arranged on both sides of the limiting shell (42), a turbine fan radiator (44) arranged above the memory (2), a heat conduction assembly (47) arranged below the support (41), an electric telescopic rod (45) fixedly connected to the bottom of the support (41), a connecting frame (46) fixedly connected to the output end of the electric telescopic rod (45) and fixedly connected to the bottom of the limiting shell (42), anti-skid pads (5) are arranged on both sides of the memory (2), a positioning plate (6) is fixedly connected to the side of the anti-skid pad (5) away from the memory (2), a limiting sliding block (7) is fixedly connected to the bottom of the positioning plate (6), the bottom of the limiting sliding block (7) is slidably connected to the base (3), a threaded rod (8) is rotatably connected to the side of the positioning plate (6) close to the support (41), the threaded rod (8) is threadedly connected between the support (41), adjusting holes (9) are arranged on both sides of the support (41), and a hand wheel (10) is fixedly connected to the end of the threaded rod (8) away from the support (41).

2. The storage chip test fixture that facilitates heat dissipation of claim 1, wherein: The heat conduction assembly (47) includes heat conduction plates (471) fixedly connected to the front side and the rear side inside the limiting shell (42) respectively, and heat conduction columns (472) arrayed fixedly connected to the top of the heat conduction plates (471) and extending to the top of the limiting shell (42).

3. The storage chip test fixture that facilitates heat dissipation of claim 1, wherein: The limiting shell (42) is fixedly connected with guide rods around the top thereof, and the guide rods extend through the top of the support (41).

4. The storage chip test fixture that facilitates heat dissipation of claim 1, wherein: The turbine fan radiator (44) is installed on the top center of the limiting shell (42) by bolts.

5. The storage chip test fixture that facilitates heat dissipation of claim 1, wherein: Dustproof nets (11) are arranged on both sides of the limiting shell (42).

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