Universal base

Abstract

The utility model relates to a universal base. The universal base comprises a base backboard used for being installed on a photovoltaic module; wherein the base back plate is provided with a first accommodating cavity which is used for accommodating component-level power electronic equipment which needs to be mounted on the base back plate; the first contact group and the second contact group are respectively arranged on the base back plate and are respectively and electrically connected with the input end and the output end of the component-level power electronic equipment under the condition that the component-level power electronic equipment is mounted on the base back plate to reach a preset position; wherein the power supply output end of the photovoltaic module is connected to the first contact group, so that the output of the photovoltaic module passes through the module-level power electronic equipment and then is output from the second contact group. According to the invention, the installation of the component-level power electronics (MLPE) equipment can be rapidly completed, and the later installation, replacement and maintenance are facilitated.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to a universal base. Background Technology

[0002] After years of development, solar photovoltaic (PV) module technology typically has a lifespan of 25-30 years. Rapid-Shut-Down (RSD) devices and optimizers, as module-level power electronic (MLPE) devices used in conjunction with PV modules, are usually limited to industrial-grade components due to the cost sensitivity of the PV industry, resulting in a lifespan of only 5-8 years. Externally mounted MLPE devices do not have the same lifespan as PV modules and can be easily disassembled, replaced, and repaired. However, external MLPE devices are expensive due to connecting cables and mounting structures, and the accumulated contact resistance between connectors over long-term operation can induce varying degrees of safety hazards.

[0003] Therefore, integrated module-level power electronic devices are currently commonly used. These devices are directly connected to the photovoltaic modules via busbars, saving on the cost of additional connection cables, reducing power consumption due to connection cables and contact resistance, and avoiding abnormal factors such as arcing and overheating that may be caused by increased cumulative contact resistance.

[0004] However, due to the complexity of photovoltaic modules in terms of specifications, models, and types, as well as the numerous processes and safety certifications, and the fact that they are capital-intensive equipment investment products, integrated module-level power electronic equipment, as an indispensable part of the module, lacks synchronization with photovoltaic modules in terms of safety certification, process, and warranty life. This seriously hinders the promotion and application of integrated module-level power electronic equipment. Utility Model Content

[0005] In view of this, embodiments of this application provide a universal base to solve at least one problem existing in the background art.

[0006] This application embodiment provides a universal base, the universal base comprising:

[0007] A base backplate for mounting on photovoltaic modules; wherein the base backplate has a first cavity for accommodating module-level power electronic devices to be mounted on the base backplate; and

[0008] The first contact group and the second contact group are respectively disposed on the back plate of the base, and are used to electrically connect the input terminal and the output terminal of the component-level power electronic device respectively when the component-level power electronic device is installed on the back plate of the base to a predetermined position; wherein, the power output terminal of the photovoltaic module is connected to the first contact group so that the output of the photovoltaic module is output from the second contact group after passing through the component-level power electronic device.

[0009] In one optional embodiment, the first contact group and the second contact group are respectively disposed within the first cavity.

[0010] In one optional embodiment, the first contact group includes a first input contact and a second input contact; the first input contact is connected to a first power output terminal of the photovoltaic module, and the second input contact is connected to a second power output terminal of the photovoltaic module.

[0011] In one optional embodiment, the second contact group includes a first output contact and a second output contact; the first output contact is connected to a first output terminal of the component-level power electronic device, and the second output contact is connected to a second output terminal of the component-level power electronic device.

[0012] In one alternative embodiment, the first contact group is connected to the power output terminal of the photovoltaic module via a busbar.

[0013] In one optional embodiment, the connection method between the first contact group and the busbar includes at least one of the following: welding connection; adapter plug-in connection.

[0014] In one optional embodiment, the connection method between the second contact group and the connection cable provided at the output terminal of the component-level power electronic device includes at least one of the following: soldering connection; adapter plug-in connection.

[0015] In an optional embodiment, the universal base further includes:

[0016] An external output interface group is disposed on the back plate of the base and electrically connected to the second contact group, for providing an external connection interface for the universal base.

[0017] In an alternative embodiment, the base back plate also has a second cavity for accommodating auxiliary devices.

[0018] In one alternative embodiment, the universal base further includes at least one of the following: a waterproof gasket; a top cover;

[0019] The upper cover is used to cover the first cavity and / or the second cavity of the base back plate and to be sealed to the base back plate.

[0020] The waterproof gasket is used to connect the top cover and the base back plate.

[0021] The beneficial effects of the technical solution provided in this application include: By using a universal base, a universal base with contacts can be pre-installed on the photovoltaic module, the module output is connected to the universal base, and the module-level power electronics (MLPE) equipment can be installed on the base later, thus quickly completing the installation of the module-level power electronics (MLPE) equipment. Therefore, by adopting an integrated installation method using a universal base, this application avoids the problems of incompatibility in terms of lifespan, safety certification, and manufacturing processes between the module-level power electronics (MLPE) equipment and the photovoltaic module, providing a more cost-effective method for installing and using module-level power electronics (MLPE) equipment. Thus, it satisfies the convenience of installing and using module-level power electronics (MLPE) equipment while avoiding the cost issues and safety hazards introduced by connectors and connecting cables in external versions. Simultaneously, it significantly reduces the later installation, replacement, and maintenance costs of the module-level power electronics (MLPE) equipment, combining the advantages of both external and integrated versions while avoiding their disadvantages.

[0022] Additional aspects and advantages of the embodiments of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the embodiments of this application. Attached Figure Description

[0023] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, are provided. The drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show details of those features. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0024] Figure 1 This is a schematic diagram of a specific example of a universal base in the embodiments of this application;

[0025] Figure 2 This is a schematic diagram of another specific example of the universal base in the embodiments of this application.

[0026] Figure label:

[0027] 1. Base backplate; 2. First input contact; 3. Second input contact; 4. First output contact; 5. Second output contact; 6. First external contact; 7. Second external contact; 11. First cavity; 12. Second cavity; 100. Universal base; 200. Component-level power electronic device. Detailed Implementation

[0028] To make the technical solution and beneficial effects of this application more apparent and understandable, a detailed description is provided below by listing specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.

[0029] The embodiments described in this application are not exhaustive, but merely illustrative of some embodiments, and are not intended to limit the scope of protection of this application. Unless otherwise specified, each step in a particular embodiment can be implemented as an independent embodiment, and the steps can be arbitrarily combined. For example, a solution after removing some steps in a particular embodiment can also be implemented as an independent embodiment, and the order of the steps in a particular embodiment can be arbitrarily interchanged. Furthermore, the optional implementation methods in a particular embodiment can be arbitrarily combined; moreover, the embodiments can be arbitrarily combined with each other. For example, some or all steps of different embodiments can be arbitrarily combined, and a particular embodiment can be arbitrarily combined with the optional implementation methods of other embodiments.

[0030] In each embodiment of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions of the embodiments are consistent and can be referenced by each other. Technical features in different embodiments can be combined to form new embodiments based on their inherent logical relationships.

[0031] The terminology used in the embodiments of this application is for the purpose of describing specific embodiments only and is not intended to limit the scope of this application.

[0032] In some embodiments, unless otherwise stated, elements expressed in the singular form, such as “a,” “an,” “the,” “the,” “the,” “the,” “the,” “the,” “this,” etc., can mean “one and only one,” or “one or more,” “at least one,” etc. For example, when using articles such as “a,” “an,” “the,” etc. in translation, the noun following the article can be understood as either a singular or a plural expression.

[0033] In some embodiments, the terms “at least one of,” “one or more,” “a plurality of,” and “multiple” may be used interchangeably. “Multiple” means at least two, such as two or three; “several” means at least one, such as one, two, or three, unless otherwise explicitly specified.

[0034] In some embodiments, prefixes such as "first," "second," etc., are merely used to distinguish different descriptive objects and do not impose restrictions on the position, order, priority, value, or content of the descriptive objects. The description of the descriptive objects should be based on the context of the embodiments, and the use of prefixes should not create unnecessary restrictions. For example, the numerical value of a descriptive object is not limited by ordinal numbers and can be one or more. For instance, in "first device," the numerical value of "device" can be one or more. Furthermore, objects modified by different prefixes can be the same or different. For example, if the descriptive object is "device," then "first device" and "second device" can be the same device or different devices, and their types can be the same or different.

[0035] In some embodiments, the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “height,” “up,” “down,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” and “counterclockwise” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the purpose of simplifying the description and are not intended to indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. In other words, they should not be construed as limitations on this application.

[0036] In some embodiments, unless otherwise expressly defined, the terms "installation," "connection," "linking," "fixing," "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0037] In some embodiments, unless otherwise expressly defined, "above," "on top of," "over," "above," "below," "below," or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "below" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. "Below," "below," and "below" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0038] This application provides a universal base that can be adapted to install various types of module-level power electronic (MLPE) devices, such as rapid-shut-down (RSD) devices and optimizers. Figure 1 A schematic diagram of a specific example of a universal base in an embodiment of this application is shown. As shown in the figure, the universal base 100 includes:

[0039] A base backplate 1 is used for mounting on photovoltaic modules; wherein, the base backplate 1 has a first cavity 11 for accommodating module-level power electronic equipment 200 to be mounted on the base backplate 1; and

[0040] The first contact group and the second contact group are respectively disposed on the base back plate 1, and are used to electrically connect the input terminal and the output terminal of the component-level power electronic device 200 respectively when the component-level power electronic device 200 is installed on the base back plate 1 to a predetermined position; wherein, the power output terminal of the photovoltaic module is connected to the first contact group so that the output of the photovoltaic module is output from the second contact group after passing through the component-level power electronic device 200.

[0041] Thus, this embodiment of the application, through the universal base, allows for the pre-installation of a universal base with contacts on the photovoltaic module. The module output is connected to the universal base, and the module-level power electronics (MLPE) equipment is subsequently installed on the base, enabling rapid installation of the MLPE equipment. This embodiment, by employing an integrated installation method with a universal base, avoids the inconvenience of synchronizing the MLPE equipment with the photovoltaic module in terms of lifespan, safety certification, and manufacturing processes, providing a more cost-effective method for installing and using MLPE equipment. Therefore, it satisfies the convenience of installing and using MLPE equipment while avoiding the cost issues and safety hazards introduced by connectors and connecting cables in external versions. Simultaneously, it significantly reduces the later installation, replacement, and maintenance costs of the MLPE equipment, combining the advantages of both external and integrated versions while avoiding their disadvantages.

[0042] In this embodiment, the predetermined position to which the component-level power electronic device 200 needs to be installed can be a pre-reserved installation position on the base back plate 1 of the universal base 100 for the component-level power electronic device 200, which can be arranged according to actual needs.

[0043] In an optional embodiment, the first contact group and the second contact group are respectively disposed within the first cavity 11 to be close to the installation area of ​​the component-level power electronics (MLPE) device, thereby saving area and reducing the required connection wire length.

[0044] In one optional embodiment, the first contact group includes a first input contact 2 and a second input contact 3; the first input contact 2 is connected to the first power output terminal of the photovoltaic module, and the second input contact 3 is connected to the second power output terminal of the photovoltaic module.

[0045] In some examples, the first power output terminal of the photovoltaic module can be a positive power output terminal, so the first input contact 2 can be a positive input contact PVIN+; the second power output terminal of the photovoltaic module can be a negative power output terminal, so the second input contact 3 can be a negative input contact PVIN-, but it is not limited to this.

[0046] In one optional embodiment, the second contact group includes a first output contact 4 and a second output contact 5; the first output contact 4 is connected to a first output terminal of the component-level power electronic device 200, and the second output contact 5 is connected to a second output terminal of the component-level power electronic device 200.

[0047] In some examples, the first output contact 4 can be a positive output contact PVOUT+, and the second output contact 5 can be a negative output contact PVOUT-, but it is not limited to these. The first input terminal of the component-level power electronic device 200 can be connected to the first input contact 2, and the second input terminal of the component-level power electronic device 200 can be connected to the second input contact 3.

[0048] In an optional embodiment, the first contact group is connected to the power output terminal of the photovoltaic module via a busbar to save the cost of additional connecting cables and reduce the power consumption of connecting cables and contact resistance, thereby avoiding abnormal factors such as arcing and overheating that may be caused by the cumulative increase in contact resistance.

[0049] Thus, through the first and second contact groups, external testing equipment can complete various input and output test items during component testing by connecting via probes.

[0050] In one optional embodiment, the connection method between the first contact group and the busbar includes at least one of the following: welding connection, adapter plug-in connection.

[0051] In some examples, the adapter plug-in connection can use a high-conductivity plug.

[0052] In one optional embodiment, the connection method between the second contact group and the connection cable provided at the output terminal of the component-level power electronic device 200 includes at least one of the following: soldering connection, adapter plug-in connection.

[0053] In this way, the output of the component itself can be connected to the two input contacts PVIN+ and PVIN- of the base via a busbar, and the external output cable of the component-level power electronics (MLPE) device can be connected to the other two output contacts PVOUT+ and PVOUT- via a soldering method.

[0054] Figure 2 A schematic diagram of another specific example of the universal base in an embodiment of this application is shown. As shown in the figure, in an optional embodiment, the universal base 100 further includes:

[0055] An external output interface group is disposed on the back plate 1 of the base and is electrically connected to the second contact group to provide an external connection interface for the universal base.

[0056] In some examples, the external output interface group can be located outside the first cavity and / or the second cavity. After the first cavity and / or the second cavity are sealed, the external output interface group can facilitate connection with other devices.

[0057] In one optional embodiment, the external output interface group includes a first external contact 6 and a second external contact 7; the first external contact 6 is connected to a first output contact 4 in the second contact group, and the second external contact 7 is connected to a second output contact 5 in the second contact group.

[0058] In some examples, the first external contact 6 can be a positive external contact PV+, and the second external contact 7 can be a negative external contact PV-, but it is not limited to these.

[0059] In this way, it can be connected to other devices through the positive external contact PV+ and the negative external contact PV-.

[0060] In an alternative embodiment, the base back plate 1 further has a second cavity 12 for accommodating auxiliary devices.

[0061] In some examples, auxiliary devices may include a protection diode device 300, resistors, capacitors, etc.

[0062] In some examples, the first cavity 11 and the second cavity 12 may have annular sidewalls and a predetermined height on the base back plate 1, i.e. protruding from the base back plate 1; or, they may be flush with the base back plate 1 or recessed into the base back plate 1, which can be set according to actual needs.

[0063] In an optional embodiment, the universal base 100 further includes at least one of the following: a waterproof gasket; a top cover;

[0064] The upper cover is used to cover the first cavity 11 and / or the second cavity 12 of the base back plate 1 and to be sealed to the base back plate 1.

[0065] The waterproof gasket is used to connect the upper cover and the base back plate 1.

[0066] Thus, by using a top cover or an auxiliary waterproof gasket, the universal base can have waterproof and other sealing properties.

[0067] After the external testing equipment completes various input and output tests using probes, and the component is ready to leave the factory after testing, the corresponding MLPE device is connected to the four contacts on the base backplate; finally, the device assembly is completed using waterproof gaskets and the top cover.

[0068] At the power plant site, if it is necessary to test the input and output characteristics of the component itself using dedicated equipment, simply open the top cover and connect the test equipment probes to the PVIN+ and PVIN- terminals to complete the test. If it is necessary to test the output characteristics of the component after the MLPE device is installed, simply control the device to be in normal working condition via wireless software and connect the test equipment probes to the overall output interface of the component to complete the test.

[0069] Therefore, the embodiments of this application have the following advantages:

[0070] (1) The new universal base avoids various differences between photovoltaic modules and MLPE equipment in terms of service life and safety certification;

[0071] (2) The new universal base is connected to the base back plate through the busbar, and the MLPE device is connected to the base back plate through the high conductivity plug. This saves the cost of external cables and connectors, while also reducing the power consumption of the MLPE device and the safety hazards that may be caused by contact resistance.

[0072] (3) The first and second contact groups of the new universal base can be used as reserved test points in the photovoltaic module testing process. The output of the photovoltaic module itself can be directly led out through the first contact group to realize the input and output characteristic test of the photovoltaic module itself; the output after the MLPE equipment is installed can be led out through the second contact group to realize the output characteristic test after the MLPE equipment is installed. Finally, various tests of the photovoltaic module in the factory manufacturing process can be completed.

[0073] (4) It can significantly reduce the installation, fixing and maintenance costs of MLPE equipment in the later stage, and promote the use and promotion of MLPE equipment on a larger scale, thus safeguarding the intelligentization of the photovoltaic industry.

[0074] It should be understood that the above embodiments are exemplary and not intended to encompass all possible implementations. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. A universal base, characterized in that, The universal base comprises: a base backboard for mounting on a photovoltaic module; wherein the base backboard has a first cavity for accommodating a component-level power electronic device to be mounted on the base backboard; and a first contact group and a second contact group respectively provided on the base backboard for respectively electrically connecting input terminals and output terminals of the component-level power electronic device in the case that the component-level power electronic device is mounted to a predetermined position on the base backboard; wherein the photovoltaic module power output is connected to the first contact group to output the output of the photovoltaic module from the second contact group after passing through the component-level power electronic device.

2. The universal base of claim 1, wherein, The first contact group and the second contact group are respectively arranged in the first cavity.

3. The universal base of claim 1, wherein, The first contact group comprises a first input contact and a second input contact; the first input contact is connected to a first power output of the photovoltaic module, and the second input contact is connected to a second power output of the photovoltaic module.

4. The universal base of any of claims 1-3, wherein, The second contact group comprises a first output contact and a second output contact; the first output contact is connected to a first output terminal of the component-level power electronic device, and the second output contact is connected to a second output terminal of the component-level power electronic device.

5. The universal base of claim 1, wherein, The first contact group is connected to the photovoltaic module power output through a busbar.

6. The universal base of claim 5, wherein, The connection mode between the first contact group and the busbar comprises at least one of the following: welding connection; conversion head plug-in connection.

7. The universal base of claim 1, wherein, The connection mode between the second contact group and the connection cable provided on the output terminal of the component-level power electronic device comprises at least one of the following: welding connection; conversion head plug-in connection.

8. The universal base of claim 1, wherein, The universal base further comprises: an external output interface group provided on the base backboard and electrically connected to the second contact group, for providing an external connection interface of the universal base.

9. The universal base of claim 1, wherein, The base backboard further has a second cavity for accommodating an auxiliary device.

10. The universal base of claim 1, wherein, The universal base further comprises at least one of the following: a waterproof gasket; an upper cover; The upper cover is used to cover the first cavity and / or the second cavity of the base backboard and is in sealed connection with the base backboard; The waterproof gasket is used to be connected between the upper cover and the base backboard.

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