Multilayer board structure, single-side gummosis multilayer board intermediate assembly and high heat dissipation circuit board

Abstract

The utility model provides a multi-layer board structure, a single-side gummosis multi-layer board intermediate assembly and a high heat dissipation circuit board. The multilayer board structure comprises at least one core board, at least two prepregs, a first substrate and a second substrate, the core board is located between the first substrate and the second substrate, one prepreg is clamped between the core board and the first substrate, and one prepreg is clamped between the core board and the second substrate. The first substrate and the second substrate are arranged on the heat dissipation module, so that the core plate is respectively bonded with the first substrate and the second substrate, the first substrate, the second substrate, the core plate and the prepreg jointly form a windowing area, and the windowing area is used for respectively fixing the heat dissipation module with the first substrate, the prepreg, the core plate and the second substrate after flowing glue flows into the windowing area. The substrates are adopted on the two side faces of the multilayer board, and compared with a circuit board which needs to be formed by pressing a plurality of core boards in the traditional technology, the use of the core boards can be reduced, and the problem of tedious process caused by pressing the plurality of core boards is avoided.

Description

Technical Field

[0001] This disclosure relates to the field of circuit boards, and in particular to a multilayer board structure, a multilayer board intermediate assembly with single-sided adhesive flow, and a high heat dissipation circuit board. Background Technology

[0002] As automotive lighting technology rapidly advances towards higher power and higher density, the thermal management of LED modules is becoming increasingly prominent, placing higher demands on the thermal conductivity of the printed circuit board (PCB), its core support. Traditional solutions, such as ordinary FR4 substrates, can achieve low-cost heat dissipation through dense PTH thermal via arrays, but their thermal conductivity is insufficient for the needs of high-power LEDs. While metal substrates (such as aluminum and copper substrates) possess excellent thermal conductivity, they suffer from drawbacks such as high cost and limited design flexibility.

[0003] To address the aforementioned issues, embedded heat dissipation technology based on double-sided or multi-layer FR4 has gradually become a new industry trend in recent years. By embedding copper blocks or ceramic copper-clad plates in the PCB, novel structures effectively improve thermal conductivity while maintaining design flexibility, providing an innovative solution for the heat dissipation problem of high-power automotive lights. For example, Chinese patent application number CN201780000030.4 discloses a circuit board and its manufacturing method, as well as a circuit board and its manufacturing method. The circuit board is formed by laminating a first core board and a second core board to form a multi-layer board, and opening holes in the first and second core boards to place ceramic heat sinks, thereby improving the heat dissipation performance of the circuit board. However, the circuit board adopts a core board sandwich lamination method, that is, forming a multi-layer board by laminating multiple core boards. The core boards themselves are expensive, especially high-performance materials (such as high-frequency materials), which increases the overall cost. Moreover, the lamination of the core boards requires higher process control capabilities, resulting in a more complex process.

[0004] Therefore, a circuit board with better heat dissipation performance and the ability to reduce the use of core boards is needed. Utility Model Content

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a multilayer board structure with better heat dissipation performance and reduced core board usage, a multilayer board intermediate assembly with single-sided adhesive flow, and a high heat dissipation circuit board.

[0006] The purpose of this disclosure is achieved through the following technical solution:

[0007] A multi-layer board structure, comprising:

[0008] The device comprises at least one core board, at least two prepreg sheets, a first substrate, and a second substrate. The core board is located between the first substrate and the second substrate. One prepreg sheet is sandwiched between the core board and the first substrate, and another prepreg sheet is sandwiched between the core board and the second substrate, so that the core board is bonded to the first substrate and the second substrate respectively. The first substrate, the second substrate, the core board, and the prepreg sheet together form a window area. The window area is used to allow the heat dissipation module to be fixed to the first substrate, the prepreg sheet, the core board, and the second substrate respectively after the adhesive flows in.

[0009] In one embodiment, the core board includes a first copper foil portion, an insulating portion, and a second copper foil portion. The two sides of the insulating portion are respectively connected to the first copper foil portion and the second copper foil portion. The first copper foil portion is bonded to one of the prepreg sheets, and the second copper foil portion is bonded to the other prepreg sheet. The first copper foil portion and the second copper foil portion have the same thickness.

[0010] In one embodiment, the first substrate includes an insulating element and a copper foil element, the insulating element being connected to the copper foil element and the insulating element being bonded to the prepreg, and the thickness of the copper foil element being less than the thickness of the first copper foil portion.

[0011] In one embodiment, the thickness of the copper foil is 30μm-40μm.

[0012] A multilayer board intermediate assembly with single-sided adhesive flow includes the multilayer board structure described in any of the above embodiments, and further includes a buffer layer, an adhesive flow layer, a first protective film, a second protective film, and a heat dissipation module. The buffer layer, the adhesive flow layer, and the first protective film are sequentially stacked on a first substrate. The first protective film has adhesive flow holes that communicate with the window area. The second protective film is connected to the second substrate. The heat dissipation module is located within the window area. The adhesive flow layer is used to enter the window area through the adhesive flow holes under high temperature and high pressure to fix the heat dissipation module to the multilayer board structure.

[0013] In one embodiment, the number of adhesive flow holes is one, the adhesive flow hole is annular, and the adhesive flow hole is arranged around the periphery of the window area.

[0014] In one embodiment, the number of adhesive flow holes is multiple, and the multiple adhesive flow holes are arranged at intervals around the periphery of the window area.

[0015] In one embodiment, the heat dissipation module is a copper block or ceramic.

[0016] In one embodiment, the first protective film is a polyimide film; and / or,

[0017] The second protective film is a polyimide film.

[0018] A high heat dissipation circuit board includes a multilayer board intermediate assembly with single-sided adhesive flow as described in any of the above embodiments.

[0019] Compared with the prior art, this disclosure has at least the following advantages:

[0020] In the aforementioned multilayer board structure, the core board is located between the first substrate and the second substrate. The core board is fixed to both the first and second substrates by a prepreg to form a multilayer board through lamination. That is, the two sides of the multilayer board utilize substrates. Compared to traditional technologies that require multiple core boards to be laminated, this application reduces the number of core boards used and avoids the cumbersome process caused by laminating multiple core boards. Furthermore, the first substrate, the second substrate, the core board, and the prepreg together form a window area. The heat dissipation module is located within this window area. After the adhesive flows into the window area, it fixes the heat dissipation module to the multilayer board structure, thereby improving the heat dissipation performance of the circuit board. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a multilayer board stacked structure in the prior art;

[0023] Figure 2 This is a schematic diagram of a multilayer board structure according to one embodiment;

[0024] Figure 3 This is a schematic diagram of the structure of a multilayer board intermediate assembly with single-sided adhesive flow according to one embodiment. Detailed Implementation

[0025] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] This disclosure provides a multilayer board structure, including at least one core board, at least two prepreg sheets, a first substrate, and a second substrate. The core board is located between the first substrate and the second substrate. One prepreg sheet is sandwiched between the core board and the first substrate, and another prepreg sheet is sandwiched between the core board and the second substrate, so that the core board is bonded to the first substrate and the second substrate respectively. The first substrate, the second substrate, the core board, and the prepreg sheets together form a window area. The window area is used for the flow of adhesive to fix a heat dissipation module to the first substrate, the prepreg sheet, the core board, and the second substrate respectively.

[0029] In the aforementioned multilayer board structure, the core board is located between the first substrate and the second substrate. The core board is fixed to both the first and second substrates by a prepreg to form a multilayer board through lamination. That is, the two sides of the multilayer board utilize substrates. Compared to traditional technologies that require multiple core boards to be laminated, this application reduces the number of core boards used and avoids the cumbersome process caused by laminating multiple core boards. Furthermore, the first substrate, the second substrate, the core board, and the prepreg together form a window area. The heat dissipation module is located within this window area. After the adhesive flows into the window area, it fixes the heat dissipation module to the multilayer board structure, thereby improving the heat dissipation performance of the circuit board.

[0030] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0031] like Figure 2As shown, a multilayer board structure 10a of one embodiment includes at least one core board 100, at least two prepreg sheets 200, a first substrate 300, and a second substrate 400. The core board 100 is located between the first substrate 300 and the second substrate 400. One prepreg sheet 200 is sandwiched between the core board 100 and the first substrate 300, and another prepreg sheet 200 is sandwiched between the core board 100 and the second substrate 400, so that the core board 100 is bonded to the first substrate 300 and the second substrate 400 respectively. The first substrate 300, the second substrate 400, the core board 100, and the prepreg sheet 200 together form a window area 100a. The window area 100a is used to fix the heat dissipation module 500 to the first substrate 300, the prepreg sheet 200, the core board 100, and the second substrate 400 respectively after the adhesive flows in.

[0032] like Figure 1 and Figure 2 As shown, in this embodiment, the core board 100 is sandwiched between the first substrate 300 and the second substrate 400. The number of core boards 100 can be increased according to design requirements. For example, for a four-layer board, one core board 100 is set between the first substrate 300 and the second substrate 400, while conventional technology requires two core boards 100. For a six-layer board, two core boards 100 are set between the first substrate 300 and the second substrate 400, while conventional technology requires three core boards 100. The core board 100 itself is expensive, especially high-performance materials (such as high-frequency materials), which will increase the overall cost. This application can reduce the use of one core board 100 by using the outer first substrate 300 and second substrate 400, thus reducing production costs and avoiding the cumbersome process caused by pressing multiple core boards 100 together. Furthermore, the first substrate 300, the second substrate 400, the core board 100 and the prepreg 200 together form a window area 100a, and the heat dissipation module 500 is located in the window area 100a. After the adhesive flows into the window area 100a, the heat dissipation module 500 is fixed to the multilayer board structure 10a, thereby improving the heat dissipation performance of the circuit board.

[0033] In the aforementioned multilayer board structure 10a, the core board 100 is located between the first substrate 300 and the second substrate 400. The core board 100 is fixed to both the first substrate 300 and the second substrate 400 by a prepreg 200 to form a multilayer board. That is, the two sides of the multilayer board utilize substrates. Compared to traditional technologies that require multiple core boards 100 to be pressed together, this application reduces the number of core boards 100 used and avoids the cumbersome process caused by pressing multiple core boards 100. Furthermore, the first substrate 300, the second substrate 400, the core board 100, and the prepreg 200 together form a window area 100a. The heat dissipation module 500 is located within the window area 100a. After the adhesive flows into the window area 100a, the heat dissipation module 500 is fixed to the multilayer board structure 10a, thereby improving the heat dissipation performance of the circuit board.

[0034] like Figure 2 As shown, in one embodiment, the core board 100 includes a first copper foil portion 110, an insulating portion 120, and a second copper foil portion 130. The insulating portion 120 has its two sides connected to the first copper foil portion 110 and the second copper foil portion 130, respectively. The first copper foil portion 110 is bonded to one of the prepreg sheets 200, and the second copper foil portion 130 is bonded to the other prepreg sheet 200. The first copper foil portion 110 and the second copper foil portion 130 have equal thicknesses. In this embodiment, the first copper foil portion 110 and the second copper foil portion 130 are respectively provided on both sides of the insulating portion 120 to be connected to the circuits of the first substrate 300 and the second substrate 400, respectively. Furthermore, the first copper foil portion 110 and the second copper foil portion 130 have equal thicknesses to balance the distribution of pressing stress during the pressing process, thereby reducing the risk of board warping.

[0035] In one embodiment, the first substrate 300 includes an insulating member and a copper foil member. The insulating member is connected to the copper foil member and bonded to the prepreg 200. The thickness of the copper foil member is less than the thickness of the first copper foil portion 110. It is understood that the copper foil member is an outer layer circuit, and the thickness of the copper foil member is less than the thickness of the first copper foil portion 110, i.e., the thickness of the outer layer circuit is less than that of the inner layer circuit, in order to reduce signal transmission loss and improve signal integrity.

[0036] In one embodiment, the thickness of the copper foil is 30μm-40μm. It is understood that the copper foil is the outer layer of copper foil, and after lamination, the multilayer board needs to undergo ceramic polishing to remove stains and impurities, making the surface smooth and flat. The outer copper foil needs to be within a certain thickness range to ensure that the underlying substrate is not exposed after polishing, preventing the risk of short circuits.

[0037] like Figure 3As shown, this application also provides a multilayer board intermediate assembly 10 with single-sided adhesive flow, including the multilayer board structure 10a described in any of the above embodiments, and further including a buffer layer 600, an adhesive flow layer 700, a first protective film 800, a second protective film 900, and a heat dissipation module 500. The buffer layer 600, the adhesive flow layer 700, and the first protective film 800 are sequentially stacked on the first substrate 300. The first protective film 800 has an adhesive flow hole 810, which is connected to the window area 100a. The second protective film 900 is connected to the second substrate 400. The heat dissipation module 500 is located in the window area 100a. The adhesive flow layer 700 is used to enter the window area 100a through the adhesive flow hole 810 under high temperature and high pressure, so as to fix the heat dissipation module 500 to the multilayer board structure 10a. In this embodiment, after the heat dissipation module 500 is placed into the window area 100a, a first protective film 800 and a second protective film 900 are attached to both sides of the multilayer board, respectively. Then, a buffer layer 600 and a flow adhesive layer 700 are placed on the first protective film 800. The buffer layer 600 is made of thin copper foil and is used to abut against the working end of the press to make the board surface flat during the pressing process. The flow adhesive layer 700 melts under high temperature and high pressure, so that the flow adhesive layer 700 enters the window area 100a through the flow adhesive hole 810, thereby placing the heat dissipation module 500 into the window area 100a. The heat dissipation module 500 in the window area 100a is fixed to the multilayer board structure 10a. Finally, after the lamination is completed, the first protective film 800, the adhesive layer 700 and the buffer layer 600 are peeled off from the first substrate 300, and the second protective film 900 is peeled off from the second substrate 400. Through the one-sided adhesive flow method and the isolation and protection effect of the first protective film 800 and the second protective film 900, there will be no adhesive overflow on the first substrate 300 and the second substrate 400, thereby improving the product yield of the circuit board.

[0038] In one embodiment, the number of the adhesive flow holes 810 is one, and the adhesive flow holes 810 are annular in shape, surrounding the periphery of the window area 100a. In this embodiment, the adhesive flow holes 810 are annular in shape and surrounding the periphery of the window area 100a, so that the cast adhesive flows into the window area 100a through the adhesive flow holes 810.

[0039] In one embodiment, there are multiple flow holes 810, which are arranged at intervals around the periphery of the window area 100a. In this embodiment, the multiple flow holes 810 are arranged around the periphery of the window area 100a so that the cast adhesive can enter the window area 100a through the multiple flow holes 810.

[0040] In one embodiment, the heat dissipation module 500 is a copper block or ceramic to improve the heat dissipation effect of the multilayer board. Of course, in other embodiments, the heat dissipation module 500 can also be other heat dissipation materials in the prior art.

[0041] In one embodiment, the first protective film 800 is a polyimide film. In this embodiment, the first protective film 800 is a polyimide film, also known as a PI film. The PI film has high heat resistance and small pore size, which prevents the cast adhesive layer 700 from passing through the PI film and contacting the surface of the multilayer board under high temperature and pressure. This avoids the problem of adhesive overflow on the surface of the multilayer board. At the same time, the PI film has extremely high heat resistance and can maintain stable performance in high temperature environments.

[0042] In one embodiment, the second protective film 900 is a polyimide film to prevent the surface of the second substrate 400 from being contaminated with excess adhesive.

[0043] This application also provides a high heat dissipation circuit board, including the multilayer board intermediate assembly 10 with single-sided adhesive flow as described in any of the above embodiments.

[0044] Compared with the prior art, this disclosure has at least the following advantages:

[0045] In the aforementioned multilayer board structure 10a, the core board 100 is located between the first substrate 300 and the second substrate 400. The core board 100 is fixed to both the first substrate 300 and the second substrate 400 by a prepreg 200 to form a multilayer board. That is, the two sides of the multilayer board utilize substrates. Compared to traditional technologies that require multiple core boards 100 to be pressed together, this application reduces the number of core boards 100 used and avoids the cumbersome process caused by pressing multiple core boards 100. Furthermore, the first substrate 300, the second substrate 400, the core board 100, and the prepreg 200 together form a window area 100a. The heat dissipation module 500 is located within the window area 100a. After the adhesive flows into the window area 100a, the heat dissipation module 500 is fixed to the multilayer board structure 10a, thereby improving the heat dissipation performance of the circuit board.

[0046] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A multi-ply board structure, characterized in that, The multi-layer board structure comprises at least one core plate, at least two prepregs, a first substrate and a second substrate, the core plate is located between the first substrate and the second substrate, one of the prepregs is clamped between the core plate and the first substrate, and another one of the prepregs is clamped between the core plate and the second substrate, so that the core plate is bonded with the first substrate and the second substrate respectively, and the first substrate, the second substrate, the core plate and the prepregs jointly form a windowed area, which is used for fixing the heat dissipation module with the first substrate, the prepreg, the core plate and the second substrate after the glue flows in. The core plate comprises a first copper foil part, an insulating part and a second copper foil part, the insulating part is connected with the first copper foil part and the second copper foil part respectively, the first copper foil part is bonded with one of the prepregs, and the second copper foil part is bonded with the other prepreg, and the thickness of the first copper foil part is equal to that of the second copper foil part.

2. The multi-layer board structure of claim 1, wherein, The first substrate comprises an insulating part and a copper foil part, the insulating part is connected with the copper foil part, the insulating part is bonded with the prepreg, and the thickness of the copper foil part is less than that of the first copper foil part.

3. The multi-ply board structure of claim 2, wherein, The thickness of the copper foil part is 30 μm-40 μm.

4. The multi-ply board structure of claim 3, wherein, The multi-layer board structure comprises the multi-layer board structure according to any one of claims 1 to 4, a buffer layer, a glue flow layer, a first protective film, a second protective film and a heat dissipation module, the buffer layer, the glue flow layer and the first protective film are sequentially stacked on the first substrate, the first protective film is provided with a glue flow hole, the glue flow hole is connected with the windowed area, the second protective film is connected with the second substrate, the heat dissipation module is located in the windowed area, and the glue flow layer is used for entering the windowed area through the glue flow hole under high temperature and high pressure, so that the heat dissipation module is fixed with the multi-layer board structure.

5. A single sided flow gluing multilayer board intermediate assembly characterized by, The number of the glue flow hole is one, the glue flow hole is in a ring shape, and the glue flow hole is arranged around the circumferential side of the windowed area.

6. The single sided flow gluing multilayer board intermediate assembly of claim 5, wherein, The number of the glue flow hole is one, the glue flow hole is in a ring shape, and the glue flow hole is arranged around the circumferential side of the windowed area.

7. The single sided flow gluing multilayer board intermediate assembly of claim 5, wherein, The heat dissipation module is a copper block or a ceramic.

8. The single sided flow gluing multilayer board intermediate assembly of claim 5, wherein, The first protective film is a polyimide film; and / or 9. The single sided flow gluing multilayer board intermediate assembly of claim 5, wherein, The second protective film is a polyimide film. The multi-layer board intermediate assembly with one-side glue flow comprises the multi-layer board intermediate assembly according to any one of claims 5 to 9.

10. A high heat dissipating circuit board, characterized by, ​

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