Amplifier chip packaging structure

Abstract

The utility model relates to the technical field of chip packaging, in particular to an amplifier chip packaging structure, which comprises a bottom plate, a chip body, a packaging cover, a mounting nut, a sticking strip, a dismounting part and an auxiliary part, the packaging cover is detachably connected with the bottom plate and is positioned above the chip body, the mounting nut is detachably connected with the bottom plate and penetrates through the bottom plate, and the sticking strip is positioned above the dismounting part. The pasting strip is detachably connected with the bottom plate and located below the bottom plate, the dismounting part is arranged above the bottom plate, the auxiliary part is arranged above the packaging cover, the bottom plate and the chip body can be fixed to an external circuit board through the mounting nut and the pasting strip, the packaging cover can be fixed to the bottom plate by controlling the dismounting part, and the chip body is wrapped. The chip body is protected in cooperation with the auxiliary component, and meanwhile, the packaging cover can be rapidly taken down by controlling the dismounting component, so that the chip body is convenient to replace.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to an amplifier chip packaging structure. Background Technology

[0002] Currently, the millimeter-wave band has advantages such as short wavelength, wide bandwidth, and large information capacity. Millimeter-wave communication technology is widely used in mobile communication, radar detection, electronic countermeasures, precision guidance, and other fields. Millimeter-wave amplifiers can amplify microwave signals in the millimeter-wave band. Microwave RF chips mostly adopt plastic packaging technology. This process first creates a metal packaging carrier frame, then bonds the chip to the frame, attaches the chip to the packaging pins, completes the chip injection molding using an injection molding machine, and finally forms the final packaged product through a cutting process. This packaging structure is only suitable for chip packaging in frequency bands below 10 GHz. For 5G millimeter-wave frequency band amplifiers above 20 GHz, there is a problem of excessive parasitic loss, which cannot guarantee the superior performance of the chip.

[0003] To address the aforementioned issues, existing patent (CN210429797U) discloses a millimeter-wave band amplifier chip packaging structure. This structure combines a packaging substrate and a cover, and incorporates a receiving groove on the packaging substrate to accommodate the chip. This effectively shortens the connection length between the chip and the packaging substrate, facilitating the reduction of parasitic inductance and improving the chip's transmission capability. The cover with an inner cavity allows the chip's DC port to directly contact the air, reducing high-frequency band losses and enhancing the chip's own radio frequency performance.

[0004] However, in the aforementioned prior art, when it is necessary to replace the chip, the disassembly of the amplifier chip package structure is quite complicated, making it inconvenient to replace the chip. Utility Model Content

[0005] The purpose of this utility model is to provide an amplifier chip packaging structure, which aims to solve the technical problem in the prior art that the disassembly of the amplifier chip packaging structure is cumbersome when the chip needs to be replaced, making it inconvenient to replace the chip.

[0006] To achieve the above objectives, this utility model employs an amplifier chip packaging structure, including a base plate, a chip body, and a mounting assembly. The chip body is detachably connected to the base plate and is located above the base plate.

[0007] The mounting assembly includes a package cover, a mounting nut, an adhesive strip, a disassembly component, and an auxiliary component. The package cover is detachably connected to the base plate and is located above the chip body. The mounting nut is detachably connected to the base plate and penetrates through the base plate. The adhesive strip is detachably connected to the base plate and is located below the base plate. The disassembly component is located above the base plate, and the auxiliary component is located above the package cover.

[0008] The disassembly component includes a rod, a movable block, a knob, and a drive unit. The knob is rotatably connected to the encapsulation cover and is located on one side of the encapsulation cover. The movable block is disposed inside the encapsulation cover. The rod is fixedly connected to the movable block and is located inside the movable block. The rod is adapted to the hole on the side of the base plate. The drive unit is disposed inside the encapsulation cover.

[0009] The drive unit includes a threaded rod and a guide rod. The threaded rod is rotatably connected to the packaging cover and is located inside the packaging cover. The threads at both ends of the threaded rod have opposite directions. The guide rod is fixedly connected to the packaging cover and is located inside the packaging cover. The moving block is threadedly connected to the threaded rod.

[0010] The auxiliary components include a positioning rod and a buffer unit. The positioning rod is fixedly connected to the encapsulation cover and is located below the encapsulation cover. The positioning rod is adapted to the holes on the surface of the base plate. The buffer unit is located above the encapsulation cover.

[0011] The buffer unit includes a telescopic rod, a spring, and a buffer plate. One end of the telescopic rod is detachably connected to the encapsulation cover and is located above the encapsulation cover. One end of the spring is detachably connected to the encapsulation cover and wraps around the telescopic rod. The buffer plate is detachably connected to the telescopic rod and is located at the end of the telescopic rod away from the encapsulation cover. The buffer plate is also detachably connected to the end of the spring away from the encapsulation cover.

[0012] This utility model discloses an amplifier chip packaging structure. The mounting nut and the adhesive strip can fix the base plate and the chip body to an external circuit board. The disassembly component can fix the package cover to the base plate and wrap the chip body. The auxiliary component protects the chip body. At the same time, the disassembly component can quickly remove the package cover, thereby facilitating the replacement of the chip body. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the amplifier chip packaging structure of this utility model.

[0015] Figure 2 This is a front view of the amplifier chip package structure of this utility model.

[0016] Figure 3 This is the utility model Figure 2 A cross-sectional view of the AA line structure.

[0017] Figure 4 This is the utility model Figure 2 BB line structural cross-sectional view.

[0018] Figure 5 This is the utility model Figure 2 CC-line structural cross-sectional view.

[0019] 101-Base plate, 102-Chip body, 103-Encapsulation cover, 104-Mounting nut, 105-Adhesive strip, 106-Insertion rod, 107-Moving block, 108-Knob, 109-Threaded rod, 110-Guide rod, 111-Positioning rod, 112-Telescopic rod, 113-Spring, 114-Buffer plate. Detailed Implementation

[0020] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0021] Please see Figures 1-5 ,in Figure 1 This is a schematic diagram of the amplifier chip packaging structure of this utility model. Figure 2 This is a front view of the amplifier chip package structure of this utility model. Figure 3 This is the utility model Figure 2 AA-line structural cross-sectional view, Figure 4 This is the utility model Figure 2 BB line structural cross-sectional view, Figure 5 This is the utility model Figure 2CC-line structural cross-sectional view.

[0022] This utility model provides an amplifier chip packaging structure, including a base plate 101, a chip body 102 and a mounting assembly. The chip body 102 is detachably connected to the base plate 101 and is located above the base plate 101.

[0023] The mounting assembly includes a package cover 103, a mounting nut 104, an adhesive strip 105, a disassembly component, and an auxiliary component. The package cover 103 is detachably connected to the base plate 101 and is located above the chip body 102. The mounting nut 104 is detachably connected to the base plate 101 and penetrates the base plate 101. The adhesive strip 105 is detachably connected to the base plate 101 and is located below the base plate 101. The disassembly component is located above the base plate 101, and the auxiliary component is located above the package cover 103.

[0024] In this embodiment, the mounting nut 104 and the adhesive strip 105 can fix the base plate 101 and the chip body 102 to the external circuit board. The disassembly component can fix the encapsulation cover 103 to the base plate 101 and wrap the chip body 102. The auxiliary component protects the chip body 102. At the same time, the disassembly component can quickly remove the encapsulation cover 103, which facilitates the replacement of the chip body 102.

[0025] Furthermore, the disassembly component includes a plug 106, a moving block 107, a knob 108, and a drive unit. The knob 108 is rotatably connected to the encapsulation cover 103 and is located on one side of the encapsulation cover 103. The moving block 107 is disposed inside the encapsulation cover 103. The plug 106 is fixedly connected to the moving block 107 and is located inside the moving block 107. The plug 106 is adapted to the hole on the side of the base plate 101. The drive unit is disposed inside the encapsulation cover 103.

[0026] In this embodiment, rotating the knob 108 controls the drive unit to move the moving block 107. When the moving block 107 moves, it can move the insertion rod 106 and insert the insertion rod 106 into the hole on the side of the base plate 101, thereby fixing the encapsulation cover 103. When disassembling the encapsulation cover 103, simply rotate the knob 108 in the opposite direction to pull out the insertion rod 106 and disconnect the encapsulation cover 103 from the base plate 101.

[0027] Furthermore, the drive unit includes a threaded rod 109 and a guide rod 110. The threaded rod 109 is rotatably connected to the encapsulation cover 103 and is located inside the encapsulation cover 103. The threads at both ends of the threaded rod 109 are in opposite directions. The guide rod 110 is fixedly connected to the encapsulation cover 103 and is located inside the encapsulation cover 103. The moving block 107 is threadedly connected to the threaded rod 109.

[0028] In this embodiment, rotating the knob 108 can drive the threaded rod 109 to rotate, and the rotation of the threaded rod 109 can drive the moving block 107 to move, thereby driving the insertion rod 106 to move. At the same time, the guide rod 110 can increase the stability of the moving block 107 when it moves.

[0029] Furthermore, the auxiliary component includes a positioning rod 111 and a buffer unit. The positioning rod 111 is fixedly connected to the encapsulation cover 103 and is located below the encapsulation cover 103. The positioning rod 111 is adapted to the holes on the surface of the base plate 101. The buffer unit is disposed above the encapsulation cover 103.

[0030] In this embodiment, when installing the encapsulation cover 103, the positioning rod 111 is first inserted into the hole on the surface of the base plate 101, which can serve to initially position the encapsulation cover 103.

[0031] Furthermore, the buffer unit includes a telescopic rod 112, a spring 113, and a buffer plate 114. One end of the telescopic rod 112 is detachably connected to the encapsulation cover 103 and is located above the encapsulation cover 103. One end of the spring 113 is detachably connected to the encapsulation cover 103 and wraps around the telescopic rod 112. The buffer plate 114 is detachably connected to the telescopic rod 112 and is located at the end of the telescopic rod 112 away from the encapsulation cover 103. The buffer plate 114 is also detachably connected to the end of the spring 113 away from the encapsulation cover 103.

[0032] In this embodiment, when the buffer plate 114 is impacted, it will compress the telescopic rod 112 and the spring 113. The spring 113 will convert part of the impact force into elastic potential energy, thereby offsetting part of the impact force and achieving the purpose of buffering and protecting the chip body 102.

[0033] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the utility model.

Claims

1. An amplifier chip packaging structure, comprising a base plate and a chip body, the chip body being detachably connected with the base plate and located above the base plate, characterized in that, further comprising a mounting assembly; the mounting assembly comprises a packaging cover, a mounting nut, a sticking strip, a detaching component and an auxiliary component, the packaging cover being detachably connected with the base plate and located above the chip body, the mounting nut being detachably connected with the base plate and penetrating through the base plate, the sticking strip being detachably connected with the base plate and located below the base plate, the detaching component being arranged above the base plate, and the auxiliary component being arranged above the packaging cover.

2. The amplifier chip packaging structure according to claim 1, characterized in that, the detaching component comprises a plug rod, a moving block, a knob and a driving unit, the knob being rotatably connected with the packaging cover and located at one side of the packaging cover, the moving block being arranged inside the packaging cover, the plug rod being fixedly connected with the moving block and located inside the moving block, and the plug rod being adapted to the hole on the side surface of the base plate, and the driving unit being arranged inside the packaging cover.

3. The amplifier chip packaging structure according to claim 2, characterized in that, the driving unit comprises a threaded rod and a guide rod, the threaded rod being rotatably connected with the packaging cover and located inside the packaging cover, and the threads on the two ends of the threaded rod being in opposite directions, the guide rod being fixedly connected with the packaging cover and located inside the packaging cover, and the moving block being threadedly connected with the threaded rod.

4. The amplifier chip packaging structure according to claim 1, characterized in that, the auxiliary component comprises a positioning rod and a buffer unit, the positioning rod being fixedly connected with the packaging cover and located below the packaging cover, and the positioning rod being adapted to the hole on the surface of the base plate, and the buffer unit being arranged above the packaging cover.

5. The amplifier chip packaging structure according to claim 4, characterized in that, the buffer unit comprises a telescopic rod, a spring and a buffer plate, one end of the telescopic rod being detachably connected with the packaging cover and located above the packaging cover, one end of the spring being detachably connected with the packaging cover and wrapping the telescopic rod, the buffer plate being detachably connected with the telescopic rod and located at the end of the telescopic rod away from the packaging cover, and the buffer plate being detachably connected with the end of the spring away from the packaging cover.

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