Flexible printed circuit board (PCB) thin plate etching die

Abstract

The utility model relates to the technical field of flexible PCB thin plates, in particular to a flexible PCB thin plate etching mold which comprises an upper supporting frame and a lower supporting frame, and locking assemblies used for mutual locking are arranged between the upper supporting frame and the lower supporting frame; the lower supporting frame comprises a lower frame body, and a positioning table for placing the flexible PCB thin plate is arranged on the lower frame body; the upper supporting frame comprises an upper frame body, the upper frame body is provided with a pressing rubber table used for pressing and fixing the PCB thin plate to the positioning table, and the pressing rubber table is provided with a plurality of drainage grooves. The flexible PCB thin plate conveying device has the advantages that the flexible PCB thin plate is prevented from being bent in the conveying process, and therefore the etching effect is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of flexible PCB thin plates, and in particular to a flexible PCB thin plate etching mold. BACKGROUND

[0002] Flexible PCB thin plates have a wide range of applications in the aerospace field, such as satellite communication systems, navigation and control systems, power and energy management systems, etc. They can provide stable transmission of high-frequency signals while meeting complex wiring requirements in limited weight and volume.

[0003] The manufacturing process of flexible PCB thin plates is relatively complex and requires printing, chemical etching, photolithography, electroplating, cutting and other steps. These steps require high-precision equipment and professional technicians to operate to ensure the quality and performance of the flexible PCB thin plate.

[0004] A silicon wafer wet etching device and its etching method are disclosed in a Chinese patent with publication number CN103805998B. It includes a conveying roller, a liquid storage box, and a liquid inlet pipe. The liquid storage box has a liquid storage cavity inside. The liquid storage box is placed above the conveying roller. The reaction liquid enters the liquid storage box through the liquid inlet pipe. The bottom of the liquid storage box is provided with multiple liquid injection holes that spray the reaction liquid onto the upper surface of the silicon wafer conveyed by the conveying roller. The reaction liquid is uniformly sprayed from the liquid injection holes of the liquid storage box above the silicon wafer to the silicon wafer below, causing the reaction liquid to overflow on the surface of the silicon wafer.

[0005] However, the conveying device of the etching equipment described above carries the PCB board forward by several conveying rollers. When the flexible PCB thin plate is placed on the conveying roller and conveyed forward, it will bend with the conveying roller, causing the etching liquid to accumulate above it, and thus causing uneven etching. Utility model content

[0006] To solve the above technical problems, the present application provides a flexible PCB thin plate etching mold, which has the advantages of avoiding bending of the flexible PCB thin plate during transportation, thereby ensuring the etching effect.

[0007] To achieve the above purpose, the technical scheme of the present application is as follows:

[0008] The flexible PCB thin plate etching mold comprises an upper support frame and a lower support frame, and a locking assembly for mutual locking is arranged between the upper support frame and the lower support frame.

[0009] The lower support frame comprises a lower frame body, and a positioning table for placing the flexible PCB thin plate is arranged on the lower frame body.

[0010] The upper support frame includes an upper frame body, on which a pressing rubber platform for pressing and fixing the PCB thin board onto the positioning stage is provided, and the pressing rubber platform is provided with a plurality of drainage grooves.

[0011] To achieve the above technical solution, the PCB board is placed on the positioning platform of the lower frame, and then the upper support frame is placed on the lower support frame. The upper and lower support frames are gradually locked by the locking components, so that the pressing rubber platform of the upper support frame gradually presses and fixes the PCB board on the positioning platform. This fixes the edge of the PCB board on the positioning platform and the rubber platform, thus fixing the entire flexible PCB board between the upper and lower support frames. When the entire board is transported in the etching equipment, the lower and upper support frames contact the conveying device, preventing the flexible PCB board from bending and deforming. This reduces the occurrence of etching solution accumulation due to deformation, which leads to a deterioration in the etching effect. At the same time, the "reference platform" and "flexible platform" of the positioning platform and the pressing rubber platform work together to ensure the flatness of the fixed PCB board, thereby ensuring the etching effect. The drainage groove can drain the etching solution from the PCB board and prevent accumulation, thus ensuring the etching effect.

[0012] As a preferred embodiment of this application, an auxiliary support platform is detachably provided on the lower support frame, and the auxiliary support platform is provided with a support surface that is flush with the positioning platform.

[0013] To achieve the above technical solution, when the PCB board is laid on the positioning platform, its central part can be supported by the auxiliary support platform, thereby preventing the center of the PCB board from bending due to its own weight, thus ensuring the flatness of the PCB board and ensuring the etching effect. When etching is required, the auxiliary support platform is removed to prevent it from affecting the etching effect.

[0014] As a preferred embodiment of this application, the locking component is provided as a pressing member at the corner of the upper support frame and the lower support frame.

[0015] To achieve the above technical solution, the corners of both the upper and lower support frames are locked by pressing components, thereby ensuring the reliable connection between the upper and lower support frames and preventing loosening that could cause the PCB board to bend and deform.

[0016] As a preferred embodiment of this application, the pressing component includes an upper pressing plate that is fastened to the upper support frame and a lower pressing plate that is fastened to the lower support frame. Two locking screws for tightening each other are provided between the upper pressing plate and the lower pressing plate, and the two locking screws are respectively provided on the two edges of the corner of the lower support frame.

[0017] The above technical solution is achieved by locking the two upper and lower pressure plates with screws, thereby pressing and locking the upper and lower support frames. Screws are also provided on the two edges of the lower support frame at the corners to achieve a locking effect. At the same time, the screws are set separately from the lower or upper support frame to prevent the upper or lower support frame from bending due to stress, which would cause the PCB board to bend when it is fixed.

[0018] As a preferred embodiment of this application, the upper pressing plate and the cross-section of the upper pressing plate are arranged in a U-shape.

[0019] The above technical solution is implemented to further ensure the uniformity of force distribution between the upper and lower support frames.

[0020] In summary, this application includes at least one of the following beneficial technical effects:

[0021] 1. The PCB board is placed on the positioning platform of the lower frame, and then the upper support frame is placed on the lower support frame. The upper and lower support frames are gradually locked by the locking components, so that the pressure rubber platform of the upper support frame gradually presses and fixes the PCB board on the positioning platform. This fixes the edge of the PCB board on the positioning platform and the rubber platform, thus fixing the entire flexible PCB board between the upper and lower support frames. When the entire board is transported in the etching equipment, the lower and upper support frames contact the conveying device, thereby preventing the flexible PCB board from bending and deforming. This reduces the possibility of etching solution accumulation due to deformation, which would lead to a deterioration in the etching effect. At the same time, the "reference platform" and "flexible platform" of the positioning platform and the pressure rubber platform work together to ensure the flatness of the fixed PCB board, thereby ensuring the etching effect. The drainage groove can drain the etching solution from the PCB board and prevent accumulation, thus ensuring the etching effect. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application.

[0024] Figure 2 This is an exploded view of an embodiment of this application.

[0025] Figure 3 This is a cross-sectional view of an embodiment of this application.

[0026] Reference numerals: 1. Upper support frame; 11. Upper frame body; 12. Pressing rubber platform; 13. Drainage groove; 2. Lower support frame; 21. Lower frame body; 22. Positioning platform; 3. Locking assembly; 31. Upper pressing plate; 32. Lower pressing plate; 33. Locking screw; 4. Auxiliary support platform. Detailed Implementation

[0027] The following is in conjunction with the appendix Figures 1-3 This application will be described in further detail.

[0028] This application discloses a flexible PCB thin-board etching mold. (Refer to...) Figure 1 The etching mold for the flexible PCB sheet 9 includes an upper support frame 1 and a lower support frame 2, with a locking assembly 3 for mutual locking between the upper support frame 1 and the lower support frame 2. The lower support frame 2 includes a lower frame body 21, on which a positioning stage 22 for placing the flexible PCB sheet 9 is provided; the upper support frame 1 includes an upper frame body 11, on which a pressing rubber stage 12 for pressing and fixing the PCB sheet 9 onto the positioning stage 22 is provided, and the pressing rubber stage 12 is provided with a plurality of drainage grooves 13. The PCB sheet 9 is placed on the positioning platform 22 of the lower frame 21, and then the upper support frame 1 is placed on the lower support frame 2. The upper support frame 1 and the lower support frame 2 are gradually locked by the locking component 3. This causes the pressing rubber platform 12 of the upper support frame 1 to gradually press and fix the PCB sheet 9 on the positioning platform 22, thereby fixing the edge of the PCB sheet 9 on the positioning platform 22 and the rubber platform. This fixes the entire flexible PCB sheet 9 between the upper support frame 1 and the lower support frame 2. When the entire PCB sheet 9 is transported in the etching equipment, the lower support frame 2 and the upper support frame 1 come into contact with the conveying device, thereby preventing the flexible PCB sheet 9 from bending and deforming. This reduces the occurrence of etching solution accumulation due to deformation, which leads to a deterioration in the etching effect. At the same time, the positioning platform 22 and the pressing rubber platform 12, as "reference platforms" and "flexible platforms," ​​work together to ensure the flatness of the fixed PCB sheet 9, thereby ensuring the etching effect. The drainage groove 13 can drain the etching solution on the PCB sheet 9 to prevent accumulation, thus ensuring the etching effect.

[0029] An auxiliary support platform 4 is detachably installed on the lower support frame 2. The auxiliary support platform 4 has a support surface that is flush with the positioning platform 22, so that when the PCB board 9 is laid on the positioning platform 22, its center can be supported by the auxiliary support platform 4, thereby preventing the center of the PCB board 9 from bending due to its own weight, thus ensuring the flatness of the PCB board 9 and ensuring the etching effect. When etching is required, the auxiliary support platform 4 can be removed to prevent it from affecting the etching effect.

[0030] The locking components are press-fitted parts located at the corners of the upper support frame 1 and the lower support frame 2. The corners of the upper support frame 1 and the lower support frame 2 are locked by the press-fitted parts, thereby ensuring the reliable connection between the upper support frame 1 and the lower support frame 2 and preventing loosening that could cause the PCB board 9 to bend and deform.

[0031] The pressing components include an upper pressing plate 31 that fastens to the upper support frame 1 and a lower pressing plate 32 that fastens to the lower support frame 2. Two locking screws 33 are provided between the upper pressing plate 31 and the lower pressing plate 32 for mutual tightening. The two locking screws 33 are respectively located on the two edges of the corner of the support frame. That is, by tightening the two upper pressing plates 31 and the lower pressing plate 32, the upper support frame 1 and the lower support frame 2 are pressed and locked together. The locking screws on the two edges of the corner of the lower support frame 2 further enhance the locking effect. Simultaneously, the locking screws 33 are separate from the lower support frame 2 or the upper support frame 1, preventing the upper support frame 1 or the lower support frame 2 from bending due to stress, which would cause the PCB sheet 9 to bend during fixing. The upper pressing plate 31 has a U-shaped cross-section, further ensuring the uniformity of force distribution on the upper support frame 1 and the lower support frame 2.

[0032] The implementation principle of a flexible PCB thin board etching mold in this application embodiment is as follows: the PCB thin board 9 is placed on the positioning stage 22 of the lower frame 21, and then the upper support frame 1 is placed on the lower support frame 2. The upper support frame 1 and the lower support frame 2 are gradually locked by the locking assembly 3, so that the pressing rubber stage 12 of the upper support frame 1 gradually presses and fixes the PCB thin board 9 on the positioning stage 22, thereby fixing the frame of the PCB thin board 9 on the positioning stage 22 and the rubber stage, thus fixing the entire flexible PCB thin board 9 on the upper support frame 1 and the lower support frame 21. Between the support frames 2, the lower support frame 2 and the upper support frame 1 contact the conveying device when the whole is transported in the etching equipment, thereby preventing the flexible PCB sheet 9 from bending and deforming, and reducing the occurrence of etching solution accumulation due to deformation, which leads to a deterioration in the etching effect; at the same time, the positioning stage 22 and the pressing rubber stage 12 work together to ensure the flatness of the PCB sheet 9, thereby ensuring the etching effect, and the setting of the drainage groove 13 can drain the etching solution on the PCB sheet 9 to prevent accumulation, thereby ensuring the etching effect.

[0033] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A flexible PCB sheet etching die characterized by: The application relates to a support frame, which comprises an upper support frame (1) and a lower support frame (2), and a locking assembly (3) arranged between the upper support frame (1) and the lower support frame (2) for locking each other; The lower support frame (2) comprises a lower frame body (21), and a positioning table (22) for placing a flexible PCB thin plate (9) is arranged on the lower frame body (21); The upper support frame (1) comprises an upper frame body (11), and a compression rubber table (12) for compressing and fixing the PCB thin plate (9) on the positioning table (22) is arranged on the upper frame body (11); a plurality of drainage grooves (13) are arranged on the compression rubber table (12).

2. The flexible PCB panel etching stencil of claim 1, wherein: A detachable auxiliary support table (4) is arranged on the lower support frame (2), and a support surface flush with the positioning table (22) is arranged on the auxiliary support table (4).

3. The flexible PCB panel etching stencil of claim 1, wherein: The locking assembly (3) is a compression piece arranged at a folding corner of the upper support frame (1) and the lower support frame (2).

4. The flexible PCB panel etching stencil of claim 3, wherein: The compression piece comprises an upper compression plate (31) buckled on the upper support frame (1) and a lower compression plate (32) buckled on the lower support frame (2), two locking screws (33) for screwing each other are arranged between the upper compression plate (31) and the lower compression plate (32), and the two locking screws (33) are arranged on the two edge sides of the folding corner of the support frame respectively.

5. The flexible PCB panel etching stencil of claim 4, wherein: The upper compression plate (31) and the lower compression plate (32) are arranged in a U-shaped cross section.

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