Electric appliance assembly

Abstract

The utility model relates to an electric appliance assembly, which comprises a circuit board, a radiating fin and a heat-conducting fin. Heat generated by a heating device of the circuit board during working is conducted to the cooling fins through the heat conducting fins and then dissipated outwards through the cooling fins, and therefore heat dissipation is achieved. The height compensation structures are arranged at the positions, corresponding to the heating devices, of the cooling fin, and the distances between the heating devices and the cooling fin are the same, so that when the cooling fin is fixed to the circuit board, heat conducting fins between the heating devices and the cooling fin can be uniformly compressed, and the heat dissipation efficiency is improved. Therefore, the situation that part of the heat-conducting fins are compressed excessively and part of the heat-conducting fins are compressed insufficiently is avoided, and each heating device is ensured to be in effective contact with the heat-conducting fins. Therefore, heat generated by the heating device can be smoothly conducted to the radiating fins through the heat-conducting fins, so that the radiating efficiency of the electric appliance assembly is improved.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit technology, and in particular to an electrical component. Background Technology

[0002] Most semiconductor testing equipment contains circuit boards, which generate a significant amount of heat during operation, necessitating a heat dissipation structure. Currently, heat sinks are typically mounted on the surface of the circuit board, with thermal conductive pads placed between the heat sink and the heat-generating components on the board. The generated heat is first conducted to the heat sink via the thermal conductive pads, and then dissipated outwards from the heat sink. However, due to the varying heights of different components, the spacing between the heat sink and each component differs. Consequently, after fixing the heat sink to the circuit board, the thermal conductive pads cannot be uniformly pressed together, potentially causing some pads to miss contact with the components, thus affecting heat conduction and reducing heat dissipation efficiency. Utility Model Content

[0003] Therefore, it is necessary to provide an electrical component that can improve heat dissipation efficiency to address the above problems.

[0004] An electrical component includes a circuit board, a heat sink, and a heat-conducting plate. A plurality of heat-generating devices are disposed on at least one surface of the circuit board. The heat sink is disposed on at least one side of the circuit board, and the heat-conducting plate is disposed between each heat-generating device and the heat sink. A height compensation structure is formed on the side of the heat sink facing the circuit board, corresponding to at least a portion of the heat-generating devices. The height compensation structure is a protrusion or a groove, and ensures that the distance between each heat-generating device and the heat sink is the same.

[0005] In one embodiment, the heat sink has heat dissipation fins on the side facing away from the circuit board.

[0006] In one embodiment, the heat sink has a plurality of equal-height blocks on the side facing the circuit board, and each of the equal-height blocks abuts against the circuit board.

[0007] In one embodiment, the heat sink has three equal-height blocks on the side facing the circuit board, and the three equal-height blocks are arranged in a triangular pattern.

[0008] In one embodiment, each of the contour blocks has a support surface formed at its top end away from the heat sink for abutting against the circuit board.

[0009] In one embodiment, the orthographic projection of each of the heat-generating devices onto the heat sink is located within the range of the corresponding height compensation structure.

[0010] In one embodiment, a heat sink is provided on both sides of the circuit board along its thickness direction, and the circuit board and each heat sink are arranged in parallel and spaced apart.

[0011] In one embodiment, the electrical assembly further includes a threaded fastener that passes through one of the heat sinks and the circuit board and engages with the other heat sink to clamp the circuit board between the heat sinks on both sides.

[0012] In one embodiment, one of the heat sinks has a countersunk hole, and the head of the threaded fastener is accommodated in the countersunk hole; the other heat sink is provided with a press-fit nut, and the threaded fastener is screwed into the press-fit nut.

[0013] In the aforementioned electrical components, the heat generated by the heat-generating devices on the circuit board is first conducted to the heat sink via a heat-conducting plate, and then dissipated outwards by the heat sink, thus achieving heat dissipation. Because the heat sink and each heat-generating device form a height-compensating structure, ensuring that the distance between each heat-generating device and the heat sink is equidistant, fixing the heat sink to the circuit board allows for uniform compression of the heat-conducting plate between each heat-generating device and the heat sink. This prevents some heat-conducting plates from being over-compressed while others are under-compressed, ensuring effective contact between each heat-generating device and the heat-conducting plate. In this way, the heat generated by the heat-generating devices can be smoothly conducted to the heat sink through the heat-conducting plate, thereby improving the heat dissipation efficiency of the aforementioned electrical components. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of an electrical component in one embodiment of the present invention;

[0016] Figure 2 for Figure 1 Exploded view of the electrical components shown;

[0017] Figure 3 for Figure 1 A cross-sectional view of the electrical components shown;

[0018] Figure 4 for Figure 1 A schematic diagram of the structure of one of the heat sinks in the electrical component shown. Detailed Implementation

[0019] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0020] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0025] Please see Figure 1 and Figure 2 This utility model provides an electrical component 100, which can be applied to related equipment for semiconductor testing. In one embodiment of this utility model, the electrical component 100 includes a circuit board 110, a heat sink 120, and a heat-conducting sheet (not shown).

[0026] The circuit board 110 is capable of performing specific circuit functions and is generally an integrated circuit board, i.e., a PCB board. At least one surface of the circuit board 110 has multiple heat-generating devices 111, which generate heat during the operation of the circuit board 110. The heat-generating devices 111 are essential components for the circuit board 110 to perform its specific circuit functions and can be electronic components such as capacitors, inductors, and coils. Specifically, in this embodiment, multiple heat-generating devices 111 are provided on both the first and second surfaces of the circuit board 110 in the thickness direction.

[0027] A heat sink 120 is disposed on at least one side of the circuit board 110, and a thermally conductive sheet is disposed between each heat-generating device 111 and the heat sink 120. The heat sink 120 is formed of a metal that is a good conductor of heat, such as aluminum or copper. Moreover, the heat sink 120 is relatively thin to reduce the thickness dimension of the electrical component 100, making it easier to install in confined spaces. The thermally conductive sheet can be formed of a material with a high thermal conductivity and capable of elastic deformation, such as thermally conductive adhesive, so that it can make good contact with the heat-generating device 111 and the heat sink 120. The heat generated by the heat-generating device 111 during operation is first conducted to the heat sink 120 by the thermally conductive sheet, and then dissipated outward by the heat sink 120 to achieve heat dissipation.

[0028] Specifically, in this embodiment, the heat sink 120 has heat dissipation fins 122 on the side facing away from the circuit board 110. The heat dissipation fins 122 can increase the contact area between the heat sink 120 and the air, thereby helping to improve the heat dissipation efficiency of the heat sink 120.

[0029] In this embodiment, where heat-generating devices 111 are provided on both sides of the circuit board 110 along its thickness direction, a heat sink 120 is provided on both sides of the circuit board 110 along its thickness direction, and the circuit board 110 and the two heat sinks 120 are arranged parallel to each other. That is, the circuit board 110 is sandwiched between the heat sinks 120 on both sides, and they are arranged parallel to each other, so the heat dissipation efficiency of the circuit board 110 can be significantly improved. Of course, in other embodiments, if the circuit board 110 has a heat-generating device 111 on only one side, the heat sink 120 can also be arranged only on the side where the heat-generating device 111 is provided.

[0030] Please refer to the following: Figure 4 A height compensation structure 121 is formed on the side of the heat sink 120 facing the circuit board 110, corresponding to at least some of the heat-generating devices 111. The height compensation structure 121 can be a protrusion or a recess. The function of the height compensation structure 121 is to compensate for the height difference of each heat-generating device 111 along the height direction of the heat-generating device 111, i.e., the thickness direction of the circuit board 110, and to ensure that the distance between each heat-generating device 111 and the heat sink 120 is the same.

[0031] The height compensation structure 121 can be configured in a one-to-one correspondence with the heat-generating devices 111 on the surface of the circuit board 110, meaning that a corresponding height compensation structure 121 is formed at the position of each heat-generating device 111 on the heat sink 120; alternatively, it can be configured for some heat-generating devices 111, while the positions corresponding to the remaining heat-generating devices 111 are not configured with height compensation structures 121. The specific form and size of the height compensation structure 121 can be determined according to the height of the heat-generating devices 111. Generally, for heat-generating devices 121 with a higher height, the corresponding height compensation structure 121 can be a groove or a small protrusion, while for heat-generating devices 121 with a lower height, the corresponding height compensation structure 121 can be a large protrusion.

[0032] For example, three heating elements 111, namely element A, element B, and element C, are disposed on the surface of circuit board 110. The height of element A is 0.1 mm greater than the height of element B, and the height of element B is 0.1 mm greater than the height of element C. Therefore, there is a height difference of 0.2 mm between element A and element C. To achieve height compensation, a height compensation structure 121 can be provided for element A. This height compensation structure 121 can be a groove with a depth of 0.1 mm. In this case, the height compensation structure 121 can be omitted for the position of element B, while a protrusion with a height of 0.1 mm can be provided for element C as the height compensation structure 121.

[0033] Of course, in the example above, a protrusion with a height of 0.1 mm can also be set for device A as a height compensation structure 121. In this case, device B would need to be set with a protrusion with a height of 0.2 mm as a height compensation structure 121, while device C could be set with a protrusion with a height of 0.3 mm as a height compensation structure 121. And so on, the height difference between the height compensation structures 121 corresponding to any two heating devices 111 should be equal to the height difference between any two heating devices 111.

[0034] The height compensation structure 121 can be integrally formed by stamping during the forming process of the heat sink 120, or it can be formed by milling. By forming the height compensation structure 121, the distance between each heat-generating device 111 and the heat sink 120 can be the same. Therefore, when the heat sink 120 is fixed to the circuit board 110, the heat-conducting sheet between each heat-generating device 111 and the heat sink 120 can be uniformly compressed, thereby avoiding the situation where some heat-conducting sheets are over-compressed and some are under-compressed. This ensures that each heat-generating device 111 is in effective contact with the heat-conducting sheet, and that heat can be smoothly conducted to the heat sink 120 through the heat-conducting sheet.

[0035] The shape of the height compensation structure 121 generally matches the shape of the corresponding heat-generating device 111, and can be circular, rectangular, etc. More specifically, in this embodiment, the orthographic projection of each heat-generating device 111 on the heat sink 120 is within the range of the corresponding height compensation structure 121. That is to say, the size of the height compensation structure 121 is larger than that of the heat-generating device 111, and the heat-conducting sheet attached to the heat-generating device 111 can be completely compressed by the height compensation structure 121, thus further ensuring that the heat-conducting sheet is uniformly compressed.

[0036] Please refer to it again. Figure 4In this embodiment, the heat sink 120 has a plurality of equal-height blocks 123 on the side facing the circuit board 110, and each equal-height block 123 abuts against the circuit board 110. The equal-height blocks 123 can also be integrally formed during the molding process of the heat sink 120, and the height of each equal-height block 123 is the same, and the surface of each equal-height block 123 that abuts against the circuit board 110 can be set as a smooth plane according to actual needs. When assembling the heat sink 120 and the circuit board 110, each equal-height block 123 can abut against the area of ​​the circuit board 110 where no heat-generating device 111 is provided.

[0037] Thus, during the process of locking the heat sink 120, the equalizing block 123 can ensure that the heat sink 120 is always parallel or approximately parallel to the circuit board 110, effectively preventing the heat sink 120 from being deformed by force, resulting in the heat conduction sheet being over-pressed or under-compressed.

[0038] Specifically, in this embodiment, each contour block 123 has a support surface (not shown) at its top end away from the heat sink 120 for contacting the circuit board 110. This support surface can be set to be a smooth plane as needed. Therefore, each contour block 123 achieves surface contact with the circuit board 110, and the larger contact area can better distribute pressure, thereby preventing damage to the circuit board 110.

[0039] Furthermore, in this embodiment, the heat sink 120 is provided with three equal-height blocks 123 on the side facing the circuit board 110, and the three equal-height blocks 123 are arranged in a triangle. This arrangement can ensure a reliable support effect for the heat sink 120 while minimizing the number of equal-height blocks 123.

[0040] In addition, please refer to again Figure 2 and Figure 3 In this embodiment, a heat sink 120 is provided on both sides of the circuit board 110 along its thickness direction; the electrical component 100 also includes a threaded fastener 130, which passes through one of the heat sinks 120 and the circuit board 110 in sequence and is screwed into the other heat sink 120 to clamp the circuit board 110 between the heat sinks 120 on both sides.

[0041] The threaded fastener 130 provides tension, thereby clamping the circuit board 110 between the heat sinks 120 on both sides, thus securing the heat sinks 120 to the circuit board 110. Furthermore, removing or installing the heat sinks 120 only requires turning the threaded fastener 130, facilitating operation in confined spaces. Specifically, the threaded fastener 130 can be a flat-head hex socket head cap screw with a relatively thin head.

[0042] Furthermore, in this embodiment, a countersunk hole 124 is provided on one side of the heat sink 120, and the head of the threaded fastener 130 is accommodated in the countersunk hole 124. In this way, the threaded fastener 130 does not occupy additional space in the thickness direction of the heat sink 120.

[0043] Furthermore, in this embodiment, a rivet nut 140 is provided on the heat sink 120 on the other side, and a threaded fastener 130 is screwed into the rivet nut 140. The rivet nut 140 is fixed to the heat sink 120 by riveting, and the threaded fastener 130 is screwed into the corresponding heat sink 120 through the rivet nut 140. In this way, it is not necessary to thread the heat sink 120. The rivet nut 140 is generally made of steel, which has high structural strength and is not prone to stripping or deformation, thus allowing the heat sink 120 to be disassembled and reassembled multiple times.

[0044] In the aforementioned electrical component 100, the heat generated by the heating element 111 of the circuit board 110 is first conducted to the heat sink 120 via a heat-conducting sheet, and then dissipated outwards by the heat sink 120, thus achieving heat dissipation. Since the heat sink 120 and each heating element 111 form a height compensation structure 121, ensuring that the distance between each heating element 111 and the heat sink 120 is the same, when the heat sink 120 is fixed to the circuit board 110, the heat-conducting sheet between each heating element 111 and the heat sink 120 is uniformly compressed. This avoids situations where some heat-conducting sheets are over-compressed while others are under-compressed, ensuring that each heating element 111 is in effective contact with the heat-conducting sheet. In this way, the heat generated by the heating element 111 can be smoothly conducted to the heat sink 120 through the heat-conducting sheet, thereby improving the heat dissipation efficiency of the aforementioned electrical component 100.

[0045] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0046] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An electrical appliance assembly, characterized in that, The application relates to an electric appliance assembly, which comprises a circuit board, a heat dissipation sheet and a heat conduction sheet, wherein the circuit board is provided with a plurality of heat generating devices on at least one side, the heat dissipation sheet is arranged on at least one side of the circuit board, and the heat conduction sheet is arranged between each heat generating device and the heat dissipation sheet; the side of the heat dissipation sheet facing the circuit board is provided with a height compensation structure corresponding to at least part of the heat generating devices; the height compensation structure is a protrusion or a groove, and the distance between each heat generating device and the heat dissipation sheet is the same.

2. The appliance assembly of claim 1, wherein, The side of the heat dissipation sheet away from the circuit board is provided with a heat dissipation fin.

3. The appliance assembly of claim 1, wherein, The side of the heat dissipation sheet facing the circuit board is provided with a plurality of equal-height blocks, and each equal-height block is in abutment with the circuit board.

4. The appliance assembly of claim 3, wherein, The side of the heat dissipation sheet facing the circuit board is provided with three equal-height blocks, and the three equal-height blocks are distributed in a triangular shape.

5. The appliance assembly of claim 3, wherein, The top end of each equal-height block away from the heat dissipation sheet is formed with an abutting surface for abutting with the circuit board.

6. The appliance assembly of claim 1, wherein, The orthographic projection of each heat generating device on the heat dissipation sheet is located in the range of the corresponding height compensation structure.

7. The electrical component of any one of claims 1 to 6, wherein, The circuit board is provided with a heat dissipation sheet on both sides along the thickness direction, and the circuit board and each heat dissipation sheet are arranged in parallel and spaced apart.

8. The appliance assembly of claim 7, wherein, The electric appliance assembly further comprises a threaded fastener, which passes through one heat dissipation sheet and the circuit board and is screwed with the other heat dissipation sheet, so as to clamp the circuit board between the two heat dissipation sheets.

9. The appliance assembly of claim 8, wherein, One heat dissipation sheet is provided with a countersunk hole, and the head of the threaded fastener is accommodated in the countersunk hole; the other heat dissipation sheet is provided with a press-in nut, and the threaded fastener is screwed with the press-in nut.

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