Display panel and display equipment

Abstract

The utility model discloses a display panel and a display device, the display panel comprises a substrate, the substrate is respectively provided with a luminescent device layer, a semiconductor cooling device layer and a driving circuit layer electrically connected with the luminescent device layer, the semiconductor cooling device layer is arranged between the driving circuit layer and the luminescent device layer, and the semiconductor cooling device layer is electrically connected with the driving circuit layer. The semiconductor cooling device layer comprises a plurality of cooling units, each cooling unit comprises a heat absorption end and a heat release end, and the heat absorption ends are arranged close to the light-emitting device layer; a heat dissipation layer and a heat conduction structure are further arranged on the substrate, the heat dissipation layer is arranged on the outer side of the substrate, and the heat dissipation layer is connected with the heat release end of the semiconductor cooling device layer through the heat conduction structure. Therefore, according to the display panel provided by the utility model, the active heat dissipation capability is improved, the heat can be led out, and the influence of the heat on devices is reduced, so that the performance of the display equipment is ensured.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0002] Display devices include display panels, which typically include a substrate. Light-emitting devices and driving circuits for these devices are mounted on the substrate. Each light-emitting device generates heat when it emits light. To ensure the lifespan of the light-emitting devices and the performance of other components, this heat must be dissipated. Currently, some display panels incorporate semiconductor cooling layers to dissipate heat, which improves the panel's heat dissipation capacity to some extent. However, the heat dissipation effect is still poor, and the heat cannot be completely dissipated, still affecting the light-emitting devices and other components. Utility Model Content

[0003] To address the aforementioned shortcomings, the technical problem to be solved by this utility model is to provide a display panel and display device that utilizes a semiconductor cooling device layer to actively enhance the rapid heat dissipation capability of the substrate and can conduct heat away, thereby reducing the impact of heat on the device and ensuring the performance of the display device.

[0004] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows:

[0005] A display panel includes a substrate. A light-emitting device layer, a semiconductor cooling device layer, and a driving circuit layer electrically connected to the light-emitting device layer are respectively disposed on the substrate. The semiconductor cooling device layer is disposed between the driving circuit layer and the light-emitting device layer, and includes multiple cooling units. Each cooling unit includes a heat-absorbing end and a heat-releasing end, with the heat-absorbing end disposed close to the light-emitting device layer. A heat dissipation layer and a thermally conductive structure are also disposed on the substrate. The heat dissipation layer is disposed on the outer side of the substrate and is connected to the heat-releasing end of the semiconductor cooling device layer through the thermally conductive structure.

[0006] In a preferred embodiment, each cooling unit includes at least one Peltier device; each Peltier device includes an insulating thermally conductive portion, a first connecting electrode, a second connecting electrode, an N-type semiconductor portion, a P-type semiconductor portion, a third connecting electrode, and an insulating heat-absorbing portion; the insulating thermally conductive portion is disposed on the side of the driving circuit layer facing the light-emitting device layer; the first connecting electrode and the second connecting electrode are disposed mutually insulated on the surface of the insulating thermally conductive portion facing the light-emitting device layer; one end of the N-type semiconductor is connected to the first connecting electrode, and the other end is connected to the third connecting electrode; one end of the P-type semiconductor is connected to the second connecting electrode, and the other end is connected to the third connecting electrode; the third connecting electrode is disposed close to the light-emitting device layer relative to the first connecting electrode and the second connecting electrode; the insulating heat-absorbing portion is disposed on the surface of the third connecting electrode facing the light-emitting device layer.

[0007] In a preferred embodiment, the light-emitting device layer includes a pixel defining layer, which has a plurality of pixel openings for accommodating the light-emitting devices; each light-emitting device includes a first electrode, a light-emitting layer, and a second electrode stacked sequentially within the pixel opening; the orthographic projection of the insulating heat-absorbing portion of the Peltier device onto the substrate at least partially overlaps with the orthographic projection of the first electrode onto the substrate.

[0008] In a preferred embodiment, the insulating heat-absorbing portion of the Peltier device in each cooling unit collectively forms the heat-absorbing end; and the insulating heat-conducting portion of the Peltier device in each cooling unit collectively forms the heat-releasing end.

[0009] The preferred method is that each of the cooling units is set up independently, or at least two of the cooling units are set up in series or in parallel.

[0010] In a preferred embodiment, the light-emitting device layer includes a red light-emitting device, a green light-emitting device, and a blue light-emitting device; the semiconductor cooling device layer includes three types of cooling units, which are defined as a first cooling unit, a second cooling unit, and a third cooling unit, respectively. The first cooling unit, the second cooling unit, and the third cooling unit are arranged in parallel, or the first cooling unit, the second cooling unit, and the third cooling unit are arranged separately, or the first cooling unit and the second cooling unit are arranged in parallel, and the third cooling unit is arranged separately. The first cooling unit is used to cool the red light-emitting device, and all the Peltier devices in the first cooling unit are arranged in series. The second cooling unit is used to cool the green light-emitting device, and all the Peltier devices in the second cooling unit are arranged in series. The third cooling unit is used to cool the blue light-emitting device, and all the Peltier devices in the third cooling unit are arranged in series.

[0011] In a preferred embodiment, the heat dissipation layer covers the entire back side of the substrate, or the heat dissipation layer includes multiple heat dissipation areas connected in a mesh.

[0012] In a preferred embodiment, an insulating layer is provided between the driving circuit layer and the heat dissipation end, and the heat-conducting structure is a heat-conducting trace that penetrates the substrate, the driving circuit layer, and the insulating layer.

[0013] A display device, comprising the display panel described above.

[0014] The preferred embodiment is that heat dissipation holes, cooling fans and / or heat dissipation paths are respectively provided on both sides of the display panel; and / or, heat sinks, heat dissipation holes, cooling fans or air guide paths are provided at the rear of the display panel.

[0015] The beneficial effects of this utility model after adopting the above technical solution are:

[0016] The display panel and display device of this invention include a substrate on which a light-emitting device layer, a semiconductor cooling device layer, and a driving circuit layer electrically connected to the light-emitting device layer are respectively disposed. The semiconductor cooling device layer is disposed between the driving circuit layer and the light-emitting device layer, and includes multiple cooling units, each of which includes a heat-absorbing end and a heat-releasing end, with the heat-absorbing end disposed close to the light-emitting device layer. A heat dissipation layer and a heat-conducting structure are also disposed on the substrate. The heat dissipation layer is disposed on the outer side of the substrate and is connected to the heat-releasing end of the semiconductor cooling device layer through the heat-conducting structure. Therefore, by setting a semiconductor cooling device layer and placing the heat-absorbing end of the Peltier device close to the light-emitting device, the display panel of this invention improves the active and rapid heat dissipation capability of the substrate, and also conducts heat away, reducing the impact of heat on the device and ensuring the performance of the display device. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the display panel structure in this utility model;

[0018] Figure 2 This is a schematic diagram of the display panel structure in the embodiment;

[0019] Figure 3 This is a schematic diagram of the structure of a cooling unit in one of the embodiments;

[0020] Figure 4 This is a schematic diagram of the Peltier device in this utility model;

[0021] Figure 5 This is a schematic diagram of the structure when all Peltier devices are connected in series in the embodiment;

[0022] Figure 6This is a schematic diagram of the heat dissipation structure provided on both sides of the display panel of the display device in the embodiment;

[0023] Figure 7 This is a schematic diagram of a heat dissipation structure disposed at the rear of the display panel of the display device in the embodiment;

[0024] In the diagram: 1-substrate, 2-light-emitting device layer, 20-first electrode, 3-driving circuit layer, 4-semiconductor cooling device layer, 40-Peltier device, 401-first connecting electrode, 402-second connecting electrode, 400-third connecting electrode, 405-insulating heat-absorbing part, 406-insulating heat-conducting part, 41-cooling unit, 410-heat-absorbing end, 411-heat-releasing end, 5-thermal-conducting structure, 6-heat-dissipating layer, 7-insulating layer, 8-pixel defining layer, 100-display panel, 200-airflow path, 300-heat-dissipating path, R-red light-emitting device, G-green light-emitting device, B-blue light-emitting device. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0026] It should be noted that in the description of this utility model, the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the direction or positional relationship are based on the direction or positional relationship shown in the drawings. This is only for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this utility model.

[0027] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] like Figure 1 and Figure 2As shown, according to an embodiment of the first aspect of the present invention, the display panel includes a substrate 1. A light-emitting device layer 2, a driving circuit layer 3 electrically connected to the light-emitting device layer 2, and a semiconductor cooling device layer 4 are respectively disposed on the substrate 1. The semiconductor cooling device layer 4 is insulated from the light-emitting device layer 2 and the driving circuit layer 3. The light-emitting device layer 2 includes a plurality of light-emitting devices, each of which may be an OLED device or an LED device.

[0029] In this invention, the semiconductor cooling device layer 4 is disposed between the driving circuit layer 3 and the light-emitting device layer 2. The semiconductor cooling device layer 4 includes multiple cooling units 41. Each cooling unit 41 includes a heat absorption end 410 and a heat release end 411. The heat absorption end 410 is disposed close to the light-emitting device layer 2, which improves the heat dissipation capacity.

[0030] like Figure 1 and Figure 2 As shown, the substrate 1 of this utility model is further provided with a heat dissipation layer 6 and a heat conduction structure 5. The heat dissipation layer 6 is connected to the heat dissipation end 411 in the semiconductor cooling device layer 4 through the heat conduction structure 5.

[0031] like Figure 1 and Figure 2 As shown, when the display panel of this utility model is working, each light-emitting device in the light-emitting device layer 2 generates heat. The heat is absorbed by the heat-absorbing end 410 of each cooling unit 41 in the semiconductor cooling device layer 4, and then transferred to the heat dissipation layer 6 through the heat-releasing end 411 of the cooling unit 41 and the heat-conducting structure 5, so that the heat generated by the light-emitting device is discharged and finally dissipated.

[0032] As can be seen, the display panel of this utility model improves the active and rapid heat dissipation capability of the substrate 1 by setting the semiconductor cooling device layer 4, and conducts heat away by setting the heat conduction structure 5 and the heat dissipation layer 6, thereby reducing the impact of heat on the device and ensuring the performance of the device.

[0033] In addition, since the semiconductor cooling device layer 4 is located between the driving circuit layer 3 and the light-emitting device layer 2, this invention significantly improves the heat dissipation capacity of the semiconductor cooling device layer 4 without affecting the overall optical effect.

[0034] like Figure 3 As shown, in some embodiments of the present invention, each cooling unit 41 includes at least one Peltier device 40, and all Peltier devices 40 are connected in series.

[0035] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, each Peltier device 40 includes an insulating and heat-conducting part 406, a first connecting electrode 401, a second connecting electrode 402, an N-type semiconductor part, a P-type semiconductor part, a third connecting electrode 400, and an insulating and heat-absorbing part 405.

[0036] An insulating and heat-conducting part 406 is disposed on the side of the driving circuit layer 3 facing the light-emitting device layer 2;

[0037] The first connecting electrode 401 and the second connecting electrode 402 are disposed insulated from each other on the surface of the insulating and heat-conducting part 406 facing the light-emitting device layer 2.

[0038] One end of the N-type semiconductor is connected to the first connecting electrode 401, and the other end is connected to the third connecting electrode 400;

[0039] One end of the P-type semiconductor is connected to the second connecting electrode 402, and the other end is connected to the third connecting electrode 400;

[0040] The third connecting electrode 400 is disposed close to the light-emitting device layer 2 relative to the first connecting electrode 401 and the second connecting electrode 402; the insulating heat-absorbing part 405 is disposed on the surface of the third connecting electrode 400 facing the light-emitting device layer 2.

[0041] like Figure 4 As shown, in actual use, the first connecting electrode 401 is electrically connected to one end of the first connecting wire, and the other end of the first connecting wire is electrically connected to the positive terminal of the external power supply E. The second connecting electrode 402 is electrically connected to one end of the second connecting wire, and the other end of the second connecting wire is electrically connected to the negative terminal of the external power supply E. Alternatively, the external power supply E can be the power supply of the driver chip or the system power supply of the display device.

[0042] It should be noted that the smallest cooling unit 41 of the semiconductor cooling device layer 4 includes a Peltier device 40, see [link / reference]. Figure 3 and Figure 4 Under the influence of an applied electric field, current can carry heat from one end of the Peltier device 40 to the other, creating a "hot" side and a "cold" side on the Peltier device 40. When the current direction is reversed, the hot and cold ends of the Peltier device 40 switch, which is the principle of heating and cooling of the Peltier device 40. It can be understood that the Peltier device 40 transfers heat from the cold end to the hot end. During this heat transfer process, the Peltier device 40 itself needs to be supplied with current and voltage, which also generates heat.

[0043] like Figure 1 and Figure 2As shown, the light-emitting device layer 2 includes a pixel defining layer 8, which has multiple pixel openings for accommodating light-emitting devices; each light-emitting device includes a first electrode 20, a light-emitting layer, and a second electrode stacked sequentially within the pixel opening; the orthographic projection of the insulating heat-absorbing portion 405 of the Peltier device 40 onto the substrate 1 at least partially overlaps with the orthographic projection of the first electrode 20 onto the substrate 1.

[0044] like Figure 3 As shown, the insulating heat-absorbing portion 405 of the Peltier device 40 in each cooling unit 41 collectively forms the heat-absorbing end 410; the insulating heat-conducting portion 406 of the Peltier device 40 in each cooling unit 41 collectively forms the heat-releasing end 411. Since the heat-absorbing end 410 of each cooling unit 41 is located close to the light-emitting device layer 2, the insulating heat-absorbing portion 405 of each Peltier device 40 is also located close to the light-emitting device layer 2. (See [reference]). Figure 1 and Figure 2 This can be configured to face the device directly, which solves the problem of the small size and weak heat dissipation of the Peltier 40 device.

[0045] like Figure 5 As shown, in some embodiments of this utility model, the number of Peltier devices 40 in each cooling unit 41 is set according to the heat generation and heating area of ​​the light-emitting device being cooled.

[0046] For example, when the light-emitting device includes a red light-emitting device R, a green light-emitting device G, and a blue light-emitting device B, the current is different and the heat generation is different when matching the Gamma white balance according to the difference in their luminous efficiency. Different cooling units 41 with different cooling capacities, i.e. different areas, can be matched according to the heat generation and the heat-generating area. Thus, all cooling units 41 can be connected in series, i.e., using the same current, and the voltage is automatically matched.

[0047] like Figure 1 and Figure 2 As shown, in some embodiments of this utility model, the light-emitting device layer 2 of the display panel includes a red light-emitting device R, a green light-emitting device G, and a blue light-emitting device B. Based on this, the semiconductor cooling device layer 4 may include three types of cooling units, which are defined as a first cooling unit, a second cooling unit, and a third cooling unit, respectively. The first cooling unit is used to cool each red light-emitting device R, and all Peltier devices 40 in the first cooling unit are connected in series. The second cooling unit is used to cool each green light-emitting device G, and all Peltier devices 40 in the second cooling unit are connected in series. The third cooling unit is used to cool each blue light-emitting device B, and all Peltier devices 40 in the third cooling unit are connected in series.

[0048] The first, second, and third cooling units are connected in parallel, and each cooling unit can be connected in parallel via wires. Alternatively, the first, second, and third cooling units can be set up independently. The first and second cooling units can be connected in parallel, and each cooling unit can be connected in parallel via wires; the third cooling unit can be set up independently.

[0049] According to the distribution of red light-emitting device R, green light-emitting device G, and blue light-emitting device B, all first cooling units are connected in series, all second cooling units are connected in series, and all third cooling units are connected in series. Then, the three series cooling units are connected in parallel. The three series cooling units can use the same voltage but different currents.

[0050] In some embodiments of this utility model, each cooling unit is set separately, or at least two cooling units are set in series or in parallel.

[0051] When the light-emitting device in this invention is an OLED device, the OLED device with blue light-emitting device B generates more heat, while the OLED devices with red light-emitting device R and green light-emitting device G can use the same cooling unit.

[0052] When the light-emitting device in this invention is an LED device, the red light-emitting LED device generates more heat, while the green light-emitting and blue light-emitting LED devices can use the same cooling unit. In other cases, the grouping and connection control methods can be determined according to the actual device efficiency.

[0053] In some embodiments of this utility model, the semiconductor cooling device layer 4 includes a plurality of cooling units 41, and each cooling unit 41 can be arranged according to the heat generation of the light-emitting device layer 2, the substrate 1 or the driving circuit layer 3.

[0054] In this invention, the distribution of cooling units 41 can be reduced proportionally according to the cooling requirements and the heat generation of different substrates 1, or they can be used only for areas with large local heat. The heat generation of the driving chip in the driving circuit layer 3 is generally large, so a cooling module can be used alone. It can be connected in series or parallel with other cooling units 41 as needed, or it can be cooled independently. That is, the position of the cooling unit 41 can be set according to the actual heat distribution, thereby greatly improving the heat dissipation capacity.

[0055] like Figure 1 and Figure 2 As shown, in some embodiments of this utility model, the heat dissipation layer 6 covers the entire back side of the substrate 1, or the heat dissipation layer 6 includes multiple heat dissipation areas connected in a mesh. Specifically, the heat dissipation layer 6 is made of diamond, or the heat dissipation layer 6 is made of a transparent material.

[0056] In this invention, the heat dissipation layer 6 can exist independently, be connected into a mesh, or be connected across the entire surface. When considering factors such as transmittance, transparent materials can be used preferentially to increase the heat dissipation area. The heat dissipation layer 6 needs to be made of a material with high thermal conductivity. Depending on the material properties, the Peltier device 40 can be made by forming an N / P semiconductor using diamond material through ion implantation. The transparent thermally conductive film can be made using CVD to prepare a diamond film. If non-transparent conductive materials such as Cu, Ag, and Al are used, they can be made into a mesh or local pattern to increase the overall transmittance. When using diamond, it is important to ensure that the equivalent voltage difference applied to both sides of the diamond does not exceed 20V.

[0057] like Figure 1 and Figure 2 As shown, in this utility model, an insulating layer 7 is provided between the driving circuit layer 3 and the heat dissipation end 411, and the heat conduction structure 5 is a heat conduction trace that penetrates the substrate 1, the driving circuit layer 3, and the insulating layer 7.

[0058] like Figure 5 and Figure 6 As shown, according to an embodiment of the second aspect of the present invention, the display device includes the display panel of the first aspect of the present invention; the display device may be, but is not limited to, an AR headset or a VR headset, and heat dissipation holes, a cooling fan, and / or a heat dissipation path 300 are respectively provided on both sides of the display panel 100; and / or; a heat sink, heat dissipation holes, a cooling fan, or an air guide path 200 is provided at the rear of the display panel 100. Furthermore, both the AR headset and the VR headset include a lens, and the lens is included in the display panel 100.

[0059] The display device of this utility model, after the heat is discharged through the semiconductor cooling device layer 4, can dissipate the heat in a timely manner through heat dissipation holes, cooling fans, heat dissipation path 300, air guide path 300, etc., thereby reducing the impact of heat on the device, ensuring the performance of the display device and improving the user experience.

[0060] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, improvements to the same display panel and display device made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A display panel, characterized by, The substrate is provided with a light emitting device layer, a semiconductor cooling device layer and a driving circuit layer electrically connected with the light emitting device layer; the semiconductor cooling device layer is arranged between the driving circuit layer and the light emitting device layer, and the semiconductor cooling device layer comprises a plurality of cooling units, each of which comprises a heat absorbing end and a heat releasing end, and the heat absorbing end is arranged close to the light emitting device layer; The substrate is further provided with a heat dissipation layer and a heat conduction structure, the heat dissipation layer is arranged on the outer side of the substrate, and the heat dissipation layer is connected with the heat releasing end of the semiconductor cooling device layer through the heat conduction structure.

2. The display panel of claim 1, wherein, Each of the cooling units comprises at least one Peltier device; Each of the Peltier devices comprises an insulating heat conducting part, a first connecting electrode, a second connecting electrode, an N-type semiconductor part, a P-type semiconductor part, a third connecting electrode and an insulating heat absorbing part; The insulating heat conducting part is arranged on the side of the driving circuit layer facing the light emitting device layer; The first connecting electrode and the second connecting electrode are arranged on the surface of the insulating heat conducting part facing the light emitting device layer; One end of the N-type semiconductor part is connected with the first connecting electrode, and the other end is connected with the third connecting electrode; one end of the P-type semiconductor part is connected with the second connecting electrode, and the other end is connected with the third connecting electrode; the third connecting electrode is arranged close to the light emitting device layer relative to the first connecting electrode and the second connecting electrode; and the insulating heat absorbing part is arranged on the surface of the third connecting electrode facing the light emitting device layer.

3. The display panel of claim 2, wherein, The light emitting device layer comprises a pixel defining layer, and the pixel defining layer is provided with a plurality of pixel openings for accommodating light emitting devices; Each of the light emitting devices comprises a first electrode, a light emitting layer and a second electrode arranged in sequence in the pixel opening; The insulating heat absorbing part of the Peltier device is at least partially overlapped with the first electrode in the orthographic projection of the substrate.

4. The display panel of claim 2, wherein, The insulating heat absorbing parts of the Peltier devices in each of the cooling units collectively form the heat absorbing end; and the insulating heat conducting parts of the Peltier devices in each of the cooling units collectively form the heat releasing end.

5. The display panel of claim 4, wherein, Each of the cooling units is arranged individually, or at least two of the cooling units are arranged in series or in parallel.

6. The display panel of claim 4, wherein, The light emitting device layer comprises red light emitting devices, green light emitting devices and blue light emitting devices; The semiconductor cooling device layer comprises three types of cooling units, which are defined as first cooling units, second cooling units and third cooling units respectively; the first cooling units, the second cooling units and the third cooling units are arranged in parallel, or the first cooling units, the second cooling units and the third cooling units are arranged individually, or the first cooling units and the second cooling units are arranged in parallel, and the third cooling units are arranged individually; The first cooling units are used for cooling the red light emitting devices, and all the Peltier devices in the first cooling units are arranged in series. The second cooling unit is used for cooling the green light emitting device, and all the Peltier devices in the second cooling unit are arranged in series. The third cooling unit is used for cooling the blue light emitting device, and all the Peltier devices in the third cooling unit are arranged in series.

7. The display panel of claim 4, wherein, The heat dissipation layer covers the back of the substrate, or the heat dissipation layer comprises a plurality of heat dissipation areas, and all the heat dissipation areas are connected in a mesh shape.

8. The display panel of claim 4, wherein, An insulating layer is arranged between the driving circuit layer and the heat dissipation end, and the heat conduction structure is a heat conduction trace penetrating through the substrate, the driving circuit layer and the insulating layer.

9. A display device, characterized by The display panel comprises the display panel according to any one of claims 1 to 8.

10. The display device of claim 9, wherein, Both sides of the display panel are respectively provided with heat dissipation holes, heat dissipation fans and / or heat dissipation paths; and / or; the back of the display panel is provided with heat dissipation fins, heat dissipation holes, heat dissipation fans or air guide paths.

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