IC chip packaging device

Abstract

The utility model belongs to the technical field of chip packaging devices, and particularly relates to an IC chip packaging device which comprises a chip packaging machine body, an adjusting structure is arranged on the chip packaging machine body, a supporting rod is connected to the adjusting structure, a supporting frame is rotationally connected to the supporting rod, a display screen 7 is installed on the supporting frame, and a connecting rod is rotationally connected to the supporting frame. One end of the connecting rod is rotationally connected with a baffle, the baffle abuts against the front side of the display screen 7, and a pressure applying structure is arranged on the display screen 7. According to the packaging device, the screen on the display screen 7 can be shielded and protected when the packaging device is not used, dust can be prevented from being gathered on the surface of the packaging device while the packaging device is prevented from being impacted and damaged, therefore, the surface cleanliness of the packaging device is guaranteed, and meanwhile the use safety is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to chip packaging device technical field, and specifically is IC chip packaging device. BACKGROUND

[0002] Integrated circuit chip (IC) as the core component of modern electronic system, its manufacturing process contains wafer processing, chip packaging test and other key links. In the chip packaging stage, the full-automatic packaging equipment realizes the electrical connection and physical protection of the chip and the substrate through the processes such as precise hot pressure welding and plastic encapsulation molding. In order to guarantee the packaging process quality, the existing packaging equipment is usually configured with a man-machine interface, such as a liquid crystal display screen or a touch screen, which is used to display the key process parameters such as packaging pressure, temperature curve and production rhythm in real time.

[0003] The mainstream packaging equipment in the current market adopts a fixed display screen structure, which is easy to be broken by tool collision during equipment maintenance or material handling. The screen surface of the open design will accumulate epoxy resin dust and metal debris during equipment operation, which seriously affects the display clarity. The conventional equipment is not equipped with a special cleaning mechanism, and the operator needs to stop the machine for manual wiping, which is time-consuming for single cleaning, resulting in a decrease in equipment utilization. These problems directly affect the monitoring accuracy of process parameters and may cause quality defects such as packaging bubble rate increase and solder line deviation.

[0004] Therefore, it is urgent to design an IC chip packaging device that can avoid the above problems. INVENTION CONTENTS

[0005] Therefore, the present scheme provides an IC chip packaging device, which can shield and protect the screen on the display screen when the packaging machine is not used, avoid damage caused by impact, and avoid dust accumulation on the surface, thereby ensuring the cleanliness of the surface and improving the safety of use.

[0006] The technical scheme for solving the above technical problems is as follows:

[0007] An IC chip packaging device, comprising a chip packaging machine body, an adjusting structure is arranged on the chip packaging machine body, a supporting rod is connected to the adjusting structure, a supporting frame is rotatably connected to the supporting rod, a display screen is installed on the supporting frame, a connecting rod is rotatably connected to the supporting frame, a baffle is rotatably connected to one end of the connecting rod, the baffle abuts against the front side of the display screen, and a pressing structure is arranged on the display screen.

[0008] Optionally, in an embodiment of the utility model, a sealing gasket is clamped on the baffle, and the sealing gasket abuts against the display screen.

[0009] Optionally, in an embodiment of the utility model, the adjusting structure includes connecting seat and screw rod, connecting seat is fixedly connected on the chip packaging machine body, screw rod is rotatably connected on the connecting seat, the screw rod is screwedly connected with slide, the slide is slidably connected on the connecting seat, the slide is rotatably connected with the supporting rod.

[0010] Optionally, in an embodiment of the utility model, the screw rod is fixedly connected with the rotating rod near the bottom end, the rotating rod penetrates the screw rod and is perpendicular to the screw rod.

[0011] Optionally, in an embodiment of the utility model, the pressing structure includes guide block and slide rod, two guide blocks are fixedly connected on the two sides of the display screen, the slide rod is slidably connected on the guide block, the slide rod is rotatably connected with the abutting block, the abutting block is in abutment with the baffle, the slide rod is externally sleeved with the spring.

[0012] Optionally, in an embodiment of the utility model, one end of the spring is in abutment with the slide rod, the other end of the spring is in abutment with the guide block.

[0013] Optionally, in an embodiment of the utility model, the cross section of one end of the slide rod is in " convex" character structure, the abutting block is perpendicular to the slide rod.

[0014] Optionally, in an embodiment of the utility model, the supporting frame is fixedly connected with the placing plate, the placing plate is in inclined arrangement.

[0015] The utility model discloses the beneficial effects are:

[0016] The IC chip packaging device can shield the screen on the display screen by the baffle when the chip packaging machine body is not needed, avoid the screen from being damaged by impact, improve the use safety of the display screen, when the baffle is used, the baffle and the display screen can be tightly abutted under the action of the pressing structure, avoid the dust from falling on the display screen, ensure the cleanness of the display screen, when the chip packaging machine body is needed, the connecting rod can be rotated 180 degrees, and then the baffle is rotated 180 degrees, the baffle can be turned to the back of the display screen, so that the baffle does not shield the screen on the display screen, and therefore the staff can view the content on the display screen and carry out relevant operation. ACCURACY OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments, and it should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as the limitation to the scope, and for the ordinary skilled in the art, other related drawings can also be obtained without the creative labor under the premise of the drawings.

[0018] Figure 1 It is the whole structure schematic view of the embodiment 1 of the utility model;

[0019] Figure 2 It is Figure 1 The A part enlarged schematic view shown in the figure;

[0020] Figure 3 It is the connecting structure schematic view of the baffle and the sealing gasket of the embodiment 1 of the utility model;

[0021] Figure 4 It is the connecting structure schematic view of the connecting seat and the screw rod of the embodiment 1 of the utility model;

[0022] The chip packaging machine body 1, adjusting structure 2, connecting seat 201, screw rod 202, rotating rod 203, sliding seat 204, supporting rod 3, support frame 4, connecting rod 5, baffle 6, display screen 7, pressure applying structure 8, guide block 801, sliding rod 802, block 803, spring 804, sealing gasket 9, placing plate 10 are indicated by reference numerals. DETAILED DESCRIPTION

[0023] It should be noted that the embodiments in the utility model and the features in the embodiments can be combined with each other without conflict.The technical scheme of the utility model will be further described below by combining the drawings of the embodiments of the utility model, and the utility model is not limited to the following specific embodiments.

[0024] It should be understood that the same or similar reference numerals in the drawings of the embodiments correspond to the same or similar parts.In the description of the utility model, it should be understood that if the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom" and the like indicate the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore, the terms describing the positional relationship in the drawings are only used for exemplary illustration, and cannot be understood as a limitation on the patent, for those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0025] Embodiment 1

[0026] Since the display screen of the existing packaging machine is easy to be damaged by impact and easy to accumulate dust when not in use, therefore, an IC chip packaging device is designed, and the specific scheme is as follows:

[0027] As Figures 1-4As shown in the figure, an IC chip packaging device includes a chip packaging machine body 1, the chip packaging machine body 1 is provided with an adjusting structure 2, the adjusting structure 2 is connected with a supporting rod 3, the supporting rod 3 is rotatably connected with a supporting frame 4, the supporting frame 4 is installed with a display screen 7, the supporting frame 4 is rotatably connected with a connecting rod 5, one end of the connecting rod 5 is rotatably connected with a baffle 6, the baffle 6 is in contact with the front side of the display screen 7, and the display screen 7 is provided with a pressing structure 8.

[0028] As shown in the figure, Figure 3 In the embodiment, the baffle 6 is clamped with a sealing gasket 9, the sealing gasket 9 is in contact with the display screen 7, the sealing gasket 9 can improve the sealing between the baffle 6 and the display screen 7, so as to avoid dust falling on the screen of the display screen 7, and effectively ensure the cleanliness of the display screen 7.

[0029] As shown in the figure, Figure 1 , 4 In the embodiment, the adjusting structure 2 includes a connecting seat 201 and a lead screw 202, the connecting seat 201 is fixedly connected on the chip packaging machine body 1, the connecting seat 201 can guide the movement of the sliding seat 204, so that the sliding seat 204 can only slide in the vertical direction, the lead screw 202 is rotatably connected on the connecting seat 201, the sliding seat 204 can be driven to slide on the connecting seat 201 through the lead screw 202, the sliding seat 204 is threadedly connected on the lead screw 202, the sliding seat 204 is slidably connected on the connecting seat 201, the supporting rod 3 is rotatably connected on the sliding seat 204, the display screen 7 can move together with the sliding seat 204 by rotating the lead screw 202, so as to adjust the height of the display screen 7, and facilitate the adaptation to the operators with different heights.

[0030] As shown in the figure, Figure 1 In the embodiment, the lead screw 202 is fixedly connected with a rotating rod 203 near the bottom end, since the rotating rod 203 penetrates the lead screw 202 and is perpendicular to the lead screw 202, the rotating rod 203 can be conveniently held to rotate the lead screw 202.

[0031] As shown in the figure, Figures 1-2As shown, in the embodiment, the pressing structure 8 comprises a guide block 801 and a sliding rod 802, two guide blocks 801 are fixedly connected to the two sides of the display screen 7, the sliding rod 802 can be guided to move through the guide block 801, the sliding rod 802 is slidably connected to the guide block 801, the cross section of one end of the sliding rod 802 is in a "convex" shape structure, the resisting block 803 is rotatably connected to the sliding rod 802, the resisting block 803 is perpendicular to the sliding rod 802, the resisting block 803 abuts against the baffle 6, the spring 804 is sleeved outside the sliding rod 802, one end of the spring 804 abuts against the sliding rod 802, the other end of the spring 804 abuts against the guide block 801, therefore, when the baffle 6 abuts against the display screen 7, the two resisting blocks 803 can abut against the baffle 6 under the action of the spring 804, so that the baffle 6 and the display screen 7 abut against each other, thus the front end of the display screen 7 can be sealed, so that the dust can be prevented from falling on the screen of the display screen 7.

[0032] As Figure 1 As shown, the support frame 4 is fixedly connected with a placing plate 10, so that the keyboard and the mouse can be placed on the placing plate 10, the edge of the placing plate 10 is upwardly protruded to form a frame, the keyboard and the mouse can be conveniently slid off the placing plate 10, and the placing plate 10 is inclined, so that the content on the keyboard can be conveniently observed, thereby facilitating the operation of the keyboard.

[0033] Working principle:

[0034] When the chip packaging machine body 1 is not needed to be used, the screen on the display screen 7 can be shielded and protected by the baffle 6, so that the screen is prevented from being damaged by impact, the safety in use is improved, and under the action of the spring 804, the two resisting blocks 803 abut against the baffle 6, so that the baffle 6 and the display screen 7 abut against each other, the front end of the display screen 7 is sealed, and the dust is prevented from falling on the screen of the display screen 7, so that the cleanliness of the screen of the display screen 7 is ensured.

[0035] When the chip packaging machine body 1 needs to be used, the abutting block 803 can be turned by 180 degrees, the abutting block 803 is turned by 180 degrees and will not abut against the baffle 6, then the connecting rod 5 is turned by 180 degrees, and the baffle 6 is turned by 180 degrees, at this time, the baffle 6 will move to the back of the display screen 7, so that the baffle 6 does not shield the screen on the display screen 7, and the staff can view the content on the display screen 7 and perform relevant operations, the hand-held rotating rod 203 can rotate the lead screw 202, the rotation of the lead screw 202 drives the sliding seat 204 to slide on the connecting seat 201 in a threaded manner, the movement of the sliding seat 204 drives the supporting rod 3 to move, the supporting rod 3 drives the supporting frame 4 to move, and the supporting frame 4 drives the display screen 7 to move, so that the height of the display screen 7 can be adjusted, different height staffs can view the content on the display screen 7, and the applicability of the display screen is improved, the keyboard and the mouse can be placed through the installation of the placing plate 10, the supporting rod 3 can rotate on the sliding seat 204, and the supporting frame 4 can rotate on the supporting rod 3, so that the orientation of the display screen 7 can be flexibly adjusted, and the staff can view the content on the display screen 7 at different positions.

[0036] The packaging device of the scheme is provided with the cover plate 6 that can be turned over on the display screen 7, when the packaging machine is not used, the cover plate 6 can be used to protect the display screen 7, avoid external impact and damage the display screen 7, and dustproof can be performed on the display screen 7, so that the display screen 7 is kept clean, the display screen 7 is further connected with the adjusting structure 2, the orientation of the display screen 7 can be adjusted in the horizontal direction, and the display screen 7 can be adjusted in height, so that the device can meet the needs of staffs with different heights to operate, and the operation comfort is better.

[0037] Embodiment 2

[0038] In the embodiment, the structure of the packaging device is basically the same as that of the embodiment 1, and the difference lies in that the rotating rod 203 is replaced with a servo motor on the basis of the embodiment 1, and the lifting controller is electrically connected with the servo motor, the servo motor is controlled to rotate in opposite directions through the lifting controller, and then the lifting adjustment of the display screen is realized, and the lifting controller is installed on the placing plate 10, so that the staff only needs to stand and operate the lifting controller to perform the lifting adjustment.

[0039] Obviously, the above embodiments of the utility model are only examples for clearly illustrating the utility model, and are not the limitation of the embodiments of the utility model. For ordinary skilled in the art, other different forms of changes or changes can be made on the basis of the above description. Here, all the embodiments are not exhausted. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model should be included in the protection scope of the utility model claim.

Claims

1. An IC chip packaging apparatus comprising a chip packaging machine body, characterized by: The chip packaging machine body is provided with an adjusting structure, the adjusting structure is connected with a supporting rod, the supporting rod is rotatably connected with a supporting frame, the supporting frame is provided with a display screen, the supporting frame is rotatably connected with a connecting rod, one end of the connecting rod is rotatably connected with a baffle, the baffle abuts against the front side of the display screen, and the display screen is provided with a pressing structure.

2. The IC chip packaging device of claim 1, wherein: The baffle is clamped with a sealing gasket, and the sealing gasket abuts against the display screen.

3. The IC chip packaging apparatus of claim 1, wherein: The adjusting structure comprises a connecting seat and a screw rod, the chip packaging machine body is fixedly connected with the connecting seat, the connecting seat is rotatably connected with the screw rod, the screw rod is threadedly connected with a sliding seat, the sliding seat is slidably connected to the connecting seat, and the sliding seat is rotatably connected with the supporting rod.

4. The IC chip packaging apparatus of claim 3, wherein: The screw rod is fixedly connected with a rotating rod near the bottom end, the rotating rod penetrates the screw rod and is perpendicular to the screw rod.

5. The IC chip packaging device of claim 1, wherein: The pressing structure comprises a guide block and a sliding rod, both sides of the display screen are fixedly connected with two guide blocks, the guide blocks are slidably connected with the sliding rod, the sliding rod is rotatably connected with an abutting block, the abutting block abuts against the baffle, and the outer portion of the sliding rod is provided with a spring.

6. The IC chip packaging apparatus of claim 5, wherein: One end of the spring abuts against the sliding rod, and the other end of the spring abuts against the guide block.

7. The IC chip packaging apparatus of claim 5, wherein: The cross section of one end of the sliding rod is in a "convex" structure, and the abutting block is perpendicular to the sliding rod.

8. The IC chip packaging apparatus of claim 1, wherein: The supporting frame is fixedly connected with a placing plate, and the placing plate is inclinedly arranged.

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