Chip temperature control protection structure

Abstract

The utility model discloses a chip temperature control protection structure, which relates to the technical field of chip temperature control protection and comprises a PCB (printed circuit board), the top of the PCB is fixedly connected with a chip main body, the top of the PCB is provided with a heat dissipation protection seat, the bottom of the PCB is provided with a protection seat, the top of the PCB is provided with a fixing mechanism, and the chip main body is fixedly connected with the fixing mechanism. The fixing mechanism comprises a first fixing assembly and a second fixing assembly, the first fixing assembly and the second fixing assembly are used in cooperation, the first fixing assembly comprises a rotating groove, the rotating groove is formed in the outer side of the protection base, and a two-way lead screw is rotationally connected into the rotating groove. According to the chip temperature control protection structure disclosed by the utility model, through the arrangement of the fixing mechanism, the chip main body can be protected, the chip main body is prevented from being collided and damaged during use, the normal use of the chip main body is ensured, the service life of the temperature control chip is prolonged, the structure is simple, and the practicability is stronger.

Description

Technical Field

[0001] This utility model relates to the field of chip temperature control and protection technology, and in particular to a chip temperature control and protection structure. Background Technology

[0002] A thermoelectric cooler (TEC) is made using the Peltier effect of semiconductor materials. The Peltier effect refers to the phenomenon that when direct current passes through a thermocouple composed of two semiconductor materials, one end absorbs heat while the other releases heat. Temperature control schemes based on TECs have advantages such as small size and ease of control, and are widely used in the semiconductor field.

[0003] A search revealed a photonic chip temperature control structure based on a TEC (authorization announcement number: CN 206638852 U), which "includes a temperature-controlled target photonic chip, a PCB substrate for leading out the photonic chip's thermally modulated electrode, and a heat-conducting plate. The heat-conducting plate has thermally conductive protrusions, and the photonic chip is bonded to the thermally conductive protrusions. The PCB substrate has through holes, and the photonic chip protrudes from the upper surface of the PCB substrate, with the thermally modulated electrode of the photonic chip leading out to the PCB substrate. The bottom end of the heat-conducting plate is attached to the cold end of the TEC cooling chip, and the hot end of the TEC cooling chip is attached to the upper surface of the heat sink. The side wall of the heat-conducting plate has openings extending directly below the thermally conductive protrusions, and an NTC temperature sensor is installed in the openings. This invention solves the problem of temperature drift in the thermal modulation of photonic chips by integrating the TEC and the photonic chip, and greatly improves the efficiency of thermally modulated coupling and packaging of the photonic chip. It has the advantages of small size, compact structure, high efficiency, and high integration."

[0004] Based on the aforementioned technologies, the applicant believes that the temperature control chip in the above technologies lacks a protective structure and is easily damaged by bumps during actual use, affecting the normal use of the chip. In response to the above problems, we have introduced a chip temperature control protection structure. Utility Model Content

[0005] This utility model discloses a chip temperature control protection structure, which aims to solve the technical problem that temperature control chips lack a protective structure and are easily damaged by bumps and knocks during actual use, affecting the normal use of the chip.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A chip temperature control protection structure includes a PCB board. A chip body is fixedly connected to the top of the PCB board. A heat dissipation protection seat is provided on the top of the PCB board, and a protective seat is provided at the bottom of the PCB board. A fixing mechanism is provided on the top of the PCB board. The fixing mechanism includes a first fixing component and a second fixing component, which cooperate with each other. The first fixing component includes a rotating groove, which is opened on the outside of the protective seat. A bidirectional lead screw is rotatably connected inside the rotating groove. Moving blocks are symmetrically threaded to the outside of the bidirectional lead screw. Fixing rods are fixedly connected to the outside of both moving blocks. Fixing heads are fixedly connected to the top of both fixing rods. One end of the bidirectional lead screw extends to the outside of the protective seat and is fixedly connected to a rotating wheel. C-shaped locking blocks are symmetrically fixedly connected to the outside of the heat dissipation protection seat and above the bidirectional lead screw. The C-shaped locking blocks and fixing heads cooperate with each other.

[0008] The fixed mechanism protects the chip body from damage during use, ensuring its normal operation and extending the lifespan of the temperature control chip. It has a simple structure and is highly practical.

[0009] In a preferred embodiment, the second fixing component includes an L-shaped fixing cover, which is symmetrically fixedly connected to the top of the PCB board. A fixing strip is symmetrically fixedly connected to the outer side of the heat dissipation protection base, and the fixing strip and the L-shaped fixing cover are used in conjunction with each other.

[0010] By setting up the second fixing component, the PCB board can be further fixed, making it more stable.

[0011] In a preferred embodiment, a fixing plate is fixedly connected to one side of the top of the protective base, and a slot is provided on the side of the fixing plate near the heat dissipation protection base. An insert plate is fixedly connected to one end of the PCB board, and the insert plate and the slot cooperate with each other.

[0012] By setting up inserts and slots, PCB boards can be fixed in place, preventing them from shaking.

[0013] In a preferred embodiment, the bottom of the heat dissipation protection base is provided with a placement groove, and the top of the heat dissipation protection base is fixedly connected with heat dissipation fins in a rectangular array.

[0014] The chip body can be covered by the placement slot, and the chip body can be cooled by the heat dissipation fins.

[0015] In a preferred embodiment, mounting plates are symmetrically fixedly connected to both sides of the protective base, and the mounting plates have fixing holes inside.

[0016] The protective base can be fixedly installed using the mounting plate and fixing holes.

[0017] In a preferred embodiment, the top of the protective base is provided with heat dissipation grooves at equal intervals for heat dissipation of the chip body.

[0018] The heat dissipation slots can help the PCB board dissipate heat.

[0019] The chip temperature control protection structure provided by this utility model has the following advantages:

[0020] Firstly, the fixed mechanism can protect the chip body, preventing it from being damaged by bumps during use, ensuring the normal use of the chip body, extending the service life of the temperature control chip, and making it simple in structure and highly practical.

[0021] Secondly, the chip body can be covered by the placement slot, the chip body can be cooled by the heat dissipation fins, the protective base can be fixedly installed by the mounting plate and fixing holes, and the heat dissipation slots can help the PCB board dissipate heat. Attached Figure Description

[0022] Figure 1 This is a three-dimensional schematic diagram of a chip temperature control protection structure proposed in this utility model.

[0023] Figure 2 This is a three-dimensional schematic diagram of a protective base for a chip temperature control protection structure proposed in this utility model.

[0024] Figure 3 This is a three-dimensional schematic diagram of a heat dissipation protection base for a chip temperature control protection structure proposed in this utility model.

[0025] Figure 4 This is a three-dimensional bottom view of a heat dissipation protection base for a chip temperature control protection structure proposed in this utility model.

[0026] Figure 5 This is a schematic diagram of the PCB board connection state for a chip temperature control protection structure proposed in this utility model.

[0027] In the attached diagram: 1. PCB board; 2. Chip body; 3. Heat dissipation protection base; 4. Protective base; 51. Rotating slot; 52. Two-way lead screw; 53. Moving block; 54. Fixing rod; 55. Fixing head; 56. Rotating wheel; 57. C-shaped locking block; 58. L-shaped fixing cover; 59. Fixing strip; 6. Fixing plate; 7. Slot; 8. Insertion plate; 9. Placement slot; 10. Heat dissipation fins; 11. Mounting plate; 12. Fixing hole; 13. Heat dissipation groove. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and marked in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0029] The chip temperature control protection structure disclosed in this utility model is mainly applied to chip temperature control protection scenarios.

[0030] Reference Figure 1 - Figure 5 A chip temperature control protection structure includes a PCB board 1, a chip body 2 fixedly connected to the top of the PCB board 1, a heat dissipation protection seat 3 on the top of the PCB board 1, a protective seat 4 at the bottom of the PCB board 1, and a fixing mechanism on the top of the PCB board 1. The fixing mechanism includes a first fixing component and a second fixing component, which cooperate with each other. The first fixing component includes a rotating groove 51, which is opened on the outside of the protective seat 4. A bidirectional lead screw 52 is rotatably connected inside the rotating groove 51. Moving blocks 53 are symmetrically threaded to the outside of the bidirectional lead screw 52. Fixing rods 54 are fixedly connected to the outside of both moving blocks 53. Fixing heads 55 are fixedly connected to the top of both fixing rods 54. One end of the bidirectional lead screw 52 extends to the outside of the protective seat 4 and is fixedly connected to a rotating wheel 56. A C-shaped locking block 57 is symmetrically fixedly connected to the outside of the heat dissipation protection seat 3 and above the bidirectional lead screw 52. The C-shaped locking block 57 and the fixing head 55 cooperate with each other. The second fixing component includes an L-shaped fixing cover 58, which is symmetrically fixedly connected to the top of the PCB board 1. Fixing strips 59 are symmetrically fixedly connected to the outer side of the heat dissipation protection base 3. The fixing strips 59 and the L-shaped fixing cover 58 work together. A fixing plate 6 is fixedly connected to one side of the top of the protective base 4. A slot 7 is provided on the side of the fixing plate 6 near the heat dissipation protection base 3. An insert plate 8 is fixedly connected to one end of the PCB board 1. The insert plate 8 and the slot 7 work together.

[0031] In this embodiment: the insert plate 8 of the PCB board 1 is inserted horizontally into the slot 7, the fixing strip 59 is inserted into the L-shaped fixing cover 58, and then the rotating wheel 56 is rotated. The rotation of the rotating wheel 56 drives the bidirectional lead screw 52 to rotate. The rotation of the bidirectional lead screw 52 drives the two moving blocks 53 to move closer to each other until the two fixing rods 54 drive the two fixing heads 55 to enter the interiors of the two C-shaped blocks 57 respectively. Through the fixed mechanism, the chip body 2 can be protected, avoiding damage to the chip body 2 during use, ensuring the normal use of the chip body 2, and extending the service life of the temperature control chip. The structure is simple and highly practical.

[0032] In the above technical solution, considering that the temperature control chip lacks a protective structure and is easily damaged by bumps during actual use, affecting the normal operation of the chip, the specific operation is as follows:

[0033] Reference Figure 1 - Figure 5 In a preferred embodiment, the bottom of the heat dissipation protection base 3 has a placement groove 9, and the top of the heat dissipation protection base 3 is fixedly connected with heat dissipation fins 10 in a rectangular array. Mounting plates 11 are symmetrically fixedly connected to both sides of the protection base 4, and fixing holes 12 are formed inside the mounting plates 11. Heat dissipation grooves 13 for heat dissipation of the chip body 2 are equidistantly formed on the top of the protection base 4.

[0034] In this embodiment: the chip body 2 can be covered by the placement slot 9, the chip body 2 can be cooled by the heat dissipation fins 10, the protective base 4 can be fixedly installed by the mounting plate 11 and fixing holes 12, and the heat dissipation groove 13 can help the PCB board 1 dissipate heat.

[0035] Working principle: In actual use, the operator first installs the protective seat 4 in the required position through the mounting plate 11 and fixing hole 12. Then, the insert plate 8 of PCB board 1 is inserted horizontally into the slot 7, and the fixing strip 59 is inserted into the L-shaped fixing cover 58. Then, the rotating wheel 56 is rotated, which drives the bidirectional lead screw 52 to rotate. The bidirectional lead screw 52 rotates, which drives the two moving blocks 53 to move closer to each other until the two fixing rods 54 drive the two fixing heads 55 to enter the interior of the two C-shaped blocks 57 respectively. At this time, the operator has completed the fixing work of the heat dissipation protection seat 3 protecting the chip body 2.

[0036] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. The substitutions may be replacements of some structures, devices, or method steps, or they may be complete technical solutions. Equivalent substitutions or modifications made based on the technical solution and inventive concept of this utility model should all be covered within the protection scope of this utility model.

Claims

1. A chip temperature control protection structure comprising a PCB board (1), characterized in that: The top of the PCB board (1) is fixedly connected with a chip body (2), the top of the PCB board (1) is provided with a heat dissipation protection seat (3), the bottom of the PCB board (1) is provided with a protection seat (4), the top of the PCB board (1) is provided with a fixing mechanism, the fixing mechanism comprises a first fixing assembly and a second fixing assembly, and the first fixing assembly and the second fixing assembly are used in cooperation with each other. The first fixing assembly comprises a rotating groove (51), the rotating groove (51) is formed in the outer side of the protection seat (4), the rotating groove (51) is rotatably connected with a bidirectional screw rod (52) in the inside, the outer side of the bidirectional screw rod (52) is symmetrically and screwedly connected with a moving block (53), the outer sides of the two moving blocks (53) are fixedly connected with a fixed rod (54), the top of the fixed rod (54) is fixedly connected with a fixed head (55), one end of the bidirectional screw rod (52) extends to the outer side of the protection seat (4) and is fixedly connected with a rotating wheel (56), the outer side of the heat dissipation protection seat (3) and above the bidirectional screw rod (52) are fixedly connected with a C-shaped clamping block (57) in a symmetrical mode, and the C-shaped clamping block (57) and the fixed head (55) are used in cooperation with each other.

2. The chip temperature protection structure of claim 1, wherein: The second fixing assembly comprises an L-shaped fixing cover (58), the L-shaped fixing cover (58) is fixedly connected to the top of the PCB board (1) in a symmetrical mode, the outer side of the heat dissipation protection seat (3) is fixedly connected with a fixed strip (59) in a symmetrical mode, and the fixed strip (59) and the L-shaped fixing cover (58) are used in cooperation with each other.

3. The chip temperature protection structure of claim 1, wherein: The top of the protection seat (4) is fixedly connected with a fixed plate (6), the side, close to the heat dissipation protection seat (3), of the fixed plate (6) is provided with a clamping groove (7), one end of the PCB board (1) is fixedly connected with a plug-in plate (8), and the plug-in plate (8) and the clamping groove (7) are used in cooperation with each other.

4. The chip temperature protection structure of claim 1, wherein: The bottom of the heat dissipation protection seat (3) is provided with a placing groove (9), and the top of the heat dissipation protection seat (3) is fixedly connected with heat dissipation fins (10) in a rectangular array.

5. The chip temperature protection structure of claim 1, wherein: The two sides of the protection seat (4) are fixedly connected with mounting plates (11) in a symmetrical mode, and the inside of the mounting plate (11) is provided with a fixed hole (12).

6. The chip temperature protection structure of claim 1, wherein: The top of the protection seat (4) is provided with heat dissipation grooves (13) for heat dissipation of the chip body (2) at equal intervals.

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