Spraying mechanism of silicon wafer cleaning machine

Abstract

The utility model discloses a spraying mechanism of a silicon wafer cleaning machine, which relates to the technical field of silicon wafer cleaning, and comprises a cleaning machine body, the front side of the cleaning machine body is rotatably connected with a box door through a hinge, one side of a containing box is fixedly connected with a pump body, the output end of the pump body is fixedly connected with an output pipe, and the output pipe is fixedly connected with a water inlet pipe. A pressurizing pump is mounted on the output pipe, a groove body is formed in the lower end of the mounting base, a connecting rod is arranged in the groove body, a spraying assembly is arranged at the lower end of the connecting rod, a water draining groove is formed in the inner bottom wall of the cleaning machine body, and a filter screen is fixedly connected to the inner wall of the water draining groove. And a drainage pipe is arranged on one side of the drainage tank. According to the silicon wafer cleaning device, the mounting base, the connecting rod and the spraying assembly are arranged, so that the surface of a silicon wafer can be comprehensively cleaned, the problem of dead angles in the cleaning process is avoided, it is ensured that cleaning liquid can reach each corner of the silicon wafer, and therefore the cleaning efficiency and quality are improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer cleaning technology, and in particular to a spray mechanism for a silicon wafer cleaning machine. Background Technology

[0002] As the substrate material for integrated circuits, the cleanliness of silicon wafers directly affects the performance of chips. Therefore, silicon wafer cleaning is one of the key processes in silicon wafer manufacturing.

[0003] Traditional silicon wafer cleaning methods often use spray nozzles to clean silicon wafers. However, spray nozzles are often in a fixed position during use, which may result in some areas of the silicon wafer surface not being effectively cleaned, affecting the cleaning effect. In addition, most spray nozzles have a fixed spray angle, which cannot adapt to silicon wafers of different shapes or sizes, reducing the flexibility of cleaning and making them inconvenient to use. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a spray mechanism for a silicon wafer cleaning machine. By incorporating a mounting base, connecting rod, and spray assembly, it enables comprehensive cleaning of the silicon wafer surface, avoiding dead zones during the cleaning process and ensuring that the cleaning solution reaches every corner of the silicon wafer, thereby improving cleaning efficiency and quality.

[0005] This utility model also provides a spraying mechanism for a silicon wafer cleaning machine as described above, comprising: a cleaning machine body, a door rotatably connected to the front side of the cleaning machine body via a hinge, a receiving box fixedly connected to the upper end of the cleaning machine body, a pump body fixedly connected to one side of the receiving box, an output pipe fixedly connected to the output end of the pump body, a pressure pump installed on the output pipe, a mounting base fixedly connected to the inner wall of the cleaning machine body, a groove provided at the lower end of the mounting base, a connecting rod provided inside the groove, a spraying assembly provided at the lower end of the connecting rod, a drain trough provided on the inner bottom wall of the cleaning machine body, a filter screen fixedly connected to the inner wall of the drain trough, and a drain pipe provided on one side of the drain trough;

[0006] The spray assembly includes a spray frame fixedly connected to the lower end of the connecting rod. Four grooves are provided below the spray frame. Four motors are fixedly connected to the outer wall of the spray frame. A rotating shaft is fixedly connected to the output end of each of the four motors and to one end of each of the four grooves. A spray shell is fixedly connected to the outer wall of the rotating shaft. A spray pipe is fixedly connected to the inner wall of the spray shell. A spray head is provided below the spray pipe.

[0007] According to the spray mechanism of the silicon wafer cleaning machine, the spray frame is shaped like a cross, and the four grooves are symmetrically distributed below the spray frame.

[0008] According to the spray mechanism of the silicon wafer cleaning machine, there are multiple spray heads, and the multiple spray heads are evenly distributed below the spray pipe.

[0009] According to the spray mechanism of the silicon wafer cleaning machine, the output end of the pressure pump is connected to the spray pipe via a hose.

[0010] According to the spraying mechanism of a silicon wafer cleaning machine, a second motor is fixedly connected to one side of the mounting base, and the output end of the second motor passes through the connecting rod and is fixedly connected to the connecting rod.

[0011] According to the spraying mechanism of the silicon wafer cleaning machine, a controller is provided on the front side of the cleaning machine body, and an operation button is provided on the front side of the cleaning machine body. The controller is electrically connected to motor one, motor two, pump body and pressure pump.

[0012] According to the spray mechanism of the silicon wafer cleaning machine, four bases are fixedly connected to the lower end of the cleaning machine body, and the four bases are arranged symmetrically.

[0013] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0015] Figure 1 This is a perspective view from the side of the spray mechanism of a silicon wafer cleaning machine according to the present invention.

[0016] Figure 2 This is a three-dimensional view of the internal structure of the spray mechanism of a silicon wafer cleaning machine according to the present invention.

[0017] Figure 3 This is an enlarged perspective view of the spray assembly of the spray mechanism of a silicon wafer cleaning machine according to the present invention.

[0018] Figure 4 This is a frontal view structural diagram of the spray mechanism of a silicon wafer cleaning machine according to the present invention.

[0019] Legend:

[0020] 1. Cleaning machine body; 2. Door; 3. Container box; 4. Pump body; 5. Output pipe; 6. Booster pump; 7. Mounting base; 8. Tank; 9. Connecting rod; 10. Spray assembly; 11. Drainage tank; 12. Filter screen; 13. Drain pipe; 101. Spray frame; 102. Groove; 103. Motor 1; 104. Rotating shaft; 105. Spray shell; 106. Spray pipe; 107. Spray head; 701. Motor 2; 14. Controller; 15. Operation button; 16. Base. Detailed Implementation

[0021] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0022] Reference Figure 1-4 This utility model discloses a spraying mechanism for a silicon wafer cleaning machine, comprising: a cleaning machine body 1, a door 2 rotatably connected to the front side of the cleaning machine body 1 via a hinge, a receiving box 3 fixedly connected to the upper end of the cleaning machine body 1, a pump body 4 fixedly connected to one side of the receiving box 3, an output pipe 5 fixedly connected to the output end of the pump body 4, a pressure pump 6 installed on the output pipe 5, a mounting base 7 fixedly connected to the inner wall of the cleaning machine body 1, a trough 8 provided at the lower end of the mounting base 7, a connecting rod 9 provided inside the trough 8, a spraying assembly 10 provided at the lower end of the connecting rod 9, a drain trough 11 provided on the inner bottom wall of the cleaning machine body 1, a filter screen 12 fixedly connected to the inner wall of the drain trough 11, and a drain pipe 13 provided on one side of the drain trough 11.

[0023] The spray assembly 10 includes a spray frame 101 fixedly connected to the lower end of the connecting rod 9. Four grooves 102 are provided below the spray frame 101. Four motors 103 are fixedly connected to the outer wall of the spray frame 101. A rotating shaft 104 is fixedly connected to the output end of each of the four motors 103 and to one end of each of the four grooves 102. A spray shell 105 is fixedly connected to the outer wall of the rotating shaft 104. A spray pipe 106 is fixedly connected to the inner wall of the spray shell 105. A spray head 107 is provided below the spray pipe 106. The spray assembly 10 can cover the surface of the silicon wafer.

[0024] The spray frame 101 is shaped like a cross, with four grooves 102 symmetrically distributed below it. The cross-shaped spray frame 101 raises the coverage area of ​​the spray head 107.

[0025] There are multiple spray heads 107, which are evenly distributed below the spray pipe 106. The multiple spray heads 107 facilitate the even spraying of the cleaning solution onto the silicon wafer surface.

[0026] The output end of the pressure pump 6 is connected to the spray pipe 106 via a hose. The pressure pump 6 facilitates the increase of the cleaning fluid pressure, thereby improving the cleaning effect of the silicon wafer.

[0027] A second motor 701 is fixedly connected to one side of the mounting base 7. The output end of the second motor 701 passes through the connecting rod 9 and is fixedly connected to the connecting rod 9. The second motor 701 facilitates the rotation of the connecting rod 9, thereby changing the angle of the spray frame 101.

[0028] A controller 14 is located on the front side of the cleaning machine body 1, and an operation button 15 is also located on the front side of the cleaning machine body 1. The controller 14 is electrically connected to motor 103, motor 701, pump body 4, and pressurizing pump 6. The controller 14 facilitates operation and control by the staff.

[0029] Four bases 16 are fixedly connected to the lower end of the cleaning machine body 1, and the four bases 16 are arranged symmetrically. The four bases 16 help to improve the stability of the cleaning machine body 1 during operation.

[0030] Working principle: When in use, open the door 2, place the silicon wafer to be cleaned into the cleaning machine body 1, and then close the door 2. At this time, the pump body 4 can be started to draw the cleaning solution from the container tank 3 and deliver it to the pressure pump 6 through the output pipe 5. The pressure pump 6 pressurizes the cleaning solution and delivers it to the spray pipe 106 through the hose. Then, it is evenly sprayed onto the surface of the silicon wafer from the spray head 107 for cleaning. When it is necessary to adjust the spray angle, the motor 701 can be started to drive the connecting rod 9 to move in the tank 8, thereby adjusting the angle of the spray frame 101 so that it is aligned with different areas of the silicon wafer. Secondly, the motor 103 can be started to output the rotating shaft 104 to change the angle of the spray shell 105, thereby slightly changing the spray angle of the spray head 107, so that the cleaning solution evenly covers the surface of the silicon wafer. In addition, the wastewater generated during the cleaning process flows into the drain tank 11, is filtered through the filter screen 12, and is discharged from the cleaning machine body 1 through the drain pipe 13.

[0031] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A spray mechanism for a silicon wafer cleaning machine, comprising: The utility model provides a cleaning machine body (1), its characterized in be that the front side of cleaning machine body (1) is connected with the box door (2) through the hinge rotation, the upper end of cleaning machine body (1) is fixedly connected with the containing box (3), one side of containing box (3) is fixedly connected with the pump body (4), the output of pump body (4) is fixedly connected with the output pipe (5), the upper installation of output pipe (5) is provided with the pressure pump (6), the inner wall of cleaning machine body (1) is fixedly connected with the mounting seat (7), the lower end of mounting seat (7) is provided with the groove (8), the inside of groove (8) is provided with the connecting rod (9), the lower end of connecting rod (9) is provided with the spray assembly (10), the inner bottom wall of cleaning machine body (1) is provided with the drain groove (11), the inner wall of drain groove (11) is fixedly connected with the filter screen (12), one side of drain groove (11) is provided with the drain pipe (13), The spray assembly (10) includes a spray frame (101) fixedly connected to the lower end of the connecting rod (9), four recesses (102) are arranged below the spray frame (101), four motor I (103) are fixedly connected to the outer side wall of the spray frame (101), the output end of each of the four motor I (103) is fixedly connected to a rotating shaft (104) penetrating through one end of the four recesses (102), a spray shell (105) is fixedly connected to the outer side wall of the rotating shaft (104), a spray pipe (106) is fixedly connected to the inner wall of the spray shell (105), and a spray head (107) is arranged below the spray pipe (106).

2. The spray mechanism of claim 1, wherein The spray frame (101) has a "cross" shape, and the four recesses (102) are symmetrically arranged below the spray frame (101).

3. The spray mechanism of claim 1, wherein The spray head (107) has a plurality of spray heads, and the plurality of spray heads (107) are uniformly arranged below the spray pipe (106).

4. The spray mechanism of claim 1, wherein The output end of the pressure pump (6) is connected to the spray pipe (106) through a hose.

5. The spray mechanism of claim 1, wherein One side of the mounting seat (7) is fixedly connected to a motor II (701), the output end of the motor II (701) penetrates through the connecting rod (9) and is fixedly connected to the connecting rod (9).

6. The spray mechanism of claim 1, wherein The front side of the cleaning machine body (1) is provided with a controller (14), and the front side of the cleaning machine body (1) is provided with an operation button (15); the controller (14) is electrically connected to the motor I (103), the motor II (701), the pump body (4), and the pressure pump (6).

7. The spray mechanism of claim 1, wherein The lower end of the cleaning machine body (1) is fixedly connected to four bases (16), and the four bases (16) are symmetrically arranged.

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