Vacuum environment cleaning system
By using a low-temperature device and a negative pressure module in the vacuum environment cleaning system to automatically clean dust, the problem of dust accumulation in vacuum processing is solved, achieving automated cleaning and stable vacuum, thereby improving processing accuracy and product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-24
- Publication Date
- 2026-03-13
AI Technical Summary
During vacuum processing, dust accumulates in the vacuum environment, affecting the precision of processing equipment and product quality. Traditional manual cleaning methods are time-consuming and may introduce secondary pollution.
The vacuum environment cleaning system includes a first negative pressure module and a second negative pressure module. It utilizes a cryogenic device connected to a vacuum chamber to automatically clean dust through condensation and air extraction. Combined with gas dilution and a heater to accelerate gas vaporization, it achieves automated cleaning.
It achieves automated cleaning of the vacuum environment, reduces manual intervention, avoids secondary pollution, maintains stable vacuum levels, and improves processing accuracy and product quality.
Smart Images
Figure CN223988875U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of vacuum processing technology, and more specifically, it relates to a vacuum environment cleaning system. Background Technology
[0002] During vacuum processing, fine dust is often generated. If this dust accumulates in the vacuum environment, it will affect the processing accuracy of the equipment and the quality of the finished product. The traditional approach is to stop the equipment after running for a period of time to break the vacuum environment in the cavity and perform manual cleaning. This method not only requires a lot of manual work time, but also may introduce secondary contamination into the cavity. Utility Model Content
[0003] The present invention provides a vacuum environment cleaning system that can automatically clean dust in a vacuum environment.
[0004] The technical solution adopted in this utility model is a vacuum environment cleaning system, including:
[0005] Vacuum cavity;
[0006] At least one first negative pressure module, the first negative pressure module including a cryogenic device and a first valve, the cryogenic device being in communication with the vacuum chamber, and the first valve being disposed between the cryogenic device and the vacuum chamber;
[0007] The second negative pressure module is connected to the cryogenic device and is used to remove dust from the cryogenic device.
[0008] In other words, the vacuum environment cleaning system of this application is equipped with a first negative pressure module and a second negative pressure module. The cryogenic device of the first negative pressure module is connected to the vacuum chamber, and a first valve is provided between the cryogenic device and the vacuum chamber for on / off switching. The second negative pressure module is connected to the cryogenic device. During dust removal, the first valve is opened, the cryogenic device works to cool, and the gas pressure at the cryogenic device decreases. The gas carrying dust in the vacuum chamber can flow to the cryogenic device in the low-pressure environment and be condensed by the cryogenic device, fixing the gas carrying dust at the cryogenic device. When the condensed gas molecules are saturated on the cold surface of the cryogenic device, the first valve can be closed. After the condensed gas molecules in the cryogenic device vaporize, the second negative pressure module works to extract the gas carrying dust from the cryogenic device, thus completing the cleaning of the vacuum environment.
[0009] Optionally, the first negative pressure module further includes a first gas pipe and a second valve. The first gas pipe is connected to the cryogenic device and is used to introduce gas into the cryogenic device. The first gas pipe is also provided with the second valve, and the gas is N2 gas.
[0010] Optionally, the first negative pressure module further includes a heater connected to the cryogenic device for heating the cryogenic device.
[0011] Optionally, the first negative pressure module further includes a second air pipe and a third valve, wherein the second air pipe is connected to the cryogenic device and the second air pipe is also provided with a third valve.
[0012] Optionally, the first negative pressure module further includes a one-way valve, which is disposed on the second air pipe.
[0013] Optionally, the first negative pressure module further includes a pressure detection structure, which is disposed between the second negative pressure module and the cryogenic device.
[0014] Optionally, the second negative pressure module includes a dry pump, a first pipeline, a second pipeline, a fourth valve, and a fifth valve;
[0015] The dry pump and the cryogenic device are connected through the first pipeline. The pressure detection structure and the fourth valve are disposed in the first pipeline. The pressure detection structure is located between the fourth valve and the cryogenic device.
[0016] The dry pump is connected to the vacuum chamber via the second pipe, and the fifth valve is installed on the second pipe;
[0017] The second negative pressure module also includes a third pipe and a sixth valve. The third pipe is connected in parallel to the second pipe, and the sixth valve is disposed on the third pipe, wherein the diameter of the sixth valve is smaller than the diameter of the fifth valve.
[0018] Optionally, the second negative pressure module further includes a fourth pipe, through which the dry pump is connected to the first pipe and the second pipe respectively; and
[0019] One or more of the first, second, third, and fourth pipes are provided with corrugated pipes.
[0020] Optionally, the first negative pressure module further includes an air regulating valve, which is disposed on the first air pipe and is used to regulate the amount of air entering the cryogenic device through the first air pipe.
[0021] Optionally, it also includes a temperature detector, which is disposed on the cryogenic device and used to detect the temperature of the cryogenic device. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 A schematic diagram of the structure of the vacuum environment cleaning system provided for implementation of this utility model;
[0024] Figure 2 A schematic diagram of the structure of the first negative pressure module in the vacuum environment cleaning system provided by this utility model.
[0025] Figure label:
[0026] 100. Vacuum cavity;
[0027] 200, First negative pressure diaphragm assembly; 210, Cryogenic device; 220, Exhaust pipe; 230, First air pipe; 240, Second air pipe; 250a, First valve; 250b, Second valve; 250c, Third valve; 260, Check valve; 270a, SM digital pressure gauge; 270b, Pirani gauge; 280, Air regulating valve;
[0028] 300, Second negative pressure membrane assembly; 310, Dry pump; 320, First pipeline; 330, Second pipeline; 340, Fourth valve; 350, Fifth valve; 360, Third pipeline; 370, Sixth valve; 380, Fourth pipeline. Specific Implementation
[0029] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0030] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0031] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the vacuum environment cleaning system or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In some descriptions of utility models, "a plurality of" means two or more, unless otherwise explicitly specified.
[0033] This application provides a vacuum environment cleaning system that can automatically remove dust from a vacuum chamber.
[0034] See Figure 1 A vacuum environment cleaning system includes a vacuum chamber 100, at least one first negative pressure module, and a second negative pressure module. The vacuum chamber 100 provides a vacuum environment suitable for product processing. The first negative pressure module is connected to the vacuum chamber 100 and evacuates the chamber, causing gas to flow from the chamber towards it. This gas carries dust to the first negative pressure module, thus removing dust from the chamber. The second negative pressure module is connected to the first negative pressure module and removes gas from the first negative pressure module, thereby removing dust from the first negative pressure module.
[0035] It should be noted that in a non-absolute vacuum environment, gases such as air may still be present.
[0036] Further, see Figure 2 The first negative pressure module may include a cryogenic device 210 and a first valve 250a. The cryogenic device 210 is connected to the vacuum chamber 100. The first valve 250a is disposed between the cryogenic device 210 and the vacuum chamber 100. The first valve 250a is used to open or close the channel between the cryogenic device 210 and the vacuum chamber 100.
[0037] Specifically, after opening the first valve 250a to connect the cryogenic device 210 with the vacuum chamber 100, the cryogenic device 210 operates for cooling, and the gas pressure at the cryogenic device 210 decreases. The gas carrying dust in the vacuum chamber 100 can then flow to the cryogenic device 210, which is in a low-pressure environment. The gas molecules are condensed at low temperature under the action of the cryogenic device 210, thus removing dust from the vacuum chamber 100. When the condensed gas molecules are saturated on the cold surface of the cryogenic device 210, the first valve 250a can be closed. After the condensed gas molecules in the cryogenic device 210 vaporize (for example, after the cryogenic device 210 stops working, the temperature at the cryogenic device 210 rises, and the condensed gas molecules begin to vaporize), the second negative pressure module can be activated to extract the gas from the cryogenic device 210, thereby cleaning the vacuum environment.
[0038] In other words, the vacuum environment cleaning system of this application is provided with a first negative pressure module and a second negative pressure module. The cryogenic device 210 of the first negative pressure module is connected to the vacuum chamber 100, and a first valve 250a is provided between the cryogenic device 210 and the vacuum chamber 100 for opening and closing. The second negative pressure module is connected to the cryogenic device 210. During dust removal, the first valve 250a is opened, and the cryogenic device 210 works to cool down. The air pressure at the cryogenic device 210 decreases, and the gas carrying dust in the vacuum chamber 100 can flow to the cryogenic device 210 in the low-pressure environment and be condensed by the cryogenic device 210, fixing the gas carrying dust at the cryogenic device 210. When the condensed gas molecules are saturated on the cold surface of the cryogenic device 210, the first valve 250a can be closed. After the condensed gas molecules in the cryogenic device 210 vaporize, the second negative pressure module works to extract the gas carrying dust from the cryogenic device 210, thus completing the cleaning of the vacuum environment.
[0039] In addition, in some embodiments, the vacuum chamber 100 cannot always maintain a constant vacuum level, that is, the vacuum chamber 100 cannot guarantee an absolute seal, so there may be slight gas leakage. Therefore, when the cryogenic device 210 is working, the gas in the vacuum chamber 100 will continuously flow to the cryogenic device 210, so that the vacuum environment in the vacuum chamber 100 can always be maintained at a predetermined vacuum level, such as 5E-5pa vacuum.
[0040] Furthermore, in one embodiment, the cryogenic device 210 and the vacuum chamber 100 can be connected via an exhaust pipe 220, and a first valve 250a can be installed on the exhaust pipe 220. The first valve 250a can be a swing valve.
[0041] In some embodiments, the cryogenic device 210 may be a cryogenic pump.
[0042] See Figure 1In one embodiment, multiple sets of first negative pressure modules can be provided, and the low temperature device 210 of each set of first negative pressure modules is connected to the vacuum chamber 100, thereby improving the efficiency of cleaning dust in the vacuum chamber 100.
[0043] See Figure 2 The first negative pressure module may also include a first air pipe 230 and a second valve 250b. The first air pipe 230 is connected to the cryogenic device 210 and is used to introduce gas into the cryogenic device 210. The first air pipe 230 is also provided with a second valve 250b.
[0044] Specifically, once the condensed gas molecules are saturated on the cold surface of the cryogenic device 210, gas can be introduced into the cryogenic device 210 by opening the second valve 250b. This causes the temperature of the cryogenic device 210 to rise rapidly, increasing the vaporization rate of the condensed gas molecules and raising the gas pressure at the cryogenic device 210. This facilitates the second negative pressure module in removing the gas from the cryogenic device 210. The gas introduced through the first gas pipe 230 can be nitrogen (N2). N2 can dilute harmful gases and also prevent corrosive gases from corroding the device and pipes.
[0045] In addition, in some embodiments, in order to further increase the rate of temperature rise at the cryogenic device 210, the first negative pressure module may also include a heater (not shown in the figure), which is connected to the cryogenic device 210 and used to heat the cryogenic device 210.
[0046] Specifically, after the first valve 250a is closed and the cryogenic device 210 stops working, the heater can heat the cryogenic device 210, accelerating the temperature rise inside the cryogenic device 210, allowing the condensed gas to vaporize rapidly. In particular, in some embodiments, the heater, in conjunction with the gas introduced through the first gas pipe 230, can achieve rapid heating, thereby improving the efficiency of condensed gas vaporization. The heater can be a heating element, which can be attached to the heater.
[0047] See Figure 2 The first negative pressure module may also include a second air pipe 240 and a third valve 250c. The second air pipe 240 is connected to the cryogenic device 210, and the second air pipe 240 is also equipped with a third valve 250c.
[0048] Specifically, when the second valve 250b is opened to allow gas to flow into the cryogenic device 210 through the first gas pipe 230, the third valve 250c can be opened simultaneously, allowing the gas flowing into the cryogenic device 210 to exit through the second gas pipe 240. This prevents excessive pressure at the cryogenic device 210 from damaging it. In other words, gas flows out from the second gas pipe 240 simultaneously with the gas flowing into the first gas pipe 230, thus balancing the pressure at the cryogenic device 210. Once the condensed gas molecules at the cryogenic device 210 have vaporized, the second valve 250b and the third valve 250c can be closed, and the second negative pressure module can then operate to evacuate the cryogenic device 210.
[0049] For example, in one embodiment, the first negative pressure module may further include a temperature detector (not shown in the figure), which is disposed on the cryogenic device 210 and used to detect the temperature of the cryogenic device 210. It is understood that when the temperature detector detects that the temperature of the cryogenic device 210 has risen to a predetermined temperature, it can be determined that the condensed gas molecules have been vaporized. At this time, the second valve 250b and the third valve 250c can be closed, and the second negative pressure module can be started to work.
[0050] Furthermore, the first negative pressure module may also include a one-way valve 260, which is disposed on the second gas pipe 240. It is understood that the one-way valve 260 can prevent external gas from entering the cryogenic device 210 through the second gas pipe 240.
[0051] See Figure 2 The first negative pressure module may also include a pressure detection structure, which is disposed between the second negative pressure module and the cryogenic device 210. It is understood that since the cryogenic device 210 and the second negative pressure module are connected, by setting a pressure detection structure between the cryogenic device 210 and the second negative pressure module, the amount of gas supplied to the cryogenic device 210 through the first gas pipe 230, the current pressure of the cryogenic device 210, and the vacuum or pressure of the cryogenic device 210 during operation of the second negative pressure module can be detected, so as to determine whether to shut down the second negative pressure module.
[0052] Specifically, in one embodiment, the pressure detection structure may include an SM digital display pressure gauge 270a, which is disposed between the second negative pressure module and the cryogenic device 210. The SM digital display pressure gauge 270a can detect the amount of gas filled into the first gas tube 230 and the current pressure of the cryogenic device 210 under normal pressure.
[0053] In one embodiment, the pressure detection structure may further include a Pirani gauge 270b, which may also be disposed between the second negative pressure module and the cryogenic device 210. When the second negative pressure module evacuates the cryogenic device 210, the Pirani gauge 270b can detect the current vacuum level of the cryogenic device 210, so as to accurately determine the timing for shutting down the second negative pressure module.
[0054] See Figure 1 The second negative pressure module may include a dry pump 310, a first pipe 320, a second pipe 330, a fourth valve 340, and a fifth valve 350.
[0055] The dry pump 310 and the cryogenic device 210 are connected via a first pipe 320. A pressure detection structure and a fourth valve 340 are mounted on the first pipe 320, with the pressure detection structure located between the fourth valve 340 and the cryogenic device 210. Specifically, when the dry pump 310 is not pumping air into the cryogenic device 210, the fourth valve 340 can be closed. After the fourth valve 340 is closed, the pressure detection structure can detect the pressure and vacuum level within the cryogenic device 210 by monitoring the first pipe 320.
[0056] The dry pump 310 is connected to the vacuum chamber 100 via a second pipe 330, and a fifth valve 350 is installed on the second pipe 330. Specifically, in one embodiment, by opening the fifth valve 350, the dry pump 310 can evacuate the vacuum chamber 100 to a vacuum environment through the second pipe 330. Once the vacuum chamber 100 is in a vacuum environment, the fifth valve 350 can be closed, and the vacuum environment within the vacuum chamber 100 can be maintained subsequently by the cryogenic device 210. In other words, in the above method, both the dry pump 310 can evacuate the vacuum chamber 100 to a vacuum environment, and the gas carrying dust in the cryogenic device 210 can be removed.
[0057] Furthermore, the second negative pressure module may also include a third pipe 360 and a sixth valve 370. The third pipe 360 is connected in parallel to the second pipe 330, and the sixth valve 370 is disposed on the third pipe 360. The diameter of the sixth valve 370 is smaller than the diameter of the fifth valve 350.
[0058] Specifically, in one embodiment, when the dry pump 310 is used to evacuate the vacuum chamber, there is a lot of gas in the vacuum chamber 100 in the initial stage. At this time, the sixth valve 370 can be opened first, so that the dry pump 310 can evacuate the vacuum chamber 100 through the sixth valve 370 with a smaller diameter. After the dry pump 310 reduces the pressure of the vacuum chamber 100 by evacuating through the sixth valve 370, the sixth valve 370 can be closed. Then, the fifth valve 350 can be opened, so that the dry pump 310 can evacuate the vacuum chamber 100 through the sixth valve 370 with a larger diameter.
[0059] Understandably, since there is a large amount of gas in the vacuum chamber 100 in the initial stage, if several pumps 310 directly use the larger-diameter fifth valve 350 to evacuate the vacuum chamber 100, the dry pumps 310 will be subjected to a large influx of gas instantaneously when the fifth valve 350 is opened, which may lead to overload or damage. Therefore, in the above embodiment, staged evacuation is adopted. First, the smaller-diameter sixth valve 370 is used to allow the dry pumps 310 to gradually adapt to the load. After the sixth valve 370 is closed, the fifth valve 350 is opened to avoid instantaneous overload. In this way, overload of the dry pumps 310 is prevented, and the efficiency of the dry pumps 310 in evacuating the vacuum chamber 100 is improved.
[0060] Furthermore, the second negative pressure module may also include a fourth pipe 380, through which the dry pump 310 is connected to the first pipe 320 and the second pipe 330 respectively. It can be understood that the connection of the dry pump 310 to the first pipe 320 and the second pipe 330 respectively through the fourth pipe 380 facilitates the simultaneous connection of the dry pump 310 to both the first pipe 320 and the second pipe 330.
[0061] Furthermore, one or more of the first pipe 320, the second pipe 330, the third pipe 360, and the fourth pipe 380 may be equipped with corrugated pipes. It is understood that using corrugated pipes can effectively reduce noise.
[0062] Furthermore, in one embodiment, see [reference] Figure 1 The first negative pressure module may also include an air regulating valve 280, which is disposed on the first air pipe 230 and is used to regulate the amount of air supplied to the low-temperature device 210 through the first air pipe 230.
[0063] It is understandable that adjusting the amount of gas introduced into the cryogenic device 210 through the regulating valve can prevent excessive gas pressure from damaging the cryogenic device 210, and can also adjust the rate of heating inside the cryogenic device 210.
[0064] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of some utility models should be included within the protection scope of some utility models.
Claims
1. A vacuum environment cleaning system, characterized by, The application relates to a vacuum chamber, at least one first negative pressure module, a second negative pressure module, a temperature detector and a temperature controller. The first negative pressure module comprises a low-temperature device and a first valve, the low-temperature device is communicated with the vacuum chamber, and the first valve is arranged between the low-temperature device and the vacuum chamber. The second negative pressure module is communicated with the low-temperature device and is used for pumping away dust on the low-temperature device. The first negative pressure module further comprises a first gas pipe and a second valve, the first gas pipe is communicated with the low-temperature device and is used for introducing gas into the low-temperature device, and the first gas pipe is provided with the second valve.
2. The vacuum environment cleaning system of claim 1, wherein, The first negative pressure module further comprises a heater, the heater is connected with the low-temperature device and is used for heating the low-temperature device.
3. The vacuum environment cleaning system of claim 2, wherein, The first negative pressure module further comprises a second gas pipe and a third valve, the second gas pipe is communicated with the low-temperature device, and the second gas pipe is provided with the third valve.
4. The vacuum environment cleaning system of claim 2, wherein, The first negative pressure module further comprises a one-way valve, the one-way valve is arranged on the second gas pipe.
5. The vacuum environment cleaning system of claim 4, wherein, The first negative pressure module further comprises a gas pressure detection structure, the gas pressure detection structure is arranged between the second negative pressure module and the low-temperature device.
6. The vacuum environment cleaning system of any one of claims 1 to 5, wherein, The second negative pressure module comprises a dry pump, a first pipeline, a second pipeline, a fourth valve and a fifth valve.
7. The vacuum environment cleaning system of claim 6, wherein, The dry pump is communicated with the low-temperature device through the first pipeline, the gas pressure detection structure and the fourth valve are arranged on the first pipeline, and the gas pressure detection structure is located between the fourth valve and the low-temperature device. The dry pump is communicated with the vacuum chamber through the second pipeline, and the fifth valve is arranged on the second pipeline. The second negative pressure module further comprises a third pipeline and a sixth valve, the third pipeline is connected in parallel with the second pipeline, and the sixth valve is arranged on the third pipeline, wherein the diameter of the sixth valve is smaller than that of the fifth valve. The second negative pressure module further comprises a fourth pipeline, the dry pump is communicated with the first pipeline and the second pipeline through the fourth pipeline; and 8. The vacuum environment cleaning system of claim 7, wherein, One or more of the first pipeline, the second pipeline, the third pipeline and the fourth pipeline are provided with a bellows. The first negative pressure module further comprises a gas regulating valve, the gas regulating valve is arranged on the first gas pipe and is used for regulating the gas amount introduced into the low-temperature device by the first gas pipe.
9. The vacuum environment cleaning system of claim 2, wherein, The application further comprises a temperature detector, the temperature detector is arranged on the low-temperature device and is used for detecting the temperature of the low-temperature device.
10. The vacuum environment cleaning system of any one of claims 1 to 5, wherein, The application further comprises a temperature controller, the temperature controller is connected with the temperature detector and the first negative pressure module and is used for controlling the temperature of the low-temperature device.