Welding mechanism of semiconductor device

Abstract

The utility model relates to the technical field of welding mechanisms, and discloses a welding mechanism of a semiconductor device, which comprises a support frame, a conveying mechanism is connected inside the support frame, two sides of the middle part of the support frame are fixedly connected with heightening plates, the upper ends of the two heightening plates are simultaneously connected with a welding mechanism, and the welding mechanism is positioned above the middle part of the conveying mechanism. A plurality of supporting assemblies are connected to the upper surface of the conveying mechanism, extension assemblies are connected to the lower ends of the adjacent sides of the two heightening plates, and limiting assemblies are connected to the ends, close to each other, of the two extension assemblies. According to the welding mechanism for the semiconductor device, when the semiconductor device needs to be welded, the semiconductor device only needs to be placed in the supporting assembly to be pre-positioned, and then the semiconductor device and the supporting assembly can be automatically limited by the two limiting assemblies when moving to the position below the welding mechanism along with the conveying mechanism; and therefore, the steps of fixing by using a clamp and disassembling the clamp after welding can be omitted, convenience and rapidness are achieved, and efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of welding mechanism technology, specifically a welding mechanism for semiconductor devices. Background Technology

[0002] Semiconductor devices are electronic components made using the electrical properties of semiconductor materials (such as silicon and germanium). These devices play a crucial role in modern electronics because they can control the flow of current and amplify signals or switch current. Semiconductor devices are widely used in computers, communication equipment, consumer electronics, medical devices, automotive electronics, and many other fields.

[0003] To achieve electrical connections and mechanical fixation, and to ensure that devices can function properly and be integrated into larger circuit systems, semiconductor devices are often soldered using soldering mechanisms.

[0004] Currently, most semiconductor device welding mechanisms only have workpiece clamping and welding functions. However, in the semiconductor device production process, there are many semiconductor devices in the same batch. This means that before welding, the device needs to be installed in the fixture and then fixed. After welding, the device needs to be removed from the fixture and then clamped and fixed for the next device to be welded. The whole process is cumbersome and reduces welding efficiency. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a semiconductor device welding mechanism that can assemble other semiconductor devices while processing and welding one semiconductor device, and automatically fix them during welding.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a welding mechanism for a semiconductor device, comprising a support frame, a conveying mechanism connected inside the support frame, two raised plates fixedly connected to both sides of the middle of the support frame, a welding mechanism simultaneously connected to the upper ends of the two raised plates, the welding mechanism being located above the middle of the conveying mechanism, a plurality of support components connected to the upper surface of the conveying mechanism, an extension component connected to the lower ends of the adjacent sides of the two raised plates, a limit component connected to the near ends of the two extension components, the two limit components being located on both sides of the plurality of support components, and the support components being located below the welding mechanism.

[0007] Furthermore, the welding mechanism includes a first moving mechanism, a second moving mechanism, an electric actuator, and a welding head. The outer wall of the first moving mechanism is connected to the upper ends of the two raised plates. The output end of the first moving mechanism is connected to the outer wall of the second moving mechanism. The output end of the second moving mechanism is connected to the outer wall of the electric actuator. The output end of the electric actuator is fixedly connected to the upper end of the welding head. The lower end of the welding head faces the support assembly and the conveying mechanism.

[0008] Furthermore, both the No. 1 moving mechanism and the No. 2 moving mechanism include a support plate, a transmission motor, a lead screw, and a slider. The two ends of the No. 1 support plate are fixedly connected to the upper ends of the two raised plates, respectively. The No. 1 transmission motor is fixedly connected to one side of the No. 1 support plate. The output shaft of the No. 1 transmission motor is fixedly connected to one end of the No. 1 lead screw. The other end of the No. 1 lead screw passes through the interior of the No. 1 support plate and is threadedly connected to the No. 1 slider. The outer walls of both ends of the No. 1 lead screw are rotatably connected to the inner wall of the penetration point of the No. 1 support plate.

[0009] The bottom surface of slider number one is fixedly connected to the middle of the upper surface of support plate number two. One end of support plate number two is fixedly connected to the outer wall of drive motor number two. The output shaft of drive motor number two is fixedly connected to one end of lead screw number two. The other end of lead screw number two passes through the interior of support plate number two and is threadedly connected to the inner wall of slider number two. The outer walls of both ends of lead screw number two are rotatably connected to the inner wall of support plate number two through the passage. The bottom surface of slider number two is fixedly connected to the outer wall of electric push rod.

[0010] Furthermore, the conveying mechanism includes a conveying motor, a conveyor belt, and two conveying rollers. The outer wall of the conveying motor is fixedly connected to the side wall of one end of the support frame. The output shaft of the conveying motor is fixedly connected to one end of one of the conveying rollers. The two conveying rollers are arranged in parallel and are located at both ends of the support frame. The outer walls of both ends of the two conveying rollers are rotatably connected to the inner wall of the support frame. The conveyor belt is sleeved on the outer walls of the two conveying rollers. Several support components are connected to the upper surface of the conveyor belt.

[0011] Furthermore, the support assembly includes a placement plate, a top block, two side plates, four moving strips, four screws, and four nuts. The bottom surface of the placement plate is fixedly connected to the upper surface of the conveyor belt. The four corners of the upper surface of the placement plate are fixedly connected to the lower ends of the four screws respectively. The four moving strips are respectively sleeved and slidably connected to the outer walls of the four screws, and the four moving strips are respectively fastened to the four screws by the four nuts. The four moving strips are arranged in pairs, and the two pairs of moving strips are fixedly connected to one side of the two side plates respectively. The bottom surface of the top block is fixedly connected to the upper surface of one end of the placement plate. The top block is perpendicular to the two moving strips, and the two limiting components are respectively connected to the two moving strips.

[0012] Furthermore, the extension assembly includes several extension plates, one end of which is fixedly connected to the side wall of the lower end of the pad plate, and the other end of which is connected to the limiting assembly.

[0013] Furthermore, the limiting component includes a movable plate, a back plate, two wedge blocks, several pressure components, and several adaptive components. One side of the back plate is fixedly connected to the end of several extension plates away from the raised plate, and the other end of the back plate is connected to several pressure components. Several sliding openings are provided through the surface of the movable plate, and the other ends of several pressure components are respectively connected through several sliding openings. The upper end of the back plate is connected to the lower end of several adaptive components, and the other ends of several adaptive components are all connected to the upper end of the movable plate. The two wedge blocks are fixedly connected to both ends of the movable plate, and the inclined surfaces of the two wedge blocks abut against the side plates.

[0014] Furthermore, the pressure assembly includes a lifting rod and a pressure roller. One end of the lifting rod is fixedly connected to the side of the back plate away from the extension plate, and the other end of the lifting rod passes through the sliding opening and is rotatably connected to the middle of the pressure roller. The surface of the pressure roller abuts against the upper surface of the placement plate.

[0015] Furthermore, the adaptive component includes a spring and two connecting blocks, with the two ends of the spring fixedly connected to the adjacent side of the two connecting blocks, and one end of each connecting block fixedly connected to the moving plate and the back plate, respectively.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The welding mechanism for this type of semiconductor device is designed by setting a welding mechanism on a support frame and a conveying mechanism inside the support frame. The conveying mechanism connects the support component and the limiting component. When the semiconductor device needs to be welded, the semiconductor device only needs to be placed inside the support component for pre-positioning. Then, when the semiconductor device and the support component move to the bottom of the welding mechanism with the conveying mechanism, they can be automatically limited by the two limiting components. This eliminates the need for the steps of using clamps for fixing and disassembling the clamps after welding, making it convenient, quick, and efficient. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall appearance of the present utility model;

[0019] Figure 2 This utility model Figure 1 Enlarged view of point A in the middle;

[0020] Figure 3 This utility model Figure 1 A schematic diagram of the overall appearance after removing the support frame and conveying mechanism;

[0021] Figure 4 This utility model Figure 3 A schematic diagram of the overall appearance after removing the welding mechanism;

[0022] Figure 5 This is an exploded view of the welding mechanism of this utility model;

[0023] Figure 6 This is an exploded view of the extension component and the limiting component of this utility model.

[0024] In the diagram: 1. Support frame; 2. Conveyor motor; 3. Conveyor roller; 4. Conveyor belt; 5. Elevation plate; 6. First moving mechanism; 7. Second moving mechanism; 8. Placement plate; 9. Side plate; 10. Moving bar; 11. Top block; 12. Moving plate; 13. Pressure roller; 14. Wedge block; 15. Screw; 16. Electric actuator; 17. Welding head; 18. Extension plate; 19. Connecting block; 20. Spring; 21. Slide; 22. Lifting rod; 23. Back plate. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0026] Please see Figures 1-6 A welding mechanism for a semiconductor device includes a support frame 1. A conveying mechanism is connected inside the support frame 1. Elevating plates 5 are fixedly connected to both sides of the middle part of the support frame 1. The upper ends of the two elevating plates 5 are simultaneously connected to the welding mechanism. The welding mechanism is located above the middle part of the conveying mechanism. A plurality of support components are connected to the upper surface of the conveying mechanism. An extension component is connected to the lower end of the adjacent side of the two elevating plates 5. A limit component is connected to the close end of the two extension components. The two limit components are located on both sides of the plurality of support components. The support components are located below the welding mechanism.

[0027] like Figures 1 to 6 As shown, the semiconductor device welding mechanism of this utility model, when in use, firstly positions the first semiconductor device inside the support assembly to prevent tilting caused by the conveying mechanism. Then, the conveying mechanism is activated, and it controls the first semiconductor device to move under the welding assembly. At this time, the semiconductor device can be automatically welded according to the pre-set control program. During welding, the operator or an external robotic arm can position the second semiconductor device inside the second support assembly. After the first semiconductor device is welded, the conveying mechanism controls both semiconductor devices to move to one side simultaneously, so that the first semiconductor device moves out from under the welding mechanism, and the second semiconductor device is moved under the welding mechanism for welding. At this time, the operator or robotic arm can remove the welded first semiconductor device from the support assembly and install the third semiconductor device. Then, the above steps can be repeated, without causing extra time waste, which is convenient, quick and easy to operate.

[0028] In addition, when the semiconductor device moves inside the support assembly and below the welding mechanism, the semiconductor device will come into contact with the two limiting components located on both sides below the welding mechanism. During the contact process, the semiconductor device will be tightly locked into the support assembly from both sides, which will enable more accurate welding during subsequent automatic welding and reduce the defect rate.

[0029] As a preferred embodiment of this utility model, the welding mechanism includes a first moving mechanism 6, a second moving mechanism 7, an electric push rod 16, and a welding head 17. The outer wall of the first moving mechanism 6 is connected to the upper ends of the two raised plates 5. The output end of the first moving mechanism 6 is connected to the outer wall of the second moving mechanism 7. The output end of the second moving mechanism 7 is connected to the outer wall of the electric push rod 16. The output end of the electric push rod 16 is fixedly connected to the upper end of the welding head 17. The lower end of the welding head 17 faces the support assembly and the conveying mechanism.

[0030] Both the first moving mechanism 6 and the second moving mechanism 7 include a support plate, a transmission motor, a lead screw, and a slider. The two ends of the first support plate are fixedly connected to the upper ends of the two raised plates 5 respectively. The first transmission motor is fixedly connected to one side of the first support plate. The output shaft of the first transmission motor is fixedly connected to one end of the first lead screw. The other end of the first lead screw passes through the interior of the first support plate and is threadedly connected to the first slider. The outer walls of both ends of the first lead screw are rotatably connected to the inner wall of the penetration point of the first support plate.

[0031] The bottom surface of slider No. 1 is fixedly connected to the middle of the upper surface of support plate No. 2. One end of support plate No. 2 is fixedly connected to the outer wall of drive motor No. 2. The output shaft of drive motor No. 2 is fixedly connected to one end of lead screw No. 2. The other end of lead screw No. 2 passes through the interior of support plate No. 2 and is threadedly connected to the inner wall of slider No. 2. The outer walls of both ends of lead screw No. 2 are rotatably connected to the inner wall of support plate No. 2 at the penetration point. The bottom surface of slider No. 2 is fixedly connected to the outer wall of electric push rod 16.

[0032] More specifically, when it is necessary to solder semiconductor devices, simply place the semiconductor device on the support assembly first, and then the conveying mechanism controls the semiconductor device to move below the soldering head 17. At this time, the external controller automatically starts the first drive motor, the second drive motor, and the electric push rod 16 according to the previously set program. After the first drive motor and the second drive motor are started, the electric push rod 16 and the soldering head 17 can be controlled to move to any position on the support assembly, so that the semiconductor device located on the support assembly can be soldered. After the electric push rod 16 is started, the soldering head 17 can be raised and lowered, thereby realizing the soldering of the semiconductor device.

[0033] It should be noted that the connection between the drive motor, lead screw, and slider is a very mature technology and will not be described in detail here; similarly, the lifting control capability of the electric actuator 16 and the welding method of the welding head 17 are also mature technologies and will not be described in detail here either.

[0034] As a preferred embodiment of this utility model, the conveying mechanism includes a conveying motor 2, a conveying belt 4, and two conveying rollers 3. The outer wall of the conveying motor 2 is fixedly connected to the side wall of one end of the support frame 1. The output shaft of the conveying motor 2 is fixedly connected to one end of one of the conveying rollers 3. The two conveying rollers 3 are arranged in parallel and are located at both ends of the support frame 1. The outer walls of both ends of the two conveying rollers 3 are rotatably connected to the inner wall of the support frame 1. The conveying belt 4 is sleeved on the outer walls of the two conveying rollers 3. Several support components are connected to the upper surface of the conveying belt 4.

[0035] More specifically, when it is necessary to control the movement of semiconductor devices on the support assembly, simply turn on the conveyor motor 2 through the external controller. The output shaft of the conveyor motor 2 will then rotate the conveyor roller 3 connected to it. After that, the conveyor roller 3 can cooperate with another conveyor roller 3 to move the conveyor belt 4. By changing the rotation direction of the output shaft of the conveyor motor 2 according to the movement direction of the support assembly, reciprocating movement can be achieved.

[0036] As a preferred embodiment of this utility model, the support assembly includes a placement plate 8, a top block 11, two side plates 9, four moving strips 10, four screws 15, and four nuts. The bottom surface of the placement plate 8 is fixedly connected to the upper surface of the conveyor belt 4. The four corners of the upper surface of the placement plate 8 are fixedly connected to the lower ends of the four screws 15 respectively. The four moving strips 10 are respectively sleeved and slidably connected to the outer walls of the four screws 15, and the four moving strips 10 are respectively fastened to the four screws 15 by the four nuts. The four moving strips 10 are arranged in pairs, and the two pairs of moving strips 10 are fixedly connected to one side of the two side plates 9 respectively. The bottom surface of the top block 11 is fixedly connected to the upper surface of one end of the placement plate 8. The top block 11 is perpendicular to the two moving strips 10. The two limiting components are respectively connected to the two moving strips 10.

[0037] More specifically, when placing semiconductor devices, simply adjust the positions of the two moving strips 10 using the screw 15 and nut to initially clamp them. No tightening is required here; just adjust the distance between the two moving strips 10. Then, insert the semiconductor device from above between the two side plates 9. Subsequently, the placement plate 8, along with the top block 11, side plates 9, and moving strips 10, moves with the conveyor belt 4. When the side plate 9 moves to contact the limiting component, the limiting component presses the placement plate 8 and the semiconductor device placed on it together. Then, welding can be performed normally through the welding mechanism.

[0038] It is worth noting that the top block 11 is set up to cooperate with the two side plates 9 to achieve "three-point positioning" of the semiconductor device. This allows the "initial point" of the semiconductor device to be determined directly after it is placed, which facilitates the rapid identification and automatic soldering of the subsequent control program.

[0039] As a preferred embodiment of the present invention, the extension assembly includes a plurality of extension plates 18, one end of each of the extension plates 18 being fixedly connected to the side wall of the lower end of the pad plate 5, and the other end of each of the extension plates 18 being connected to the limiting assembly.

[0040] More specifically, by setting the extension plate 18, support can be provided for the limit component.

[0041] It should be noted that the extension plate 18, the shim plate 5, and the limiting assembly can all be connected by bolts. This allows for different extension distances of the limiting assembly when welding semiconductor devices of other sizes by changing the length of the extension plate 18. Furthermore, since the moving strip 10 on the placement plate 8 can be adjusted on the screw 15, the limiting effect on the semiconductor device will not be affected.

[0042] As a preferred embodiment of this utility model, the limiting component includes a movable plate 12, a back plate 23, two wedge blocks 14, a number of pressure components and a number of adaptive components. One side of the back plate 23 is fixedly connected to the end of a number of extension plates 18 away from the raised plate 5, and the other end of the back plate 23 is connected to a number of pressure components. A number of sliding openings 21 are provided through the surface of the movable plate 12, and the other ends of the number of pressure components are respectively connected through the number of sliding openings 21. The upper end of the back plate 23 is connected to the lower end of a number of adaptive components, and the other ends of the number of adaptive components are all connected to the upper end of the movable plate 12. The two wedge blocks 14 are fixedly connected to both ends of the movable plate 12, and the inclined surfaces of the two wedge blocks 14 abut against the side plate 9.

[0043] The pressure assembly includes a lifting rod 22 and a pressure roller 13. One end of the lifting rod 22 is fixedly connected to the side of the back plate 23 away from the extension plate 18, and the other end of the lifting rod 22 passes through the slide 21 and is rotatably connected to the middle of the pressure roller 13. The surface of the pressure roller 13 abuts against the upper surface of the placement plate 8.

[0044] The adaptive component includes a spring 20 and two connecting blocks 19. The two ends of the spring 20 are fixedly connected to the adjacent side of the two connecting blocks 19, and one end of the two connecting blocks 19 is fixedly connected to the moving plate 12 and the back plate 23, respectively.

[0045] More specifically, when a semiconductor device is about to move under the welding mechanism, the wedge block 14 will contact the side plate 9 first, so that even if the conveyor belt 4 undergoes a slight positional change due to bending or other reasons, the side plate 9 can be positioned exactly between the two moving plates 12.

[0046] As the conveyor belt 4 continues to move, the two sets of pressure rollers 13 on the two moving plates 12 will press against both sides of the upper surface of the semiconductor device. Because there are several springs 20 pulling between the moving plate 12 and the back plate 23, the moving plate 12 will press tightly against the surface of the semiconductor device. After the semiconductor device is soldered, the support assembly and the semiconductor device continue to move away from the pressure rollers 13 and then stop.

[0047] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A soldering mechanism of a semiconductor device, characterized by: The utility model provides a welding device for the welding of the workpiece, the welding device comprises a support frame (1), the inside of support frame (1) is connected with conveying mechanism, the both sides of support frame (1) middle part are fixedly connected with the pad high board (5), the upper end of two pad high boards (5) is connected with welding mechanism simultaneously, welding mechanism is located the top of conveying mechanism middle part, the upper surface of conveying mechanism is connected with a plurality of support assemblies, the lower end of adjacent side of two pad high boards (5) is connected with extension assembly, the end of two extension assemblies close is connected with limiting assembly, two limiting assemblies are located the both sides of a plurality of support assemblies, and support assembly is located the below of welding mechanism.

2. A solder mechanism for a semiconductor device according to claim 1, wherein: The welding mechanism includes a first moving mechanism (6), a second moving mechanism (7), an electric push rod (16) and a welding head (17), the outer wall of the first moving mechanism (6) is connected with the upper end of the two pad high boards (5), the output end of the first moving mechanism (6) is connected with the outer wall of the second moving mechanism (7), the output end of the second moving mechanism (7) is connected with the outer wall of the electric push rod (16), the output end of the electric push rod (16) is fixedly connected with the upper end of the welding head (17), and the lower end of the welding head (17) faces the support assembly and the conveying mechanism.

3. A solder mechanism for a semiconductor device according to claim 2, wherein: The first moving mechanism (6) and the second moving mechanism (7) both include a support plate, a transmission motor, a lead screw and a sliding block, the both ends of the first support plate are fixedly connected with the upper end of the two pad high boards (5), the first transmission motor is fixedly connected to one side of the first support plate, the output shaft of the first transmission motor is fixedly connected with one end of the first lead screw, the other end of the first lead screw penetrates into the inside of the first support plate and is threadedly connected with the first sliding block, and the outer walls of the both ends of the first lead screw are rotatably connected with the inner walls of the penetration positions of the first support plate. The bottom surface of the first sliding block is fixedly connected with the middle part of the upper surface of the second support plate, one end of the second support plate is fixedly connected with the outer wall of the second transmission motor, the output shaft of the second transmission motor is fixedly connected with one end of the second lead screw, the other end of the second lead screw penetrates into the inside of the second support plate and is threadedly connected with the inner wall of the second sliding block, and the outer walls of the both ends of the second lead screw are rotatably connected with the inner walls of the penetration positions of the second support plate, and the bottom surface of the second sliding block is fixedly connected with the outer wall of the electric push rod (16).

4. A solder mechanism for a semiconductor device according to claim 3, wherein: The conveying mechanism includes a conveying motor (2), a conveying belt (4) and two conveying rollers (3), the outer wall of the conveying motor (2) is fixedly connected with the side wall of one end of the support frame (1), the output shaft of the conveying motor (2) is fixedly connected with one end of one of the two conveying rollers (3), the two conveying rollers (3) are arranged in parallel, and the two conveying rollers (3) are located at the both ends of the support frame (1), the outer walls of the both ends of the two conveying rollers (3) are rotatably connected with the inner walls of the support frame (1), the conveying belt (4) is sleeved on the outer walls of the two conveying rollers (3), and a plurality of support assemblies are connected to the upper surface of the conveying belt (4).

5. A solder mechanism for a semiconductor device according to claim 4, wherein: The supporting assembly comprises a placing plate (8), a top block (11), two side plates (9), four moving strips (10), four screw rods (15) and four nuts, the bottom surface of the placing plate (8) is fixedly connected with the upper surface of the conveying belt (4), the four corners of the upper surface of the placing plate (8) are fixedly connected with the lower ends of the four screw rods (15) respectively, the four moving strips (10) are sleeved and slidably connected with the outer walls of the four screw rods (15) respectively, the four moving strips (10) are tightly connected with the four screw rods (15) through the four nuts respectively, the four moving strips (10) are grouped in two, the two groups of moving strips (10) are fixedly connected with one side of the two side plates (9) respectively, the bottom surface of the top block (11) is fixedly connected with the upper surface of one end of the placing plate (8), the top block (11) is arranged perpendicularly to the two moving strips (10), and the two limiting assemblies are connected with the two moving strips (10) respectively.

6. A solder mechanism for a semiconductor device according to claim 5, wherein: The lengthening assembly comprises a plurality of lengthening plates (18), one end of each of the lengthening plates (18) is fixedly connected with the side wall of the lower end of the cushion plate (5), and the other end of each of the lengthening plates (18) is connected with the limiting assembly.

7. A solder mechanism for a semiconductor device according to claim 6, wherein: The limiting assembly comprises a moving plate (12), a back plate (23), two wedge-shaped blocks (14), a plurality of pressure assemblies and a plurality of self-adapting assemblies, one side of the back plate (23) is fixedly connected with one end, away from the cushion plate (5), of the plurality of lengthening plates (18), the other end of the back plate (23) is connected with the plurality of pressure assemblies, a plurality of slide openings (21) are formed in the surface of the moving plate (12), the other ends of the plurality of pressure assemblies are respectively penetrated through the plurality of slide openings (21), the upper end of the back plate (23) is connected with the lower end of the plurality of self-adapting assemblies, the other end of each of the plurality of self-adapting assemblies is connected with the upper end of the moving plate (12), the two wedge-shaped blocks (14) are fixedly connected with the two ends of the moving plate (12) respectively, and the inclined surfaces of the two wedge-shaped blocks (14) are in abutment with the side plates (9).

8. A solder mechanism for a semiconductor device according to claim 7, wherein: The pressure assembly comprises a lifting rod (22) and a pressing wheel (13), one end of the lifting rod (22) is fixedly connected with one side of the back plate (23) away from the lengthening plate (18), the other end of the lifting rod (22) is penetrated through the slide opening (21) and rotationally connected with the middle portion of the pressing wheel (13), and the surface of the pressing wheel (13) is in abutment with the upper surface of the placing plate (8).

9. A solder mechanism for a semiconductor device according to claim 8, wherein: The self-adapting assembly comprises a spring (20) and two connecting blocks (19), the two ends of the spring (20) are fixedly connected with the adjacent sides of the two connecting blocks (19) respectively, and one end of each of the two connecting blocks (19) is fixedly connected with the moving plate (12) and the back plate (23) respectively.

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