Bearing tool and silicon wafer processing device
By using a support fixture to perform batch positioning and processing of the head and tail wafers after silicon rod cutting, the problem of difficult batch processing of head and tail wafers is solved, realizing efficient and low-energy silicon wafer processing and improving silicon wafer quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2026-03-13
AI Technical Summary
Existing technologies make it difficult to batch position and process the head and tail wafers after silicon rod cutting, resulting in low processing efficiency, high energy consumption during the remelting process, and poor silicon wafer quality.
A support fixture is provided, including a base plate and a detachable positioning frame. Materials are fixed by positioning parts and wax adhesion, and in conjunction with a heating and cooling mechanism, batch positioning and processing of multiple materials can be achieved.
It improves material processing efficiency, ensures silicon wafer thickness consistency and surface precision, reduces energy consumption, and increases the utilization rate of head and tail wafers.
Smart Images
Figure CN223989384U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of silicon wafer processing equipment technology, and more particularly to a support fixture. This disclosure also relates to a silicon wafer processing apparatus using the support fixture. Background Technology
[0002] Silicon wafers are a crucial material in semiconductor manufacturing, and their processing quality directly affects the stability of subsequent processes and product performance. In silicon wafer production, the slicing process of silicon rods requires high efficiency and precision to ensure that each wafer has a consistent thickness and excellent surface roughness. However, the head and tail wafers produced after cutting silicon rods, due to not undergoing full-surface diamond wire cutting, have poor thickness consistency and cannot meet the requirements for conventional silicon wafers. These head and tail wafers are usually considered waste and directly recycled. The recycling process requires remelting the head and tail wafers and processing them into silicon rods, which consumes additional energy and fails to utilize the crystal structure characteristics already formed in the head and tail wafers. Furthermore, the silicon rods produced after recycling will still produce head and tail wafers after cutting. Therefore, recycling cannot completely solve the waste of head and tail wafers and consumes excessive energy.
[0003] To improve the utilization rate of the first and last wafers while reducing the energy consumed in their utilization, existing technologies have begun to collect and process these wafers. For example, multiple first and last wafers are bonded together to form a new silicon rod, which is then recut, avoiding the energy consumed by remelting the first and last wafers. However, the silicon wafers cut from the bonded rods are of poor quality and cannot meet the demands of products requiring high wafer precision. To further improve wafer precision, existing technologies propose using grinding to treat the wafer surface, resulting in wafers with high surface precision and consistent thickness. However, due to the inconsistent shapes of the first and last wafers, it is difficult to batch-fix and simultaneously grind them, leading to low efficiency in processing the first and last wafers using grinding.
[0004] Therefore, there is a need for a support fixture that can position materials in batches to enable batch processing of materials. Utility Model Content
[0005] One of the technical problems to be solved by this disclosure is: how to provide a support fixture that can perform batch positioning of materials so as to enable batch processing of materials.
[0006] To address the aforementioned technical problems, a first aspect of this disclosure provides a supporting fixture, which includes a base plate and a positioning frame. The positioning frame is detachably mounted on the base plate and has a plurality of positioning parts, each having a shape that at least partially conforms to the material, so as to position the material on the base plate when the material is detachably fixed to the base plate.
[0007] In some embodiments, the side of the positioning frame facing the material is provided with scale lines for measuring the height of the material.
[0008] In some embodiments, a plurality of positioning parts are arranged in a straight line to enable the positioning of a plurality of materials in a straight line on the base plate.
[0009] In some embodiments, the material is adapted to be fixed to the base plate by wax bonding.
[0010] In some embodiments, the support fixture further includes a heating mechanism for heating the base plate, which is capable of heating to melt the wax applied to the top surface of the base plate, so as to fix the material to the base plate by wax adhesion by placing it on the base plate, and can heat the base plate by heating the base plate after the material has been processed to melt the wax on the base plate and allow the material to be removed from the base plate.
[0011] In some embodiments, the supporting fixture further includes a pressing mechanism for flattening the material, which applies vertical downward pressure to the material placed on the base plate so that the unsolidified wax at the bottom of the material is evenly distributed.
[0012] In some embodiments, the top surface of the base plate is configured to be polished so that it can fully contact the bottom surface of the material and stably support the material.
[0013] A silicon wafer processing apparatus includes the aforementioned support fixture, wherein the material to be processed is a silicon wafer.
[0014] In some embodiments, the silicon wafer processing apparatus includes a grinding mechanism configured to move and grind the silicon wafers in an arrangement direction of a plurality of silicon wafers.
[0015] In some embodiments, the silicon wafer processing apparatus includes a marking mechanism that can cover and mark the surface of the silicon wafer to be ground with pigment, so that when the grinding mechanism is grinding, the grinding can be confirmed by observing whether there is pigment on the surface of the silicon wafer being ground.
[0016] Through the above technical solution, the supporting fixture provided by this disclosure can position multiple materials and support multiple positioned materials for processing. In use, the positioning frame of this supporting fixture is first installed on the base plate, and then the material to be ground is pasted onto the top of the base plate. The positioning part on the positioning frame has a shape that at least partially conforms to the material being ground, allowing it to conform to the material when pasted onto the base plate, thereby positioning the material. Multiple materials are then pasted onto the base plate with the multiple positioning parts on the positioning frame. After secure pasting, the positioning frame can be removed from the base plate, and the base plate can be moved below the processing mechanism to process the materials pasted on the base plate. After processing is complete, the processed materials pasted onto the base plate are removed, thus obtaining the processed material. The supporting fixture provided by this disclosure can cooperate with the positioning frame to arrange and fix multiple materials into a shape suitable for simultaneous processing, enabling the processing mechanism to batch process the materials fixed on it, thereby improving the material processing efficiency. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a three-dimensional structural schematic diagram of the supporting tooling disclosed in the embodiments of this disclosure;
[0019] Figure 2 This is a top view of the supporting tooling disclosed in an embodiment of this disclosure;
[0020] Figure 3 This is a top view of the supporting tooling disclosed in another embodiment of the present disclosure;
[0021] Figure 4 This is a front view structural schematic diagram of the support tooling disclosed in this embodiment.
[0022] Explanation of reference numerals in the attached figures:
[0023] 1. Base plate; 2. Positioning frame; 21. Positioning part; 3. Material; 4. Grinding mechanism. Detailed Implementation
[0024] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
[0025] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values set forth in these embodiments should be interpreted as exemplary only and not as limiting.
[0026] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0027] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.
[0028] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.
[0029] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.
[0030] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.
[0031] The first aspect of this disclosure provides a support fixture, such as... Figure 1 and Figure 2 As shown, it includes a base plate 1 and a positioning frame 2. The positioning frame 2 is detachably mounted on the base plate 1 and has multiple positioning parts 21. Each positioning part 21 has a shape that at least partially conforms to the material 3, so as to position the material 3 on the base plate 1 when the material 3 is detachably fixed to the base plate 1. The material 3 can be detachably fixed to the base plate 1 in any way that will not damage the material 3, and this method can ensure that the material 3 is firmly and stably fixed to the base plate 1 during processing. This method can be to use an adhesive that loses its stickiness after heating to stick the material 3 to the base plate 1, and then heat the adhesive after processing to remove the processed material 3 from the base plate 1.
[0032] Through the above technical solution, the supporting fixture provided in this disclosure can position multiple materials 3 and support multiple positioned materials 3 so that the materials 3 can be processed. In use, the positioning frame 2 of this supporting fixture is first installed on the base plate 1, and then the materials 3 to be ground are pasted onto the top of the base plate 1. The positioning part 21 on the positioning frame 2 has a shape that at least partially conforms to the material 3 to be ground, so that it conforms to the material 3 when pasted onto the base plate 1, thereby positioning the material 3. Multiple materials 3 are respectively pasted onto the multiple positioning parts 21 on the positioning frame 2 and then pasted onto the base plate 1. After they are firmly pasted, the positioning frame 2 can be removed from the base plate 1, and the base plate 1 can be moved below the processing mechanism to process the materials 3 pasted onto the base plate 1. After processing is completed, the processed materials 3 pasted onto the base plate 1 are removed, thus obtaining the processed materials 3. The support fixture provided in this disclosure can cooperate with the positioning frame 2 to arrange and fix multiple materials 3 into a shape suitable for simultaneous processing, so that the processing mechanism can process the materials 3 fixed on it in batches, thereby improving the processing efficiency of the materials 3.
[0033] The multiple positioning parts 21 can be arranged in a compact arrangement or with gaps between them. The shape of the positioning parts 21 can be set according to the shape of the material 3 supported by this supporting fixture. For example, when the material 3 being processed has a plane perpendicular to the horizontal plane, the positioning part 21 can also be set to have a plane perpendicular to the horizontal plane. Figure 2 As shown, the positioning part 21 is configured to fit against the plane of the material 3, thereby restricting the position of the material 3; when the material 3 being processed has a cylindrical circumferential surface, the positioning part 21 can be configured to have a groove, in which an inner surface matching a portion of the circumferential surface of the material 3 is formed, such as... Figure 3 As shown, it is fitted to the plane on material 3, thereby restricting the position of material 3.
[0034] Before using this support fixture, multiple positioning frames 2 with different positioning parts 21 can be prepared in advance so that when this support fixture is applied to materials 3 with different shapes, the appropriate positioning frame 2 can be quickly changed, so that this support fixture can be applied to materials 3 with different shapes.
[0035] In some embodiments, the side of the positioning frame 2 facing the material 3 is provided with a scale line (not shown in the figure) for measuring the height of the material 3. This scale line allows the height of the material 3 to be determined after it is placed on the base plate 1, before the positioning frame 2 is removed and the material 3 is processed. This allows the determination of the distance the processing equipment needs to move down to process the material 3 in subsequent processing steps, preventing damage to the processing equipment or excessive processing depth due to excessive downward movement, thus ensuring a safe, stable, and efficient processing process.
[0036] In some embodiments, such as Figure 2 and Figure 3 As shown, multiple positioning parts 21 are arranged in a straight line to position multiple materials 3 in a straight line on the base plate 1. Because of the straight-line arrangement of the positioning parts 21, each material 3 that is attached to and fixed to the base plate 1 is also arranged in a straight line. During processing, the processing device only needs to be set to move in a straight line to process all the materials 3 arranged on the base plate 1, thereby improving the processing efficiency of the processing device and making this support fixture suitable for batch processing of materials 3.
[0037] In some embodiments, material 3 is adapted to be fixed to the base plate 1 by wax. Preferably, the wax is meltable at a temperature of 100°C to 120°C and solidifies at room temperature and the operating temperature of material 3 when the processing device processes the material. By using wax that solidifies during processing and melts upon heating, material 3 can be fixed to the base plate 1 to prevent displacement during processing, thereby ensuring the processing accuracy of the processing device. At the same time, wax is easy to arrange and easy to melt, allowing multiple materials 3 to be easily attached to the base plate 1 by wax and removed from the base plate 1 after processing.
[0038] In some embodiments, as shown in the figure, the supporting fixture also includes a heating mechanism (not shown) for heating the base plate 1. This heating mechanism is capable of heating to melt the wax applied to the top surface of the base plate 1, so that the material 3 can be fixed to the base plate 1 by wax adhesion by placing it on the base plate 1. After the material 3 has been processed, the heating mechanism can heat the base plate 1 to melt the wax on the base plate 1, allowing the material 3 to be removed from the base plate 1. The heating mechanism can be any device capable of heating the base plate 1 to melt the wax applied to the base plate 1, such as an electromagnetic heating device equipped with an induction coil. By providing a heating mechanism, the base plate 1 can be quickly and uniformly heated and the wax on the base plate 1 can be melted, thereby allowing the material 3 to adhere to the base plate 1. After processing, the material 3 can be quickly removed from the base plate 1 by the heating mechanism, improving the efficiency of processing the material 3.
[0039] In some embodiments, the support fixture further includes a cooling mechanism (not shown) for cooling the base plate 1. This cooling mechanism can rapidly cool the base plate 1 after wax is applied and material 3 is attached, causing the wax to solidify quickly. This allows the base plate 1 to be easily moved directly under the processing device for processing material 3. The cooling mechanism can be any device capable of cooling the base plate 1 to rapidly solidify the wax applied to it, such as a refrigerator utilizing semiconductor cooling principles and disconnected from the base plate 1. The cooling mechanism enables rapid wax solidification, reducing the waiting time for wax to solidify and improving the efficiency of processing material 3 using this support fixture.
[0040] In some embodiments, the supporting fixture further includes a pressing mechanism (not shown) for flattening the material 3. This pressing mechanism applies vertical downward pressure to the material 3 placed on the base plate 1, ensuring a uniform distribution of the uncured wax at the bottom of the material 3. In some embodiments, the worker can press the material 3 by hand and rotate it slightly to ensure a uniform distribution of the uncured wax at the bottom of the material 3. When the material 3 is adhered to the base plate 1 using wax, some wax remains between the bottom of the material 3 and the base plate 1. This wax is not evenly distributed at the bottom of the material 3. If the wax is directly cooled and solidified before processing, the unevenly distributed wax at the bottom will result in the material 3 not being actually placed flat on the base plate. In some processing methods that require a certain thickness of the material 3, such as grinding, the unflattened material 3 will result in parameters that do not meet requirements after processing. By pressing the material 3 and ensuring a uniform distribution of wax at the bottom of the material 3, it is ensured that the material 3 is placed horizontally on the base plate 1, thereby ensuring that the material 3 can be processed into a product that meets expectations and requirements.
[0041] In some embodiments, the top surface of the base plate 1 is polished to ensure complete contact with the bottom surface of the material 3 and to stably support the material 3. In some preferred embodiments, both the top and bottom surfaces of the base plate 1 are polished. Polishing the bottom surface of the base plate 1 ensures it is level, allowing it to remain level when placed on a horizontal surface. Polishing the top surface of the base plate 1 ensures it is level, guaranteeing that the bottom surface of the material 3 adhered to the top surface of the base plate 1 is parallel to the horizontal plane, thus ensuring that the material 3 will not fail to achieve the desired processing effect due to uneven placement.
[0042] A silicon wafer processing apparatus includes the aforementioned support fixture, such as... Figure 1 , Figure 2 and Figure 4 As shown, the material 3 to be processed is a silicon wafer. In some embodiments, the silicon wafer is the head and tail wafer produced after the silicon rod is cut, with one side having a smooth plane produced after cutting, and the side opposite to the smooth plane having one or more planes that are not parallel to the smooth plane. When the silicon wafer is attached to the base plate 1, the smooth plane contacts the top surface of the base plate 1, so that the silicon wafer can be placed stably on the base plate 1, and the side opposite to the smooth plane faces upward for processing.
[0043] In some embodiments, such as Figure 4As shown, the silicon wafer processing apparatus includes a grinding mechanism 4, which is configured to move and grind silicon wafers in an arrangement direction of multiple silicon wafers. The grinding mechanism 4 can be any grinding device capable of grinding silicon wafers to meet silicon wafer production requirements, such as a grinding wheel. The grinding mechanism 4 can grind the top of the silicon wafers to obtain a smooth, flat top surface, allowing the silicon wafer heads and tails to be processed into silicon wafer products that meet the requirements. The grinding mechanism 4 moves and grinds in the arrangement direction of multiple silicon wafers, enabling the silicon wafer heads and tails to be processed into silicon wafers in batches, thereby improving the efficiency of processing silicon wafer heads and tails.
[0044] In some embodiments, the silicon wafer processing apparatus includes a marking mechanism (not shown in the figure) that can cover and mark the surface of the silicon wafer to be polished using pigment, so that when the polishing mechanism 4 is polishing, the presence of pigment on the polished surface of the silicon wafer can be observed to confirm whether polishing is complete. The marking mechanism can be any device capable of marking the surface of the silicon wafer to be polished. In some embodiments, the surface of the silicon wafer to be polished can be marked by a worker using a brush or other tool capable of marking the surface of the silicon wafer to be polished.
[0045] The marking mechanism marks the top surface of the silicon wafer, allowing the determination of the degree of grinding. Since the grinding mechanism 4 uses a fixed-height translational method to grind multiple silicon wafers, when height differences exist on the top surface, a single grinding operation cannot completely grind the top surface to a flat plane, requiring multiple adjustments to the height of the grinding mechanism 4. When the pigment on the top surface of the silicon wafer is completely ground away by the grinding mechanism 4, it indicates that there are no surfaces on the top of the silicon wafer lower than the current grinding height, signifying that the top of the silicon wafer has been ground to a horizontal plane, and the grinding process is complete. The marking mechanism allows for monitoring the grinding progress and avoids re-grinding after completion. Furthermore, the marking mechanism allows the grinding mechanism 4 to grind all the silicon wafers on the base plate 1 until all the pigment on the top of the last silicon wafer is ground away before stopping, thus obtaining finished silicon wafers with uniform thickness.
[0046] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.
[0047] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.
Claims
1. A support tool characterized by, The supporting tool comprises: a bottom plate (1) adapted to fix a plurality of materials (3) to be processed; a positioning frame (2) detachably mounted on the bottom plate (1) and provided with a plurality of positioning portions (21), each of which has a shape capable of being attached to the material (3) to position the material (3) in a fixed position on the bottom plate (1) in at least one direction.
2. The jacking tool of claim 1, wherein, A side of the positioning frame (2) facing the material (3) is provided with a scale line for measuring the height of the material (3).
3. The jacking tool of claim 1, wherein, The plurality of positioning portions (21) are arranged in a straight line to position the plurality of materials (3) in a straight line on the bottom plate (1).
4. The support tooling of claim 3, wherein, The material (3) is adapted to be fixed to the bottom plate (1) by wax sticking.
5. The support tooling of claim 4, wherein, The supporting tool further comprises a heating mechanism for heating the bottom plate (1) to melt the wax applied to the top surface of the bottom plate (1) to fix the material (3) to the bottom plate (1) by wax sticking by placing the material (3) on the bottom plate (1), and to melt the wax on the bottom plate (1) by heating the bottom plate (1) by the heating mechanism after the material (3) is processed, and to allow the material (3) to be removed from the bottom plate (1).
6. The support tool of claim 5, wherein, The supporting tool further comprises a pressing mechanism for flattening the material (3) to apply vertical downward pressure to the material (3) placed on the bottom plate (1) by the pressing mechanism to uniformly distribute the un-solidified wax at the bottom of the material (3).
7. The support tool of claim 1, wherein, The top surface of the bottom plate (1) is polished to completely contact the bottom surface of the material (3) and smoothly support the material (3).
8. A silicon wafer processing apparatus, characterized by comprising: The supporting tool comprises the supporting tool according to any one of claims 1-7, and the material to be processed is a silicon wafer.
9. The silicon wafer processing apparatus of claim 8 wherein, The silicon wafer processing device comprises a grinding mechanism (4) configured to move and grind the silicon wafer in the arrangement direction of the plurality of silicon wafers.
10. The silicon wafer processing apparatus of claim 9, wherein The silicon wafer processing device comprises a marking mechanism capable of covering and marking the surface to be ground of the silicon wafer with paint, so that whether the grinding is completed can be confirmed by observing whether the paint exists on the surface of the silicon wafer being ground when the grinding mechanism (4) grinds.