High-heat-dissipation film thermal printing head
By setting heat dissipation plate protrusions on the lower surface of the insulating substrate and connecting them with thermally conductive adhesive parts, the problem of poor heat dissipation in existing thermal printheads is solved, achieving more efficient heat dissipation and a more stable structure, thereby improving the performance and lifespan of the printhead.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-03-13
AI Technical Summary
Existing thermal printheads have poor heat dissipation, leading to overheating, unstable material properties, and poor structural reliability. This is mainly due to the limited contact area between the heat sink and the insulating substrate and the large difference in thermal conductivity.
A heat sink protrusion is provided on the lower surface of the insulating substrate and connected by a thermally conductive adhesive part to increase the contact area between the heat sink and the heat-generating substrate. A combination of materials with moderate thermal conductivity is used, and the local glaze coating structure is optimized to control heat conduction.
It improves heat dissipation, enhances the heat dissipation capacity of the print head, increases printing speed and lifespan, reduces thermal stress, and ensures structural stability and reliability.
Smart Images
Figure CN223989883U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of thermal printing technology, and in particular to a high heat dissipation thin-film thermal printhead. Background Technology
[0002] In the field of thermal printhead technology, existing thermal printheads mainly consist of a heating substrate and a heat sink. The heating substrate typically includes an insulating substrate, a local glaze coating on the surface of the insulating substrate, wire electrodes and a heating resistor arranged above the local glaze coating and the insulating substrate, and an uppermost protective layer. The heat sink is arranged below the insulating substrate to dissipate heat from the heating substrate. When the printhead is working, the heating resistor generates heat, which first passes through the local glaze coating, then through the insulating substrate, and finally is conducted out through the heat sink.
[0003] However, current thermal printhead heat dissipation methods have the following problems. On the one hand, the heat sink only contacts the insulating substrate from below. This single contact method results in a limited heat dissipation area, making it difficult to dissipate the heat generated by the heating resistor quickly and effectively, which easily leads to overheating of the printhead during operation. On the other hand, the insulating substrate is usually made of ceramic, with a thermal conductivity of 20-24 W / (m·K), while the commonly used heat sink material is aluminum or other high thermal conductivity materials, with aluminum having a thermal conductivity as high as 237 W / (m·K). This large difference in thermal conductivity causes the heat generated by the resistor to be conducted slowly in the insulating ceramic substrate, resulting in heat accumulation within the insulating substrate and a continuous increase in the local temperature of the printhead. In addition, the large difference in thermal conductivity creates a large temperature gradient between the resistor and the heat sink, which not only affects the performance stability of the internal materials of the printhead but may also cause stress concentration at the joints due to different thermal stresses. Under long-term action, this may lead to material deformation or even cracking, affecting the structural integrity and reliability of the printhead. Utility Model Content
[0004] The purpose of this application is to provide a high heat dissipation thin-film thermal printhead to solve the problems existing in the background art.
[0005] The embodiments of this application can be implemented through the following technical solutions:
[0006] A high-heat-dissipation thin-film thermal printhead includes a heat sink and a heating substrate. The heating substrate includes an insulating substrate and a partial glaze coating, a heating resistor, a wire electrode, and a protective layer disposed on the upper surface of the insulating substrate. The heat sink is located on the lower surface of the insulating substrate, and one side of the front end of the heat sink extends toward the insulating substrate in a direction perpendicular to the width of the heat sink to form a heat sink boss. The lower surface and the leading edge end face of the insulating substrate are respectively connected to the upper surface of the heat sink and the side of the heat sink boss for heat transfer. The height of the heat sink boss is 10%-100% of the thickness of the insulating substrate.
[0007] Furthermore, the heat sink boss is connected to the insulating substrate via a thermally conductive adhesive portion.
[0008] Furthermore, the thermally conductive adhesive portion is located at any one or more locations between the lower surface of the insulating substrate and the upper surface of the heat sink, and between the leading edge end face of the insulating substrate and the boss surface of the heat sink.
[0009] Furthermore, the thermal conductivity of the thermally conductive material used in the thermally conductive adhesive part is between that of the insulating substrate and the heat dissipation plate material.
[0010] Furthermore, the width w of the heat sink boss 11 It ranges from 0.1 to 10 mm.
[0011] Furthermore, the heat sink is made of aluminum.
[0012] Furthermore, the partial glaze coating is disposed on the upper surface of the insulating substrate at one of the front ends of the upper surface of the insulating substrate, and its cross-sectional shape is an arc-shaped protrusion.
[0013] Furthermore, the thickness h of the local glaze coating 40 Satisfying 20μm≤h 40 ≤50μm.
[0014] Furthermore, the width w of the local glaze coating 40 Satisfying 0.3mm≤w 40 ≤2.0mm.
[0015] Furthermore, the distance d between the leading edge of the local glaze coating and the leading edge of the insulating substrate satisfies 0 ≤ d ≤ 3 mm.
[0016] The embodiments of this application provide a high heat dissipation thin-film thermal printhead with at least the following beneficial effects:
[0017] The high heat dissipation thin-film thermal printhead of this application increases the contact area between the heat sink and the heating substrate by setting a specific structure of heat sink protrusions, thereby enhancing the heat dissipation effect. In addition, by adjusting the specific contact area, the combination of materials, and the area of the local glaze coating, heat dissipation can be controlled as needed, thereby increasing the printing speed of the printhead and extending the service life of the printhead. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the cross-sectional structure of the thermal printhead according to an embodiment of the present invention;
[0019] Figure 2 This is a top view of the thermal printhead according to an embodiment of the present invention;
[0020] Numbers in the diagram
[0021] 10-Heat dissipation plate, 11-Heat dissipation plate boss, 20-Insulating substrate, 30-Thermoconductive adhesive part, 40-Partial glaze coating, 50-Heating resistor, 60-Wire electrode, 70-Protective layer. Detailed Implementation
[0022] The present application will now be further described based on preferred embodiments and with reference to the accompanying drawings.
[0023] Furthermore, for ease of understanding, various components on the drawings have been enlarged or reduced, but this is not intended to limit the scope of protection of this application.
[0024] Singular forms of words also include plural meanings, and vice versa.
[0025] In the description of the embodiments of this application, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, in the description of this application, in order to distinguish different units, the terms "first," "second," etc. are used in this specification, but these are not limited by the manufacturing order, nor should they be construed as indicating or implying relative importance. Their names may differ in the detailed description and claims of this application.
[0026] The vocabulary used in this specification is for illustrative purposes and is not intended to limit the scope of this application. It should also be noted that, unless otherwise expressly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection via an intermediate medium; or they can refer to the internal communication between two components. Those skilled in the art will understand the specific meaning of these terms in this application.
[0027] Figure 1 This is a schematic diagram of the cross-sectional structure of a high heat dissipation thin-film thermal printhead provided in an embodiment of the present invention. Figure 2 This utility model provides a top view structural diagram of a high heat dissipation thin-film thermal printhead. It should be noted that... Figure 2 No protective layer is shown, such as Figure 1 and Figure 2As shown, this utility model provides a high heat dissipation thin-film thermal printhead, which includes a heat sink 10 and a heating substrate. Specifically, the heating substrate includes an insulating substrate 20, a partial glaze coating 40 disposed on the upper surface of the insulating substrate 20, a heating resistor 50 located on the side of the partial glaze coating 40 facing away from the insulating substrate 20, a wire electrode 60 located on the side of the heating resistor 50 facing away from the insulating substrate 20, and a protective layer 70 located on the side of the wire electrode 60 facing away from the insulating substrate 20. The heat sink 10 is located on the lower surface of the insulating substrate 20, and one side of the front end of the heat sink 10 extends toward the insulating substrate 20 in a direction perpendicular to the width of the heat sink 10 to form a heat sink boss 11. The lower surface and the leading edge end face of the insulating substrate 20 are respectively connected to the upper surface of the heat sink 10 and the side of the heat sink boss 11 for heat transfer.
[0028] In some preferred embodiments, the heat sink 10 is made of aluminum; it is worth noting that the heat sink 10 can also be made of different thermal conductivity materials, or a combination of multiple thermal conductivity materials, depending on the requirements of the product printing speed.
[0029] In some preferred embodiments, the heat sink 10 and the insulating substrate 20 are connected by a thermally conductive adhesive portion 30. It should be noted that the thermally conductive adhesive portion 30 can be located at any one or more locations between the lower surface of the insulating substrate 20 and the upper surface of the heat sink 10, or between the leading edge of the insulating substrate 20 and the side of the heat sink protrusion 11. Preferably, the connection between the insulating substrate 20 and the heat sink 10 is achieved by the thermally conductive adhesive portion 30. Preferably, the thermal conductivity of the thermally conductive material used in the thermally conductive adhesive portion 30 is between that of the insulating substrate 20 and the heat sink 10, so as to play a transition and buffering role, making heat conduction more stable and orderly, reducing thermal expansion differences and reducing thermal stress. Specifically, the thermally conductive adhesive portion 30 can be connected by thermally conductive tape, dispensing, or other means.
[0030] In some preferred embodiments, the height h of the heat sink boss 11 11 The thickness of the insulating substrate 20 is 10%-100%. On the one hand, the contact area between the insulating substrate 20 and the heat sink 10 is further increased to improve the heat dissipation effect. On the other hand, the height of the heat sink protrusion 11 is too high, which will affect the paper travel path.
[0031] In some preferred embodiments, the width w of the heat sink boss 11 11 It ranges from 0.1 to 10 mm.
[0032] Specifically, the local glaze coating 40 is disposed on one side of the front end of the upper surface of the insulating substrate 20. It is formed by locally printing an amorphous base glaze paste on the insulating substrate 20 and sintering it at a temperature of 1200 to 1250°C. The local glaze coating 40 serves to insulate and protect the heating resistor 50 on one hand, and prevents the heat generated by the heating resistor 50 located on it from being dissipated too quickly through the insulating substrate 20, thus ensuring that it operates within a suitable temperature range.
[0033] Specifically, the cross-sectional shape of the partial glaze coating 40 is an arc-shaped protrusion, and its thickness is h. 40 Its width is w 40 In some preferred embodiments, the thickness h of the local glaze coating 40 40 Satisfying 20μm≤h 40 ≤50μm, the width w of the local glaze coating 40 40 Satisfying 0.3mm≤w 40 ≤2.0mm, at this point, the heat of the local glaze coating 40 will not be unable to dissipate due to excessive thickness or width of the local glaze coating 40, nor will it fail to prevent the heat generated by the heating resistor 50 from being dissipated too quickly through the insulating substrate 20 due to excessive thickness or width of the local glaze coating 40.
[0034] In some preferred embodiments, the distance d between the front edge of the local glaze coating 40 and the front edge of the insulating substrate 20 satisfies 0≤d≤3mm. Since the heating resistor 50 is located at the center of the local glaze coating 40, by minimizing the distance d, the heating resistor 50 is brought closer to the heat sink protrusion 11, thereby allowing the heat generated by the heating resistor 50 to be better dissipated to the heat sink protrusion 11 through the edge of the insulating substrate 20.
[0035] The specific embodiments of this application have been described in detail above. For those skilled in the art, several improvements and modifications can be made to this application without departing from the principle of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.
Claims
1. A high-heat-dissipation thin film thermal printing head, comprising a heat-dissipation plate (10) and a heat-generating substrate, the heat-generating substrate comprising an insulating substrate (20) and a partial glaze coating (40) disposed on the upper surface of the insulating substrate (20), a heat-generating resistor (50), a wire electrode (60), and a protective layer (70), characterized in that the heat-dissipation plate (10) is located on the lower surface of the insulating substrate (20), and the heat-dissipation plate (10) extends along a direction perpendicular to the width of the heat-dissipation plate (10) to form a heat-dissipation plate boss (11) on the front end side of the heat-dissipation plate (10), and the lower surface of the insulating substrate (20) and the front edge end surface are respectively connected to the upper surface of the heat-dissipation plate (10) and the side surface of the heat-dissipation plate boss (11) to transfer heat.
2. The high-heat-dissipation thin film thermal printing head according to claim 1, characterized in that the heat-dissipation plate boss (11) and the insulating substrate (20) are connected by a heat-conducting adhesive portion (30). The height h of the heat sink boss (11) 11 It is 10%-100% of the thickness of the insulating substrate (20).
3. The high-heat-dissipation thin film thermal printing head according to claim 2, characterized in that the heat-conducting adhesive portion (30) is located at any one or more of the following positions: between the lower surface of the insulating substrate (20) and the upper surface of the heat-dissipation plate (10), and between the front edge end surface of the insulating substrate (20) and the surface of the heat-dissipation plate boss (11).
4. The high-heat-dissipation thin film thermal printing head according to claim 2, characterized in that the thermal conductivity of the heat-conducting material used in the heat-conducting adhesive portion (30) is between the thermal conductivity of the material of the insulating substrate (20) and the thermal conductivity of the material of the heat-dissipation plate (10).
5. The high-heat-dissipation thin film thermal printing head according to claim 1, characterized in that the heat-dissipation plate (10) is made of aluminum.
6. The high-heat-dissipation thin film thermal printing head according to claim 1, characterized in that the heat-dissipation plate (10) is made of aluminum.
7. The high-heat-dissipation thin film thermal printing head according to claim 1, characterized in that the partial glaze coating (40) is disposed on the upper surface of the insulating substrate (20) on the front end side of the upper surface of the insulating substrate (20), and the cross-sectional shape of the partial glaze coating (40) is a circular arc-shaped protrusion.
8. The high-heat-dissipation thin film thermal printing head according to claim 7, characterized in that the circular arc-shaped protrusion of the partial glaze coating (40) is a circular arc-shaped protrusion with a radius of curvature of 0.5-2 mm.
9. The high-heat-dissipation thin film thermal printing head according to claim 7, characterized in that the circular arc-shaped protrusion of the partial glaze coating (40) is a circular arc-shaped protrusion with a radius of curvature of 1-1.5 mm. The width w of the heat sink boss (11) is 0.1-10 mm. 11 is 0.1-10 mm.
10. The high-heat-dissipation thin film thermal printing head according to claim 7, characterized in that the distance d between the front end edge of the partial glaze coating (40) and the front end edge of the insulating substrate (20) satisfies the condition 0≤d≤3 mm. The thickness h of the partial glaze coating (40) 40 satisfies 20 pm < h 40 ≤ 50 pm. The width w of the partial enamel coating (40) 40 satisfies 0.3 mm ≤ w 40 ≤ 2.0 mm.