Electroplating device for diamond wire

Abstract

The utility model relates to the technical field of wire electroplating, in particular to an electroplating device for a diamond wire, which comprises an electroplating box, a plating bin is arranged at one end in the electroplating box, a combination bin is arranged at the other end in the electroplating box, a first power supply is mounted at one end of the plating bin, and a fixing clamp and a connecting clamp are mounted in the plating bin. A sand feeding frame is mounted in the combination bin; a second power supply is mounted at one end of the combination bin; the electroplating device has the beneficial effects that a nickel plate can be fixedly clamped in the fixing clamp, meanwhile, a tungsten filament ring is fixed in the connecting clamp, then the nickel plate and the tungsten filament ring are both arranged in electroplating liquid in the plating bin, and then the first power supply is turned on, so that the surface of the tungsten filament ring is plated with a nickel layer; then the electroplated tungsten filament is connected with a connecting clamp in a combination bin and embedded in a sand feeding frame, a nickel plate is clamped in a fixing clamp in the combination bin, then the nickel plate and the sand feeding frame are placed in electroplating liquid in the combination bin, a second power source is turned on, and a nickel layer is continuously electroplated while sand feeding is conducted, so that the diamond particles are wrapped with the nickel layer, and the diamond particles are thickened.

Description

Technical Field

[0001] This utility model relates to the field of wire electroplating, specifically to an electroplating device for diamond wire. Background Technology

[0002] Diamond wire, as a high-efficiency cutting tool, is widely used in industries such as photovoltaics and semiconductors. Its diameter, material, and surface treatment process have a significant impact on cutting efficiency, surface quality, and material loss. In the production process of diamond wire, the electroplating process has a significant impact on the performance of diamond wire. High-quality electroplating can ensure that diamond particles are evenly distributed and firmly attached to the wire substrate, thereby improving cutting efficiency and stability. It mainly uses current to drive the deposition of metal ions and the attachment of diamond, so that the diamond particles can be evenly and firmly attached to the wire substrate, thus completing the electroplating process.

[0003] In existing technologies, traditional wire electroplating equipment mainly consists of an electroplating tank, a sand-coating tank, a thickening tank, an anode, a cathode conductive device, an electroplating solution circulation system, and a temperature control system. The electroplating tank holds the electroplating solution; the sand-coating tank is responsible for the pretreatment and uniform distribution of diamond particles, ensuring their adhesion to the wire substrate; the thickening tank is responsible for forming a stable bond between the diamond particles and the wire substrate; the anode provides metal ions; the cathode conductive device ensures uniform current conduction to the wire substrate; the electroplating solution circulation system maintains the stability of the electroplating solution composition and temperature; and the temperature control system regulates and maintains a suitable electroplating temperature to ensure electroplating quality and efficiency, thereby completing the electroplating process.

[0004] However, in traditional wire plating equipment, the wire substrate needs to be sanded separately during the sanding process, and then placed in a thickening tank for continuous nickel plating. This process separates the sanding and thickening operations, which reduces the bonding between the diamond particles and the wire substrate, causing the diamond particles on the surface of the diamond wire to easily fall off when used later. Therefore, this utility model proposes an electroplating device for diamond wire to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this invention is to provide an electroplating device for diamond wire to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an electroplating device for diamond wire, comprising: an electroplating box, a plating chamber at one end of the electroplating box, a bonding chamber at the other end of the electroplating box, a first power supply installed at one end of the plating chamber, a fixing clamp and a connecting clamp installed inside the plating chamber, an upper sand frame installed inside the bonding chamber, and a second power supply installed at one end of the bonding chamber.

[0007] Preferably, the electroplating tank is in an overall cuboid structure. Two sets of installation grooves are provided on one side wall of the electroplating tank. The two sets of installation grooves are in an overall symmetrical structure. A first support frame and a second support frame are respectively and fixedly installed in the two sets of installation grooves. The first support frame is located at one end of the plating bin, and the second support frame is located at one end of the bonding bin.

[0008] Preferably, the first support frame is in an overall inverted "L" - shaped structure. The first support frame and the second support frame are in an overall symmetrical structure. Threaded holes are provided on one side of the vertical ends of the first support frame and the second support frame. A chute is provided on the upper side wall of the first support frame. The overall cross - section of the chute is in a "convex" - shaped structure. An inner cavity is provided at one end of the upper end of the first support frame.

[0009] Preferably, the first power supply and the second power supply are in an overall symmetrical structure. A hole is provided at the bottom of the first power supply. A screw rod is provided in the hole. The external thread of the screw rod is threadedly connected to the threaded hole provided on the first support frame. The positive electrodes of the first power supply and the second power supply are each electrically connected to a fixed clamp, and the negative electrodes of the first power supply and the second power supply are electrically connected to a connecting clamp.

[0010] Preferably, the bonding bin is in an overall symmetrical structure with the plating bin. A water collecting trough is provided on the bottom surface of the bonding bin. A delivery pipe is fixedly installed on the surface at the lowest point of the water collecting trough. The delivery pipe is in an overall inverted "L" - shaped structure. A support plate is fixedly installed on the inner wall of the bonding bin. An installation groove is provided on the surface of the support plate, and an upper sand frame is clamped in the installation groove.

[0011] Preferably, two sets of connecting clamps are provided and are electrically connected to the negative electrodes of the first power supply and the second power supply. A power supply wiring is provided at the upper end of the connecting clamp. The power supply wiring is wound around the surface of the wire bundling frame. A wire bundling disc is fixedly installed at the bottom of the wire bundling frame. A sliding plate is fixedly installed on the surface of the wire bundling frame close to the first support frame or the second support frame. Fixed screw rods are fixedly installed at both ends of the sliding plate. The whole sliding plate is clamped in the chute. The sliding plate can perform linear displacement in the chute. One end of the fixed screw rod is externally threaded and connected to a fixed nut.

[0012] Compared with the prior art, the beneficial effects of the present utility model are:

[0013] When the electroplating device for diamond wire proposed by the present utility model is in use, the nickel plate can be fixedly clamped in the fixed clamp, and at the same time, the tungsten wire coil is fixed in the connecting clamp. Then, both the nickel plate and the tungsten wire coil are placed in the electroplating solution in the plating bin. Then, the first power supply is turned on, so that a nickel layer is plated on the surface of the tungsten wire coil. Then, the tungsten wire plated with the nickel layer is connected to the connecting clamp in the bonding bin and placed in the diamond particles in the upper sand frame. A nickel plate is clamped in the fixed clamp in the bonding bin. Then, the nickel plate and the upper sand frame are placed in the electroplating solution in the bonding bin, and the second power supply is turned on, so that while sanding, the nickel layer is continuously electroplated to wrap the diamond particles and make it thicker, making the overall structure more stable, thus avoiding the problem of diamond particles falling off during the processing. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a top view of the structure of this utility model;

[0016] Figure 3 This is a schematic diagram of the rear structure of this utility model;

[0017] Figure 4 This is a schematic diagram of the structure of the wire harness of this utility model.

[0018] In the diagram: 1. Electroplating box; 2. Plating chamber; 3. Bonding chamber; 4. First power supply; 5. Fixing clamp; 6. Connecting clamp; 7. Upper sand frame; 8. Second power supply; 9. First support frame; 10. Second support frame; 11. Slide chute; 12. Conveying pipe; 13. Support plate; 14. Power wiring; 15. Cable tie; 16. Slide plate;

[0019] 17. Fix the screw. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clear and complete, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of this utility model, and are merely used to explain the embodiments of this utility model. They are not intended to limit the embodiments of this utility model. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0021] Example 1: Please refer to Figures 1-4 This utility model provides a technical solution: an electroplating device for diamond wire, comprising: an electroplating box 1, a plating chamber 2 opened at one end of the electroplating box 1, a connecting chamber 3 opened at the other end of the electroplating box 1, a first power supply 4 installed at one end of the plating chamber 2, a fixing clip 5 and a connecting clip 6 installed inside the plating chamber 2, an upper sand frame 7 installed inside the connecting chamber 3, and a second power supply 8 installed at one end of the connecting chamber 3;

[0022] In use, the nickel plate can be fixed in the fixing clamp 5, and the tungsten wire ring can be fixed in the connecting clamp 6. Then, both the nickel plate and the tungsten wire ring are placed in the electroplating solution in the plating chamber 2. Then, the first power supply 4 is turned on, so that the surface of the tungsten wire ring is plated with a nickel layer. Then, the nickel-plated tungsten wire is connected to the connecting clamp 6 in the bonding chamber 3 and placed in the diamond particles in the upper sand frame 7. The fixing clamp 5 in the bonding chamber 3 holds the nickel plate. Then, the nickel plate and the upper sand frame 7 are placed in the electroplating solution in the bonding chamber 3. The second power supply 8 is turned on, so that while sanding, a nickel layer is continuously electroplated to coat the diamond particles and thicken them, making the overall structure more stable. This avoids the problem of diamond particles falling off during processing.

[0023] Example 2: Based on Example 1, a bonding chamber 3 is provided to ensure a more stable bond between the wire base and the diamond particles. The bonding chamber 3 is symmetrical to the plating chamber 2. A water collection trough is formed on the bottom surface of the bonding chamber 3, and a conveying pipe 12 is fixedly installed at the lowest point of the water collection trough. The conveying pipe 12 has an inverted D-shaped structure. A support plate 13 is fixedly installed on the inner wall of the bonding chamber 3, and an installation groove is formed on the surface of the support plate 13. An upper sand frame 7 is inserted into the installation groove. The electroplating box 1 has a rectangular structure, and two sets of installation grooves are formed on one side wall of the electroplating box 1. The mounting slots are symmetrical in structure. A first support frame 9 and a second support frame 10 are fixedly installed in the two mounting slots respectively. The first support frame 9 is located at one end of the plating chamber 2, and the second support frame 10 is located at one end of the bonding chamber 3. The first power supply 4 and the second power supply 8 are symmetrical in structure. The bottom of the first power supply 4 has a hole, and a screw is installed in the hole. The screw is threaded to the threaded hole of the first support frame 9. The positive terminals of the first power supply 4 and the second power supply 8 are electrically connected to a fixing clip 5, and the negative terminals of the first power supply 4 and the second power supply 8 are electrically connected to a connecting clip 6.

[0024] During the electroplating process, the operator first secures the tungsten wire ring and nickel plate to the connecting clip 6 and fixing clip 5 in the plating chamber 2, respectively, and turns on the first power supply 4, thereby plating a nickel layer onto the surface of the tungsten wire ring. After plating, the plated tungsten wire is connected to the connecting clip 6 in the bonding chamber 3 and embedded into the diamond particles in the upper sand frame 7. The fixing clip 5 in the bonding chamber 3 also holds the nickel plate. Next, the entire upper sand frame 7 is placed on the surface of the support plate 13 in the bonding chamber 3, so that the entire upper sand frame 7 is immersed in the electroplating solution. Then, the second power supply 8 is turned on. Under the action of current drive, electrochemical deposition, and mechanical interlocking of diamond particles, nickel ions dissolve from the anode (nickel plate) and migrate to the cathode (tungsten wire surface), and then deposit on the tungsten wire surface to form a strong bond with the diamond particles. This process not only achieves uniform adhesion of diamond particles to the wire substrate, but also further enhances the bonding strength between the particles and the wire substrate by thickening the nickel layer, thereby making the bonding between the wire substrate and the diamond particles more stable.

[0025] Embodiment 3: On the basis of Embodiment 2, a first support frame 9 is provided for facilitating electroplating. The first support frame 9 is integrally in an inverted "L" - shaped structure. The first support frame 9 and the second support frame 10 are integrally in a symmetrical structure. Threaded holes are provided on one side of the vertical ends of the first support frame 9 and the second support frame 10. A chute 11 is provided on the side wall of the upper end of the first support frame 9. The overall cross - section of the chute 11 is in a "convex" - shaped structure. An inner cavity is provided at one end of the upper end of the first support frame 9; Two sets of connection clips 6 are provided and are electrically connected to the negative electrodes of the first power source 4 and the second power source 8. A power supply wire 14 is provided at the upper end of the connection clip 6. The power supply wire 14 is wound on the surface of the wire - bundling frame 15. A wire - bundling disc is fixedly installed at the bottom of the wire - bundling frame 15. A slide plate 16 is fixedly installed on the surface of the wire - bundling frame 15 close to the first support frame 9 or the second support frame 10. Fixing screws 17 are fixedly installed at both ends of the slide plate 16. The slide plate 16 is entirely stuck in the chute 11. The slide plate 16 can perform linear displacement in the chute 11. One end of the fixing screw 17 is externally thread - connected with a fixing nut;

[0026] For facilitating electroplating, a slide plate 16 is stuck in the chute 11 provided on the side wall of the upper end of the first support frame 9. If it is necessary to disassemble or move the wire - bundling frame 15, the fixing nuts at both ends of the slide plate 16 can be rotated to make the fixing nuts away from the first support frame 9, so that the wire - bundling frame 15 can perform linear movement along the chute 11 under the cooperation of the slide plate 16, thus realizing the disassembly of the wire - bundling frame 15. And water - collecting grooves are provided at the bottoms of the plating chamber 2 and the bonding chamber 3. Under the action of the water - collecting grooves, the delivery pipe 12 is more convenient for transporting or pumping the electroplating solution, thus being more convenient for the overall electroplating.

[0027] During actual use, the nickel plate can be fixedly stuck in the fixing clip 5, and at the same time, the tungsten wire coil is fixed in the connection clip 6. Then, both the nickel plate and the tungsten wire coil are placed in the electroplating solution in the plating chamber 2. Then, the first power source 4 is turned on, so that a nickel layer is plated on the surface of the tungsten wire coil. Then, the tungsten wire plated with the nickel layer is connected to the connection clip 6 in the bonding chamber 3 and is placed in the diamond particles in the upper - sand frame 7. A nickel plate is stuck in the fixing clip 5 in the bonding chamber 3. Then, the nickel plate and the upper - sand frame 7 are placed in the electroplating solution in the bonding chamber 3, and the second power source 8 is turned on, so that while sanding, the nickel layer is continuously electroplated to wrap the diamond particles and make it thicker, making the overall structure more stable, thus avoiding the problem of diamond particles falling off during the processing.

[0028] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A plating apparatus for a diamond wire, comprising: The utility model provides an electroplating box (1), and one end of the electroplating box (1) is provided with a plating layer bin (2), and the other end of the electroplating box (1) is provided with a combination bin (3), characterized in that: one end of the plating layer bin (2) is provided with a first power supply (4), and the plating layer bin (2) is provided with a fixed clamp (5) and a connecting clamp (6) inside; the combination bin (3) is provided with an upper sand frame (7) inside; and one end of the combination bin (3) is provided with a second power supply (8).

2. The electroplating device for a diamond wire according to claim 1, wherein: The electroplating box (1) is in the overall cuboid structure, and the sidewall of one end of the electroplating box (1) is provided with two groups of mounting grooves; the two groups of mounting grooves are in the overall symmetrical structure; the first supporting frame (9) and the second supporting frame (10) are respectively fixedly installed in the two groups of mounting grooves; the first supporting frame (9) is located at one end of the plating layer bin (2); and the second supporting frame (10) is located at one end of the combination bin (3).

3. The electroplating device for a diamond wire according to claim 2, wherein: The first supporting frame (9) is in the overall inverted "L" shape structure; the first supporting frame (9) and the second supporting frame (10) are in the overall symmetrical structure; the vertical end of the first supporting frame (9) and the vertical end of the second supporting frame (10) are both provided with threaded holes; the upper end of the first supporting frame (9) is provided with a sliding groove (11); the sliding groove (11) is in the overall "convex" cross-section structure; and one end of the upper end of the first supporting frame (9) is provided with an inner cavity.

4. The electroplating device for a diamond wire according to claim 1, wherein: The first power supply (4) and the second power supply (8) are in the overall symmetrical structure; the bottom of the first power supply (4) is provided with a hole; the hole is provided with a screw rod; the outer screw of the screw rod is in threaded connection with the threaded hole of the first supporting frame (9); the positive poles of the first power supply (4) and the second power supply (8) are both electrically connected with the fixed clamp (5); and the negative poles of the first power supply (4) and the second power supply (8) are both electrically connected with the connecting clamp (6).

5. The electroplating device for a diamond wire according to claim 1, wherein: The combination bin (3) is in the overall symmetrical structure with the plating layer bin (2); the bottom surface of the combination bin (3) is provided with a water collecting groove; the conveying pipe (12) is fixedly installed on the surface of the lowest point of the water collecting groove; the conveying pipe (12) is in the overall inverted "L" shape structure; the inner wall of the combination bin (3) is fixedly installed with a supporting plate (13); the surface of the supporting plate (13) is provided with a mounting groove; and the upper sand frame (7) is clamped in the mounting groove.

6. The electroplating device for a diamond wire according to claim 1, wherein: The connecting clamp (6) is provided with two groups and is electrically connected with the negative poles of the first power supply (4) and the second power supply (8); the upper end of the connecting clamp (6) is provided with a power supply wire (14); the power supply wire (14) is wound on the surface of the wire bundling frame (15); the wire bundling frame (15) is fixedly installed with a wire bundling disc at the bottom; the wire bundling frame (15) is fixedly installed with a sliding plate (16) on the upper end close to the first supporting frame (9) or the second supporting frame (10); the sliding plate (16) is fixedly installed with a fixed screw rod (17) at both ends; the sliding plate (16) is clamped in the sliding groove (11); the sliding plate (16) can linearly displace in the sliding groove (11); and the fixed screw rod (17) is externally connected with a fixed nut at one end.

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