Electronic component surface defect detection device

Abstract

The utility model relates to an electronic component surface defect detection device, and belongs to the technical field of electronic component detection. Comprising a base, a cleaning mechanism, a detecting mechanism and an adjusting mechanism, a U-shaped connecting plate and a back plate are arranged at the upper end of the base, the back plate is fixedly connected to one side of the base, the detecting mechanism is arranged on the side face of the back plate, the cleaning mechanism is arranged at the lower end of the connecting plate, and a buffering sponge layer is arranged on one side of the adjusting mechanism. The cleaning mechanism is arranged to be matched with the adjusting mechanism, so that dust and impurities on a device and a lens can be effectively cleaned at the same time, and the dust and impurities on the device and the lens are effectively prevented from influencing a defect detection result.

Description

Technical Field

[0001] This utility model relates to a surface defect detection device for electronic components, belonging to the field of electronic component testing technology. Background Technology

[0002] Electronic components are the basic building blocks of electronic systems. They can be single physical entities or collections of multiple physical entities. During the production of electronic components, machine vision technology is used to collect surface image information of semiconductor devices to detect surface defects, thereby strictly controlling product quality.

[0003] When inspecting electronic components, dust and impurities on the components and lenses can easily affect the acquired image information. They are inconvenient to clean and can affect the test results, reducing the accuracy of surface defect detection. Utility Model Content

[0004] The technical problem this invention aims to solve is that existing electronic component surface defect detection devices accumulate dust on the components and lenses during use, making cleaning difficult and affecting the detection results.

[0005] To solve the above problems, this utility model provides an electronic component surface defect detection device, including a base, a cleaning mechanism, a detection mechanism, and an adjustment mechanism. The upper end of the base is provided with a U-shaped connecting plate and a back plate. The back plate is fixedly connected to one side of the base. The detection mechanism is located on the side of the back plate. The cleaning mechanism is located at the lower end of the connecting plate. A buffer sponge layer is provided on one side of the adjustment mechanism.

[0006] The cleaning mechanism includes a cleaning ring, a cleaning cylinder, and a cleaning block. The cleaning ring is fixedly connected to the lower end of the connecting plate via a connecting column. The cleaning cylinder is located at the lower end of the connecting plate, and the cleaning block is fixedly connected to the lower end of the telescopic shaft of the cleaning cylinder.

[0007] Furthermore: the detection mechanism includes a detection head, an L-shaped fixing column, a fixing plate, and a motor. The motor is located on one side of the back plate, one end of the fixing column is fixedly connected to the output shaft of the motor, and both ends of the side of the fixing plate are fixedly connected to the detection head and the fixing column, respectively.

[0008] Furthermore: the adjustment mechanism includes an adjustment cylinder and an adjustment plate. The adjustment cylinder is disposed in a groove in the base. The output shaft of the adjustment cylinder is fixedly connected to the adjustment plate. The buffer sponge layer is fixedly connected to the side of the adjustment plate.

[0009] Furthermore, sliding columns are provided on both sides of the groove, and the lower ends of the adjustment plate are slidably connected to the sliding columns via sliding grooves.

[0010] Furthermore, both the cleaning block and the cleaning ring are made of elastic sponge material.

[0011] Furthermore, the rotation radius of the detection head is within the range of the connecting plate.

[0012] The advantages of this utility model compared with the prior art are as follows:

[0013] This patent, by setting up a cleaning mechanism in conjunction with an adjustment mechanism, can effectively clean dust and impurities on the device and lens simultaneously, effectively preventing dust and impurities on the device and lens from affecting the defect detection results. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0015] Figure 1 This utility model relates to the structure of a surface defect detection device for electronic components. Figure 1 .

[0016] Figure 2 This utility model relates to the structure of a surface defect detection device for electronic components. Figure 2 .

[0017] Figure 3 This is a cross-sectional view of an electronic component surface defect detection device according to the present invention.

[0018] Figure 4 This is a structural diagram of the cleaning cylinder and cleaning block of an electronic component surface defect detection device according to the present invention.

[0019] In the attached image:

[0020] 1. Base; 11. Sliding column; 2. Cleaning mechanism; 21. Cleaning ring; 22. Cleaning cylinder; 23. Cleaning block; 3. Detection mechanism; 31. Detection head; 32. Fixing column; 33. Fixing plate; 34. Motor; 4. Adjustment mechanism; 41. Buffer sponge layer; 42. Adjustment cylinder; 43. Adjustment plate. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Combined with appendix Figure 1 , 23. This utility model provides a surface defect detection device for electronic components, including a base 1, a cleaning mechanism 2, a detection mechanism 3, and an adjustment mechanism 4. The upper end of the base 1 is provided with a U-shaped connecting plate and a back plate. The back plate is fixedly connected to one side of the base 1. The detection mechanism 3 is located on the side of the back plate and includes a detection head 31, an L-shaped fixing post 32, a fixing plate 33, and a motor 34. The motor 34 is located on one side of the back plate. One end of the fixing post 32 is fixedly connected to the output shaft of the motor 34. Both ends of the side of the fixing plate 33 are fixedly connected to the detection head 31 and the fixing post 32, respectively. The rotation radius of the detection head 31 is within the range of the connecting plate. The adjustment mechanism 4 includes an adjustment cylinder 42 and an adjustment plate 43. 2 is located in the groove of the base 1, and sliding columns 11 are provided on both sides of the groove. The lower ends of the adjustment plate 43 are slidably connected to the sliding columns 11 through the sliding grooves. The output shaft of the adjustment cylinder 42 is fixedly connected to the adjustment plate 43. The buffer sponge layer 41 is fixedly connected to the side of the adjustment plate 43. When performing surface defect detection on electronic components, the pins of the electronic components are first inserted and fixed on the buffer sponge layer 41. The adjustment cylinder 42 drives the telescopic shaft to extend and move the device to the vicinity of the detection head 31. Then the detection head 31 performs defect detection on the device. During the detection process, the motor 34 can rotate the fixed column 32 so that the detection head 31 can detect the device from various angles, thereby improving the detection efficiency.

[0023] Combined with appendix Figure 1-4 The cleaning mechanism 2 is located at the lower end of the connecting plate. The cleaning mechanism 2 includes a cleaning ring 21, a cleaning cylinder 22, and a cleaning block 23. The cleaning ring 21 is fixedly connected to the lower end of the connecting plate through a connecting column. The cleaning cylinder 22 is located at the lower end of the connecting plate. The cleaning block 23 is fixedly connected to the lower end of the telescopic shaft of the cleaning cylinder 22. Both the cleaning block 23 and the cleaning ring 21 are made of elastic sponge material. When there is dust on the surface of the component or lens, the adjusting cylinder 42 drives the telescopic shaft to extend and retract, so that the component moves in the cleaning ring 21 to clean the side of the component. Then, the adjusting cylinder 42 stops the telescopic shaft from extending and retracting, and the cleaning cylinder 22 drives the cleaning block 23 to move up and down to clean the side of the lens and component. After cleaning, the adjusting cylinder 42 drives the telescopic shaft to extend so that the component is removed from the range of the cleaning ring 21, and then it can be tested.

[0024] The working principle of this application is as follows:

[0025] When there is dust on the surface of the component or lens, the adjusting cylinder 42 drives the telescopic shaft to extend and retract, allowing the component to move within the cleaning ring 21 to clean the side of the component. Then, the adjusting cylinder 42 stops the telescopic shaft extension and retraction, and the cleaning cylinder 22 drives the cleaning block 23 to move up and down to clean the lens and one side of the component. This can effectively clean the dust and impurities on the component and lens simultaneously, effectively preventing the dust and impurities on the component and lens from affecting the defect detection results. After cleaning, the adjusting cylinder 42 drives the telescopic shaft to extend, allowing the component to move out of the cleaning ring 21 range, and then the detection can be performed. During the detection, the pins of the electronic component are first inserted and fixed on the buffer sponge layer 41. The adjusting cylinder 42 drives the telescopic shaft to extend, moving the component to the vicinity of the detection head 31. Then, the detection head 31 performs defect detection on the component. During the detection process, the motor 34 can rotate the fixed column 32, allowing the detection head 31 to detect the component from various angles, thereby improving the detection efficiency.

[0026] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A surface defect detection device for electronic components, characterized in that: The utility model relates to a cleaning device for glass, including base (1), cleaning mechanism (2), detection mechanism (3), adjusting mechanism (4), the upper end of base (1) is equipped with the connecting plate and backplate of U type, backplate fixed connection in base (1) one side, detection mechanism (3) is equipped with backplate side, cleaning mechanism (2) is equipped with connecting plate lower extreme, adjusting mechanism (4) one side is equipped with buffer sponge layer (41), The cleaning mechanism (2) includes a cleaning ring (21), a cleaning cylinder (22) and a cleaning block (23), the cleaning ring (21) is fixedly connected to the lower end of the connecting plate through a connecting column, the cleaning cylinder (22) is arranged at the lower end of the connecting plate, and the cleaning block (23) is fixedly connected to the lower end of the telescopic shaft of the cleaning cylinder (22).

2. The electronic component surface defect inspection apparatus according to claim 1, wherein: The detection mechanism (3) includes a detection head (31), an L-shaped fixed column (32), a fixed plate (33) and a motor (34), the motor (34) is arranged on one side of the backplate, one end of the fixed column (32) is fixedly connected with the output shaft of the motor (34), and the fixed plate (33) is fixedly connected with the detection head (31) and the fixed column (32) at both ends of the side surface.

3. The electronic component surface defect inspection apparatus according to claim 1, wherein: The adjusting mechanism (4) includes an adjusting cylinder (42) and an adjusting plate (43), the adjusting cylinder (42) is arranged in the groove of the base (1), the output shaft of the adjusting cylinder (42) is fixedly connected with the adjusting plate (43), and the buffer sponge layer (41) is fixedly connected to the side surface of the adjusting plate (43).

4. The apparatus of claim 3, wherein: Both sides of the groove are provided with sliding columns (11), and both sides of the lower end of the adjusting plate (43) are slidably connected to the sliding columns (11) through sliding grooves.

5. The electronic component surface defect inspection apparatus according to claim 1, wherein: The cleaning block (23) and the cleaning ring (21) are both made of elastic sponge material.

6. The electronic component surface defect inspection apparatus according to claim 2, wherein: The rotating radius of the detection head (31) is within the range of the connecting plate.

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