Power amplifier chip screening test tool

Abstract

The utility model discloses a screening and testing tool for chips of a power amplifier. The screening and testing tool comprises a radiator and a plurality of mounting clamp assemblies arranged on the radiator, the mounting clamp assemblies are arranged in one-to-one correspondence with chips to be tested; the installation clamp assembly comprises a pressing plate, a chip installation groove formed in the pressing plate, a printed board arranged on the lower portion of the pressing plate, a chip carrying plate arranged on the lower portion of the printed board, a first connecting assembly and a second connecting assembly, wherein the first connecting assembly and the second connecting assembly are oppositely arranged on the pressing plate. The first connecting assembly comprises an overturning seat assembly arranged on the pressing plate, a transfer printed board arranged on the overturning seat assembly and a spring needle arranged on the transfer printed board; the overturning seat assembly overturns towards the to-be-tested chip, and the spring needle is in extrusion contact with the printed board; the switching printed board is electrically connected with the printed board, and the chip carrier board is electrically connected with the printed board. According to the scheme, the device has the advantages of simple structure, convenience in installation, high efficiency and reliability in testing and the like.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a power amplifier chip screening and testing fixture. Background Technology

[0002] Power amplifier chips are the core components in the production of power amplifier products, and the consistency of their various parameters directly determines the quality and stability of the power amplifier product, especially for combiner power amplifiers. Specifically, the phase or amplitude consistency of the chip determines the combining efficiency of the power amplifier. Because many power amplifier chips require additional external circuitry for testing these parameters, they cannot be tested directly on the wafer. Therefore, the chip and its power supply circuitry must first be assembled onto a carrier, and then tested on a probe station (for the most accurate testing) or coaxially. However, due to the limited adsorption area and lack of heat dissipation of the probe station, its efficiency is relatively low during mass production.

[0003] Therefore, there is an urgent need to propose a power amplifier chip screening and testing fixture that is simple in structure, easy to install, and highly efficient and reliable in testing. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this utility model is to provide a power amplifier chip screening and testing fixture. The technical solution adopted by this utility model is as follows:

[0005] A power amplifier chip screening and testing fixture is provided for testing several chips under test. The fixture includes a heat sink and several mounting fixture assemblies disposed on the heat sink. Each mounting fixture assembly is configured to correspond one-to-one with a chip under test. Each mounting fixture assembly includes a pressure plate, a chip mounting slot formed on the pressure plate, a printed circuit board disposed on the lower part of the pressure plate, a chip carrier board disposed on the lower part of the printed circuit board, and a first connecting assembly and a second connecting assembly disposed opposite to each other on the pressure plate.

[0006] The printed circuit board and the chip carrier are disposed at the lower part of the chip mounting slot; the chip under test is disposed on the chip carrier; the pressure plate presses the chip carrier onto the heat sink;

[0007] The first connection assembly includes a flip-up seat assembly disposed on a pressure plate, an adapter printed circuit board disposed on the flip-up seat assembly, and a spring pin disposed on the adapter printed circuit board; the flip-up seat assembly flips toward the chip under test, and the spring pin presses against the printed circuit board; the adapter printed circuit board and the printed circuit board are electrically connected.

[0008] Furthermore, the flip-up assembly includes a lower mounting block, an upper mounting block disposed on the lower mounting block, and a rotating shaft disposed between the lower mounting block and the upper mounting block; the rotating shaft is located on the side away from the chip under test; the lower mounting block is fixed on the pressure plate, and the adapter printed circuit board is fixed on the upper mounting block.

[0009] Furthermore, a lower mounting block has a lower locking groove on its side; a buckle assembly is hung between the lower mounting block and the upper mounting block; the lower part of the buckle assembly is placed in the lower locking groove.

[0010] Furthermore, the buckle assembly includes an L-shaped bracket and a snap pin disposed on the lower inner side of the L-shaped bracket; the snap pin is engaged in the lower snap pin groove, and the upper inner wall of the L-shaped bracket is engaged on the upper mounting block.

[0011] Furthermore, the first connecting component and the second connecting component have the same structure.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] (1) This utility model uses a pressure plate to press and attach the chip carrier to the heat sink, so as to facilitate heat conduction and heat dissipation during the test and ensure its heat dissipation reliability.

[0014] (2) This utility model uses a flip-type lower mounting block and an upper mounting block to mount the adapter printed circuit board on the upper mounting block. When installing or removing the chip under test, the flip-type lower mounting block and upper mounting block provide a larger operating space, making the installation and removal of the chip under test efficient and reliable.

[0015] (3) By setting up a buckle assembly, this utility model ensures that the spring pin is reliably pressed against the printed circuit board, thus ensuring reliable electrical contact.

[0016] In summary, this utility model has the advantages of simple structure, convenient installation, and efficient and reliable testing, and has high practical and promotional value in the field of chip testing technology. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope of protection. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the multi-chip test structure of this utility model.

[0019] Figure 2 This is a schematic diagram of the single-chip test structure of this utility model.

[0020] Figure 3 This is a schematic diagram of the first blasting operation of this utility model.

[0021] Figure 4 This is a schematic diagram of the second blasting operation of this utility model.

[0022] In the above figures, the component names corresponding to the reference numerals are as follows:

[0023] 100. Heat sink; 200. Chip under test; 1. Pressure plate; 2. First connecting component; 3. Second connecting component; 4. Chip carrier board; 5. Printed circuit board; 21. Lower mounting block; 22. Upper mounting block; 23. Rotating shaft; 24. Spring pin; 25. Adapter printed circuit board; 26. Snap-fit ​​assembly; 211. Lower snap slot; 261. L-shaped card holder; 262. Snap pin. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this application clearer, the present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of this utility model include, but are not limited to, the following embodiments. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0025] In this embodiment, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0026] The terms "first" and "second," etc., used in the specification and claims of this embodiment are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0027] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0028] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0029] like Figures 1 to 4As shown, this embodiment provides a power amplifier chip screening and testing fixture that can test several chips 200 under test. The power amplifier chip screening and testing fixture includes a heat sink 100 and several mounting fixture assemblies disposed on the heat sink 100. Each mounting fixture assembly corresponds to one chip 200 under test. Each mounting fixture assembly includes a pressure plate 1, a chip mounting slot formed on the pressure plate 1, a printed circuit board 5 disposed at the lower part of the pressure plate 1, a chip carrier board 4 disposed at the lower part of the printed circuit board 5, and a first connecting component 2 and a second connecting component 3 disposed opposite to each other on the pressure plate 1. The printed circuit board 5 and the chip carrier board 4 are disposed at the lower part of the chip mounting slot, and the chip 200 under test is disposed on the chip carrier board 4; furthermore, the pressure plate 1 presses and adheres the chip carrier board 4 to the heat sink 100. During the testing process, heat is transferred to the heat sink 100, ensuring its heat dissipation reliability.

[0030] In this embodiment, the first connecting component 2 and the second connecting component 3 have the same structure. Taking the first connecting component 2 as an example, it includes a flip-up seat assembly disposed on the pressure plate 1, an adapter printed circuit board 25 disposed on the flip-up seat assembly, and a spring pin 24 disposed on the adapter printed circuit board 25. Here, the flip-up seat assembly includes a lower mounting block 21, an upper mounting block 22 disposed on the lower mounting block 21, and a rotating shaft 23 disposed between the lower mounting block 21 and the upper mounting block 22. The rotating shaft 23 is located on the side away from the chip under test 200. In addition, the lower mounting block 21 is fixed on the pressure plate 1, and the adapter printed circuit board 25 is fixed on the upper mounting block 22. In this embodiment, the upper mounting block 22 is flipped toward the chip under test 200, so that the spring pin 24 is pressed into contact with the printed circuit board 5.

[0031] Since the lower mounting block 21 and the upper mounting block 22 are connected by a flip connection, in order to prevent unreliable contact between the spring pin 24 and the printed circuit board 5, a lower locking groove 211 is provided on the side of the lower mounting block 21, and a buckle assembly 26 is hung between the lower mounting block 21 and the upper mounting block 22. The buckle assembly 26 includes an L-shaped bracket 261 and a locking pin 262 located on the lower inner side of the L-shaped bracket 261. Here, by engaging the locking pin 262 into the lower locking groove 211, and with the upper inner wall of the L-shaped bracket 261 engaged with the upper mounting block 22, the lower mounting block 21 and the upper mounting block 22 can be tightly connected.

[0032] In use, remove the clip assembly 26, and flip the upper mounting block 22 outward (away from the chip under test 200) to expose the space between the printed circuit board 5 and the chip carrier board 4, so that the chip under test 200 can be installed. After the chip under test 200 is installed, flip the upper mounting block 22 inward so that the spring pin 24 is pressed against the printed circuit board 5, and the test can be performed.

[0033] The above embodiments are merely preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Any changes made based on the design principles of this utility model, or any non-creative changes made on this basis, shall fall within the scope of protection of this utility model.

Claims

1. A power amplifier chip screening test tool for testing a plurality of chips under test (200), characterized by, The application relates to a heat sink (100), a plurality of mounting clamp assemblies arranged on the heat sink (100), and a to-be-tested chip (200) corresponding to the mounting clamp assemblies; the mounting clamp assembly comprises a pressing plate (1), a chip mounting groove formed in the pressing plate (1), a printed board (5) arranged at the lower part of the pressing plate (1), a chip carrier plate (4) arranged at the lower part of the printed board (5), and a first connecting assembly (2) and a second connecting assembly (3) oppositely arranged on the pressing plate (1). The printed board (5) and the chip carrier plate (4) are arranged at the lower part of the chip mounting groove; the to-be-tested chip (200) is arranged on the chip carrier plate (4); and the pressing plate (1) presses the chip carrier plate (4) to adhere to the heat sink (100). The first connecting assembly (2) comprises a turnover seat assembly arranged on the pressing plate (1), an adapter printed board (25) arranged on the turnover seat assembly, and a spring needle (24) arranged on the adapter printed board (25); the turnover seat assembly turns over to the to-be-tested chip (200), and the spring needle (24) is in extrusion contact with the printed board (5); the adapter printed board (25) is electrically connected with the printed board (5) and the chip carrier plate (4).

2. The power amplifier chip screening test tool of claim 1, wherein, The turnover seat assembly comprises a lower mounting block (21), an upper mounting block (22) arranged on the lower mounting block (21), and a rotating shaft (23) arranged between the lower mounting block (21) and the upper mounting block (22); the rotating shaft (23) is located at the side far away from the to-be-tested chip (200); the lower mounting block (21) is fixed on the pressing plate (1), and the adapter printed board (25) is fixed on the upper mounting block (22).

3. The power amplifier chip screening test tool of claim 2, wherein, A lower clamping groove (211) is formed in the side edge of the lower mounting block (21); a clamping buckle assembly (26) is hung between the lower mounting block (21) and the upper mounting block (22); and the lower part of the clamping buckle assembly (26) is arranged in the lower clamping groove (211).

4. The power amplifier chip screening test tool of claim 3, wherein, The clamping buckle assembly (26) comprises an L-shaped clamping seat (261) and a clamping pin (262) arranged in the lower inner side of the L-shaped clamping seat (261); the clamping pin (262) is clamped in the lower clamping groove (211), and the upper inner wall of the L-shaped clamping seat (261) is clamped on the upper mounting block (22).

5. The power amplifier chip screening test tool of claim 1, wherein, The first connecting assembly (2) and the second connecting assembly (3) have the same structure.

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