Optical packaging module
By using a glass substrate and groove design, the substrate warping problem was solved, enabling a thinner and faster optical packaging module, which improves signal transmission speed and electrical connection reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2026-03-13
AI Technical Summary
In existing co-packaged optical devices, the substrate is prone to expansion and warping, leading to electrical connection failures.
A glass substrate is used instead of a plastic substrate, and grooves and glass perforations are formed on the glass substrate to house optical engines and electronic components, improving bending resistance, and achieving electrical connection through conductive components and filler layers.
It improves bending resistance, prevents substrate warping, reduces overall thickness, and increases signal transmission speed and electrical connection reliability.
Smart Images
Figure CN223992985U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor packaging structure, and more particularly to an optical packaging module. Background Technology
[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multifunctionality and high performance. The application of fifth-generation (5G) communication technology has expanded to various fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data needs to be efficiently transmitted, processed, and stored. The demand for data transmission, in particular, is surging, leading the industry to replace electricity with light as the data transmission medium. This aims to improve transmission capacity, efficiency, and distance while reducing energy consumption during transmission. Against this backdrop, co-packaged optical devices have become a future trend in semiconductor and packaging technologies.
[0003] Please see Figure 1 This is a cross-sectional schematic diagram of an existing co-packaged optical device 1, which mainly has an optical engine 11 set on a substrate 10. The optical engine 11 includes an electronic chip 112 formed in the packaging structure 111 and a photonic chip 113 attached to the packaging structure 111. One end of the photonic chip 113 is connected to an optical fiber 14, and a shelf 15 is provided below the junction of the photonic chip 113 and the optical fiber 14 to enable the optical signal to be transmitted to the optical engine 11 for communication. At the same time, a switching chip (switch IC) 12 needs to be attached to the substrate 10 in order to be used in the terminal product.
[0004] However, in the aforementioned co-packaged optical devices, the substrate has the disadvantage of being prone to expansion and warping when heated, causing problems in the application of end products.
[0005] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content
[0006] In view of the various deficiencies of the prior art, this application provides an optical packaging module, including: a glass substrate having a first side and a second side opposite to each other, and a groove formed on the first side; an optical engine disposed in the groove and electrically connected to the glass substrate; and an electronic component disposed on the glass substrate and electrically connected to the glass substrate.
[0007] This application also provides a method for manufacturing an optical packaging module, comprising: providing a glass substrate having a first side and a second side opposite to each other, and forming a groove on the first side; disposing an optical engine in the groove and electrically connecting it to the glass substrate; and disposing electronic components on the glass substrate and electrically connecting them to the glass substrate.
[0008] In the aforementioned optical packaging module and its manufacturing method, a plurality of glass through holes are formed in the glass substrate, connecting the first side and the second side.
[0009] In the aforementioned optical packaging module and its manufacturing method, the groove is formed on the first side and surrounds the edge of the first side.
[0010] In the aforementioned optical packaging module and its manufacturing method, the optical engine includes an electronic chip formed in the packaging structure and a photonic chip disposed on the packaging structure. The photonic chip is electrically connected to the electronic chip through the packaging structure. The electronic chip is an integrated electronic circuit element, and the photonic chip is a photonic integrated circuit element.
[0011] In the aforementioned optical packaging module and its manufacturing method, the electronic component is a switching chip, which is connected to the first side of the glass substrate via multiple conductive elements. Furthermore, a filler layer covering the multiple conductive elements is formed between the electronic component and the glass substrate.
[0012] As can be seen from the above, in the optical packaging module of this application, a glass substrate is mainly used instead of a plastic substrate to improve the bending resistance and avoid electrical connection failure caused by substrate warping. At the same time, grooves are formed on the surface of the glass substrate to accommodate the optical engine, thereby reducing the overall thickness and size. In addition, glass through holes are formed in the glass substrate, which allow electronic components to be electrically connected to the glass through holes. In addition to being electrically connected to the glass substrate, they can also be electrically connected to the support structure placed below the glass substrate, thereby increasing the signal transmission speed. Attached Figure Description
[0013] Figure 1 This is a cross-sectional schematic diagram of an existing co-packaged optical device.
[0014] Figures 2A to 2C This is a cross-sectional schematic diagram of the optical packaging module and its manufacturing method according to this application.
[0015] Figure 3 This is a top view schematic diagram of the optical packaging module of this application.
[0016] Explanation of reference numerals in the attached figures
[0017] 1. Co-packaged optical devices
[0018] 10 substrate
[0019] 11 Optical Engine
[0020] 111 Package Structure
[0021] 112 Electronic Chip
[0022] 113 Photonic Chips
[0023] 12 Switching chips
[0024] 14 optical fibers
[0025] 15 brackets
[0026] 2 Optical Packaging Module
[0027] 20 Glass substrate
[0028] 20a First side
[0029] 20b Second side
[0030] 200 grooves
[0031] 201 Glass perforation
[0032] 21 Optical Engines
[0033] 211 Package Structure
[0034] 212 Electronic Chip
[0035] 213 Photonic Chip
[0036] 22 Electronic components
[0037] 220 Conductive component
[0038] 221 Fill layer
[0039] 24 fiber optic cables
[0040] 25. Brackets. Detailed Implementation
[0041] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0042] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," "third," and "one" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0043] Please see Figures 2A to 2C This is a cross-sectional schematic diagram illustrating the manufacturing process of the optical packaging module of this application.
[0044] like Figure 2A As shown, a glass substrate 20 is provided, having a first side 20a and a second side 20b opposite to each other, and at least one groove 200 is formed on the first side 20a (this example shows that the first side 20a has multiple grooves 200), and multiple glass through-holes (TGVs) 201 communicating with the first side 20a and the second side 20b are formed in the glass substrate 20.
[0045] The glass substrate 20 possesses unique advantages, such as ultra-low flatness (extremely flatness), better thermal stability, and mechanical stability. Because the glass substrate 20 is extremely flat, it improves the focusing depth of photolithography, allowing for a significantly greater number of apertures per square meter of area compared to organic materials. Therefore, the spacing between the glass through-holes 201 can be less than 100 micrometers, enabling increased interconnect density for subsequent electronic components (chips). Furthermore, the coefficient of thermal expansion of the glass substrate 20 is closer to that of the electronic components, and its higher temperature tolerance reduces deformation and increases reliability.
[0046] Additionally, a circuit layer (e.g., a redistribution layer (RDL)) may be formed on the first side 20a and / or the second side 20b of the glass substrate 20. The groove 200 may be formed by laser cutting or other methods.
[0047] like Figure 2B As shown, an optical engine 21 is provided in each of the grooves 200.
[0048] The optical engine 21 includes an electronic chip 212 formed in the packaging structure 211 and a photonic chip 213 attached to the packaging structure 211. One end of the photonic chip 213 is connected to an optical fiber 24, and a bracket 25 is provided below the junction of the photonic chip 213 and the optical fiber 24 to enable the optical signal to be transmitted to the optical engine 21 for communication.
[0049] The electronic chip 212 is, for example, an electronic integrated circuit (EIC), and the photonic chip 213 is, for example, a photonic integrated circuit (PIC). Furthermore, the optical engine 21 can be electrically connected to the glass substrate 20 via multiple conductive elements.
[0050] like Figure 2C As shown, at least one electronic component 22 is disposed on and electrically connected to the glass substrate 20.
[0051] The electronic component 22 is, for example, a switching chip, which can be placed on the first side 20a of the glass substrate 20 through multiple conductive elements 220 and electrically connected to the glass substrate 20. A filling layer 221 covering the multiple conductive elements 220 can be formed between the electronic component 22 and the glass substrate 20 to obtain the optical packaging module 2 of this application.
[0052] In this embodiment, the electronic component 22 can be electrically connected to the glass substrate through the plurality of glass through-holes 201 to improve signal transmission speed.
[0053] Please refer to the following at the same time. Figure 2C and Figure 3 Through the aforementioned manufacturing method, this application discloses an optical packaging module 2, which includes: a glass substrate 20 having a groove 200; an optical engine 21 disposed in the groove 200; and an electronic component 22 disposed on the glass substrate 20.
[0054] The glass substrate 20 has opposing first sides 20a and second sides 20b, and forms a plurality of glass perforations 201. A groove 200 is formed on the first side 20a and surrounds the edge of the first side 20a, and a plurality of optical engines 21 are disposed in the groove 200. The optical engines 21 and the electronic components 22 can be electrically connected to the glass substrate 20 and the subsequent support structure placed below the glass substrate 20 through the glass perforations 201.
[0055] The optical engine 21 includes a package structure 211, an electronic chip 212 embedded in the package structure 211, and a photonic chip 213 disposed on the package structure 211, so that the photonic chip 213 is electrically connected to the electronic chip 212 through the package structure.
[0056] In summary, the optical packaging module and its manufacturing method of this application mainly use a glass substrate instead of a plastic substrate to improve the bending resistance and avoid electrical connection failure caused by substrate warping. At the same time, grooves are formed on the surface of the glass substrate to accommodate the optical engine, thereby reducing the overall thickness and size. In addition, glass through holes are formed in the glass substrate, which allow electronic components to be electrically connected to the glass through holes. In addition to being electrically connected to the glass substrate, they can also be electrically connected to the support structure placed below the glass substrate, thereby increasing the signal transmission speed.
[0057] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. An optical package module, characterized by comprising: Comprising: a glass substrate having opposite first and second sides, and a recess formed in the first side; an optical engine disposed in the recess and electrically connected to the glass substrate; and an electronic component disposed on the glass substrate and electrically connected to the glass substrate.
2. The optical packaging module as described in claim 1, characterized in that, The glass substrate has a plurality of glass vias formed therein that communicate between the first and second sides.
3. The optical packaging module as described in claim 1, characterized in that, The recess is formed in the first side and surrounds an edge of the first side.
4. The optical packaging module as described in claim 1, characterized in that, The optical engine includes an electronic chip formed in a package structure and a photonic chip disposed on the package structure.
5. The optical packaging module as described in claim 4, characterized in that, The photonic chip is electrically connected to the electronic chip through the package structure.
6. The optical package module of claim 4, wherein the optical package module is configured to be mounted on a printed circuit board (PCB) and the optical package module is configured to be mounted on the PCB in a direction perpendicular to the PCB. The electronic chip is an electronic integrated circuit component and the photonic chip is a photonic integrated circuit component.
7. The optical packaging module as described in claim 1, characterized in that, The electronic component is a switch chip that is disposed on the first side of the glass substrate through a plurality of conductive members.
8. The optical packaging module as described in claim 7, characterized in that, A fill layer is formed between the electronic component and the glass substrate that encapsulates the plurality of conductive members.