Optical module

Abstract

The utility model provides an optical module which comprises a laser chip, a driving chip, a monitor and an MCU, and the driving chip is connected with the MCU. The monitor is used for monitoring the laser chip. The driving chip comprises a first output pin and a first control pin, the first output pin is connected with the laser chip, and the first control pin is connected with the MCU. And a second output pin of the MCU is connected with a first control pin of the driving chip. And a monitoring pin of the MCU is connected with the monitor so as to determine that the light emitting power of the first light signal is stable according to a monitoring result of the monitor. The MCU comprises a controller, the controller is used for setting the bias current as a first current value and then setting the bias current as a second current value after the light emitting power is stable, and the first current value is smaller than the second current value. The first current value is a low value, so that the light emitting power of the laser chip is not too high when the laser chip is started, and the light overshoot phenomenon is reduced.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing. Utility Model Content

[0003] This disclosure provides an optical module that reduces the occurrence of optical overshoot.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] Circuit board;

[0006] A laser chip, connected to the circuit board, is used to emit a first light / optical signal;

[0007] Driver chip, including:

[0008] The first output pin is connected to the laser chip to output bias current;

[0009] First control pin;

[0010] A monitor is used to monitor the laser chip;

[0011] An MCU is mounted on the surface of a circuit board. Its second output pin is connected to the first control pin to control the output bias current of the driver chip. The monitoring pin of the MCU is connected to the monitor to determine the stability of the output power of the first optical / optical signal based on the monitoring results of the monitor.

[0012] The MCU includes:

[0013] The controller is used to set the bias current to a first current value, and after the output light power stabilizes, set the bias current to a second current value, wherein the first current value is less than the second current value.

[0014] The above technical solution has the following beneficial effects: This disclosure provides an optical module, including a circuit board and a laser chip. The laser chip is connected to the circuit board and is used to emit a first optical / optical signal. The optical module also includes a driver chip, a monitor, and an MCU. The driver chip is connected to the MCU so that the MCU can control the driver chip to output a bias current. The monitor is used to monitor the laser chip. The driver chip includes a first output pin and a first control pin. The first output pin is connected to the laser chip to output a bias current through the first output pin. The first control pin is connected to the MCU so that the MCU can control the driver chip to output a bias current. The MCU is disposed on the surface of the circuit board. The second output pin of the MCU is connected to the first control pin of the driver chip to control the driver chip to output a bias current. The monitoring pin of the MCU is connected to the monitor to determine the stability of the output power of the first optical signal based on the monitoring results of the monitor. When the optical module is started at a high temperature greater than 40°C, the actual temperature of the laser chip has not yet reached the high temperature. Under the same bias current, the output power of the laser chip will be very high, which will lead to optical overshoot. The MCU includes a controller. The controller first sets the bias current to a first current value. After the output power stabilizes, it sets the bias current to a second current value, where the first current value is lower than the second current value. The lower first current value ensures that the output power of the laser chip is not too high during startup, reducing optical overshoot. Stable output power indicates that the actual temperature of the laser chip has reached a high temperature. Once the actual temperature of the laser chip gradually stabilizes, the controller gradually increases the bias current output by the driver chip to the second current value to ensure the normal operation of the laser chip.

[0015] In some embodiments, an optical module is provided in which the first current value is less than 50% of the second current value.

[0016] The above technical solution has the following beneficial effects: the first current value is less than 50% of the second current value, which can ensure that the output power of the laser chip is effectively limited to a low level in the initial stage of optical module startup, thereby greatly reducing the risk of optical overshoot.

[0017] In some embodiments, an optical module is provided, the monitor comprising:

[0018] A backlight detector is located in the backlight direction of the laser chip to receive the second light / optical signal emitted by the laser chip and convert the second light / optical signal into a monitoring current;

[0019] The monitoring pin includes a first monitoring pin, which is connected to the backlight detector;

[0020] The MCU also includes:

[0021] A register used to store a first preset range;

[0022] The controller is used to determine that the output power is stable based on the difference between two adjacent monitored currents being within the first preset range.

[0023] The above technical solution has the following beneficial effects: The monitor includes a backlight detector located in the backlight direction of the laser chip to receive the second light / optical signal emitted by the laser chip and convert the second light / optical signal into a monitoring current. The MCU's monitoring pins include a first monitoring pin connected to the backlight detector so that the MCU can obtain the monitoring current. The MCU also includes a register for storing a first preset range. The controller is used to determine whether the optical power is stable based on the difference between two adjacent monitoring currents falling within the first preset range, thereby realizing the function of determining whether the optical power is stable based on the monitoring current.

[0024] In some embodiments, an optical module is provided, the monitor comprising:

[0025] A backlight detector is located in the backlight direction of the laser chip to receive the second light / optical signal emitted by the laser chip and convert the second optical signal into a monitoring current;

[0026] The monitoring pin includes a first monitoring pin, which is connected to the backlight detector;

[0027] The MCU also includes:

[0028] A register used to store a second preset range;

[0029] The controller is used to determine that the output light power is stable based on the difference between the monitoring optical power corresponding to two adjacent monitoring currents being within the second preset range.

[0030] The above technical solution has the following beneficial effects: The monitor includes a backlight detector located in the backlight direction of the laser chip to receive the second optical / optical signal emitted by the laser chip and convert the second optical / optical signal into a monitoring current. The MCU's monitoring pins include a first monitoring pin connected to the backlight detector so that the MCU can obtain the monitoring current. The MCU also includes a register for storing a second preset range. The controller is used to determine whether the optical power is stable based on the difference between the monitoring optical power corresponding to two adjacent monitoring currents falling within the second preset range, thereby realizing the function of determining whether the optical power is stable based on the monitoring current.

[0031] In some embodiments, an optical module is provided, the monitor comprising:

[0032] A temperature sensing element is used to monitor the actual temperature of the laser chip.

[0033] The monitoring pin includes a second monitoring pin, which is connected to the temperature sensing element;

[0034] The MCU also includes:

[0035] The register is used to store the third preset range and preset temperature.

[0036] The controller is used to determine that the output power is stable based on the difference between the actual temperature and the preset temperature being within the third preset range.

[0037] The above technical solution has the following beneficial effects: The monitor includes a temperature sensing element, which is used to monitor the actual temperature of the laser chip. The MCU's monitoring pin includes a second monitoring pin, which is connected to the temperature sensing element to obtain the actual temperature of the laser chip. The MCU also includes a register, which is used to store a third preset range and a preset temperature. The controller is used to determine whether the optical power is stable based on the difference between the actual temperature and the preset temperature falling within the third preset range, thereby realizing the function of determining whether the optical power is stable based on the actual temperature.

[0038] In some embodiments, an optical module is provided, the monitor comprising:

[0039] A temperature sensing element is used to monitor the actual temperature of the laser chip.

[0040] The monitoring pin includes a second monitoring pin, which is connected to the temperature sensing element;

[0041] The MCU also includes:

[0042] The register is used to store the third preset range and preset temperature.

[0043] The controller is used to determine that the output power is stable based on the fact that the difference between the actual temperature and the preset temperature is within the third preset range, and the difference between two adjacent monitoring currents is within the first preset range.

[0044] The above technical solution has the following beneficial effects: The monitor includes a temperature sensing element, which is used to monitor the actual temperature of the laser chip. The MCU's monitoring pin includes a second monitoring pin, which is connected to the temperature sensing element to obtain the actual temperature of the laser chip. The MCU also includes a register, which is used to store a third preset range and a preset temperature. The controller is used to determine that the optical power is stable based on the difference between the actual temperature and the preset temperature being within the third preset range, and the difference between two adjacent monitored currents being within the first preset range, thereby further reducing the occurrence of optical overshoot.

[0045] In some embodiments, an optical module is provided, further comprising:

[0046] A semiconductor cooler, on which the temperature sensing element and laser chip are disposed;

[0047] Control circuit, including:

[0048] The output pin is connected to the semiconductor cooler;

[0049] The second control pin is connected to the third output pin of the MCU.

[0050] The above technical solution has the following beneficial effects: The optical module also includes a semiconductor cooler and a control circuit. The semiconductor cooler is equipped with a temperature sensing element and a laser chip, ensuring that the actual temperature of the semiconductor cooler detected by the temperature sensing element is the actual temperature of the laser chip. The control circuit includes an output pin and a second control pin. The output pin is connected to the semiconductor cooler to output operating current to the semiconductor cooler. The second control pin is connected to the third output pin of the MCU, allowing the MCU to control the control circuit to output operating current through the third output pin.

[0051] In some embodiments, an optical module is provided, comprising:

[0052] Circuit board;

[0053] A laser chip, connected to the circuit board, is used to emit a first light / optical signal;

[0054] Driver chip, including:

[0055] The first output pin is connected to the laser chip to output bias current;

[0056] First control pin;

[0057] The MCU is mounted on the surface of the circuit board, and its second output pin is connected to the first control pin to control the output bias current of the driver chip.

[0058] The MCU includes:

[0059] Registers are used to store delay times;

[0060] The controller is configured to set the bias current to a first current value, and after the delay time, set the bias current to a second current value, wherein the first current value is less than the second current value.

[0061] The above technical solution has the following beneficial effects: This disclosure provides an optical module, including a circuit board and a laser chip. The laser chip is connected to the circuit board for emitting a first optical / optical signal. The optical module also includes a driver chip and an MCU. The driver chip is connected to the MCU so that the MCU can control the driver chip to output a bias current. The driver chip includes a first output pin and a first control pin. The first output pin is connected to the laser chip to output a bias current through the first output pin. The first control pin is connected to the MCU so that the MCU can control the driver chip to output a bias current. The MCU is disposed on the surface of the circuit board. The second output pin of the MCU is connected to the first control pin of the driver chip to control the driver chip to output a bias current. The optical module starts at a high temperature greater than 40°C. The actual temperature of the laser chip has not yet reached the high temperature. Under the same bias current, the output power of the laser chip will be very high, which will lead to optical overshoot. The MCU includes a register for storing a delay time. The register is connected to the controller so that the controller can read the delay time from the register. The controller first sets the bias current to a first current value, and after a delay, sets it to a second current value, where the first current value is less than the second. The lower first current value ensures that the laser chip's output power is not excessive during startup, reducing optical overshoot. After the delay, the laser chip's actual temperature reaches a high level. Once the actual temperature of the laser chip gradually stabilizes, the controller gradually increases the bias current output by the driver chip to the second current value to ensure the normal operation of the optical module.

[0062] In some embodiments, an optical module is provided, the monitor comprising:

[0063] A temperature sensing element is used to monitor the actual temperature of the laser chip.

[0064] The monitoring pin includes a second monitoring pin, which is connected to the temperature sensing element;

[0065] The MCU also includes:

[0066] The register is used to store the third preset range and preset temperature.

[0067] The controller is used to set the bias current to a second current value within the third preset range based on the difference between the actual temperature and the preset temperature during the delay period.

[0068] The above technical solution has the following beneficial effects: The monitor includes a temperature sensing element, which is used to monitor the actual temperature of the laser chip. The MCU's monitoring pin includes a second monitoring pin, which is connected to the temperature sensing element to obtain the actual temperature of the laser chip. The MCU also includes a register, which is used to store a third preset range and a preset temperature. During the delay period, if the difference between the actual temperature and the preset temperature is within the third preset range, the controller sets the bias current to a second current value. After the delay period, the controller sets the bias current to the second current value. The controller is used to set the bias current to the second current value during the delay period based on the difference between the actual temperature and the preset temperature being within the third preset range, so that the optical module can start working normally as soon as possible.

[0069] In some embodiments, an optical module is provided, further comprising:

[0070] The first lens is located in the light-emitting direction of the laser chip;

[0071] An optical fiber adapter is located in the converging direction of the first lens to receive the first optical signal converged by the first lens.

[0072] The above technical solution has the following beneficial effects: The optical module further includes a first lens and an optical fiber adapter. The first lens is located in the light-emitting direction of the laser chip to receive the first optical signal emitted by the laser chip and to converge the light. The optical fiber adapter is located in the convergence direction of the first lens so that the optical fiber adapter can receive the first optical signal converged by the first lens, enabling the optical module to emit the first optical signal. Attached Figure Description

[0073] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0074] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments;

[0075] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0076] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0077] Figure 4 An exploded view of an optical module according to some embodiments;

[0078] Figure 5 This is an internal structural diagram of an optical module according to some embodiments;

[0079] Figure 6 This is a partial principle of the internal structure of an optical module according to some embodiments. Figure 1 ;

[0080] Figure 7 This is a structural diagram of an MCU provided according to some embodiments;

[0081] Figure 8 This is a partial principle of the internal structure of an optical module according to some embodiments. Figure 2 ;

[0082] Figure 9 This is a partial principle of the internal structure of an optical module according to some embodiments. Figure 3 ;

[0083] Figure 10 This is a partial principle of the internal structure of an optical module according to some embodiments. Figure 4 ;

[0084] Figure 11 This is a partial principle of the internal structure of an optical module according to some embodiments. Figure 5 ;

[0085] Figure 12 This is a partial principle of the internal structure of an optical module according to some embodiments. Figure 6 ;

[0086] Figure 13 This is a method flow for adjusting bias current according to some embodiments. Figure 1 ;

[0087] Figure 14 This is a method flow for adjusting bias current according to some embodiments. Figure 2 . Detailed Implementation

[0088] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0089] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0090] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0091] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0092] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0093] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0094] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0095] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0096] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0097] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0098] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0099] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0100] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0101] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0102] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0103] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0104] Figure 2 This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0105] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0106] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0107] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0108] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0109] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0110] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0111] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0112] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0113] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0114] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0115] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0116] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0117] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0118] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0119] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0120] In some implementations, the gold fingers are located on the surface of one side of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers are set on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is large.

[0121] In some implementations, the gold fingers of the circuit board extend from the electrical port and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0122] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0123] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0124] In some embodiments, the optical module includes a light emitting component 400, such as... Figure 3 and Figure 4 As shown. The light emitting component 400 is used to emit light signals.

[0125] In some embodiments, the optical module includes an optical receiving component 500, such as... Figure 3 and Figure 4 As shown. The optical receiving unit 500 is used to receive optical signals and convert them into electrical signals.

[0126] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold fingers.

[0127] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0128] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0129] In some embodiments, a driver chip 320 may be disposed on the surface of the circuit board 300. The driver chip 320 may be connected to the laser chip of the light emitting component 400 to provide a driving signal to the laser chip, so that the laser chip can emit light / light signals under the action of the driving signal.

[0130] In some embodiments, an MCU 310 may be disposed on the surface of the circuit board 300. The MCU 310 may be connected to the driver chip 320 to control the driver chip 320 to output a drive signal. The drive signal may be a bias current.

[0131] Figure 5 This is an internal structural diagram of an optical module according to some embodiments. Figure 5 As shown, in some embodiments, the light emitting component 400 may include a laser chip 410, which can emit light / optical signals. For example, the laser chip is a distributed feedback laser (DFB chip), which emits light under the action of a driving signal. Alternatively, the laser chip may be an electroabsorption modulated laser (EML chip), which emits light under the action of a driving signal and modulates the light into an optical signal under the action of a modulation signal. The modulation signal can be a modulation current or a modulation voltage.

[0132] The light / light signal emitted by the laser chip 410 may include a first light / light signal and a second light / light signal. The first light / light signal is emitted in the light-emitting direction of the laser chip 410, and the second light / light signal is emitted in the backlight direction of the laser chip 410.

[0133] When the laser chip is a DFB chip, it directly emits a first beam and a second beam. The optical module also includes an optical modulator, which can be located in the emission direction of the laser chip to receive the first beam emitted by the laser chip. The optical modulator can modulate the first beam into a first optical signal.

[0134] When the laser chip is an EML chip, the laser chip directly emits the first optical signal and the second optical signal, and no separate optical modulator is required.

[0135] In some embodiments, the light emitting component 400 may include a first lens 440. The first lens 440 may be located in the light emission direction of the laser chip 410 so that the first lens 440 can receive the first light signal emitted by the laser chip 410. The first lens 440 may be a converging lens so that the first light signal emitted by the laser chip 410 is focused.

[0136] In some embodiments, the optical emitting component 400 may include an optical fiber adapter 450. The optical fiber adapter 450 may be located in the convergence direction of the first lens 440 so that the optical fiber adapter 450 can receive the first optical signal converged by the first lens 440, thereby enabling the optical module to emit the first optical signal.

[0137] In some embodiments, the light emitting component 400 may include a backlight detector. The backlight detector may be located in the backlight direction of the laser chip 410 so that the backlight detector can receive the second light / light signal emitted by the laser chip 410.

[0138] In some embodiments, the light emitting component 400 may include a thermoelectric cooler (TEC) 420. A laser chip 410 may be placed on the thermoelectric cooler 420 to control the actual temperature of the laser chip 410 within a target temperature range.

[0139] In some embodiments, the light emitting component 400 may include a temperature sensing element 432. The temperature sensing element 432 may be placed around the laser chip 410 to collect the actual temperature around the laser chip 410, thereby enabling monitoring of the actual temperature of the laser chip 410. The temperature sensing element 432 may also be placed on the thermoelectric cooler 420 to collect the actual temperature of the thermoelectric cooler 420 and identify the actual temperature of the thermoelectric cooler 420 as the actual temperature of the laser chip 410, thereby enabling monitoring of the actual temperature of the laser chip 410.

[0140] The temperature sensing element 432 can be a thermistor. A thermistor is a temperature-sensitive component whose resistance changes with temperature. Therefore, the actual temperature around the thermistor can be determined by its resistance value.

[0141] The preset high temperature is greater than 40°C. The optical module starts up at the preset high temperature, meaning it starts at a temperature greater than 40°C. When the optical module first starts up, the actual temperature of the laser chip 410 has not yet reached the preset high temperature. Since the lower the actual temperature of the laser chip 410 under the same bias current, the higher the output power of the laser chip 410, when the optical module starts up at the preset high temperature, the bias current supplied to the laser chip is set to the bias current corresponding to the preset temperature of the optical module. This results in a very high output power of the laser chip, exceeding the output power threshold and causing optical overshoot.

[0142] To address this issue, in some embodiments, after the optical module is powered on, the MCU first sets the bias current to a first current value. Once the output optical power stabilizes, the bias current is then set to a second current value, which is greater than the first current value. The lower first current value ensures that the output optical power of the laser chip 410 is not excessive during startup, reducing optical overshoot. After the actual temperature of the laser chip 410 gradually stabilizes, the MCU controls the bias current output by the driver chip to gradually increase to the second current value, ensuring the normal operation of the laser chip 410. This method effectively controls the output optical power of the laser chip 410, reduces optical overshoot, and improves the stability and reliability of the optical module.

[0143] In some embodiments, the first current value can be less than 50% of the second current value, which ensures that the output power of the laser chip 410 is effectively limited to a low level during the initial startup of the optical module, thereby greatly reducing the risk of optical overshoot. As the actual temperature of the laser chip 410 gradually rises and stabilizes, the MCU gradually adjusts the bias current to the second current value to meet the requirements for normal operation of the optical module. Experiments have shown that when the first current value is 30%-50% of the second current value, optical overshoot is reduced by 60%-90%.

[0144] Furthermore, the ratio between the first and second current values ​​can be flexibly adjusted according to the actual application scenario and the characteristics of the laser chip 410 to achieve optimal startup performance and stability. This strategy of dynamically adjusting the bias current not only improves the performance of the optical module but also extends the lifespan of the laser chip 410.

[0145] Figure 6 This is a partial principle of the internal structure of an optical module according to some embodiments. Figure 1 . Figure 7This is a structural diagram of an MCU provided according to some embodiments. For example... Figure 6 and Figure 7 As shown, in some embodiments, the driver chip 320 may include a first control pin 321. The first control pin 321 may be connected to the MCU 310 so that the MCU 310 can control the driver chip 320 to output a bias current.

[0146] In some embodiments, the driver chip 320 may include a first output pin 322. The first output pin 322 may be electrically connected to the laser chip 410 so that the driver chip 320 outputs a bias current to the laser chip 410, and the laser chip 410 emits light under the action of the bias current.

[0147] In some embodiments, MCU310 may include a second output pin 313. The second output pin 313 may be connected to a first control pin 321 of driver chip 320 to enable electrical connection between MCU310 and driver chip 320.

[0148] In some embodiments, MCU310 may include register 311. Register 311 may store a delay time. After the delay time, it indicates that the actual temperature of laser chip 410 has reached a preset temperature, that is, the output power of laser chip 410 is stable.

[0149] The delay time can be dynamically adjusted according to the thermal response characteristics of the laser chip. That is, the delay time can be preset according to the overshoot time of the optical module and stored in register 311. For example, the delay time can be from 5ms to 100ms.

[0150] In some embodiments, MCU 310 may include controller 312. Controller 312 may be connected to register 311 so that controller 312 can read and write data stored in register 311.

[0151] After the optical module is started, the controller 312 can first set the bias current to a first current value, and after a delay time, that is, after the optical module's output power stabilizes, set the bias current to a second current value.

[0152] Figure 8 This is a partial principle of the internal structure of an optical module according to some embodiments. Figure 2 .like Figure 7 and Figure 8 As shown, in some embodiments, the optical module may include a monitor 430. The monitor 430 may monitor the laser chip 410.

[0153] In some embodiments, MCU310 may include a monitoring pin 314. Monitoring pin 314 may be connected to monitor 430 so that MCU310 can monitor the monitoring results of monitor 430, and MCU310 can determine whether the output power of the first optical / optical signal is stable based on the monitoring results of monitor 430.

[0154] The controller 312 of the MCU310 is used to first set the bias current to a first current value during startup, and then set the bias current to a second current value after the output light power stabilizes. The first current value is less than the second current value.

[0155] Figure 9 This is a partial principle of the internal structure of an optical module according to some embodiments. Figure 3 .like Figure 9 As shown, in some embodiments, the monitor 430 may include a backlight detector 431. The backlight detector 431 may be located on the back side of the laser chip 410 so that the backlight detector 431 can receive the light / optical signals emitted by the laser chip 410. The backlight detector 431 can convert the received light / optical signals into electrical signals. The electrical signal at this time is a monitoring current.

[0156] The monitoring pin 314 of MCU310 may include a first monitoring pin 3141. The first monitoring pin 3141 may be connected to the backlight detector 431 so that MCU310 can monitor the monitoring current of the backlight detector 431.

[0157] The monitoring current is proportional to the intensity of the light / optical signal received by the backlight detector 431. In this way, the MCU310 can monitor the emission status of the laser chip 410 in real time to ensure the normal operation of the optical module. When the intensity of the light / optical signal emitted by the laser chip 410 falls below a preset threshold, the MCU310 can trigger an alarm mechanism to remind the user to perform maintenance or replace the laser chip 410, thereby ensuring the stability and reliability of the optical module.

[0158] like Figure 7 and Figure 9 As shown, in some embodiments, register 311 can store a first preset range. When the difference between two consecutive monitored currents is within the first preset range, it indicates that the monitored current is stable, meaning the actual temperature of the laser chip 410 has reached the high temperature at which the optical module starts up, and the output power of the optical module is also stable. When the difference between two consecutive monitored currents exceeds the first preset range, it indicates that the monitored current is unstable, meaning the actual temperature of the laser chip 410 has not reached the high temperature at which the optical module starts up, and the output power of the optical module is also unstable. For example, the first preset range is -0.5mA to 0.5mA.

[0159] When the controller 312 of the MCU310 detects that the difference between two adjacent monitored currents exceeds a first preset range, the controller 312 of the MCU310 cannot adjust the bias current to make the bias current the first current value. When the controller 312 of the MCU310 detects that the difference between two adjacent monitored currents is within the first preset range, the controller 312 of the MCU310 can adjust the bias current to make the bias current the second current value.

[0160] In some embodiments, register 311 may store a second preset range. When the difference in monitoring optical power corresponding to two adjacent monitoring currents is within the second preset range, it indicates that the monitoring optical power is stable, meaning that the actual temperature of the laser chip 410 has reached the high temperature at which the optical module starts up, and the output optical power of the optical module is also stable. When the difference in monitoring optical power corresponding to two adjacent monitoring currents exceeds the second preset range, it indicates that the monitoring optical power is unstable, meaning that the actual temperature of the laser chip 410 has not reached the high temperature at which the optical module starts up, and the output optical power of the optical module is also unstable. For example, the second preset range is -0.05mW to 0.05mW.

[0161] When the controller 312 of the MCU310 detects that the difference in monitoring optical power corresponding to two adjacent monitoring currents exceeds a second preset range, the controller 312 of the MCU310 cannot adjust the bias current to make the bias current the first current value. When the controller 312 of the MCU310 detects that the difference in monitoring optical power corresponding to two adjacent monitoring currents is within the second preset range, the controller 312 of the MCU310 can adjust the bias current to set the bias current to the second current value.

[0162] Figure 10 This is a partial principle of the internal structure of an optical module according to some embodiments. Figure 4 . Figure 11 This is a partial principle of the internal structure of an optical module according to some embodiments. Figure 5 .like Figure 10 and Figure 11 As shown, in some embodiments, the monitor 430 may include a temperature sensing element 432. The temperature sensing element 432 may be located around the laser chip 410 to collect the actual temperature around the laser chip 410, thereby enabling monitoring of the actual temperature of the laser chip 410.

[0163] In some embodiments, the monitoring pin 314 of the MCU 310 may include a second monitoring pin 3142. The second monitoring pin 3142 may be connected to the temperature sensing element 432 so that the MCU 310 can monitor the actual temperature detected by the temperature sensing element 432. For example, the MCU 310 may obtain the resistance value of the thermistor and obtain the actual temperature monitored by the thermistor based on the resistance value of the thermistor.

[0164] In some embodiments, register 311 may store a preset temperature. The preset temperature is the temperature that the optical module is expected to reach, i.e., the high temperature at which the optical module starts up. When the actual temperature is close to the preset temperature, the output power of the optical module is stable. When the actual temperature differs significantly from the preset temperature, the output power of the optical module is unstable. Therefore, the controller 312 of MCU 310 can determine whether the output power of the optical module is stable by judging whether the preset temperature and the actual temperature are close.

[0165] In some embodiments, register 311 may store a third preset range. When the difference between the actual temperature and the preset temperature is within the third preset range, the actual temperature is close to the preset temperature. When the difference between the actual temperature and the preset temperature exceeds the third preset range, the actual temperature differs significantly from the preset temperature. Therefore, if the difference between the actual temperature and the preset temperature exceeds the third preset range, the actual temperature is unstable, meaning the actual temperature has not reached the preset temperature, and the optical module's output power is also unstable; if the difference between the actual temperature and the preset temperature is within the second preset range, the actual temperature is stable, meaning the actual temperature has reached the preset temperature, and the optical module's output power is also stable. For example, the third preset range is -2℃ to 2℃.

[0166] When the controller 312 of the MCU310 detects that the difference between the actual temperature and the preset temperature exceeds a third preset range, the controller 312 of the MCU310 cannot adjust the bias current to make the bias current the first current value. When the controller 312 of the MCU310 detects that the difference between the actual temperature and the preset temperature is within the third preset range, the controller 312 of the MCU310 can adjust the bias current to make the bias current the second current value.

[0167] In some embodiments, register 311 may store a delay time. After the delay time, it indicates that the actual temperature of the laser chip 410 has reached the preset temperature, that is, the output power of the laser chip 410 is stable.

[0168] When the controller 312 of MCU310 detects that the difference between the actual temperature and the preset temperature exceeds the third preset range within the waiting delay time, after the waiting delay time, the controller 312 of MCU310 can adjust the bias current so that the bias current is set to the second current value, further reducing the occurrence of optical overshoot.

[0169] When the controller 312 of MCU310 detects that the difference between the actual temperature and the preset temperature is within the third preset range during the waiting delay time, the controller 312 of MCU310 can adjust the bias current to set the bias current to the second current value so that the optical module can work normally as soon as possible.

[0170] In some embodiments, the optical module may include a semiconductor cooler 420. A laser chip 410 and a temperature sensor 432 may be disposed on the semiconductor cooler 420, with the temperature sensor 432 located around the laser chip 410.

[0171] In some embodiments, the optical module may include a control circuit 330. The control circuit 330 may include an output pin 332. The output pin 332 may be connected to a thermoelectric cooler 420, allowing the control circuit 330 to output operating current to the thermoelectric cooler 420, thereby enabling the thermoelectric cooler 420 to heat or cool, thus controlling the actual temperature of the laser chip 410 within a target temperature range. The control circuit 330 may include a second control pin 331. The second control pin 331 may be connected to an MCU 316, allowing the MCU 310 to control the output operating current of the control circuit 330.

[0172] In some embodiments, MCU310 may include a third output pin 315. The third output pin 315 may be connected to a second control pin 331 of control circuit 330 so that MCU310 can control control circuit 330 to output operating current.

[0173] Figure 12 This is a partial principle of the internal structure of an optical module according to some embodiments. Figure 6 .like Figure 12 As shown, in some embodiments, the monitor 430 may include a backlight detector 431 and a temperature sensor 432. The backlight detector 431 is connected to the first monitoring pin 3141 of the MCU 310, and the temperature sensor 432 is connected to the second monitoring pin 3142 of the MCU 310. The register 311 may store a first preset range, a second preset range, a preset temperature, and a third preset range.

[0174] In some embodiments, when the controller 312 of the MCU310 detects that the difference between two adjacent monitored currents is within a first preset range, the controller 312 of the MCU310 can adjust the bias current to set the bias current to a second current value.

[0175] In some embodiments, when the controller 312 of the MCU310 detects that the difference in monitoring optical power corresponding to two adjacent monitoring currents is within a second preset range, the controller 312 of the MCU310 can adjust the bias current to set the bias current to the second current value.

[0176] In some embodiments, when the controller 312 of the MCU310 detects that the difference between the actual temperature and the preset temperature is within a third preset range, the controller 312 of the MCU310 can adjust the bias current to set the bias current to a second current value.

[0177] In some embodiments, when the controller 312 of the MCU310 detects that the difference between the actual temperature and the preset temperature is within a third preset range, and the difference between two adjacent monitored currents is within a first preset range, the controller 312 of the MCU310 can adjust the bias current to set the bias current to a second current value, thereby further reducing the occurrence of optical overshoot.

[0178] In some embodiments, when the controller 312 of the MCU310 detects that the difference between the actual temperature and the preset temperature is within a third preset range, and the difference between the monitoring optical power corresponding to two adjacent monitoring currents is within a second preset range, the controller 312 of the MCU310 can adjust the bias current to set the bias current to the second current value, thereby further reducing the occurrence of optical overshoot.

[0179] Figure 13 This is a method flow for adjusting bias current according to some embodiments. Figure 1 .like Figure 13 As shown, the methods for adjusting the bias current include:

[0180] S100: Power on and set the bias current to the first current value.

[0181] The optical module starts up at a preset high temperature, specifically above 40°C. The controller sets the bias current to a first current value, which is less than a second current value. The second current value is the bias current corresponding to the optical module at the preset high temperature. Setting the bias current to the first current value, which is less than the second current value, ensures that the output optical power of the laser chip does not exceed the output optical power threshold, reducing optical overshoot.

[0182] S200: Control monitor monitors the laser chip.

[0183] The controller controls the monitor to monitor the laser chip.

[0184] When the monitor includes a backlight detector, the controller controls the backlight detector to monitor the second optical / optical signal of the laser chip.

[0185] When the monitor includes a temperature sensor, the controller controls the temperature sensor to monitor the actual temperature of the laser chip.

[0186] When the monitor includes a backlight detector and a temperature sensor, the controller controls the backlight detector to monitor the second light / light signal of the laser chip, and also controls the temperature sensor to monitor the actual temperature of the laser chip.

[0187] S300: Determines whether the optical power is stable based on the monitoring results of the monitor.

[0188] When the monitor includes a backlight detector, the monitoring result can be whether the difference between two adjacent monitored currents is within a first preset range. When the difference between two adjacent monitored currents is within the first preset range, the controller determines that the optical power is stable. When the difference between two adjacent monitored currents exceeds the first preset range, the controller determines that the optical power is unstable.

[0189] When the monitor includes a backlight detector, the monitoring result can be whether the difference in monitoring optical power corresponding to two adjacent monitoring currents is within a second preset range. If the difference in monitoring optical power corresponding to two adjacent monitoring currents is within the second preset range, the controller determines that the optical power is stable. If the difference in monitoring optical power corresponding to two adjacent monitoring currents exceeds the second preset range, the controller determines that the optical power is unstable.

[0190] When the monitor includes a temperature sensor, the monitoring result can be whether the difference between the actual temperature and the preset temperature is within a third preset range. When the difference between the actual temperature and the preset temperature is within the third preset range, the controller determines that the optical power is stable. When the difference between the actual temperature and the preset temperature exceeds the third preset range, the controller determines that the optical power is unstable.

[0191] When the monitor includes a backlight detector and a temperature sensor, the monitoring result can be whether the difference between two adjacent monitored currents is within a first preset range. When the difference between two adjacent monitored currents is within the first preset range, the controller determines that the optical power is stable. When the difference between two adjacent monitored currents exceeds the first preset range, the controller determines that the optical power is unstable.

[0192] When the monitor includes a backlight detector and a temperature sensor, the monitoring result can be whether the difference in monitoring optical power corresponding to two adjacent monitoring currents is within a second preset range. If the difference in monitoring optical power corresponding to two adjacent monitoring currents is within the second preset range, the controller determines that the optical power is stable. If the difference in monitoring optical power corresponding to two adjacent monitoring currents exceeds the second preset range, the controller determines that the optical power is unstable.

[0193] When the monitor includes a backlight detector and a temperature sensor, the monitoring result can be whether the difference between the actual temperature and the preset temperature is within a third preset range. When the difference between the actual temperature and the preset temperature is within the third preset range, the controller determines that the optical power is stable. When the difference between the actual temperature and the preset temperature exceeds the third preset range, the controller determines that the optical power is unstable.

[0194] When the monitor includes a backlight detector and a temperature sensor, the monitoring result can be whether the difference between the actual temperature and the preset temperature is within a third preset range, and whether the difference between two adjacent monitored currents is within a first preset range. If the difference between the actual temperature and the preset temperature is within the third preset range, and the difference between two adjacent monitored currents is within the first preset range, the controller determines that the optical power is stable. If the difference between the actual temperature and the preset temperature exceeds the third preset range, and / or the difference between two adjacent monitored currents exceeds the first preset range, the controller determines that the optical power is unstable.

[0195] When the monitor includes a backlight detector and a temperature sensor, the monitoring results can be whether the difference between the actual temperature and the preset temperature is within a third preset range, and whether the difference in monitoring optical power corresponding to two adjacent monitoring currents is within a second preset range. If the difference between the actual temperature and the preset temperature is within the third preset range, and the difference in monitoring optical power corresponding to two adjacent monitoring currents is within the second preset range, the controller determines that the optical power is stable. If the difference between the actual temperature and the preset temperature exceeds the third preset range, and / or the difference in monitoring optical power corresponding to two adjacent monitoring currents exceeds the second preset range, the controller determines that the optical power is unstable.

[0196] Based on the fact that the difference between the actual temperature and the preset temperature is within the third preset range, and the difference between two adjacent monitored currents is within the first preset range, the optical power is determined to be stable, further reducing the occurrence of optical overshoot.

[0197] Based on the fact that the difference between the actual temperature and the preset temperature is within the third preset range, and the difference between the monitoring optical power corresponding to two adjacent monitoring currents is within the second preset range, the optical power is determined to be stable, further reducing the occurrence of optical overshoot.

[0198] S400: If the output power is stable, set the bias current to the second current value.

[0199] Stable output power indicates that the actual temperature of the laser chip has reached the preset high temperature. Therefore, if the output power is stable, the controller sets the bias current to the bias current corresponding to the optical module at the preset high temperature, i.e., the second current value. At the preset high temperature, the controller sets the bias current to the second current value, ensuring that the output power of the laser chip meets the requirements but does not exceed the output power threshold.

[0200] If the output power is unstable, return to S200.

[0201] If the output power is unstable, it indicates that the actual temperature of the laser chip has not reached the preset high temperature. Therefore, the controller controls the monitor to monitor the laser chip until the output power stabilizes.

[0202] Figure 14This is a method flow for adjusting bias current according to some embodiments. Figure 2 .like Figure 14 As shown, the methods for adjusting the bias current include:

[0203] T100: Power on and set the bias current to the first current value.

[0204] T200: After the delay time, set the bias current to the second current value.

[0205] The delay time can be dynamically adjusted based on the thermal response characteristics of the laser chip; that is, the delay time can be set according to the overshoot time of the optical module. For example, the delay time can be from 5ms to 100ms.

[0206] After the delay period, the output power of the optical module is stabilized. Therefore, after the delay period, the controller sets the bias current to the bias current corresponding to the optical module at a preset high temperature, i.e., the second current value.

[0207] If the difference between the actual temperature and the preset temperature obtained by the controller is within the third preset range during the delay period, it indicates that the delay time may be too long. In this case, the controller will set the bias current to the second current value based on the difference between the actual temperature and the preset temperature being within the third preset range, so that the optical module can work normally as soon as possible.

[0208] If, after the delay time, the difference between the actual temperature and the preset temperature is within the third preset range, it indicates that the delay time may be too short. In this case, the controller sets the bias current to the second current value based on the difference between the actual temperature and the preset temperature being within the third preset range, thereby further reducing the occurrence of optical overshoot.

[0209] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module characterized by comprising: The application relates to a laser module, comprising: a circuit board; a laser chip connected with the circuit board and used for emitting a first light / signal; a driving chip, comprising: a first output pin connected with the laser chip and used for outputting a bias current; a first control pin; a monitor used for monitoring the laser chip; an MCU arranged on the surface of the circuit board, a second output pin of the MCU being connected with the first control pin to control the driving chip to output the bias current, and a monitoring pin of the MCU being connected with the monitor to determine the stability of the light output power of the first light / signal according to the monitoring result of the monitor; wherein the MCU comprises: a controller used for setting the bias current as a first current value, waiting for the stability of the light output power, and then setting the bias current as a second current value, the first current value being smaller than the second current value.

2. The optical module according to claim 1, characterized by The first current value is smaller than 50% of the second current value.

3. The optical module according to claim 1, characterized by The monitor comprises: a back light detector located in the back light direction of the laser chip to receive a second light signal emitted by the laser chip and convert the second light signal into a monitoring current; the monitoring pin comprises a first monitoring pin connected with the back light detector; the MCU further comprises: a register used for storing a first preset range; the controller is used for determining the stability of the light output power according to the difference between two adjacent monitoring currents being located in the first preset range.

4. The optical module according to claim 1, characterized by The monitor comprises: a back light detector located in the back light direction of the laser chip to receive a second light / signal emitted by the laser chip and convert the second light / signal into a monitoring current; the monitoring pin comprises a first monitoring pin connected with the back light detector; the MCU further comprises: a register used for storing a second preset range; the controller is used for determining the stability of the light output power according to the difference between the monitoring light powers corresponding to two adjacent monitoring currents being located in the second preset range.

5. The optical module according to claim 1, characterized by The monitor comprises: a temperature sensing element used for monitoring the actual temperature of the laser chip; the monitoring pin comprises a second monitoring pin connected with the temperature sensing element; the MCU further comprises: a register used for storing a third preset range and a preset temperature; the controller is used for determining the stability of the light output power according to the difference between the actual temperature and the preset temperature being located in the third preset range.

6. The optical module according to claim 5, characterized by The application further relates to a laser module, comprising: a semiconductor refrigerator provided with the temperature sensing element and the laser chip; a control circuit, comprising: an output pin connected with the semiconductor refrigerator; a second control pin connected with a third output pin of the MCU.

7. The optical module according to claim 3, characterized by The monitor further comprises: a temperature sensing element used for monitoring the actual temperature of the laser chip; the monitoring pin further comprises a second monitoring pin connected with the temperature sensing element; the MCU further comprises: a register used for storing a third preset range and a preset temperature; The controller is configured to determine that the output power is stable when the difference between the actual temperature and the preset temperature is within the third preset range and the difference between two adjacent monitored currents is within the first preset range.

8. An optical module characterized by comprising: Comprise: A circuit board; A laser chip connected with the circuit board, configured to emit a first light / signal; A driving chip comprising: A first output pin connected with the laser chip, configured to output a bias current; A first control pin; An MCU disposed on the surface of the circuit board, a second output pin connected with the first control pin, configured to control the driving chip to output the bias current; The MCU comprises: A register configured to store a delay time; A controller configured to set the bias current to a first current value, and set the bias current to a second current value after the delay time, wherein the first current value is less than the second current value.

9. The optical module according to claim 8, characterized by Further comprise: A monitor connected with a monitoring pin of the MCU, configured to monitor the laser chip; The monitor further comprises: A temperature sensing element configured to monitor an actual temperature of the laser chip; The monitoring pin further comprises a second monitoring pin connected with the temperature sensing element; The MCU further comprises: A register further configured to store a third preset range and a preset temperature; The controller is configured to set the bias current to the second current value according to the difference between the actual temperature and the preset temperature being within the third preset range within the delay time.

10. The optical module according to claim 1 or 8, characterized by, Further comprise: A first lens located in the light emitting direction of the laser chip; An optical fiber adapter located in the converging direction of the first lens, configured to receive a first light signal converged by the first lens.

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