Intelligent heat dissipation device for computer

Abstract

The intelligent heat dissipation device for the computer comprises a heat dissipation assembly and sealing pieces arranged on the two sides of the heat dissipation assembly, U-shaped plates are integrally formed on the two sides of the heat dissipation assembly, a heat conduction pipe is arranged in the heat dissipation assembly in a penetrating mode, the two ends of the heat conduction pipe are connected with insertion pipes respectively, and each sealing piece comprises a baffle and a positioning plate. The baffle is attached to the inner wall of the U-shaped plate to form a rectangular cavity, side plates are detachably fixed to the two ends of the cavity, lug plates are arranged on the surfaces of the side plates, the positioning plate is located on the upper end face of the U-shaped plate, the two ends of the positioning plate are fixed to the lug plates, the insertion pipe is located in the rectangular cavity, and the upper end of the insertion pipe is used for being connected with a circulating water pipeline. According to the utility model, the heat dissipation assembly and the sealing member are designed in a split manner, so that each internal structure can be dismounted during later installation, and the stability and the detachability of the structural member are ensured on the basis of the modular basic design.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to an intelligent heat dissipation device for computers. Background Technology

[0002] Computers typically consist of components such as a motherboard, CPU, graphics card, power supply, and heatsink. The CPU and graphics card generate significant heat during operation, usually requiring a heatsink for cooling. Furthermore, both the CPU and graphics card need to operate at certain temperatures for optimal energy efficiency. Therefore, intelligent temperature control is an essential part of computer cooling. Intelligent temperature control typically employs PWM (Pulse Width Modulation), a technology that controls the circuit by adjusting the duty cycle of a signal. This allows for precise control of the output power of relevant components, thereby achieving temperature control.

[0003] For intelligent cooling devices for graphics cards, air cooling or water cooling structures are usually used. For water cooling structures, the design usually consists of heat sink fins, water pipes and fans. The related structures on the heat sink fins are usually designed as a whole. However, since the cooling structure usually accumulates a lot of dust, it usually needs to be cleaned periodically. The whole design of water cooling makes it difficult to clean the dust in the gaps, which will cause the cooling efficiency to gradually decrease. Utility Model Content

[0004] This utility model addresses the shortcomings of existing technologies by providing the following technical solution:

[0005] A smart heat dissipation device for computers includes: a heat dissipation component and sealing components disposed on both sides of the heat dissipation component.

[0006] Specifically, the heat dissipation component has U-shaped plates integrally formed on both sides, and a heat-conducting pipe is inserted inside the heat dissipation component. The two ends of the heat-conducting pipe are respectively connected to inserts. The sealing component includes a baffle and a positioning plate. The baffle fits against the inner wall of the U-shaped plate to form a rectangular cavity. Side plates are detachably fixed at both ends of the cavity. Ear plates are provided on the surface of the side plates. The positioning plate is located on the upper end face of the U-shaped plate. The two ends of the positioning plate are fixed to the ear plates. The insert is located inside the rectangular cavity. The upper end of the insert is used to connect to a circulating water pipe.

[0007] As an improvement to the above technical solution, the heat dissipation component includes a number of equidistant heat dissipation fins. The ends of the heat dissipation fins are integrally formed with the end face of the U-shaped plate away from the concave side. A number of heat conduction pipes are disposed through the interior of the heat dissipation fins. The two ends of the heat conduction pipes are respectively inserted into the interior of the side plates on both sides. The ends of two adjacent heat conduction pipes are detachably fixed with connecting pipes. The heat conduction pipes located at the outermost edge on both sides are located inside the rectangular cavity.

[0008] As an improvement to the above technical solution, the end of the heat pipe is rotatably provided with a threaded part, which is inserted into the inner wall of the second connecting pipe and threadedly connected to the inner wall of the second connecting pipe.

[0009] As an improvement to the above technical solution, the baffle is U-shaped, and the outer walls of the two branches of the baffle are attached to the inner wall of the U-shaped plate. The upper end face of the baffle and the U-shaped plate is provided with an insertion port that penetrates into the interior of the rectangular cavity. A connecting pipe is inserted into the interior of the insertion port, and the connecting pipe is detachably connected to the connecting pipe.

[0010] As an improvement to the above technical solution, the upper end of the second connecting tube is integrally formed with an insert tube, the insert tube has an inner tube inside, the inner tube fits against the inner wall of the first connecting tube, and the insert tube is tightly attached to the lower end of the first connecting tube.

[0011] As an improvement to the above technical solution, a cover plate is detachably fixed to the upper surface of the heat dissipation component, and several heat dissipation fans are fixed inside the cover plate.

[0012] The beneficial effects of this utility model are:

[0013] By designing the heat dissipation components and sealing parts in a detachable manner, the internal structures can be disassembled during later installation. Since the overall structure is fixed by two positioning plates, although a modular design is adopted, the overall structure can still be secured with just two screws. This modular design ensures the stability and detachability of the structural components. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0015] Figure 2 This is an exploded view of the present invention;

[0016] Figure 3 for Figure 2 Enlarged structural diagram at point A in the middle;

[0017] Figure 4 for Figure 3 Enlarged structural diagram at point B in the middle.

[0018] Reference numerals: 10, sealing component; 11, baffle; 111, insertion port; 12, positioning plate; 13, connecting pipe one; 20, heat dissipation assembly; 21, U-shaped plate; 22, side plate; 221, ear plate; 222, connecting pipe two; 223, heat conduction pipe; 224, insertion pipe; 225, inner pipe; 30, cover plate; 40, cooling fan. Detailed Implementation

[0019] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0020] For intelligent cooling devices for graphics cards, air cooling or water cooling structures are usually used. For water cooling structures, the design usually consists of heat sink fins, water pipes and fans. The related structures on the heat sink fins are usually designed as a whole. However, since the cooling structure usually accumulates a lot of dust, it usually needs to be cleaned periodically. The whole design of water cooling makes it difficult to clean the dust in the gaps, which will cause the cooling efficiency to gradually decrease.

[0021] To resolve the above issues, please refer to Figures 1 to 4 The present invention provides a device comprising: a heat dissipation assembly 20 and sealing members 10 disposed on both sides of the heat dissipation assembly 20.

[0022] Specifically, the heat dissipation component 20 has U-shaped plates 21 integrally formed on both sides, and heat conduction pipes 223 are inserted into the heat dissipation component 20. The two ends of the heat conduction pipes 223 are respectively connected to insertion tubes 224. The sealing component 10 includes a baffle 11 and a positioning plate 12. The baffle 11 fits against the inner wall of the U-shaped plate 21 to form a rectangular cavity. The two ends of the cavity are detachably fixed with side plates 22. The surface of the side plates 22 is provided with ear plates 221. The positioning plate 12 is located on the upper end face of the U-shaped plate 21. The two ends of the positioning plate 12 are fixed to the ear plates 221. The insertion tubes 224 are located inside the rectangular cavity. The upper end of the insertion tubes 224 is used to connect to the circulating water pipe.

[0023] The U-shaped plate 21 and the baffle 11 cooperate to form a positioning structure on the side, which has a rectangular cavity inside. The heat conduction pipes 223 at both ends can be inserted into the rectangular cavity, which provides protection. An external circulating water pipe is connected via a connecting pipe 224. Thus, during cleaning, only the positioning plate 12 needs to be removed to release the positional restrictions and protection on the heat conduction pipes 223 and the connecting pipes 224. This facilitates subsequent disassembly and cleaning. Furthermore, due to this structural design, the cooling fan 40 above can be installed independently without interfering with the heat dissipation assembly 20. For details, please refer to [link / reference]. Figures 1 to 3 A cover plate 30 is detachably fixed to the upper end face of the heat dissipation component 20, and several cooling fans 40 are fixed inside the cover plate 30.

[0024] When dust needs to be cleaned, the cooling fan 40 can be removed separately. The water pipes on both sides can be cleaned by removing the two baffles 11, then removing the entire bottom heat dissipation assembly 20, and then soaking it in water for cleaning, without affecting the motherboard and other structural components mounted on the cover plate 30 and cooling fan 40.

[0025] The power control of the cooling fan 40 is achieved in conjunction with the PWM temperature control module. By adjusting the power output of the structural components through PWM, the cooling fan 40 adjusts its speed according to the power output. When the overall operating power of the motherboard is high, the speed of the cooling fan 40 will be higher, and when the power is low, the power of the cooling fan 40 will naturally decrease, thereby realizing the function of intelligent temperature control.

[0026] In one embodiment, see Figures 1 to 3 The heat dissipation assembly 20 includes several heat dissipation fins arranged at equal intervals. The ends of the heat dissipation fins are integrally formed with the end face of the U-shaped plate 21 away from the concave side. Several heat conduction pipes 223 are arranged through the interior of the heat dissipation fins. The two ends of the heat conduction pipes 223 are respectively inserted into the interior of the side plates 22 on both sides. The ends of two adjacent heat conduction pipes 223 are detachably fixed with connecting pipes 222. The heat conduction pipes 223 located at the outermost position on both sides are located inside the rectangular cavity.

[0027] Heat dissipation is provided at the bottom through heat dissipation fins. Since the heat dissipation fins are independently set at the bottom and are fixed to the U-shaped plate 21 in one piece, two heat pipes 223 can be inserted into the interior of the rectangular cavity, so that baffles 11 can be designed on both sides to provide protection.

[0028] In addition, to further enhance the detachability of the overall structure, specifically, the end of the heat pipe 223 is rotatably provided with a threaded part (not shown in the figure), which is inserted into the inner wall of the connecting pipe 222 and threadedly connected to the inner wall of the connecting pipe 222.

[0029] The connection between the heat pipe 223 and the connecting pipe 222 can be loosened by rotating the threaded part. During subsequent disassembly, the connecting pipes 222 on both sides can be removed separately. In this design, the heat pipe 223 is not additionally fixed to the heat sink fins. When the outer connecting pipe 222 is removed, the outer side plate 22 can also be removed. At this time, the inner heat pipe 223 can be directly pulled out, thus completing the disassembly of the bottom pipe structure. It is also possible to clean individual structural components in different locations.

[0030] To further ensure the stability of structural component connections, please refer to [link / reference]. Figures 1 to 3Specifically, the baffle 11 is U-shaped, and the outer walls of the two branches of the baffle 11 are attached to the inner wall of the U-shaped plate 21. The upper end face of the baffle 11 and the U-shaped plate 21 is provided with an insertion port 111 that penetrates into the rectangular cavity. A connecting tube 13 is inserted into the insertion port 111, and the connecting tube 13 is detachably connected to the connecting tube 222.

[0031] The nested rectangular design allows for a more stable rectangular connection between the U-shaped plate 21 and the baffle 11. In this case, once the ear plate 221 is fixed to the top positioning plate 12, the U-shaped plate 21 and the baffle 11 can be firmly secured.

[0032] In one embodiment, see Figures 1 to 4 Specifically, the upper end of the connecting tube 222 is integrally formed with an insert tube 224, and the insert tube 224 is provided with an inner tube 225. The inner tube 225 is attached to the inner wall of the connecting tube 13, and the insert tube 224 is attached to the lower end of the connecting tube 13.

[0033] The circulating water pipes are conveniently connected by extending the insertion tube 224 through the inner tube 225 to the outside of the rectangular cavity. Furthermore, this design allows the inner tube 225 to connect with the connecting tube 13, ensuring that the heat-conducting tubes 223 on both sides are not suspended, thus guaranteeing that the structural components' sealing performance is not affected by vibration. The connection between the inner tube 225 and the connecting tube 13 also provides additional auxiliary support between the U-shaped plate 21 and the baffle 11.

[0034] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. An intelligent heat dissipation device for a computer, characterized by, The utility model provides a heat dissipation assembly and a heat dissipation device, and the heat dissipation assembly comprises a U-shaped plate (21) integrally formed on both sides of the heat dissipation assembly (20), and a heat conduction pipe (223) is arranged in the heat dissipation assembly (20). The heat dissipation assembly (20) comprises a plurality of equidistantly arranged heat dissipation fins, the end of the heat dissipation fin is integrally formed with the end face of the U-shaped plate (21) away from the recessed side, a plurality of heat conduction pipes (223) are arranged in the heat dissipation fin, the two ends of the heat conduction pipe (223) are respectively inserted into the inside of the side plate (22) on both sides, and the end of the adjacent two heat conduction pipes (223) is detachably fixed with a connecting pipe two (222). The end of the heat conduction pipe (223) is rotatably provided with a threaded portion, the threaded portion is inserted into the inner wall of the connecting pipe two (222) and is threadedly connected with the inner wall of the connecting pipe two (222).

2. The intelligent heat dissipation device for computer according to claim 1, characterized in that: The baffle (11) is U-shaped, the outer wall of the two branches of the baffle (11) is attached to the inner wall of the U-shaped plate (21), the baffle (11) and the upper end face of the U-shaped plate (21) are provided with a socket (111) penetrating into the rectangular cavity, the inside of the socket (111) is inserted with a connecting pipe one (13), and the connecting pipe one (13) is detachably connected with the connecting pipe two (222).

3. The intelligent heat dissipation device for computer according to claim 2, characterized in that: The upper end of the connecting pipe two (222) is integrally formed with a spout (224), the inside of the spout (224) is provided with an inner tube (225), the inner tube (225) is attached to the inner wall of the connecting pipe one (13), and the spout (224) is tightly attached to the lower end of the connecting pipe one (13).

4. The intelligent heat dissipation device for computer according to claim 2, characterized in that: The upper end face of the heat dissipation assembly (20) is detachably fixed with a cover plate (30), and the inside of the cover plate (30) is fixed with a plurality of heat dissipation fans (40).

5. The intelligent heat dissipation device for computer according to claim 4, characterized in that: ​ 6. The intelligent heat dissipation device for computer according to any one of claims 1-5, characterized in that: ​

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