Electrical equipment

Abstract

The utility model discloses an electrical device comprising a dehumidifying device, the dehumidifying device comprises a first housing, a semiconductor chilling plate and a liquid bearing part, the semiconductor chilling plate is installed on the first housing, the semiconductor chilling plate comprises a cold end part and a hot end part, the cold end part is located at the inner side of the first housing, and the hot end part is located at the outer side of the first housing. The hot end part is located on the outer side of the first shell, and the liquid bearing part is arranged on the inner side of the first shell and located on the lower side of the cold end part. According to the dehumidification device, active dehumidification of the interior of the first shell is achieved by ingeniously utilizing the existing properties of the semiconductor chilling plate, and the dehumidification device is simple in structural design, small in occupied space, low in cost and more beneficial to application and popularization.

Description

Technical Field

[0001] This utility model relates to the field of electrical equipment technology, and specifically to an electrical device. Background Technology

[0002] Electrical equipment generates a significant amount of heat during normal operation, leading to high internal temperatures. A large temperature difference between the inside and outside of the equipment can cause condensation inside, potentially resulting in short circuits and failures of internal electronic components, severely impacting the equipment's normal operation.

[0003] Therefore, how to provide a solution to overcome or alleviate the above-mentioned defects remains a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] The purpose of this utility model is to provide an electrical device and a dehumidification device, wherein the dehumidification device can achieve active dehumidification of the inside of the first housing, and the structure design is simple.

[0005] To solve the above-mentioned technical problems, the present invention provides a dehumidification device, including a first housing, a semiconductor refrigeration chip, and a liquid-receiving component. The semiconductor refrigeration chip is installed in the first housing and includes a cold end and a hot end. The cold end is located inside the first housing, and the hot end is located outside the first housing. The liquid-receiving component is disposed inside the first housing and located below the cold end.

[0006] In the above-described embodiment, by placing the cold end of the semiconductor cooling chip inside the first housing, a low-temperature region can be actively created within the first housing to actively select the location where condensation occurs. Specifically, hot air inside the first housing can condense on the surface of the cold end, forming droplets. A liquid-receiving component is provided below the cold end to catch the droplets falling from its surface, significantly preventing them from dripping into the electronic devices inside the first housing. This greatly reduces the risk of short-circuit failures and ensures the normal operation and lifespan of the electronic devices within the first housing. Furthermore, the cold end also cools the interior of the first housing, controlling its internal temperature, which is also beneficial for ensuring the normal operation of the electronic devices inside.

[0007] Compared to dedicated industrial dehumidifiers, this embodiment of the invention does not require separate dehumidification fans, dehumidification radiators, or other components. Instead, it cleverly utilizes the existing properties of semiconductor cooling chips to achieve active dehumidification of the interior of the first housing. The structure is simple, occupies little space, and is low in cost, making it more conducive to widespread application.

[0008] Optionally, at least one of the cold end and the hot end is provided with a first heat dissipation component.

[0009] Optionally, the first housing is provided with an installation area for mounting a heating device, and the first housing is provided with a first air-cooling path, in which the cold end is located downstream of the installation area.

[0010] Optionally, the cold end is located below the mounting area.

[0011] Optionally, the first housing includes a first base plate and a mounting side plate connected to the first base plate, the semiconductor cooling chip and the liquid-receiving component are both mounted on the mounting side plate, and the cold end is located on the side of the mounting area close to the first base plate.

[0012] Optionally, the first base plate is further provided with a flow limiting plate, and the distance between the flow limiting plate and the mounting side plate gradually decreases from top to bottom.

[0013] Optionally, it may also include a second heat dissipation component, which is mounted on the first housing, with at least a portion of the second heat dissipation component located on the outside of the first housing.

[0014] Optionally, it further includes a second housing connected to the first housing, the second housing being able to at least cover the second heat dissipation component and the hot end.

[0015] Optionally, the second housing is provided with an air inlet and an air outlet, and a second air-cooling path is formed between the air inlet and the air outlet. The second heat dissipation component and the hot end are both located on the second air-cooling path.

[0016] This utility model also provides an electrical device, including electronic components and the above-mentioned dehumidification device, wherein the electronic components are installed inside the first housing.

[0017] Optionally, the electronic device includes a control component, which is communicatively connected to the thermoelectric cooler and is used to control the start and stop of the thermoelectric cooler. Attached Figure Description

[0018] Figure 1 This is a partial cross-sectional view of the dehumidification device provided in the embodiment of this utility model;

[0019] Figure 2 for Figure 1 The front view.

[0020] Figure label:

[0021] 1000 - Dehumidifier; 1100 - First housing; 1100A - Mounting side panel; 1110 - First bottom plate; 1120 - First top plate; 1130 - First left side panel; 1140 - First right side panel; 1150 - First rear side panel; 1160 - Mounting area; 1200 - Semiconductor cooling chip; 1210 - Cold end; 1220 - Hot end; 1300 - Liquid-receiving component; 1400 - First heat dissipation component; 1500 - Flow limiting plate; 1600 - Second heat dissipation component; 1700 - Second housing; 1710 - Second bottom plate; 1711 - Air outlet; 1720 - Second top plate; 1730 - Second left side panel; 1740 - Second right side panel; 1741 - Air inlet; 1750 - Second rear side panel;

[0022] P - First air-cooling path; Q - Second air-cooling path. Detailed Implementation

[0023] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] In the description of the embodiments of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0025] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0026] The directional terms mentioned in the embodiments of this utility model, such as "inner" and "outer", are only for reference to the direction of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this utility model, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0027] In the description of embodiments of this utility model, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0028] Please refer to Figure 1 and Figure 2 , Figure 1 This is a partial cross-sectional view of the dehumidification device provided in the embodiment of this utility model; Figure 2 for Figure 1 The front view.

[0029] like Figure 1 and Figure 2 As shown, this embodiment of the present invention provides a dehumidification device 1000, including a first housing 1100, a semiconductor cooling chip 1200, and a liquid-collecting component 1300. The semiconductor cooling chip 1200 and the liquid-collecting component 1300 are both mounted on the first housing 1100 for integrated assembly via the first housing 1100.

[0030] The first housing 1100 also includes a mounting area 1160 for mounting electronic components of electrical equipment. These electronic components may include, for example, control components, switch components, circuit breakers, etc. These components generate a lot of heat during use; therefore, they may also be referred to as heat-generating devices.

[0031] Here, the present invention does not limit the structural shape of the first housing 1100. In practical applications, those skilled in the art can select the shape according to specific needs, as long as it meets the requirements of use. For example, the first housing 1100 can be a cylindrical housing, a prismatic housing, or other irregularly shaped housings.

[0032] In the implementation of the attached diagram, as follows: Figure 1 and Figure 2As shown, the first shell 1100 can be a prismatic shell, specifically a cuboid, including a first bottom plate 1110, a first top plate 1120, a first left side plate 1130, a first right side plate 1140, a first rear side plate 1150, and a first front side plate (not shown in the figure). The first left side plate 1130, the first right side plate 1140, the first rear side plate 1150, and the first front side plate can all be referred to as side plates of the first shell 1100. The first bottom plate 1110 and the first top plate 1120 can be spaced apart in the top-bottom direction (i.e., the vertical direction). The first left side plate 1130 and the first right side plate 1140 can be spaced apart in the left-right direction. The first rear side plate 1150 and the first front side plate can be spaced apart in the front-back direction. The orientation and positional relationship of the top, bottom, left, right, front, and rear can be referred to... Figure 1 The diagram is shown in the image.

[0033] The semiconductor cooling chip 1200 includes a cold end 1210. The cold end 1210 is located inside the first housing 1100. A liquid-receiving component 1300 is also disposed inside the first housing 1100, and the liquid-receiving component 1300 is located below the cold end 1210.

[0034] By employing the above-described solution, this embodiment of the invention, by placing the cold end 1210 of the semiconductor cooling chip 1200 inside the first housing 1100, can actively create a low-temperature region inside the first housing 1100 to actively select the location where condensation occurs. Specifically, the hot air inside the first housing 1100 can condense on the surface of the cold end 1210, forming droplets. A liquid-receiving component 1300 is provided below the cold end 1210, which can collect droplets falling from the surface of the cold end 1210, thus largely preventing droplets from falling into the electronic devices inside the first housing 1100. This significantly reduces the risk of short-circuit failures in the electronic devices, ensuring the normal operation and lifespan of the electronic devices inside the first housing 1100.

[0035] Furthermore, the aforementioned cold end 1210 can also cool the interior of the first housing 1100 to control the temperature inside the first housing 1100, which is also of positive significance for ensuring the normal operation of the electronic devices inside the first housing 1100.

[0036] Compared to dedicated industrial dehumidifiers, this utility model embodiment does not require separate dehumidification fans, dehumidification radiators, or other components. Instead, it cleverly utilizes the existing properties of the semiconductor cooling chip 1200 to achieve active dehumidification of the interior of the first housing 1100. The structure is simple, occupies little space, and is low in cost, making it more conducive to widespread application.

[0037] The semiconductor cooling chip 1200 also includes a hot end 1220 located outside the first housing 1100 for heat dissipation outside the first housing 1100.

[0038] The specific structural form of the liquid-receiving component 1300 is not limited here, as long as it can collect the liquid droplets; for example, see [reference needed]. Figure 1 The liquid-receiving component 1300 can be constructed using a bent plate or similar material. Generally, the air humidity inside the first housing 1100 is not high, and the amount of liquid collected in the liquid-receiving component 1300 is not large. Therefore, a drainage structure may not be necessary; the liquid-receiving component 1300 can simply collect the liquid droplets. Alternatively, a drainage structure in the form of a drain hole or drain pipe can be provided in the first housing 1100 to promptly drain the liquid collected in the liquid-receiving component 1300, thereby largely preventing the liquid from overflowing into the first housing 1100.

[0039] In some alternative implementations, at least one of the cold end 1210 and the hot end 1220 may be provided with a first heat dissipation component 1400. The first heat dissipation component 1400 may specifically be a heat dissipation fin or the like, and the first heat dissipation component 1400 may be used to increase the heat exchange area of ​​the cold end 1210 and the hot end 1220.

[0040] For the cold end 1210, the first heat dissipation component 1400 disposed thereon can also have a relatively low temperature. Therefore, condensation can also occur on the first heat dissipation component 1400, which is equivalent to increasing the condensation generation area, thereby improving the efficiency of condensation generation and enabling more efficient dehumidification of the interior of the first housing 1100. Correspondingly, the aforementioned liquid-receiving component 1300 can also be located on the lower side of the first heat dissipation component 1400 to collect the droplets condensed on the first heat dissipation component 1400.

[0041] The first heat dissipation component 1400 provided on the hot end 1220 can be used to improve heat dissipation efficiency so as to dissipate heat from the hot end 1220 more efficiently.

[0042] In some alternative implementations, a first air-cooling path P may be provided within the first housing 1100.

[0043] Along the first air-cooling path P, the cold end 1210 can be located downstream of the mounting area 1160. That is, the air inside the first housing 1100 can first pass through the electronic components in the mounting area 1160 to exchange heat with the electronic components and form hot air at a higher temperature, and then flow to the cold end 1210. In this way, a larger temperature difference can be formed at the cold end 1210, which is also more conducive to condensation occurring at the cold end 1210.

[0044] Here, the embodiments of this utility model do not limit the specific path form of the first air-cooling path P. In practical applications, those skilled in the art can design it according to specific needs, as long as it can meet the requirements of use. For example, see [link to relevant documentation]. Figure 2 , Figure 2 The dashed arrow shown represents a specific first air-cooling path P, where the green arrow represents relatively cold air at a relatively low temperature. After flowing through the installation area 1160 and exchanging heat with the electronic devices in the installation area 1160, the relatively hot air at a relatively high temperature can be represented by the red arrow.

[0045] In practical applications, in order to form the first air-cooling path P with the above-mentioned specific path form, a fan, a baffle plate or other structure (not shown in the figure) can be set in the first housing 1100 to control the airflow direction in the first housing 1100.

[0046] In some alternative implementations, the cold end 1210 can be located below the mounting area 1160. That is, the cold end 1210 can be located below the electronic device. In this way, droplets condensed on the surface of the cold end 1210 are less likely to drip onto the electronic device, thus ensuring the safe and reliable operation of the electronic device to a greater extent.

[0047] In specific assembly, both the thermoelectric cooler 1200 and the liquid-receiving component 1300 can be mounted on the mounting side plate 1100A of the first housing 1100. For example, in Figure 1 and Figure 2 In this implementation, the mounting side plate 1100A can be the first right side plate 1140. Of course, the mounting side plate 1100A can also be other side plates of the first housing 1100, which is not limited here.

[0048] The first base plate 1110 may also be provided with a flow-limiting plate 1500. From top to bottom, the distance between the flow-limiting plate 1500 and the mounting side plate 1100A can gradually decrease. With this configuration, the flow-limiting plate 1500 restricts the hot air inside the first housing 1100, allowing more hot air to accumulate at the cold end 1210, thereby promoting condensation of hot air on the surface of the cold end 1210 and enabling better active dehumidification of the interior of the first housing 1100.

[0049] In some alternative implementations, the dehumidification device 1000 provided in this embodiment of the present invention may further include a second heat dissipation component 1600.

[0050] The second heat dissipation component 1600 can be installed on the first housing 1100, and at least a portion of the second heat dissipation component 1600 can be located on the outside of the first housing 1100. The second heat dissipation component 1600 can be used to cool the interior of the first housing 1100 to remove the heat generated by the electronic devices inside the first housing 1100, thereby enabling temperature control inside the first housing 1100 and ensuring the normal operation of the electronic devices.

[0051] Here, the specific structural form of the second heat dissipation component 1600 is not limited in this embodiment. In practical applications, those skilled in the art can select according to specific needs, as long as it meets the requirements of use. For example, the second heat dissipation component 1600 can be a liquid-cooled radiator, evaporator, heat exchanger, etc.

[0052] Combination Figure 1 and Figure 2 The second heat dissipation component 1600 may be mounted on the first top plate 1120. The second heat dissipation component 1600 may have a portion located inside the first housing 1100, or this portion may be located on the first air cooling path P. On the first air cooling path P, relatively hot air (red dashed arrow) flows through the second heat dissipation component 1600 and can form relatively cool air (green dashed arrow). This cool air, after flowing through the electronic devices in the mounting area 1160, becomes hot air again and flows towards the cold end 1210.

[0053] With the adoption of the second heat dissipation component 1600, the temperature inside the first housing 1100 can be effectively controlled. Therefore, the first housing 1100 can be configured as a completely sealed housing. This improves the dustproof and waterproof rating of the first housing 1100, reducing the entry of external dust, moisture, and other impurities into the first housing 1100 and thus minimizing any adverse effects on the normal operation of the electronic components inside the first housing 1100.

[0054] In some alternative implementations, the dehumidification device 1000 provided in this embodiment of the present invention may further include a second housing 1700.

[0055] The second housing 1700 can be connected to the first housing 1100, and the second housing 1700 can at least cover the second heat dissipation component 1600 and the hot end 1220 to protect the second heat dissipation component 1600 and the hot end 1220, thereby reducing the erosion of the second heat dissipation component 1600 and the hot end 1220 by external dust, moisture and other impurities.

[0056] Here, this embodiment of the present invention does not limit the specific structural form of the second housing 1700. In practical applications, those skilled in the art can configure it according to specific needs, as long as it meets the requirements of use. For example, the second housing 1700 can be a cylindrical housing, a prismatic housing, or other irregularly shaped housings, etc.

[0057] In the implementation of the attached diagram, as follows: Figure 1 and Figure 2 As shown, the second housing 1700 can be a prismatic housing, specifically a cuboid shape, including a second bottom plate 1710, a second top plate 1720, a second left side plate 1730, a second right side plate 1740, a second rear side plate 1750, and a second front side plate (not shown in the figure). The second bottom plate 1710 and the second top plate 1720 can be spaced apart in the top-bottom direction (i.e., the vertical direction). The second left side plate 1730 and the second right side plate 1740 can be spaced apart in the horizontal direction. The second rear side plate 1750 and the second front side plate can be spaced apart in the front-back direction. Furthermore, the second bottom plate 1710 and the first bottom plate 1110 can be an integral structure, the second left side plate 1730 and the first left side plate 1130 can be an integral structure, the second rear side plate 1750 and the first rear side plate 1150 can be an integral structure, and the second front side plate and the first front side plate can be an integral structure. This effectively reduces the material consumption of the dehumidification device 1000 provided in this embodiment of the invention, thereby reducing costs.

[0058] The second housing 1700 may be provided with an air inlet 1741 and an air outlet 1711. A second air-cooling path Q (e.g., ...) can be formed between the air inlet 1741 and the air outlet 1711. Figure 2 (Solid arrows in the diagram) Both the second heat dissipation component 1600 and the hot end 1220 can be located on the second air cooling path Q. Specifically, the air inlet 1741 can introduce relatively cool air (green arrow), which, after passing through the second heat dissipation component 1600, can form relatively warm air (red arrow), and then flow through the hot end 1220 to sequentially remove heat from the second heat dissipation component 1600 and the hot end 1220.

[0059] Here, the embodiments of this utility model do not limit the specific path form of the second air-cooling path Q. In practical applications, those skilled in the art can design it according to specific needs, as long as it can meet the requirements of use. For example, one can refer to... Figure 2 The scheme shown is used to construct the second air-cooling path Q. In practical applications, in order to form the second air-cooling path Q with the specific path shape described above, a fan, baffle, or other structure (not shown in the figure) can be installed inside the second housing 1700 to control the airflow direction inside the second housing 1700.

[0060] Furthermore, this embodiment of the invention does not limit the location of the air inlet 1741 and the air outlet 1711. In practical applications, those skilled in the art can choose according to specific needs, as long as the requirements of use are met. For example, the air inlet 1741 can be located on the second right side plate 1740, and the air outlet 1711 can be located on the second bottom plate 1710.

[0061] This utility model embodiment also provides an electrical device, including a dehumidifier 1000 and electronic components. The dehumidifier 1000 is the dehumidifier 1000 involved in the above-described implementations, and the electronic components are installed inside the first housing 1100.

[0062] As mentioned above, the dehumidification device 1000 provided in this embodiment of the present invention can actively select the cold end 1210 of the semiconductor cooling chip 1200 as the condensation location, and a liquid-receiving component 1300 can be provided on the lower side of the cold end 1210 to receive the condensed droplets. This can largely prevent droplets from falling into electronic devices, and can largely prevent problems such as short circuit failure of electronic devices, which is beneficial to ensuring the normal operation and service life of the electronic devices inside the dehumidification device 1000.

[0063] In this embodiment of the invention, the electronic device may include a control component. The control component may include, for example, a printed circuit board (PCB), a chip, etc., which can be communicatively connected to the thermoelectric cooler 1200 to control the start and stop of the thermoelectric cooler 1200. That is, in this embodiment of the invention, the thermoelectric cooler 1200 may not be in a normally open state; it may only be activated when needed, thus reducing energy waste.

[0064] Of course, the semiconductor cooling chip 1200 in this embodiment of the present invention can also be in a normally open state, which can simplify the control logic inside the electrical device.

[0065] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

Claims

1. An electrical device, characterized by The application relates to an electronic device and a dehumidifying device, the dehumidifying device comprising a first shell, a semiconductor refrigerating sheet and a liquid receiving component, the semiconductor refrigerating sheet being installed in the first shell, the semiconductor refrigerating sheet comprising a cold end and a hot end, the cold end being located on the inner side of the first shell, the hot end being located on the outer side of the first shell, the liquid receiving component being arranged on the inner side of the first shell and located on the lower side of the cold end, the first shell being arranged as a closed shell as a whole, and the electronic device being installed on the inner side of the first shell. The dehumidifying device further comprises a second heat dissipation component and a second shell, the second heat dissipation component being installed on the first shell, at least part of the second heat dissipation component being located on the outer side of the first shell, the second shell being connected with the first shell, the second shell being capable of covering at least the second heat dissipation component and the hot end, the second shell being provided with an air inlet and an air outlet, a second air cooling path being formed between the air inlet and the air outlet, and the second heat dissipation component and the hot end being located on the second air cooling path.

2. The electrical device of claim 1, wherein, At least one of the cold end and the hot end is provided with a first heat dissipation component.

3. The electrical device of claim 1, wherein, The first shell is provided with a mounting area for mounting a heating device, and the first shell is provided with a first air cooling path, on which the cold end is located downstream of the mounting area.

4. The electrical device of claim 3, wherein, The cold end is located below the mounting area.

5. The electrical device of claim 4, wherein, The first shell comprises a first bottom plate and a mounting side plate connected with the first bottom plate, the semiconductor refrigerating sheet and the liquid receiving component being mounted on the mounting side plate, and the cold end being located on the side of the mounting area close to the first bottom plate.

6. The electrical device of claim 5, wherein, The first bottom plate is further provided with a flow limiting plate, the distance between the flow limiting plate and the mounting side plate gradually decreasing from top to bottom.

7. The electrical device according to any of claims 1-6, characterized by The electronic device comprises a control component, the control component being communicatively connected with the semiconductor refrigerating sheet and used for controlling the start and stop of the semiconductor refrigerating sheet.

Images