HDI circuit board with sealed anti-layering structure

Abstract

The utility model discloses an HDI circuit board with a sealing anti-layering structure, which comprises an HDI circuit board, the outer edge of the HDI circuit board is wrapped with a sealing wrapping adhesive layer, and the upper surface and the lower surface of the HDI circuit board are respectively provided with a pressing plate frame which is tightly pressed on the sealing wrapping adhesive layer. A locking structure is arranged among the HDI circuit board, the sealing wrapping glue layer and the pressing plate frame, the periphery of the HDI circuit board is sleeved with the sealing glue layer for wrapping, surface air contact is reduced, the service life of the HDI circuit board is prolonged, the aging condition is reduced, meanwhile, the sealing glue layer is pressed through the locking structure and the pressing frame, the sealing performance is improved, and meanwhile the sealing performance of the HDI circuit board is improved. And the interlayer fastening of the HID circuit board can be further improved, and the service life of the HID circuit board is greatly prolonged.

Description

Technical Field

[0001] This utility model relates to HDI circuit board structure, and in particular to an HDI circuit board with a sealed anti-delamination structure. Background Technology

[0002] Delamination can occur when HDI circuit boards are used for a long time or in complex environments. Long-term use in high temperature, humid environment or chemical environment may cause the interlayer adhesive of HDI circuit board to age or deteriorate, thus causing delamination. Therefore, it is necessary to seal the outer edge of HDI circuit board to reduce the probability of delamination.

[0003] Therefore, existing HDI circuit boards need further improvement. Utility Model Content

[0004] The purpose of this invention is to provide an HDI circuit board with a sealed anti-delamination structure, which can improve its sealing performance and reduce the probability of delamination by wrapping the outer edges of the HDI circuit board with a sealing adhesive layer.

[0005] To achieve the above objectives, the present invention adopts the following solution:

[0006] An HDI circuit board with a sealed anti-delamination structure includes an HDI circuit board, the outer edge of which is wrapped with a sealing adhesive layer, and pressure plate frames are provided on the upper and lower surfaces of the HDI circuit board to press against the sealing adhesive layer. A locking structure is provided between the HDI circuit board, the sealing adhesive layer and the pressure plate frames.

[0007] Furthermore, the sealing and wrapping adhesive layer is silicone sealant.

[0008] Furthermore, the sealing adhesive layer is wrapped around the HDI circuit board and around the outer edges of the upper and lower end faces of the HDI circuit board.

[0009] Furthermore, the pressure plate frame is made of plastic material.

[0010] Furthermore, the locking structure includes multiple openings extending through the pressure plate frame, the sealing adhesive layer, and the HDI circuit board, with clamping nuts installed in the openings.

[0011] Furthermore, the number of openings is four, which are respectively located at the four corners of the HDI circuit board.

[0012] In summary, the advantages of this utility model over the prior art are:

[0013] This invention addresses the shortcomings of existing HDI circuit boards. Through its structural design, it offers the following advantages: a sealing layer is wrapped around the HDI circuit board, reducing contact with surface air, extending its lifespan, and reducing aging. Simultaneously, a locking structure and a clamping frame compress the sealing layer, improving sealing performance and further enhancing interlayer bonding, significantly extending the HDI circuit board's lifespan. Furthermore, the design is simple and easy to use. Attached Figure Description

[0014] Figure 1 This is a top view of the present invention;

[0015] Figure 2 This is a cross-sectional view of the present invention;

[0016] Figure 3 for Figure 2 A sectional view along line AA. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figure 1-3 This utility model provides an HDI circuit board with a sealed anti-delamination structure, including an HDI circuit board 1, wherein the outer edge of the HDI circuit board 1 is wrapped with a sealing adhesive layer 2, and a pressure plate frame 3 is provided on the upper and lower surfaces of the HDI circuit board 1 to press against the sealing adhesive layer 2, and a locking structure 4 is provided between the HDI circuit board 1, the sealing adhesive layer 2 and the pressure plate frame 3.

[0019] By sealing the interlayer of the outer edges of the HDI circuit board 1 with the sealing adhesive layer 2, the contact with external air is reduced, thus improving its lifespan.

[0020] The upper and lower pressure plate frames 3 are used to press the edges of the sealing adhesive layer 2 on the HDI circuit board 1, thereby improving the sealing effect of the sealing adhesive layer 2 and preventing it from falling off. The locking structure 4 can further improve the stability between the layers of the HDI circuit board 1 and can also press the sealing adhesive layer 2 and the pressure plate frames 3 to prevent them from falling off.

[0021] The sealing and wrapping adhesive layer 2 of this utility model is a silicone sealant.

[0022] The sealing and wrapping adhesive layer 2 of this utility model is wrapped around the HDI circuit board 1 and the outer edges of the upper and lower end faces of the HDI circuit board 1.

[0023] The pressure plate frame 3 described in this utility model is made of plastic material.

[0024] The locking structure 4 of this utility model includes multiple openings 401 that penetrate through the pressure plate frame 3, the sealing and wrapping adhesive layer 2 and the HDI circuit board 1, and a clamping nut 402 is installed in the opening 401.

[0025] The present invention has four openings 401, which are respectively located at the four corners of the HDI circuit board 1.

[0026] The foregoing has shown and described the basic principles and main features of this utility model, as well as its advantages. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An HDI circuit board with a sealed delamination-proof structure, comprising an HDI circuit board (1), characterized in that: The outer edge of the HDI circuit board (1) is wrapped with a sealing wrapping glue layer (2), the upper and lower surfaces of the HDI circuit board (1) are respectively provided with a pressing plate frame (3) pressed to the sealing wrapping glue layer (2), and a locking structure (4) is arranged between the HDI circuit board (1), the sealing wrapping glue layer (2) and the pressing plate frame (3).

2. The HDI circuit board with a sealed delamination-preventing structure according to claim 1, characterized in that: The sealing wrapping glue layer (2) is a silica gel sealing glue.

3. The HDI circuit board with a sealed delamination-preventing structure according to claim 1, wherein: The sealing wrapping glue layer (2) wraps the four sides of the HDI circuit board (1) and the outer edges of the upper and lower end surfaces of the HDI circuit board (1).

4. The HDI circuit board with a sealed delamination-preventing structure according to claim 1, wherein: The pressing plate frame (3) is made of plastic material.

5. The HDI circuit board with a sealed delamination-preventing structure according to any one of claims 1-4, characterized in that: The locking structure (4) comprises a plurality of openings (401) penetrating through the pressing plate frame (3), the sealing wrapping glue layer (2) and the HDI circuit board (1), and a pressing nut (402) is mounted in the opening (401).

6. The HDI circuit board with a sealed delamination-preventing structure according to claim 5, characterized in that: The number of the openings (401) is four, which are respectively arranged at the four corner positions of the HDI circuit board (1).

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