Repair equipment

Abstract

The utility model provides repair equipment which is used for repairing a circuit board. The repair equipment comprises a fixing base, a first heating device and a heat dissipation device, the fixing base is used for installing the circuit board assembly, and the first heating device and the heat dissipation device are both connected to the fixing base. The first heating device is used for heating a first device on the circuit board assembly, and the heat dissipation device is used for conducting heat dissipation on the circuit board assembly. The heat dissipation device comprises a base and at least one first heat conduction piece, and the at least one first heat conduction piece is arranged on the top face of the base in a protruding mode. The base is provided with a device area, the device area is used for being arranged corresponding to a first device of the circuit board assembly in the first direction, the at least one first heat conduction piece surrounds the device area, and the at least one first heat conduction piece is used for being in heat conduction connection with the circuit board assembly. When the repair equipment is used for repairing the circuit board assembly, the periphery of the to-be-repaired device on the circuit board assembly is heated uniformly, and the periphery of the to-be-repaired device is not prone to upwarp to cause missing solder.

Description

Technical Field

[0001] This application relates to the field of rework equipment for circuit board assemblies, and more particularly to a rework equipment. Background Technology

[0002] When repairing circuit board assemblies, it is necessary to disassemble and solder the components to be repaired on the circuit board. During the disassembly and soldering process, the components to be repaired on the circuit board need to be heated, and the circuit board needs to be cooled.

[0003] However, existing rework equipment suffers from significant differences in heat dissipation rates around the components being repaired during circuit board cooling, resulting in substantial temperature variations around the components. This can cause the edges of the components to lift, leading to incomplete soldering and affecting the soldering yield. Utility Model Content

[0004] This application provides a rework equipment for circuit board assemblies. When the circuit board assembly is reworked using this equipment, the periphery of the component to be reworked on the circuit board assembly is heated more evenly, and the periphery of the component to be reworked is less likely to lift up and cause a void solder joint.

[0005] This application provides a rework device for reworking circuit boards. The rework device includes a mounting base, a first heating device, and a heat dissipation device. The mounting base is used to mount the circuit board assembly, and both the first heating device and the heat dissipation device are connected to the mounting base. The first heating device is used to heat a first device on the circuit board assembly, and the heat dissipation device is used to dissipate heat from the circuit board assembly. The heat dissipation device includes a base and at least one first heat-conducting element. The at least one first heat-conducting element protrudes from the top surface of the base. The base has a device area, which is arranged corresponding to the first device of the circuit board assembly in a first direction. The at least one first heat-conducting element surrounds the device area and is used for thermally conductive connection with the circuit board assembly.

[0006] It is understandable that the corresponding arrangement of the device area of ​​the base and the first device of the circuit board assembly means that the device area of ​​the heat dissipation device and the first device of the circuit board assembly are centrally aligned, that is, the center of the device area is aligned with the center of the first device of the circuit board assembly. For example, when projected along the first direction, in a plane perpendicular to the first direction, the projection of the device area can completely fall into the projection of the first device, or the projection of the device area and the projection of the first device at least partially coincide, or the projection of the device area and the projection of the first device partially coincide, or the projection of the first device can completely fall into the projection of the device area.

[0007] It is understood that a thermally conductive connection refers to a connection between components that allows for heat transfer. In this embodiment, the first thermally conductive element is connected to the circuit board assembly, and heat on the circuit board assembly can be transferred from the contact point between the circuit board assembly and the first thermally conductive element to the heat dissipation device, thereby achieving heat dissipation for the circuit board assembly. Therefore, the temperature of the area on the circuit board assembly in contact with the first thermally conductive element is lower.

[0008] Since the device area is correspondingly arranged with the first device of the circuit board assembly, the embodiments of this application arrange the first heat-conducting element around the device area. The first heat-conducting element can carry away the heat around the first device and reduce the temperature difference in the surrounding area of ​​the first device, thereby avoiding the periphery from lifting and causing open soldering, which affects the soldering yield of the device.

[0009] In some embodiments, there are multiple first heat-conducting elements, which are spaced apart.

[0010] In this embodiment, multiple first heat-conducting elements can surround the device area to dissipate heat from the surrounding area of ​​the first device, thereby reducing the temperature difference in the surrounding area of ​​the first device. Furthermore, the heat dissipation device can adjust the connection area and connection position between the first heat-conducting elements and the circuit board assembly by controlling the number, shape, and position of the first heat-conducting elements. The heat dissipation device has a wide range of applications.

[0011] In some embodiments, the number of first heat-conducting elements is one, and the first heat-conducting element is in the form of a ring or an open ring.

[0012] In this embodiment, a first heat-conducting element can surround the device area to dissipate heat from the surrounding area of ​​the first device, thereby reducing the temperature difference in the surrounding area of ​​the first device. Furthermore, the heat dissipation device can adjust the connection area and connection position between the first heat-conducting element and the circuit board assembly by controlling the shape and position of the first heat-conducting element. The heat dissipation device has a wide range of applications.

[0013] In some embodiments, the base and the first heat-conducting element are integrally formed structural components. This simplifies the manufacturing process and reduces the manufacturing cost of the heat dissipation device.

[0014] In some embodiments, the heat dissipation device further includes a thermally conductive pad disposed on the top surface of the first thermally conductive element away from the base; the thermally conductive pad is used for thermally conductive connection between the first thermally conductive element and the circuit board assembly.

[0015] It is understood that thermally conductive pads possess good adhesion, flexibility, good compressibility, and excellent thermal conductivity. In this embodiment, the thermally conductive pad allows air to escape between the first thermally conductive element and the circuit board assembly, ensuring full contact between the first thermally conductive element and the circuit board assembly, which is beneficial for improving the heat conduction effect.

[0016] In addition, a thermal pad is disposed on the first thermally conductive component. Since the first thermally conductive component protrudes from the top surface of the base, when the thermal pad is deformed by compression, the connection area between the portion of the thermal pad located between the first thermally conductive component and the circuit board assembly and the first thermally conductive component and the circuit board assembly can remain unchanged. This allows the connection area between the first thermally conductive component and the circuit board assembly to remain within a stable range, thereby preventing large fluctuations in the heat dissipation rate of the heat dissipation device to the circuit board assembly. This, in turn, helps to ensure that the temperature difference around the first device of the circuit board assembly remains stable within a small range.

[0017] In some implementations, the base is provided with heat dissipation channels for the flow of coolant.

[0018] In this embodiment, the heat dissipation device can quickly remove heat from the base through the coolant in the heat dissipation channel, which helps to improve the heat dissipation effect of the heat dissipation device.

[0019] In some embodiments, the base is provided with heat dissipation channels, and the heat dissipation device also includes heat dissipation material disposed within the heat dissipation channels, the thermal conductivity of the heat dissipation material being greater than that of the base. In this way, heat on the base can be quickly transferred to the heat dissipation material to cool the base, thereby improving the heat dissipation effect of the heat dissipation device.

[0020] In some implementations, the projection of the heat dissipation channel onto the top surface of the base along the first direction surrounds the device area.

[0021] It is understandable that, because the heat dissipation material or coolant within the heat dissipation channel can quickly remove heat from the base, the area of ​​the base near the heat dissipation channel has a faster heat dissipation efficiency. In this embodiment, by placing the heat dissipation channel around the device area, it is beneficial to balance the heat dissipation efficiency of the first heat-conducting component located around the device area, thereby reducing the temperature difference around the first device of the circuit board assembly.

[0022] In some embodiments, the base includes a first side and a second side, which are located on opposite sides of the device area. At least one first heat-conducting element is provided on both the first and second sides. The total contact area of ​​the first heat-conducting element on the first side is a first area, and the total contact area of ​​the first heat-conducting element on the second side is a second area, where the first area is smaller than the second area. The base includes a first sub-region and a second sub-region spaced apart. The first sub-region is located on the first side, and its edge surrounds the first heat-conducting element on the first side. The first sub-region is located on the second side, and its edge surrounds the first heat-conducting element on the second side. The heat dissipation channel includes a first segment, a second segment, and a connecting segment. The connecting segment connects the first segment and the second segment. The first segment is located on the side of the first sub-region away from the device area, and the second segment is located on the side of the second sub-region away from the device area. In a plane perpendicular to the first direction, the distance between the first segment and the first sub-region of the heat dissipation channel is smaller than the distance between the second segment and the second sub-region of the heat dissipation channel.

[0023] It is understood that the contact surface of the first heat-conducting component is the surface on which the first heat-conducting component contacts the circuit board assembly. The total contact area of ​​the first heat-conducting components on the first edge is the sum of the contact areas of all the first heat-conducting components on the first edge with the circuit board assembly. Similarly, the total contact area of ​​the first heat-conducting components on the second edge is the sum of the contact areas of all the first heat-conducting components on the second edge with the circuit board assembly. In this embodiment, because the first area is smaller than the second area, the heat dissipation rate of the area on the circuit board assembly corresponding to the first edge is slower, while the heat dissipation rate of the area on the circuit board assembly corresponding to the second edge is faster.

[0024] It is understandable that the heat dissipation material or coolant within the heat dissipation channel can quickly remove heat from the base, thus the area on the base near the heat dissipation channel has a faster heat dissipation efficiency. In this embodiment, by adjusting the distance between the heat dissipation channel and the first sub-region, and the distance between the heat dissipation channel and the second sub-region, the heat dissipation rate of the two regions corresponding to the first and second edges on the circuit board assembly is made moderate, and the difference in heat dissipation rate between the two regions is small, thereby reducing the temperature difference between the two regions on the circuit board assembly.

[0025] In some implementations, the first section is the outlet pipe connected to the heat dissipation channel, and the second section is the inlet pipe connected to the heat dissipation channel.

[0026] During the rework of circuit board assemblies, the temperature of the coolant in the first section of the heat dissipation channel is usually higher than that in the second section. In this embodiment, by adjusting the distance between the heat dissipation channel and the first sub-region, and the distance between the heat dissipation channel and the second sub-region, the heat dissipation rate of the two regions corresponding to the first and second edges on the circuit board assembly is made moderate, and the difference in heat dissipation rate between the two regions is small, thereby reducing the temperature difference between the two regions on the circuit board assembly.

[0027] In some embodiments, the first heat-conducting element is made of at least one of copper, aluminum, and steel. This results in a moderate thermal conductivity for the first heat-conducting element, leading to better heat dissipation of the heat dissipation device.

[0028] In some implementations, a portion of the top surface of the base is located in the device region.

[0029] In this embodiment, the device area of ​​the heat dissipation device may be provided with other heat-conducting components (e.g., a second heat-conducting component). In this way, the heat dissipation device can also be thermally connected to the circuit board assembly through other heat-conducting components in the device area to improve the heat dissipation rate of the area on the circuit board assembly corresponding to the device area, thereby protecting other devices in that area except for the first device.

[0030] In some implementations, a portion of the base is hollowed out, and at least a portion of the device area is located within the hollowed-out area of ​​the base.

[0031] In some embodiments, the mounting base includes a first side and a second side facing away from each other. The first side is used to mount the circuit board assembly, and the heat dissipation device is fixedly connected to the second side. The mounting base is provided with a through hole that penetrates through the first side and the second side, and the first heat-conducting element is exposed relative to the through hole of the mounting base.

[0032] In this embodiment, the first side of the mounting base is used to mount the circuit board assembly, while the heat dissipation device is fixedly connected to the second side of the mounting base. In this way, the heat dissipation device does not occupy one side of the space on the first side of the mounting base, nor does it interfere with the mounting of the circuit board assembly.

[0033] In some embodiments, the mounting base has a recess formed by a portion of the first surface, the recess surrounding a through hole in the mounting base, and the recess is used to mount a circuit board assembly.

[0034] In this embodiment, the groove can be used to accommodate the circuit board assembly and also to position the circuit board assembly, thereby improving the assembly speed of the circuit board assembly and thus improving the rework efficiency of the circuit board assembly.

[0035] In some embodiments, the mounting base includes a first side and a second side facing away from each other. The first side is used to mount the circuit board assembly, and a heat dissipation device is located on the side of the first side away from the second side and is movably connected to the mounting base. The heat dissipation device surrounds the first heat-generating device.

[0036] In this embodiment, when the first heating device heats the circuit board, the heat dissipation device can dissipate heat to the area around the heating area, thereby preventing other devices around the heating area from failing due to high temperature.

[0037] In some embodiments, the mounting base includes a first side and a second side facing away from each other, the first side being used to mount the circuit board assembly, a heat dissipation device being located on the side of the first side away from the second side and movably connected to the mounting base; a first heating device surrounding the heat dissipation device.

[0038] In this embodiment, when the first heating device heats the circuit board, the heat dissipation device can dissipate heat to the inner area of ​​the heating area, thereby preventing other devices inside the heating area from failing due to high temperature.

[0039] In some embodiments, the first thermally conductive element is used for thermally conductive connection with a second device of the circuit board assembly, the second device of the circuit board assembly being spaced apart from the first device of the circuit board assembly.

[0040] It is understandable that the second component of a circuit board assembly typically requires protection with filler or potting compound. The filler or potting compound expands at high temperatures, potentially squeezing the solder joints of the second component. However, this embodiment utilizes heat dissipation material or coolant within the heat dissipation channel to rapidly remove heat from the base, maintaining the solder joint temperature of the second component below the solder solidus line. This prevents the solder joints of the second component from melting and being squeezed by the filler or potting compound on the circuit board assembly, thus avoiding problems such as insufficient solder or solder bridging.

[0041] In addition, the solder joints of the second device are not affected by the filler or potting compound on the circuit board assembly, so that the circuit board assembly does not need to be cleaned of adhesive during the rework process. This avoids problems such as component collision, long time consumption, and adhesive contamination of the circuit board assembly caused by adhesive cleaning.

[0042] In some embodiments, the rework equipment also includes a base and a lifting device. The base has a mounting groove, and a fixed seat is installed in the mounting groove. The lifting device is installed on the base, and a first heating device is installed on the lifting device. The lifting device can drive the first heating device to move closer to or away from the fixed seat in a first direction.

[0043] In this embodiment, the mounting base can be fixed in place, while the lifting device can move closer to or further away from the mounting base along the first direction. This facilitates the alignment between the first heating device and the circuit board assembly mounted on the mounting base with high precision, and also helps to avoid collisions between the first heating device and the circuit board assembly.

[0044] In some embodiments, the base is provided with a leakage hole that penetrates the bottom wall of the mounting groove; the repair equipment also includes a leakage collection tank and a leakage detector, the leakage collection tank is located on the side of the base opposite to the mounting groove and is connected to the leakage hole; the leakage detector is located in the leakage collection tank.

[0045] Furthermore, if coolant leaks from the heat dissipation unit, it can be collected in a leakage collection tank via the leakage hole on the base. A leakage detector located in the collection tank can then detect the presence of liquid. If a leak occurs in the heat dissipation unit, the equipment can be repaired by cutting off all power.

[0046] In some embodiments, the base includes a first surface and a second surface facing away from each other, with the opening of the mounting groove located on the first surface; along a second direction, the bottom wall of the mounting groove is away from the second surface of the base, and the second direction points from the drain hole to the edge of the bottom wall of the mounting groove. Thus, when liquid is present in the mounting groove, the liquid can flow along the bottom wall of the mounting groove to the drain hole.

[0047] In some embodiments, the base also includes a receiving cavity, which is spaced apart from the mounting slot; the control circuit of the rework equipment is located inside the receiving cavity, and the heat dissipation device is located outside the receiving cavity.

[0048] In this embodiment, by placing the heat dissipation device outside the receiving cavity of the base and placing the control circuit of the rework equipment inside the receiving cavity, the control circuit of the rework equipment can be isolated from the heat dissipation device. This separates the electrical and water circuits of the rework equipment, thereby preventing safety issues such as electrical leakage caused by leakage from the heat dissipation device in the control circuit of the rework equipment.

[0049] In some embodiments, the repair equipment also includes a foot switch electrically connected to a lifting device, the foot switch being used to control the first heating device to move along a first direction.

[0050] Users can control the lifting device and the first heating element's raising and lowering via a foot switch, and can also control the duration the first heating element remains in a certain position. This allows users to free their hands during repairs by controlling the position of the first heating element with their feet. Attached Figure Description

[0051] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0052] Figure 1A This is a schematic diagram of the rework equipment provided in some embodiments of this application;

[0053] Figure 1B yes Figure 1A The diagram shows the structure of the equipment under repair in another state;

[0054] Figure 2 yes Figure 1A The diagram shows a partial exploded view of the rework equipment in some embodiments.

[0055] Figure 3 yes Figure 2 The diagram shows a partial structural schematic of the base in some embodiments;

[0056] Figure 4 yes Figure 3 An exploded view of a portion of the structure of the base shown in some embodiments;

[0057] Figure 5 yes Figure 3 The diagram shows a partial cross-sectional structure of the base cut along point AA.

[0058] Figure 6A yes Figure 2 The diagram shows the structural schematic of the mounting base in some embodiments;

[0059] Figure 6B yes Figure 6A The diagram shows the structure of the mounting base at another angle;

[0060] Figure 7A yes Figure 2 The diagram shows a structural schematic of the heat dissipation device in some embodiments;

[0061] Figure 7B yes Figure 7A A schematic diagram of the heat dissipation device shown from another angle;

[0062] Figure 8 yes Figure 7B The heat dissipation device shown is partially exploded in some embodiments.

[0063] Figure 9 yes Figure 7A The diagram shows a partial cross-sectional view of the heat dissipation device cut along point BB in some embodiments.

[0064] Figure 10A yes Figure 7AA schematic diagram of the heat dissipation device shown from another angle;

[0065] Figure 10B yes Figure 10A An exploded view of part of the heat dissipation device shown.

[0066] Figure 11A yes Figure 7A The diagram shows a partial structural schematic of the heat dissipation device in some embodiments.

[0067] Figure 11B yes Figure 11A A top view of a portion of the heat dissipation device shown;

[0068] Figure 12 yes Figure 11A A top view of a portion of the heat dissipation device shown;

[0069] Figure 13A yes Figure 7A The heat dissipation device shown is a partial structural schematic diagram in some other embodiments;

[0070] Figure 13B yes Figure 13A A top view of a portion of the heat dissipation device shown;

[0071] Figure 14A yes Figure 7A The heat dissipation device shown is a partial structural schematic diagram in some other embodiments;

[0072] Figure 14B yes Figure 14A A top view of a portion of the heat dissipation device shown;

[0073] Figure 15A yes Figure 7A The heat dissipation device shown is a partial structural schematic diagram in some other embodiments;

[0074] Figure 15B yes Figure 15A A top view of a portion of the heat dissipation device shown;

[0075] Figure 16A yes Figure 7A The diagram shows a structural schematic of the heat dissipation device in some other embodiments;

[0076] Figure 16B yes Figure 16A A schematic diagram of the heat dissipation device shown from another angle;

[0077] Figure 17 yes Figure 16A The diagram shows a partial structural schematic of the heat dissipation device in some embodiments.

[0078] Figure 18A yes Figure 16A A top view of a portion of the heat dissipation device in some embodiments;

[0079] Figure 18B yes Figure 16A Top view of a portion of the heat dissipation device in some other embodiments;

[0080] Figure 19 yes Figure 2 The diagram shows the assembly structure of the mounting base and heat dissipation device in some embodiments;

[0081] Figure 20 yes Figure 19 A partial structural diagram of the assembly structure of the mounting base and heat dissipation device shown from another angle;

[0082] Figure 21 yes Figure 1A The diagram shows a partial cross-sectional view of the rework equipment cut along CC in some embodiments.

[0083] Figure 22 yes Figure 2 The diagram shows the structural schematics of the mounting base, heat dissipation device, and circuit board assembly in some embodiments;

[0084] Figure 23 yes Figure 2 The diagram shows the assembly structure of the mounting base, heat dissipation device, and circuit board assembly.

[0085] Figure 24 yes Figure 23 Top view of a portion of the heat dissipation device and circuit board assembly in some embodiments;

[0086] Figure 25 yes Figure 23 The assembly structure of the rework equipment and circuit board assembly shown is a schematic diagram of a partial cross-sectional structure cut along DD in some embodiments;

[0087] Figure 26A yes Figure 7A A top view of a portion of the heat dissipation device in some other embodiments;

[0088] Figure 26B yes Figure 7A Top view of a portion of the heat dissipation device in some other embodiments. Figure 2 ;

[0089] Figure 27 yes Figure 7A Top view of a portion of the heat dissipation device in some other embodiments;

[0090] Figure 28 yes Figure 1A The diagram shows a structural schematic of the rework equipment in some other embodiments;

[0091] Figure 29A yes Figure 28 The diagram shows the structural schematics of the first heating device and the heat dissipation device in some embodiments;

[0092] Figure 29B yes Figure 29A The diagram shows a partial structural cut along E1-E1.

[0093] Figure 30A yes Figure 28 Schematic diagrams of the first heating device and the heat dissipation device in some other embodiments;

[0094] Figure 30B yes Figure 30A The diagram shows a partial structural cut along E2-E2. Detailed Implementation

[0095] The embodiments of this application are described below with reference to the accompanying drawings.

[0096] In the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. "Movable connection" refers to a connection where the relative positional relationship can change after connection.

[0097] The term "one-piece molding" refers to the process of forming one of two parts, in which the part is connected to the other part without the need for further processing (such as bonding, welding, snap-fit, screw connection) to join the two parts together.

[0098] The directional terms mentioned in the embodiments of this application, such as "top," "bottom," "inner," "outer," and "side," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0099] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0100] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0101] References or "some embodiments" as described in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiments, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0102] The terms “including,” “having,” and their variations all mean “including but not limited to,” unless otherwise specifically emphasized. The term “multiple” means at least two.

[0103] The terms "perpendicular" and similar designations are relative to the current technological level, rather than being an absolutely strict mathematical definition. Slight deviations are allowed, and approximations of perpendicularity are acceptable. For example, "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80° and 100°.

[0104] It is understood that the specific embodiments described herein are merely illustrative of related embodiments and not intended to limit the scope of those embodiments. Furthermore, it should be noted that, for ease of description, only the parts relevant to the embodiments are shown in the accompanying drawings.

[0105] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0106] Please refer to the following: Figure 1A , Figure 1B and Figure 2 , Figure 1A This is a schematic diagram of the rework equipment 100 provided in some embodiments of this application. Figure 1B yes Figure 1A The diagram shown is a structural schematic of the repair equipment 100 in another state. Figure 2 yes Figure 1A The diagram shown is a partial exploded view of the rework equipment 100 in some embodiments. It is understood that... Figures 1A to 2 The parts of the repair equipment 100 are shown only schematically; their actual shape, size, location, and construction are not subject to change. Figure 1A , Figure 1B and Figure 2 Limited by.

[0107] In some embodiments, the rework equipment 100 may include a base 10, a fixing seat 20, a first heating device 30, a heat dissipation device 40, and a lifting device 50. The fixing seat 20, the heat dissipation device 40, and the lifting device 50 are all mounted on the base 10. The rework equipment 100 provided in this application embodiment is used for reworking circuit board assemblies 60. The rework of the circuit board assembly 60 may include disassembly and soldering processes.

[0108] The mounting bracket 20 is used to mount the circuit board assembly 60. It can be understood that the circuit board assembly 60 can be a circuit board assembly 60 to be repaired, that is, there is at least one component to be repaired on the circuit board assembly 60.

[0109] The first heating device 30 is used to heat the circuit board assembly 60. For example, the first heating device 30 can heat the circuit board assembly 60 during disassembly and soldering. In some examples, the first heating device 30 can be used to blow air onto the circuit board assembly 60. It is understood that the first heating device 30 can be used to blow air onto the circuit board assembly 60 to heat it; or, the first heating device 30 can also be used to blow air onto the circuit board assembly 60 to cool it. For example, the first heating device 30 may include a hot air gun. In this case, the first heating device 30 may have an air outlet 31, which can be aimed at the components on the circuit board assembly 60 that need to be reworked during heating. In other examples, the first heating device 30 may include a laser head. The first heating device 30 can use a laser to heat the circuit board assembly 60.

[0110] For example, the first heating device 30 is fixedly connected to the lifting device 50. The lifting device 50 can drive the first heating device 30 to move relative to the base 10 along the Z-axis. In some examples, the lifting device 50 can be driven by a motor to move the first heating device 30 along the Z-axis. In this embodiment, the fixed base 20 can be fixed, while the lifting device 50 moves closer to or further away from the fixed base 20 along the Z-axis, which is beneficial for the alignment of the first heating device 30 with the circuit board assembly 60 mounted on the fixed base 20, and the alignment is more accurate. It also helps to avoid collisions between the first heating device and the circuit board assembly 60.

[0111] In this embodiment, the raising and lowering of the first heating device 30 and the heating time of the first heating device 30 can both be controlled by programming. For example, during the soldering process, when the first heating device 30 heats the circuit board assembly 60, at least eight heating temperature zones can be set, and the temperature, time, and gas flow rate of each temperature zone can be controlled independently to meet the reflow curve requirements such as Ramp-Soak-Spike (RSS) and Ramp-To-Spike (RTS).

[0112] The heat dissipation device 40 is used to dissipate heat from the circuit board assembly 60 during rework. In some examples, the heat dissipation device 40 can be fixedly connected to the mounting base 20. In this case, the heat dissipation device 40 can be used to dissipate heat from a specific area on the circuit board assembly 60. In other examples, the heat dissipation device 40 can also be movably connected to the mounting base 20. In this case, the heat dissipation device 40 can dissipate heat from different areas on the circuit board assembly 60. For example, the heat dissipation device 40 can move with the first heating device 30 to dissipate heat from the area surrounding the heated area on the circuit board assembly 60.

[0113] It is understood that the rework device 100 may have more or fewer components. In some examples, the rework device 100 may include more components, such as a foot switch 110. The foot switch 110 can be electrically connected to the lifting device 50. The user can control the lifting of the lifting device 50 and the first heating device 30 via the foot switch 110, and can also control the duration of the first heating device 30 in a certain position via the foot switch 110. In this way, during the rework process, the user can control the position of the first heating device 30 by foot, thereby freeing their hands. In other examples, the rework device 100 may include fewer components; for example, the rework device 100 may not include the base 10 and / or the lifting device 50.

[0114] Please refer to the following: Figures 3 to 5 , Figure 3 yes Figure 2 The diagram shown is a partial structural schematic of the base 10 in some embodiments. Figure 4 yes Figure 3 An exploded view of a portion of the structure of the base 10 in some embodiments is shown. Figure 5 yes Figure 3 The diagram shows a partial cross-sectional view of the base 10 cut along point AA.

[0115] In some embodiments, the base 10 may include a base body 11 and a mounting plate 12. The mounting plate 12 is fixedly connected to the base body 11 and together with the base body 11, encloses the receiving cavity 101.

[0116] For example, the base body 11 includes a housing 111 and a partition 112. The partition 112 is located inside the housing 111 and is fixedly connected to the housing 111.

[0117] For example, the mounting plate 12 includes a first surface 121 and a second surface 122 disposed opposite to each other. The mounting plate 12 is provided with a mounting groove 123, the opening of which can be located on the first surface 121. For example, the mounting plate 12 also provides a first through hole 124. The first through hole 124 can penetrate the bottom wall 1231 of the mounting groove 123. For example, the mounting plate 12 also provides a drain hole 125. The drain hole 125 can penetrate the bottom wall 1231 of the mounting groove 123 and is spaced apart from the first through hole 124. For example, the mounting plate also provides a second through hole 126. The second through hole 126 can penetrate the side wall 1232 of the mounting groove 123. It is understood that the first through hole 124, the drain hole 125, and the second through hole 126 can all communicate with the mounting groove 123.

[0118] For example, along the second direction, the bottom wall 1231 of the mounting groove 123 is away from the second surface 122 of the base 10. The second direction points from the drain hole 125 to the edge of the bottom wall 1231 of the mounting groove 123. Thus, when liquid is present in the mounting groove 123, the liquid can flow along the bottom wall 1231 of the mounting groove 123 to the drain hole 125.

[0119] It is understood that in this embodiment, the base 10 is provided with a mounting groove 123, a first through hole 124, and a drain hole 125, and the mounting groove 123, the first through hole 124, and the drain hole 125 can be provided on the mounting plate 12. In some other embodiments, the mounting groove 123, the first through hole 124, and the drain hole 125 can also be provided at other positions on the base 10, and this application does not strictly limit this.

[0120] In some embodiments, the mounting groove 123 is spaced apart from the receiving cavity 101. It is understood that the mounting groove 123 and the receiving cavity 101 are not in communication. Exemplarily, the second surface 122 of the mounting plate 12 can be fixedly connected to the base body 11. For example, a portion of the second surface 122 of the mounting plate 12 can be fixedly connected to the housing 111 of the base body 11, and a portion can be fixedly connected to the partition 112 of the base body 11. In this case, the second surface 122 of the mounting plate 12 faces the receiving cavity 101. The partition 112 can be located within the receiving cavity 101 and seal the first through hole 124 of the mounting plate 12, thereby isolating the receiving cavity 101 and the mounting groove 123.

[0121] In some embodiments, the control circuit (not shown) of the repair equipment 100 may be located inside the receiving cavity 101.

[0122] In some embodiments, the repair equipment 100 further includes a second heating device 70. The second heating device 70 can be mounted on the base body 11, and a portion of the second heating device 70 can be exposed relative to the first through hole 124 of the mounting plate 12. Exemplarily, a portion of the second heating device 70 can be located within the first through hole 124. Exemplarily, the second heating device 70 is mounted on the base 10 using a side-insertion assembly method for easy maintenance.

[0123] In some embodiments, the rework device 100 further includes a leakage collection tank 102 and a leakage detector 80. The leakage collection tank 102 may be disposed on the side of the base 10 opposite to the mounting groove 123 and communicate with the leakage hole 125. Exemplarily, the leakage collection tank 102 may be mounted on the partition 112 of the base body 11. Exemplarily, the leakage detector 80 may be disposed in the leakage collection tank 102. The leakage detector 80 may be used to detect whether there is liquid in the leakage collection tank 102. Exemplarily, the leakage detector 80 may be a leakage detection rope, a sensor, etc.

[0124] Please refer to the following: Figure 6A and Figure 6B , Figure 6A yes Figure 2 The diagram shown is a structural schematic of the fixing base 20 in some embodiments. Figure 6B yes Figure 6A The diagram shows the structure of the fixed base 20 at another angle.

[0125] In some embodiments, the mounting base 20 includes a first surface 21 and a second surface 22 that are disposed opposite to each other. For ease of description below, for example, the length direction of the base 10 is defined as the X-axis direction, the width direction as the Y-axis direction, and the height direction as the Z-axis direction. The X-axis, Y-axis, and Z-axis are mutually perpendicular. It is understood that the coordinate system of the base 10 can also be flexibly set according to specific needs. In this embodiment, the first surface 21 and the second surface 22 of the mounting base 20 can be disposed opposite to each other in the Z-axis direction. Furthermore, in the following description, the side closer to the first surface 21 is defined as the "top," and the side farther from the first surface 21 is defined as the "bottom."

[0126] For example, the mounting base 20 is provided with a through hole 23. The through hole 23 can penetrate through the first surface 21 and the second surface 22 of the mounting base 20. For example, the mounting base 20 is provided with a groove 24. The groove 24 can be recessed by a portion of the first surface 21 of the mounting base 20. The groove 24 can be provided around the through hole 23.

[0127] For example, the mounting base 20 is provided with a first limiting portion 251 and a second limiting portion 252. The first limiting portion 251 may protrude from the first surface 21 of the mounting base 20. The first limiting portion 251 may be disposed around the groove 24. The second limiting portion 252 may protrude from the groove sidewall 241 of the groove 24. The second limiting portion 252 may be disposed opposite to the first limiting portion 251. The second limiting portion 252 and the first limiting portion 251 cooperate to limit the movement of the circuit board assembly 60 in the Z-axis direction.

[0128] In some embodiments, the mounting base 20 may include a first portion 20a and a second portion 20b. For example, Figure 6A The first part 20a and the second part 20b are schematically distinguished by dashed lines. The second part 20b can be arranged around the first part 20a. In some examples, the external dimensions of the mounting base 20 can be standardized (for example, the mounting base 20 is 180mm long and 8mm thick, with the first part 20a being 11mm wide and the second part 20b being 2mm thick). In this way, the mounting base 20 can be quickly replicated and promoted.

[0129] Please refer to the following: Figures 7A to 8 , Figure 7A yes Figure 2 The diagram shown is a structural schematic of the heat dissipation device 40 in some embodiments. Figure 7B yes Figure 7A The diagram shows the structure of the heat dissipation device 40 from another angle. Figure 8 yes Figure 7B The exploded view of a portion of the structure of the heat dissipation device 40 in some embodiments is shown.

[0130] In some embodiments, the heat dissipation device 40 includes a base 41 and at least one first heat-conducting element 42. Exemplarily, the base 41 may include a top surface 411, a bottom surface 412, and a side surface 413. The top surface 411 and the bottom surface 412 of the base 41 are disposed opposite to each other. The side surface 413 of the base 41 connects between the top surface 411 and the bottom surface 412. Exemplarily, the first heat-conducting element 42 may protrude from the top surface 411 of the base 41.

[0131] In some embodiments, the base 41 and the first heat-conducting element 42 can be integrally formed structural components to simplify the manufacturing process and reduce the manufacturing cost of the heat dissipation device 40. In other embodiments, the first heat-conducting element 42 can also be fixed to the base 41 by welding, bonding, or other means.

[0132] For example, the material of the first heat-conducting element 42 may include metals such as copper, aluminum, and steel. In this case, the thermal conductivity of the first heat-conducting element 42 is moderate, and the heat dissipation effect of the heat dissipation device 40 is good. In other examples, the material of the first heat-conducting element 42 may include other thermally conductive materials such as thermally conductive silicone and graphite.

[0133] Please refer to the following: Figure 8 and Figure 9 , Figure 9 yes Figure 7A The diagram shows a partial cross-sectional view of the heat dissipation device 40 taken at point BB in some embodiments. For example, Figure 9 The base 41 and the first heat-conducting component 42 are schematically divided by dashed lines.

[0134] In some embodiments, the base 41 is provided with a heat dissipation channel 410. For example, the base 41 may include a base body 414 and a base plate 415. At least a portion of the bottom surface 412 may be located inside the base body 414 and fixedly connected to it. The base plate 415 and the base body 414 may together form the heat dissipation channel 410.

[0135] For example, the base 41 is provided with a first through hole 416 and a second through hole 417 spaced apart. Both the first through hole 416 and the second through hole 417 penetrate the side surface 413 of the base 41 and are connected to the heat dissipation channel 410.

[0136] For example, the heat dissipation channel 410 may be in an open-loop shape. In other examples, the heat dissipation channel 410 may also be in a ring shape or other shapes, which are not strictly limited in this application.

[0137] Please refer to the following: Figure 10A and Figure 10B , Figure 10A yes Figure 7A The diagram shows the structure of the heat dissipation device 40 from another angle. Figure 10B yes Figure 10A The diagram shows a partial exploded view of the heat dissipation device 40. Among them, Figure 10B The base plate 415 of the base 41 is not shown in the figure.

[0138] In some embodiments, the heat dissipation device 40 may further include an inlet pipe 43 and an outlet pipe 44. Both the inlet pipe 43 and the outlet pipe 44 are fixedly connected to the base 41 and communicate with the heat dissipation channel 410. For example, the inlet pipe 43 may be inserted into the first through hole 416 and communicate with one end of the heat dissipation channel 410. For example, the outlet pipe 44 may be inserted into the second through hole 417 and communicate with the other end of the heat dissipation channel 410.

[0139] In some embodiments, the heat dissipation channel 410, the inlet pipe 43, and the outlet pipe 44 can all be used to allow coolant to pass through. It is understood that coolant can flow into the heat dissipation channel 410 via the inlet pipe 43 and then out of the heat dissipation channel 410 via the outlet pipe 44, carrying away heat from the base 41 and the first heat-conducting element 42. It is understood that the temperature of the coolant in the outlet pipe 44 is generally higher than the temperature of the coolant in the inlet pipe 43.

[0140] In some examples, the coolant can be water. It is understood that the heat dissipation device 40 uses water cooling to dissipate heat from the base 41 and the first heat-conducting element 42. In other examples, the coolant can also be other liquids such as glycerin.

[0141] In some embodiments, the rework equipment 100 may further include a water-cooling device (not shown). The inlet pipe 43 and outlet pipe 44 of the heat dissipation device 40 are both connected to the water-cooling device. In this way, the water-cooling device can cool the water in the heat dissipation channel 410. For example, liquid with a higher temperature flowing out of the outlet pipe 44 can be cooled by the water-cooling device before entering the heat dissipation channel 410 through the inlet pipe 43 to dissipate heat from the base 41 and the first heat-conducting element 42, thereby improving the heat dissipation efficiency of the heat dissipation device 40. For example, the water-cooling device can be a standard water chiller available on the market that has a cooling function and can operate in a constant temperature mode.

[0142] In other embodiments, the heat dissipation device 40 may further include a heat dissipation material disposed within the heat dissipation channel 410. The thermal conductivity of the heat dissipation material is greater than that of the base 41. This allows heat on the base 41 to be quickly transferred to the heat dissipation material, thereby cooling the base 41 and improving the heat dissipation effect of the heat dissipation device 40. For example, the material of the base 41 may include copper, aluminum, steel, etc. Materials with high thermal conductivity, such as silver, graphite, and aluminum nitride, may be disposed within the heat dissipation channel 410. It is understood that in this embodiment, the heat dissipation device 40 may also not include the inlet pipe 43 and the outlet pipe 44.

[0143] Please refer to the following: Figure 11A and Figure 11B , Figure 11A yes Figure 7A The diagram shown is a partial structural schematic of the heat dissipation device 40 in some embodiments. Figure 11B yes Figure 11A A top view of a portion of the structure of the heat dissipation device 40 shown. Exemplary. Figure 11A and Figure 11B The base 41 and the first heat-conducting element 42 of the heat dissipation device 40 are shown.

[0144] In some embodiments, the base 41 has a device region 401. For example, Figure 11A and Figure 11BThe device area 401 is schematically outlined using dashed boxes. A portion of the top surface 411 of the base 41 may be located within the device area 401. It should be understood that the division of the device area 401 can be adjusted according to actual needs. The actual shape, size, location, and structure of the device area 401 are not subject to change. Figure 11A Limited by.

[0145] For example, at least one first heat-conducting element 42 may surround the device region 401. It is understood that the at least one first heat-conducting element 42 may completely surround the device region 401 or partially surround the device region 401. For example, the number of first heat-conducting elements 42 may be five, and the five first heat-conducting elements 42 may be located on three sides of the periphery of the device region 401. In this case, the five first heat-conducting elements 42 may partially surround the device region 401.

[0146] In other examples, the number of first heat-conducting elements 42 may be two, three, four or more than five, and this application does not impose strict limitations on this.

[0147] It is understood that, in the embodiments of this application, the plurality of first heat-conducting elements 42 may be located on at least two sides of the periphery of the device region 401. For example, the plurality of first heat-conducting elements 42 may be located on opposite or adjacent sides of the periphery of the device region 401; or, the plurality of first heat-conducting elements 42 may also be located on three sides of the periphery of the device region 401 (e.g., Figure 11B (as shown); or, multiple first heat-conducting elements 42 may also be located on the four sides of the periphery of the device region 401.

[0148] Please continue reading. Figure 11A and Figure 11B In some embodiments, the base 41 may be generally rectangular. The base 41 may include a first side 418 and a second side 419. For example, Figure 11B The first side 418 and the second side 419 are schematically divided by dashed lines. The first side 418 and the second side 419 are located on opposite sides of the device region 401. For example, at least one first heat-conducting element 42 is provided on both the first side 418 and the second side 419.

[0149] It is understood that the first side 418 and the second side 419 are two opposite sides of the base 41. The specific shape and size of the first side 418 and the second side 419 are not subject to... Figure 11B Restricted.

[0150] For example, the base 41 may include a first sub-region 402a and a second sub-region 402b spaced apart. The first sub-region 402a is located at a first edge 418, and the edge of the first sub-region 402a surrounds a first heat-conducting element 42 on the first edge 418. The first sub-region 402a is also located at a second edge 419, and the edge of the first sub-region 402a surrounds a first heat-conducting element 42 on the second edge 419.

[0151] For example, the number of first heat-conducting elements 42 on the first edge 418 can be one. In this case, projected along the first direction, the projection of the first heat-conducting element 42 on the top surface 411 of the base 41 is the first sub-region 402a, or the projected area of ​​the first heat-conducting element 42 on the top surface 411 of the base 41 is slightly smaller than the area of ​​the first sub-region 402a. In some other embodiments, the number of first heat-conducting elements 42 on the first edge 418 can also be multiple.

[0152] For example, the number of first heat-conducting elements 42 on the second side 419 can be three. In this case, the edge of the second sub-region 402b can surround the three first heat-conducting elements. A portion of the edge of the second sub-region 402b can coincide with a portion of the edge of the first heat-conducting element 42. In some other instances, the number of first heat-conducting elements 42 on the second side 419 can also be one, two, or more than three.

[0153] In some embodiments, the heat dissipation device 40 may further include a second heat-conducting element 45. The second heat-conducting element 45 may protrude from the top surface 411 of the base 41. The second heat-conducting element 45 may be located in the device region 401.

[0154] Please see Figure 12 , Figure 12 yes Figure 11A A top view of a portion of the structure of the heat dissipation device 40 shown.

[0155] In some embodiments, the projection of the heat dissipation channel 410 onto the top surface 411 of the base 41 surrounds the device region 401 along a first direction.

[0156] For example, the heat dissipation channel 410 may include a first segment 410a, a second segment 410b, and a connecting segment 410c. The connecting segment 410c connects the first segment 410a and the second segment 410b. For example, Figure 12 The first section 410a, the second section 410b, and the connecting section 410c of the heat dissipation channel 410 are schematically divided using dashed lines.

[0157] For example, the first segment 410a of the heat dissipation channel 410 can be connected to the liquid outlet pipe 44. The second segment 410b of the heat dissipation channel 410 can be connected to the liquid inlet pipe 43.

[0158] For example, the first segment 410a of the heat dissipation channel 410 may be located on the side of the first sub-region 402a away from the device region 401. The second segment 410b of the heat dissipation channel 410 may be located on the side of the second sub-region 402b away from the device region 401.

[0159] In some embodiments, a portion of the projection of the heat dissipation channel 410 onto the top surface 411 of the base 41 may also be located in the device region 401, which is not strictly limited in this application.

[0160] In some of his embodiments, the heat dissipation channel 410 may also be other shapes, which are not strictly limited in this application.

[0161] Please refer to the following: Figure 13A and Figure 13B , Figure 13A yes Figure 7A The diagram shown is a partial structural schematic of the heat dissipation device 40 in some other embodiments. Figure 13B yes Figure 13A A top view of a portion of the structure of the heat dissipation device 40 shown. Exemplary. Figure 13A and Figure 13B The base 41 and the first heat-conducting element 42 of the heat dissipation device 40 are shown. Figure 13A and Figure 13B The technical solution of the heat dissipation device 40 shown is the same as Figure 11A The technical solution of the heat dissipation device 40 shown is similar, except that:

[0162] In this embodiment, the first heat-conducting element 42 of the heat dissipation device 40 can be located on the four sides of the periphery of the device region 401. At this time, the first heat-conducting element 42 of the heat dissipation device 40 can completely surround the device region 401.

[0163] For example, the number of first heat-conducting elements 42 can be five, and the five first heat-conducting elements 42 can be located on the four sides of the periphery of the device region 401. In some other examples, the number of first heat-conducting elements 42 can also be four or more five, and multiple first heat-conducting elements 42 can be located on the four sides of the periphery of the device region 401.

[0164] It is understood that in the above embodiments, the heat dissipation device 40 has multiple first heat-conducting elements 42, which are arranged around the device region 401. Other structures and arrangements of the first heat-conducting elements 42 will be described below with reference to the accompanying drawings.

[0165] Please refer to the following: Figure 14A and Figure 14B , Figure 14A yes Figure 7A The diagram shown is a partial structural schematic of the heat dissipation device 40 in some other embodiments. Figure 14B yes Figure 14A A top view of a portion of the structure of the heat dissipation device 40 shown. Exemplary. Figure 14A and Figure 14B The base 41 and the first heat-conducting element 42 of the heat dissipation device 40 are shown. Figure 14A and Figure 14B The technical solution of the heat dissipation device 40 shown is the same as Figure 11A The technical solution of the heat dissipation device 40 shown is similar, except that:

[0166] In this embodiment, the heat dissipation device 40 has one first heat-conducting element 42. For example, the first heat-conducting element 42 can be semi-annular and arranged around the device region 401. In this case, the first heat-conducting element 42 can be located on three sides of the periphery of the device region 401. It is understood that the device region 401 can be partially surrounded.

[0167] Please refer to the following: Figure 15A and Figure 15B , Figure 15A yes Figure 7A The diagram shown is a partial structural schematic of the heat dissipation device 40 in some other embodiments. Figure 15B yes Figure 15A A top view of a portion of the structure of the heat dissipation device 40 shown. Exemplary. Figure 15A and Figure 15B The base 41 and the first heat-conducting element 42 of the heat dissipation device 40 are shown. Figure 15A and Figure 15B The technical solution of the heat dissipation device 40 shown is the same as Figure 14A The technical solution of the heat dissipation device 40 shown is similar, except that:

[0168] In this embodiment, the heat dissipation device 40 has one first heat-conducting element 42. The first heat-conducting element 42 can be annular and arranged around the device region 401. In this case, the first heat-conducting element 42 can be located on the four sides of the periphery of the device region 401. It can be understood that the first heat-conducting element 42 can completely surround the device region 401.

[0169] Please refer to the following: Figure 16A , Figure 16B and Figure 17 , Figure 16A yes Figure 7A The diagram shown is a structural schematic of the heat dissipation device 40 in some other embodiments. Figure 16B yes Figure 16A The diagram shows the structure of the heat dissipation device 40 from another angle. Figure 17 yes Figure 16A The diagram shows a partial structural representation of the heat dissipation device 40 in some embodiments. Exemplary, Figure 17 The base plate 415 of the base 41 is not shown in the figure. Figure 16A , Figure 16B and Figure 17 The embodiments shown may include most of the technical content of the embodiments described above. The following mainly describes the differences between the two, and the most common aspects of the two will not be repeated.

[0170] In some embodiments, a portion of the base 41 may be openwork. Exemplarily, the base 41 may be generally annular. In other examples, the base 41 may also be open-ring shaped, which is not strictly limited in this application.

[0171] For example, the first heat-conducting element 42 may be located around the periphery of the hollowed-out area 420 of the base 41. The heat dissipation channel 410 may be arranged around the hollowed-out area 420 of the base 41. In some examples, the heat dissipation channel 410 may be arranged around the first heat-conducting element 42. In other examples, the first heat-conducting element 42 may also be located on the top side of the heat dissipation channel 410.

[0172] Please refer to the following: Figure 18A and Figure 18B , Figure 18A yes Figure 16A The heat dissipation device 40 shown is a top view of a portion of its structure in some embodiments. Figure 18B yes Figure 16A The heat dissipation device 40 shown is a top view of a portion of its structure in some other embodiments.

[0173] In some embodiments, at least a portion of the device region 401 of the heat dissipation device 40 may be located within the cutout region 420. It is understood that the device region 401 may be entirely located within the cutout region 420 of the base 41, or it may be partially located within the cutout region 420 of the base 41. See also... Figure 18A In some examples, the device area 401 may be entirely located within the cutout area 420 of the base 41. In this case, the device area 401 may extend through the base 41. Please refer to [link / reference]. Figure 18B In some embodiments, the device region 401 may be partially located within the cutout region 420 of the base 41. In this case, a portion of the top surface 411 of the base 41 may be located within the device region 401.

[0174] Please refer to the following: Figure 19 and Figure 20 , Figure 19 yes Figure 2 The diagram shows the assembly structure of the mounting base 20 and the heat dissipation device 40 in some embodiments. Figure 20 yes Figure 19 The attached mounting base 20 and the heat dissipation device 40 are shown in a partial structural diagram from another angle.

[0175] In some embodiments, the heat dissipation device 40 can be fixedly connected to the mounting base 20. For example, the heat dissipation device 40 can be fixedly connected to the second surface 22 of the mounting base 20. For example, the heat dissipation device 40 may also include a mounting portion 46. The mounting portion 46 can be connected to the side surface 413 of the base 41. The mounting portion 46 and the base 41 can be integrally formed structural components, and the mounting portion 46 can also be fixedly connected to the base 41 by welding or other methods. The mounting portion 46 can be fixedly connected to the mounting base 20 by fasteners such as bolts and screws, thereby fixing the heat dissipation device 40 to the mounting base 20.

[0176] For example, the first heat-conducting element 42 of the heat dissipation device 40 may be exposed relative to the through hole 23 of the mounting base 20. It is understood that the first heat-conducting element 42 being exposed relative to the through hole 23 can be in any of the following situations: First, the first heat-conducting element 42 is located on the side of the first surface 21 of the mounting base 20 away from the second surface 22. In this case, the base 41 can pass through the through hole 23. Second, at least a portion of the first heat-conducting element 42 is located within the through hole 23. Third, the first heat-conducting element 42 is located on the side of the second surface 22 of the mounting base 20 away from the first surface 21.

[0177] Please see Figure 21 , Figure 21 yes Figure 1A The diagram shows a partial cross-sectional view of the rework equipment 100 along the CC direction in some embodiments.

[0178] In some embodiments, the fixing seat 20 is fixedly connected to the base 10. In this case, the heat dissipation device 40 can be connected to the base 10 via the fixing seat 20. In this embodiment, the fixing seat 20 and the heat dissipation device 40 can be fixed in place, thereby preventing frequent movement of liquid within the heat dissipation channel 410 and subsequent leakage. Exemplarily, the fixing seat 20 can be fixedly connected to the mounting plate 12 of the base 10. For example, the fixing seat 20 can be located within the mounting groove 123 of the mounting plate 12. Exemplarily, the inlet pipe 43 and outlet pipe 44 of the heat dissipation device 40 can pass through the second through hole 126 of the base 10.

[0179] For example, the heat dissipation device 40 is disposed opposite to the second heating device 70. For instance, the base 41 of the heat dissipation device 40 may be disposed opposite to the second heating device 70. It is understood that the base 41 of the heat dissipation device 40 is projected along the target direction to obtain projection C, and the second heating device 70 is projected along the target direction to obtain projection D, and projection C and projection D may at least largely overlap. In some embodiments, the substantial overlap may be any of the following: projection C is completely located within projection D; or projection D is completely located within projection C; or projection C and projection D intersect each other, and the intersection area of ​​projection C and projection D accounts for more than 50% of projection C or projection D.

[0180] In this embodiment, the second heating device 70 can be used to blow air onto the heat dissipation device 40. For example, the second heating device 70 can be used to blow air onto the base 41 of the heat dissipation device 40. The second heating device 70 can keep the coolant in the heat dissipation channel 410 of the heat dissipation device 40 within a suitable temperature range. In this way, the heat dissipation rate of the circuit board assembly 60 is moderate, and the temperature difference between the circuit board 61 and the first device 62 is small, thereby avoiding the impact on the soldering yield of the circuit board 61 and the first device 62 due to excessive temperature difference during the soldering process.

[0181] For example, the heat dissipation device 40 can be located within the mounting groove 123 of the base 10. In this case, the heat dissipation device 40 is located outside the receiving cavity 101 of the base 10. In this embodiment, by placing the heat dissipation device 40 outside the receiving cavity 101 of the base 10, and placing the control circuit of the rework equipment 100 inside the receiving cavity 101, the control circuit of the rework equipment 100 can be isolated from the heat dissipation device 40. In this way, the circuit and water circuit of the rework equipment 100 are separated, thereby avoiding safety problems such as leakage current caused by leakage of the heat dissipation device 40 from the control circuit of the rework equipment 100.

[0182] Furthermore, if coolant leaks from the heat dissipation device 40, it can be collected in the leakage collection tank 102 via the leakage hole 125 of the base 10. At this time, the leakage detector 80 (see [link to relevant documentation]) installed in the leakage collection tank 102 will activate. Figure 4 This can be used to detect the presence of liquid in the leakage collection tank 102. If the heat dissipation device 40 leaks, the repair device 100 can cut off all power.

[0183] Please refer to the following: Figure 22 and Figure 23 , Figure 22 yes Figure 2 The schematic diagrams shown depict the mounting base 20, heat dissipation device 40, and circuit board assembly 60 in some embodiments. Figure 23 Figure 2 The diagram shows the assembly structure of the mounting base 20, the heat dissipation device 40, and the circuit board assembly 60. For example, Figure 22 The assembly structure of the mounting base 20 and the heat dissipation device 40 is shown in the figure.

[0184] In some embodiments, the circuit board assembly 60 may include a circuit board 61, a first device 62, and a second device 63. Both the first device 62 and the second device 63 are disposed on the circuit board 61 and are spaced apart. It is understood that when the rework equipment 100 reworks the circuit board assembly 60, it can disassemble and solder the first device 62. During disassembly, the first device 62 may be the device to be reworked; during soldering, the first device 62 may be a new device after replacement. The second device 63 is another device, besides the first device 62, that requires heat dissipation during the rework process. For example, the second device 63 may be a device adjacent to the first device 62; in other examples, the second device 63 may be a device with its back attached to the first device 62.

[0185] In this embodiment, after the circuit board assembly 60 is installed and fixed, the user can control the lifting device to drive the first heating device to descend closer to the circuit board assembly 60 and heat the first device 62 on the circuit board assembly 60. After a predetermined heating time, the user can control the first heating device to rise away from the circuit board assembly 60, and then disassemble and remove the device to be repaired from the circuit board assembly 60. After the device to be repaired is removed, the user can control the first heating device to descend closer to the circuit board assembly 60 to heat the circuit board assembly 60, and adjust the heating curve to achieve the soldering of new devices.

[0186] For example, the circuit board assembly 60 can be mounted on the first surface 21 of the mounting base 20. For instance, the circuit board assembly 60 can be located within a recess 24 of the mounting base 20 and cover the through hole 23 of the mounting base 20. It is understood that the recess 24 can be used to accommodate the circuit board assembly 60 and also for positioning the circuit board assembly 60, improving the assembly speed of the circuit board 61 and thus increasing the rework efficiency of the circuit board assembly 60. In some examples, the shape and size of the recess 24 can be adapted to the shape and size of the circuit board assembly 60 to facilitate the positioning and installation of the circuit board assembly 60.

[0187] In this embodiment, the first surface 21 of the mounting base 20 is used to mount the circuit board assembly 60, while the heat dissipation device 40 is fixedly connected to the second surface 22 of the mounting base 20. In this way, the heat dissipation device 40 does not occupy one side of the space on the first surface 21 of the mounting base, nor does it interfere with the installation of the circuit board assembly 60. In other examples, the heat dissipation device 40 may also be fixedly connected to other positions on the mounting base 20; this application does not strictly limit this.

[0188] Please refer to the following: Figures 23 to 25 , Figure 24 yes Figure 23 The heat dissipation device 40 and circuit board assembly 60 shown are partial structural top views in some embodiments. Figure 25 yes Figure 23 The assembly structure of the rework equipment 100 and circuit board assembly 60 shown is a partial cross-sectional view taken along DD in some embodiments. Exemplary, Figure 24 The heat dissipation device 40, the first heat-conducting component 42, and the device area 401 are schematically outlined with dashed boxes. Figure 25 The base 41 and the first heat-conducting component 42 are schematically divided by dashed lines.

[0189] In some embodiments, the device area 401 of the heat dissipation device 40 is correspondingly disposed with the first device 62 of the circuit board assembly 60 in a first direction. The first direction is the thickness direction of the circuit board assembly 60, i.e., the Z-axis direction. It is understood that the corresponding disposal of the device area 401 of the heat dissipation device 40 and the first device 62 of the circuit board assembly 60 means that the device area 401 of the heat dissipation device 400 and the first device 62 of the circuit board assembly 60 are centrally aligned, i.e., the center of the device area 401 is aligned with the center of the first device 62 of the circuit board assembly 60. For example, when projected along the first direction, in a plane perpendicular to the first direction, the projection of the device area 401 can completely fall into the projection of the first device 62, or the projection of the device area 401 and the projection of the first device 62 at least partially overlap, or the projection of the device area 401 and the projection of the first device 62 partially overlap, or the projection of the first device 62 can completely fall into the projection of the device area 401. The projection of the first heat-conducting element 42 may exist in a portion opposite to the first device 62, or the projection of the first heat-conducting element 42 may be located on the periphery of the first device 62. It should be understood that, in the embodiments of this application, the area of ​​the device region 401 of the heat dissipation device 40 is not necessarily equal to the area of ​​the first device 62 of the circuit board assembly 60. The shape of the device region 401 is also not necessarily the same as the shape of the first device 62.

[0190] In some embodiments, the first heat-conducting element 42 of the heat dissipation device 40 is thermally connected to the circuit board assembly 60. It is understood that a thermally conductive connection means that heat transfer can be achieved between the connecting components. In this embodiment, the first heat-conducting element 42 is connected to the circuit board assembly 60, and heat transfer can be achieved between the first heat-conducting element 42 and the circuit board assembly 60. When the temperature on the circuit board assembly 60 is higher than the temperature on the first heat-conducting element 42, the heat on the circuit board assembly 60 can be transferred to the first heat-conducting element 42 to cool the circuit board assembly 60.

[0191] For example, the second device 63 may be located on the side of the circuit board 61 opposite to the first device 62. The circuit board assembly 60 may cover the first thermal conductive element 42. The first thermal conductive element 42 may be thermally connected to the second device 63 of the circuit board assembly 60. For example, the first thermal conductive element 42 may also be thermally connected to the circuit board 61 of the circuit board assembly 60.

[0192] In some examples, the second heat conductor 45 (see Figure 11A It can also be used for thermally conductive connection circuit board assembly 60.

[0193] In this embodiment, heat on the circuit board assembly 60 can be transferred from the contact point between the circuit board assembly 60 and the first heat-conducting element 42 to the heat dissipation device 40, thereby achieving heat dissipation of the circuit board assembly 60. Therefore, the temperature of the area on the circuit board assembly 60 in contact with the first heat-conducting element 42 is lower. Since the device area 401 is correspondingly arranged with the first device 62 of the circuit board assembly 60, this application, by arranging the first heat-conducting element 42 around the device area 401, can remove heat from the periphery of the first device 62 and reduce the temperature difference in the periphery of the first device 62, thereby avoiding periphery lifting and resulting in open solder joints, which affects the soldering yield of the device. For example, there can be multiple first heat-conducting elements 42. Multiple first heat-conducting elements 42 can surround the device area 401 to dissipate heat from the periphery of the first device 62, thereby reducing the temperature difference in the periphery of the first device 62. As another example, there can be only one first heat-conducting element 42. The first heat-conducting element 42 is in the form of a ring or an open ring and surrounds the device area 401 to dissipate heat from the periphery of the first device 62, thereby reducing the temperature difference in the periphery of the first device 62.

[0194] Furthermore, the heat dissipation device 40 can adjust the connection area and connection position between the first heat-conducting element 42 and the circuit board assembly 60 by controlling the number, shape, and position of the first heat-conducting element 42. For example, by reducing the connection area between the second heat-conducting element and the circuit board assembly 60, the heat dissipation efficiency of the heat dissipation device 40 can be reduced, thereby reducing the heating rate of the first heating device 30, which in turn helps to reduce the power consumption of the rework equipment 100. It is understood that the number, shape, and position of the first heat-conducting element 42 can be set as needed. The heat dissipation device 40 has a wide range of applications.

[0195] In some embodiments, the heat dissipation device 40 may further include a thermally conductive pad 47. For example, the thermally conductive pad 47 may be disposed on the side of the first thermally conductive member 42 away from the top surface 411 of the base 41. In this case, the thermally conductive pad 47 may be located between the first thermally conductive member 42 and the circuit board assembly 60, and thermally connect the first thermally conductive member 42 and the circuit board assembly 60. For example, the thermally conductive pad 47 may be disposed between the first thermally conductive member 42 and the second device 63, and thermally connect the first thermally conductive member 42 and the second device 63.

[0196] In this embodiment, the thermally conductive pad 47 has good adhesion, flexibility, good compressibility, and excellent thermal conductivity. The thermally conductive pad 47 allows air to escape between the first thermally conductive element 42 and the circuit board assembly 60, ensuring full contact between the first thermally conductive element 42 and the circuit board assembly 60, which is beneficial for improving the heat conduction effect.

[0197] In addition, the thermal pad 47 is disposed on the first thermal conductive element 42. Since the first thermal conductive element 42 protrudes from the top surface 411 of the base 41, when the thermal pad 47 is compressed and deformed, the portion of the thermal pad 47 located between the first thermal conductive element 42 and the circuit board assembly 60 can maintain a constant connection area with the first thermal conductive element 42 and the circuit board assembly 60. This allows the connection area between the first thermal conductive element 42 and the circuit board assembly 60 to remain within a stable range, thereby preventing significant fluctuations in the heat dissipation rate of the heat dissipation device 40 on the circuit board assembly 60. This, in turn, helps to ensure that the temperature difference around the first device 62 of the circuit board assembly 60 remains stable within a small range.

[0198] In this embodiment of the application, the heat dissipation device 40 may include at least two structures (respectively...) Figure 7A and Figure 16A (The two structures shown). In some embodiments, such as Figure 11A As shown, a portion of the first surface 21 of the base 41 is located in the device region 401. At this time, the device region 401 may be provided with a second heat-conducting element 45. It is understood that the heat dissipation device 40 can also be thermally connected to the circuit board assembly 60 through the second heat-conducting element 45 of the device region 401. This can improve the heat dissipation rate of the area on the circuit board assembly 60 corresponding to the device region 401, thereby protecting other devices in that area besides the first device 62.

[0199] In other embodiments, such as Figure 16A As shown, a portion of the base 41 is hollowed out, and at least a portion of the device area 401 is located in the hollowed-out area 420 of the base 41. The structure of the heat dissipation device 40 is relatively simple.

[0200] It is understood that, in this embodiment of the application, for circuit board assemblies where some areas requiring heat dissipation are known, the number of first heat-conducting elements 42 in areas where heat dissipation is not required can be reduced, simplifying the structure of the heat dissipation device. Furthermore, the area of ​​the thermally conductive connection of the first heat-conducting elements 42 can be minimized, resulting in a moderate heat dissipation rate of the heat dissipation device 40 on the circuit board assembly 60. Consequently, the heating power of the first heating device 30 on the circuit board assembly 60 is also moderate, reducing power loss. It is understood that, to ensure the disassembly and soldering of the circuit board assembly 60, the heat dissipation rate of the heat dissipation device 40 on the circuit board assembly 60 is increased, and the heating power of the first heating device 30 on the circuit board assembly 60 is also increased accordingly.

[0201] In some embodiments, the central axis A1 of the air outlet 31 of the first heating device 30 (see [reference]) Figure 2The central axis A2 of the mounting base 20 and the central axis A3 of the first device 62 of the circuit board assembly 60 are aligned. In this way, the first heating device 30 is quickly aligned with the area on the circuit board assembly 60 that needs to be heated, which helps to improve the alignment efficiency of the first heating device 30 and the first device 62 of the circuit board assembly 60 during the rework process.

[0202] Understandably, the second device 63 typically requires protection with filler or potting compound. The filler or potting compound expands at high temperatures, potentially squeezing the solder joints of the second device 63. However, this embodiment utilizes the heat dissipation material or coolant within the heat dissipation channel 410 to rapidly remove heat from the base 41, maintaining the solder joint temperature of the second device 63 below the solder solidus line. This prevents the solder joints of the second device 63 from melting and being squeezed by the filler or potting compound on the circuit board assembly 60, thus avoiding problems such as insufficient solder or solder bridging.

[0203] In addition, by arranging the heat dissipation channel 410 around the device area 401 in this embodiment, it is beneficial to balance the heat dissipation efficiency of the first heat-conducting component 42 located around the device area 401, thereby reducing the temperature difference in the area surrounding the first device 62 of the circuit board assembly 60.

[0204] In addition, the solder joints of the second device 63 are not affected by the filler or potting compound on the circuit board assembly 60, so that the circuit board assembly 60 does not need to be cleaned during the rework process, thereby avoiding problems such as device collision, long time consumption, and adhesive contamination of the circuit board assembly 60 caused by cleaning.

[0205] This embodiment of the application incorporates a water-cooling device. Under the action of the water-cooling device, the heat dissipation device 40 maintains the temperature within a stable range through external circulation of coolant. On one hand, while meeting the soldering conditions of the circuit board assembly 60, the coolant can also quickly remove heat from the base 41, significantly improving thermal conductivity. This keeps the solder joint temperature of the second device 63 below the solder solidus line, thus preventing the solder joint of the second device 63 from melting and being squeezed by the filler or potting compound on the circuit board assembly 60, which could lead to insufficient solder or solder bridging. On the other hand, maintaining the temperature within a stable range through external circulation of coolant ensures a moderate heat dissipation rate for the circuit board assembly 60. The temperature difference between the circuit board 61 and the first device 62 is small, thus preventing the soldering yield of the circuit board 61 and the first device 62 from being affected by excessive temperature difference during the soldering process.

[0206] Please refer to the following: Figure 26A and Figure 26B , Figure 26A yes Figure 7AA top view of a portion of the structure of the heat dissipation device 40 in some other embodiments, as shown in Figure 1. Figure 26B yes Figure 7A Top view of a portion of the structure of the heat dissipation device 40 in some other embodiments. Figure 2 .

[0207] In this embodiment, the total contact area of ​​the first heat-conducting element 42 on the first side 418 is the first area. The total contact area of ​​the first heat-conducting element 42 on the second side 419 is the second area. For example, Figure 26A The first area is schematically marked with a left diagonal line, and the second area is schematically marked with a right diagonal line. It can be understood that the contact surface of the first heat-conducting element 42 is the surface where the first heat-conducting element 42 contacts the circuit board assembly 60. The total contact area of ​​the first heat-conducting elements 42 on the first side 418 is the sum of the contact areas of all the first heat-conducting elements 42 on the first side 418 with the circuit board assembly 60. The total contact area of ​​the first heat-conducting elements 42 on the second side 419 is the sum of the contact areas of all the first heat-conducting elements 42 on the second side 419 with the circuit board assembly 60. In this embodiment, the total contact area of ​​the first heat-conducting elements 42 on the first side 418 is the total contact area of ​​the first heat-conducting elements 42 in the first sub-region 402a. The total contact area of ​​the first heat-conducting elements 42 on the second side 419 is the total contact area of ​​the first heat-conducting elements 42 in the second sub-region 402b.

[0208] For example, the first area is smaller than the second area. In the first direction, the overlapping area of ​​the heat dissipation channel 410 and the first heat-conducting element 42 on the first side 418 is greater than the overlapping area of ​​the heat dissipation channel 410 and the first heat-conducting element 42 on the second side 419. Figure 26B The overlapping area of ​​the heat dissipation channel 410 and the first heat-conducting element 42 on the first side 418, and the overlapping area of ​​the heat dissipation channel 410 and the first heat-conducting element 42 on the second side 419 are schematically shown using left diagonal lines. It can be understood that the overlapping area of ​​the heat dissipation channel 410 and the first heat-conducting element 42 on the second side 419 is greater than or equal to zero.

[0209] It is understandable that, since the heat dissipation material or coolant within the heat dissipation channel 410 can quickly remove heat from the base 41, the area on the base 41 with a larger overlap with the heat dissipation channel 410 has a faster heat dissipation efficiency. In this embodiment, by adjusting the overlap area between the heat dissipation channel 410 and the first heat-conducting element 42 on the first side 418, and the overlap area between the heat dissipation channel 410 and the first heat-conducting element 42 on the second side 419, the heat dissipation rate of the two areas on the circuit board assembly 60 corresponding to the first side 418 and the second side 419 is made moderate, and the difference in heat dissipation rate between the two areas is small, thereby reducing the temperature difference between the two areas on the circuit board assembly 60.

[0210] Furthermore, the first section 410a of the heat dissipation channel 410 can be connected to the outlet pipe 44, and the second section 410b can be connected to the inlet pipe 43. Therefore, during the rework of the circuit board assembly 60, the temperature of the coolant in the first section 410a of the heat dissipation channel 410 is usually higher than the temperature of the coolant in the second section 410b. In this embodiment, by adjusting the overlapping area of ​​the heat dissipation channel 410 and the first heat-conducting element 42 on the first side 418, and the overlapping area of ​​the heat dissipation channel 410 and the first heat-conducting element 42 on the second side 419, the heat dissipation rate of the two regions corresponding to the first side 418 and the second side 419 on the circuit board assembly 60 is moderate, and the difference in heat dissipation rate between the two regions is small, thereby reducing the temperature difference between the two regions on the circuit board assembly 60.

[0211] In some other embodiments, if the first area of ​​the first sub-region 402a is greater than the second area of ​​the second sub-region 402b, then in the first direction, the overlapping area of ​​the heat dissipation channel 410 and the first sub-region 402a is smaller than the overlapping area of ​​the heat dissipation channel 410 and the second sub-region 402b.

[0212] Please see Figure 27 , Figure 27 yes Figure 7A The heat dissipation device 40 shown is a top view of a portion of its structure in some other embodiments.

[0213] In some embodiments, the first area of ​​the heat dissipation device 40 is smaller than the second area. In a plane perpendicular to the first direction, both the first sub-region 402a and the second sub-region 402b are spaced apart from the heat dissipation channel 410. Exemplarily, the first segment 410a of the heat dissipation channel 410 may be located on the side of the first sub-region 402a away from the device region 401. The second segment 410b of the heat dissipation channel 410 may be located on the side of the second sub-region 402b away from the device region 401.

[0214] For example, in a plane perpendicular to the first direction, the distance H1 between the first segment 410a of the heat dissipation channel 410 and the first sub-region 402a is less than the distance H2 between the second segment 410b of the heat dissipation channel 410 and the second sub-region 402b.

[0215] It is understandable that the distance H1 between the heat dissipation channel 410 and the first sub-region 402a is the minimum distance from the edge of the heat dissipation channel 410 to the edge of the first sub-region 402a. Similarly, the distance H2 between the heat dissipation channel 410 and the second sub-region 402b is the minimum distance from the edge of the heat dissipation channel 410 to the edge of the second sub-region 402b.

[0216] It is understandable that, since the heat dissipation material or coolant within the heat dissipation channel 410 can quickly remove heat from the base 41, the area on the base 41 near the heat dissipation channel 410 has a faster heat dissipation efficiency. In this embodiment, by adjusting the distance H1 between the heat dissipation channel 410 and the first sub-region 402a, and the distance H2 between the heat dissipation channel 410 and the second sub-region 402b, the heat dissipation rate of the two regions on the circuit board assembly 60 corresponding to the first edge 418 and the second edge 419 is made moderate, and the difference in heat dissipation rate between the two regions is small, thereby reducing the temperature difference between the two regions on the circuit board assembly 60.

[0217] Furthermore, the first segment 410a of the heat dissipation channel 410 can be connected to the outlet pipe 44, and the second segment 410b can be connected to the inlet pipe 43. Therefore, during the rework of the circuit board assembly 60, the temperature of the coolant in the first segment 410a of the heat dissipation channel 410 is usually higher than the temperature of the coolant in the second segment 410b. In this embodiment, by adjusting the distance H1 between the heat dissipation channel 410 and the first sub-region 402a, and the distance H2 between the heat dissipation channel 410 and the second sub-region 402b, the heat dissipation rate of the two regions corresponding to the first edge 418 and the second edge 419 on the circuit board assembly 60 is moderate, and the difference in heat dissipation rate between the two regions is small, thereby reducing the temperature difference between the two regions on the circuit board assembly 60.

[0218] In some other embodiments, if the first area of ​​the first sub-region 402a is greater than the second area of ​​the second sub-region 402b, then in a plane perpendicular to the first direction, the distance H1 between the first segment 410a of the heat dissipation channel 410 and the first sub-region 402a is greater than the distance H2 between the second segment 410b of the heat dissipation channel 410 and the second sub-region 402b.

[0219] Please refer to the following: Figure 28 , Figure 29A and Figure 29B , Figure 28 yes Figure 1AThe schematic diagram shown is a structural representation of the rework equipment 100 in some other embodiments. Figure 29A yes Figure 28 The schematic diagrams shown below are structural representations of the first heating device 30 and the heat dissipation device 40 in some embodiments. Figure 29B yes Figure 29A The diagram shows a partial structural cut along E1-E1.

[0220] In some embodiments, the heat dissipation device 40 can be movably connected to the base 10. In this case, the heat dissipation device 40 is movably connected to the fixed base 20. Exemplarily, the heat dissipation device 40 can be mounted on the lifting device 50. In this case, the heat dissipation device 40 can be located on the side of the fixed base 20 whose first surface 21 is away from the second surface 22. The lifting device 50 can drive the heat dissipation device 40 to move closer to or away from the first surface 21 of the fixed base 20 along a first direction. Exemplarily, the heat dissipation device 40 can surround the first heat-generating device 30 (e.g., ...). Figure 29A and Figure 29B (As shown). In this embodiment, when the first heating device 30 heats the circuit board 61, the heat dissipation device 40 can dissipate heat around the heating area, thereby preventing other devices around the heating area from failing due to high temperature.

[0221] Please refer to the following: Figure 30A and Figure 30B , Figure 30A yes Figure 28 The schematic diagram shown is a structural representation of the first heating device 30 and the heat dissipation device 40 in some other embodiments. Figure 30B yes Figure 30A The diagram shows a partial structural cut along E2-E2. Figure 30A and Figure 30B The technical solution shown is the same as Figure 29A and Figure 29B The technical solutions shown are similar, but differ in that:

[0222] In this embodiment, the first heating device 30 may surround the heat dissipation device 40 (e.g., Figure 30A and Figure 30B (As shown). In this embodiment, when the first heating device 30 heats the circuit board 61, the heat dissipation device 40 can dissipate heat to the inner area of ​​the heating area, thereby preventing other devices inside the heating area from failing due to high temperature.

[0223] It is understood that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0224] The above are merely some embodiments of this application, and the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A rework apparatus (100) for reworking a circuit board assembly, characterized by The repair equipment (100) comprises a fixing base (20) for mounting a circuit board assembly (60), a first heating device (30) and a heat dissipation device (40), wherein the first heating device (30) and the heat dissipation device (40) are connected to the fixing base (20); The first heating device (30) is used for heating a first device (62) on the circuit board assembly (60), and the heat dissipation device (40) is used for dissipating heat of the circuit board assembly (60); The heat dissipation device (40) comprises a base (41) and at least one first heat conduction member (42), wherein the at least one first heat conduction member (42) is protruded from a top surface (411) of the base (41), the base (41) has a device area (401) arranged in correspondence with the first device (62) of the circuit board assembly (60) in a first direction, and the at least one first heat conduction member (42) surrounds the device area (401), and the at least one first heat conduction member (42) is used for heat conduction connection with the circuit board assembly (60).

2. The rework apparatus (100) according to claim 1, characterized in that The number of the first heat conduction members (42) is multiple, and the multiple first heat conduction members (42) are arranged at intervals.

3. The rework apparatus (100) according to claim 1, characterized in that The number of the first heat conduction members (42) is one, and the first heat conduction member (42) is annular or open-loop.

4. The rework apparatus (100) according to any one of claims 1 to 3, characterized in that The base (41) and the first heat conduction member (42) are an integrally formed structure.

5. The rework apparatus (100) according to any one of claims 1 to 3, characterized in that The heat dissipation device (40) further comprises a heat conduction gasket (47) arranged on a side of the first heat conduction member (42) away from the top surface (411) of the base (41). The heat conduction gasket (47) is used for heat conduction connection between the first heat conduction member (42) and the circuit board assembly (60).

6. The rework apparatus (100) according to claim 1, characterized in that The base (41) is provided with a heat dissipation channel (410) for flowing of a cooling liquid.

7. The rework apparatus (100) according to claim 1, characterized in that The base (41) is provided with a heat dissipation channel (410), and the heat dissipation device (40) further comprises a heat dissipation material arranged in the heat dissipation channel (410), wherein a heat conduction coefficient of the heat dissipation material is greater than a heat conduction coefficient of the base (41).

8. The rework apparatus according to claim 6 or 7, characterized in that In the first direction, a projection of the heat dissipation channel (410) on the top surface (411) of the base (41) surrounds the device area (401).

9. The rework apparatus of claim 6, wherein The base (41) comprises a first edge portion (418) and a second edge portion (419), the first edge portion (418) and the second edge portion (419) are respectively located on opposite sides of the device area (401), at least one first heat conduction member (42) is arranged on each of the first edge portion (418) and the second edge portion (419), a total area of contact surfaces of the first heat conduction members (42) on the first edge portion (418) is a first area, a total area of contact surfaces of the first heat conduction members (42) on the second edge portion (419) is a second area, and the first area is less than the second area. The base (41) comprises a first sub-region (402a) and a second sub-region (402b) arranged at intervals, the first sub-region (402a) is located on the first edge (418), and the edge of the first sub-region (402a) surrounds the first heat conduction member (42) on the first edge (418); the first sub-region (402a) is located on the second edge (419), and the edge of the first sub-region (402a) surrounds the first heat conduction member (42) on the second edge (419); the heat dissipation channel (410) comprises a first section (410a), a second section (410b), and a connecting section (410c) connected between the first section (410a) and the second section (410b), the first section (410a) is located on the side of the first sub-region (402a) away from the device area (401), and the second section (410b) is located on the side of the second sub-region (402b) away from the device area (401). In a plane perpendicular to the first direction, the distance (H1) between the first section (410a) of the heat dissipation channel (410) and the first sub-region (402a) is less than the distance (H2) between the second section (410b) of the heat dissipation channel (410) and the second sub-region (402b).

10. The rework apparatus of claim 9, wherein The first section (410a) is connected to the liquid outlet pipe (44) of the heat dissipation channel (410), and the second section (410b) is connected to the liquid inlet pipe (43) of the heat dissipation channel (410).

11. The rework apparatus (100) according to any one of claims 1 to 3, characterized in that The material of the first heat conduction member (42) comprises at least one of copper, aluminum, and steel.

12. The rework apparatus (100) according to any one of claims 1 to 3, characterized in that A part of the top surface (411) of the base (41) is located in the device area (401).

13. The rework apparatus (100) according to any one of claims 1 to 3, characterized in that A part of the base (41) is hollowed out, and at least part of the device area (401) is located in the hollowed-out area (420) of the base (41).

14. The rework apparatus (100) according to any one of claims 1 to 3, characterized in that The fixing seat (20) comprises a first face (21) and a second face (22) arranged back to back, the first face (21) is used for mounting the circuit board assembly (60), and the heat dissipation device (40) is fixedly connected to the second face (22). The fixing seat (20) is provided with a through hole (23), the through hole (23) of the fixing seat (20) penetrates the first face (21) and the second face (22), and the first heat conduction member (42) is exposed relative to the through hole (23) of the fixing seat (20).

15. The rework apparatus (100) according to claim 14, characterized in that The fixing seat (20) is provided with a groove (24), the groove (24) is recessed by a part of the first face (21), the groove (24) is arranged around the through hole (23) of the fixing seat (20), and the groove (24) is used for mounting the circuit board assembly (60).

16. The rework apparatus (100) according to any one of claims 1 to 3, characterized in that The fixing base (20) comprises a first surface (21) and a second surface (22) arranged oppositely, the first surface (21) is used for mounting the circuit board assembly (60), the heat dissipation device (40) is located on the side of the first surface (21) away from the second surface (22), and the fixing base (20) is movably connected; The heat dissipation device (40) surrounds the first heat generating device (30), or the first heat generating device (30) surrounds the heat dissipation device (40).

17. The rework apparatus (100) according to any one of claims 1 to 3, characterized in that The first heat conducting member (42) is used for heat conduction connection with the second device (63) of the circuit board assembly (60), and the second device (63) of the circuit board assembly (60) is arranged at intervals with the first device (62) of the circuit board assembly (60).

18. The rework apparatus (100) according to any one of claims 1 to 3, characterized in that The repair equipment (100) further comprises a base (10) and a lifting device (50), the base (10) is provided with a mounting groove (123), and the fixing base (20) is mounted in the mounting groove (123); The lifting device (50) is mounted on the base (10), the first heat generating device (30) is mounted on the lifting device (50), and the lifting device (50) can drive the first heat generating device (30) to move towards or away from the fixing base (20) along the first direction.

19. The rework apparatus (100) according to claim 18, characterized in that The base (10) is provided with a liquid leakage hole (125), and the liquid leakage hole (125) penetrates the groove bottom wall (1231) of the mounting groove (123); The repair equipment (100) further comprises a liquid leakage collection groove (102) and a liquid leakage detector (80), the liquid leakage collection groove (102) is located on the side of the base (10) away from the mounting groove (123), and is communicated with the liquid leakage hole (125); The liquid leakage detector (80) is arranged in the liquid leakage collection groove (102).

20. The rework apparatus (100) according to claim 18, characterized in that The base (10) further comprises a containing cavity (101), and the containing cavity (101) is arranged at intervals with the mounting groove (123); The control circuit of the repair equipment (100) is arranged in the containing cavity (101), and the heat dissipation device (40) is located outside the containing cavity (101).

21. The rework apparatus (100) according to claim 18, characterized in that The repair equipment (100) further comprises a foot switch (110), the foot switch (110) is electrically connected with the lifting device (50), and the foot switch (110) is used for controlling the first heat generating device (30) to move along the first direction.

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