Electronic equipment and on-board device heat dissipation module thereof

Abstract

The embodiment of the utility model discloses electronic equipment and an on-board device heat dissipation module thereof. The on-board device heat dissipation module comprises a first circuit board, a first device, a pump and a liquid cooling film, a first surface of the first circuit board is provided with a first cavity capable of accommodating a liquid cooling working medium, and a first device is connected to the first surface and is arranged in the first cavity; the body of the liquid cooling film internally comprises a flow channel, the flow channel comprises a liquid inlet and a liquid outlet, the first cavity comprises an inlet and an outlet, the liquid inlet is communicated with the outlet, and the liquid outlet is communicated with the inlet; the pump is disposed on the passage between the inlet and the outlet. Through the arrangement, the first device can be immersed in the liquid cooling working medium in the first cavity, heat generated by operation of the first device is conducted to the liquid cooling working medium, meanwhile, liquid cooling circulation can be constructed and formed based on the pump and the liquid cooling film, heat in the first cavity is continuously guided out through the liquid cooling working medium, and immersed type active liquid cooling heat dissipation is achieved. Therefore, the temperature of the device on the board can be prevented from being too high, and application requirements of different scenes can be met.

Description

Technical Field

[0001] This application relates to the field of terminal device technology, and in particular to an electronic device and its chip stacking architecture. Background Technology

[0002] As the performance and computing power of terminal electronic devices increase, the heat dissipation problem of processor chips becomes increasingly prominent. Taking mobile phones as an example, the heat generated by the chip when processing a large number of computing tasks needs to be dissipated in a timely manner. At the same time, the printed circuit board (PCB) architecture usually adopts a double-sided layout to increase the layout density, that is, components are also placed on opposite sides of the chip. The heat accumulation on both sides of the PCB will further affect the heat dissipation efficiency of the components on the board. Traditional passive cooling architectures can no longer achieve rapid and continuous heat dissipation, and may even cause the system-on-chip (SoC) to reduce its frequency, affecting the user experience. Utility Model Content

[0003] This application provides an electronic device and a heat dissipation module for onboard components, which effectively improves the heat dissipation effect of onboard components through structural optimization.

[0004] The first aspect of this application provides an on-board device heat dissipation module, which includes a first circuit board, a first device, a pump, a liquid coolant, and a liquid cooling film. The first circuit board includes a first side and a second side disposed opposite to each other. The first side of the first circuit board is provided with a first cavity for accommodating the liquid coolant. The first device is connected to the first side and disposed in the first cavity. The liquid coolant is disposed in the first cavity and covers the first device. The liquid cooling film includes a flow channel, which includes an inlet and an outlet. The first cavity includes an inlet and an outlet. The inlet of the flow channel is connected to the outlet of the first cavity, and the outlet of the flow channel is connected to the inlet of the first cavity. The pump is disposed in the passage between the inlet and the outlet of the first cavity. In this configuration, a liquid cooling medium is placed in the first chamber. The inlet and outlet of the first chamber are connected to the inlet and outlet of the liquid cooling film. A pump located on this liquid cooling cycle provides the flow power for the liquid cooling medium, ensuring its continuous flow. This creates a liquid cooling cycle between the liquid cooling film and the first chamber. The first device is covered by the liquid cooling medium, and the heat generated by the first device is carried out of the first chamber by the circulating liquid, achieving active heat dissipation. This prevents the device on the board from overheating, providing a good technical guarantee for ensuring the device's performance and operational reliability.

[0005] Furthermore, this application uses a pump as the power source for the liquid cooling cycle, and the pump's output parameters can be adjusted as needed to achieve good heat dissipation. In addition, the liquid cooling film allows for flexible placement; for example, when applied to mobile phones, the liquid cooling film can be applied to components such as the back cover, screen, mid-frame, or motherboard bracket to fully utilize the available space within the electronic device for heat exchange, meeting the application needs of different scenarios.

[0006] For example, the heat dissipation module for on-board devices may further include a first housing, which may be sealed to a first side of the first circuit board to form a first cavity.

[0007] Based on the first aspect, the present application also provides a first implementation of the first aspect: the heat dissipation module of the device on the board further includes a second circuit board, the second circuit board is connected to the first circuit board through a frame board, and an accommodating space is formed between the first circuit board, the second circuit board and the frame board, and the first device is located in the accommodating space.

[0008] Based on the first embodiment of the first aspect, this application also provides a second embodiment of the first aspect: the heat dissipation module of the device on the board further includes a second housing, the two ends of which are sealed to the first circuit board and the second circuit board to form a first cavity. With this configuration, in scenarios that meet heat dissipation requirements, the implementation method of forming the first cavity based on the second housing can reduce the amount of heat dissipation working fluid, facilitating lightweight management.

[0009] For example, the inlet and outlet of the first cavity may be located on a first circuit board. Alternatively, the inlet and outlet of the first cavity may be located on a second circuit board.

[0010] Based on the first implementation of the first aspect, this application also provides a third implementation of the first aspect: the frame plate is sealed and connected to the first circuit board and the second circuit board respectively, and the accommodating space is the first cavity.

[0011] For example, the inlet and outlet of the first cavity may be located on a first circuit board. Alternatively, the inlet and outlet of the first cavity may be located on a second circuit board, or on a frame board.

[0012] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, or the third implementation of the first aspect, this application also provides a fourth implementation of the first aspect: the heat dissipation module of the device on the board further includes a second device, which is connected to a second surface, that is, the second device is located on the second surface of the first circuit board. In practical applications, when the heat generated by the operation of the second device is transferred to the first surface side through the board body of the first circuit board, the heat can also be carried away by the liquid cooling medium in the first cavity, further improving the heat dissipation effect of the second device.

[0013] Based on the fourth implementation of the first aspect, this application also provides a fifth implementation of the first aspect: a second cavity for accommodating liquid cooling medium is provided on the second side of the first circuit board. The liquid cooling medium is also disposed in the second cavity and covers the second device. The inlet is connected to the outlet through the second cavity, and the outlet is connected to the inlet through the second cavity. In practical applications, the second cavity can be connected to the first cavity on the other side through the inlet and outlet on the first circuit board; correspondingly, the inlet and outlet of the liquid cooling film are indirectly connected to the second cavity and the first cavity, respectively. In this way, the liquid cooling medium heated in the first cavity flows into the second cavity through the outlet and merges with the heated liquid cooling medium in the second cavity. They then flow into the liquid cooling film through the inlet. The liquid cooling medium that has completed heat exchange and cooling through the liquid cooling film flows into the second cavity through the outlet and further flows into the first cavity through the inlet, thus forming a liquid cooling cycle.

[0014] For example, the heat dissipation module of the device on the board may also include a third housing, which is sealed to the second side of the first circuit board to form a second cavity.

[0015] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, or the third implementation of the first aspect, or the fourth implementation of the first aspect, or the fifth implementation of the first aspect, this application also provides a sixth implementation of the first aspect: the flow channel includes multiple sub-flow channels arranged in parallel. Thus, along the flow path of the liquid cooling working fluid, the spaced sub-flow channels can achieve a relatively balanced heat transfer capacity.

[0016] Based on the sixth implementation of the first aspect, this application also provides a seventh implementation of the first aspect: the pump is a piezoelectric micropump, which is stacked on the body of the liquid cooling film and corresponding one-to-one with the sub-channels. This arrangement provides significant layout benefits in the thickness direction.

[0017] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, or the sixth embodiment of the first aspect, or the seventh embodiment of the first aspect, this application also provides an eighth embodiment of the first aspect: the body of the liquid cooling film is bent and encloses a clearance area. Thus, the clearance area formed by the bent body can avoid functional structural assembly interference with the mating components.

[0018] In practical applications, the liquid cooling film can be applied to the inner wall of the phone's back cover, allowing the phone's camera module to be exposed through the clearance area of ​​the liquid cooling film and the through-holes in the back cover. For example, the clearance area of ​​the liquid cooling film can be completely aligned with the outline of the camera module, or a certain gap can be left.

[0019] A second aspect of this application provides an electronic device including a housing and a circuit board assembly disposed within the housing. The circuit board assembly employs an on-board device heat dissipation module as described above, with a liquid cooling film of the on-board device heat dissipation module covering the inner wall of the housing. Thus, heat is exchanged to the housing through the liquid cooling film and dissipated into the environment through the housing to meet the performance requirements of the device operation.

[0020] In practical applications, this liquid cooling film can be bonded to the housing of electronic devices through a thermally conductive interface material to improve the heat transfer efficiency between the two.

[0021] For example, the housing may include a back cover with a groove on its inner wall, into which a liquid cooling film covers. This reduces the space occupied in the thickness direction and also reduces the thermal resistance for heat dissipation through the back cover.

[0022] Based on the second aspect, this application also provides a first implementation of the second aspect: the electronic device further includes a mid-frame and a liquid cooling film covering the mid-frame. This allows heat to be further exchanged to the mid-frame side through the liquid cooling film and dissipated into the environment through the mid-frame.

[0023] A third aspect of this application provides an electronic device including a housing, a mid-frame, and a circuit board assembly disposed within the housing. The circuit board assembly employs an on-board device heat dissipation module as described above, with a liquid cooling film covering the mid-frame. Thus, heat is exchanged to the mid-frame via the liquid cooling film and dissipated into the environment through the mid-frame to meet the performance requirements of the device operation.

[0024] For example, the electronic device can be a mobile phone, tablet, or computer. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a heat dissipation module for on-board components provided in an embodiment of this application;

[0026] Figure 2 This is a schematic diagram of the structure of a liquid cooling film provided in an embodiment of this application;

[0027] Figure 3 for Figure 2 A schematic diagram of an assembly relationship of the liquid cooling film shown;

[0028] Figure 4 for Figure 2Another schematic diagram of the assembly relationship of the liquid cooling film shown;

[0029] Figure 5 for Figure 2 CC cross-section view in the middle;

[0030] Figure 6 This is a schematic diagram of another liquid cooling film provided in an embodiment of this application;

[0031] Figure 7 This is a schematic diagram of the structure of another liquid cooling film provided in the embodiments of this application;

[0032] Figure 8 A schematic diagram of another on-board device heat dissipation module provided in an embodiment of this application;

[0033] Figure 9 A schematic diagram of another on-board device heat dissipation module provided in the embodiments of this application;

[0034] Figure 10 A schematic diagram of another on-board device heat dissipation module provided in an embodiment of this application;

[0035] Figure 11 A schematic diagram of another on-board device heat dissipation module provided in the embodiments of this application;

[0036] Figure 12 This is a schematic diagram of another on-board device heat dissipation module provided in an embodiment of this application. Detailed Implementation

[0037] This application provides a heat dissipation solution for on-board devices that can effectively improve heat dissipation capabilities to meet the performance requirements of device operation.

[0038] With the advancement of terminal electronic devices, processor chips are experiencing increased power consumption and higher integration, making heat dissipation a more prominent issue. A typical circuit board layout architecture assembles chips and other components on opposite sides of a PCB, also with components arranged on the opposite side of the chip—a "double-sided board." The heat accumulated on both sides of the PCB further affects the heat dissipation efficiency of the components on the board. If the heat generated during chip operation is not dissipated in time, excessively high temperatures can lead to decreased chip performance or even damage. Furthermore, high temperatures accelerate component aging and shorten the lifespan of electronic devices.

[0039] Based on this, this application provides an on-board device heat dissipation module, including a first circuit board, a first device, a pump, and a liquid cooling film. The first circuit board includes a first side and a second side disposed opposite to each other. A first cavity for containing liquid cooling medium is disposed on the first side of the first circuit board. The first device is connected to the first side of the first circuit board, and the liquid cooling medium is disposed in the first cavity and covers the first device. The liquid cooling film includes a flow channel, which includes an inlet and an outlet. The first cavity includes an inlet and an outlet. The inlet of the flow channel is connected to the outlet of the first cavity, and the outlet of the flow channel is connected to the inlet of the first cavity. The pump is disposed in the passage between the inlet and outlet of the first cavity. With this configuration, the first device can be immersed in the liquid cooling medium in the first cavity. The heat generated by its operation will be conducted to the liquid cooling medium. At the same time, a liquid cooling cycle can be formed based on the first cavity and the liquid cooling film. The pump located on the liquid cooling cycle can provide the flow power for the liquid cooling medium. The liquid cooling medium continuously exports the heat in the first cavity and dissipates it into the environment, realizing immersion active liquid cooling heat dissipation of the first device. This avoids overheating of components on the board, providing a good technical guarantee for ensuring the performance and operational reliability of the components.

[0040] Furthermore, this application uses a pump as the power source for the liquid cooling cycle, and the pump's output parameters can be adjusted as needed to achieve good heat dissipation. In addition, the liquid cooling film allows for flexible placement; for example, in mobile phones, the liquid cooling film can be applied to components such as the back cover, screen, mid-frame, or motherboard bracket to fully utilize the available space within the electronic device for heat exchange, meeting the application needs of different scenarios.

[0041] To better understand the technical solution and effects of this application, specific embodiments will be described in detail below with reference to the accompanying drawings. Please refer to... Figure 1 The circle is a schematic diagram of a heat dissipation module for on-board devices provided in an embodiment of this application.

[0042] In this embodiment, the heat dissipation module 100 on the board includes a first circuit board 10 and a second circuit board 20. The first circuit board 10 and the second circuit board 20 are connected by a frame plate 30, forming a receiving space between the first circuit board 10, the second circuit board 20, and the frame plate 30. In a specific implementation, the frame plate 30 can connect the first circuit board 10 and the second circuit board 20 to achieve an electrical connection. For example, but not limited to, a soldering process can be used to achieve the corresponding electrical connection. Further details are omitted here.

[0043] For example, the heat dissipation module 100 on the board can be used in electronic devices such as mobile phones, tablets, or computers. Here, the first circuit board 10 is a main board with electronic components such as chips and memory, and the second circuit board 20 is an RF board with radio frequency (RF) components (not shown in the figure) to realize data transmission and communication functions.

[0044] The first circuit board 10 is a double-sided board, meaning that devices are disposed on both the first and second sides of the first circuit board 10, which are arranged opposite each other. The first side of the first circuit board 10 is located closer to the second circuit board 20, and the first device 1 is connected to the first side of the first circuit board 10, i.e., arranged within the receiving space. The second side of the first circuit board 10 is located away from the second circuit board 20, and the second device 2 is connected to the second side of the first circuit board 10.

[0045] In a specific implementation, the first device 1 can be a device for constructing a power module, such as, but not limited to, a power management unit (PMU), capacitor, or inductor. The specific device can be determined according to different application scenarios, and this application embodiment does not impose any limitations. The second device 2 can be a chip, such as, but not limited to, a system-on-chip (SoC) package formed based on the packaging substrate 12.

[0046] like Figure 1 As shown, the first housing 3 is a cover-like structure with an open end, and is sealed to the first surface of the first circuit board 10 through the edge of the open end, forming a first cavity A for containing the liquid cooling medium. The first device 1 is located inside the first cavity A and can be immersed in the liquid cooling medium; that is, the liquid cooling medium is disposed inside the first cavity A and covers the first device 1. In this way, the heat generated by the first device 1 during operation can be exchanged to the liquid cooling medium. In a specific implementation, the liquid cooling medium can be an insulating medium, such as, but not limited to, silicone oil or fluorinated liquid, which are highly compatible liquid cooling media.

[0047] Here, the first housing 3 can be made of metal, providing both good heat transfer and electromagnetic shielding. The number of first devices 1 within the first cavity A can be one or more. Multiple first devices 1 to be cooled can be of the same type, such as all capacitors; or they can be of different types, such as some being capacitors and others being inductors. In other words, the specific devices to be cooled located on the first surface are determined according to the overall product design requirements. This application does not limit the scope of the embodiments.

[0048] In specific implementations, the first housing 3 and the first circuit board 10 can be connected by welding or bonding, such as, but not limited to, wire bonding or adhesive bonding, as long as the functional requirement of sealing and fixing between the two can be met. This application does not limit the scope of the embodiments.

[0049] It is understood that the specific shape and size ratio of the first housing 3 are not limited to the example in the figure. They can be determined according to the actual heat dissipation requirements of the device to be cooled and the layout of the first side of the first circuit board 10.

[0050] The heat dissipation module 100 for the device on the board also includes a liquid cooling film 4 and a pump 5. The flexible body of the liquid cooling film 4 includes a flow channel 41, and the inlet 411 and outlet 412 of the flow channel 41 are respectively connected to the first cavity A. In this embodiment, the first circuit board 10 has an inlet 101 and an outlet 102. The liquid cooling medium heated in the first cavity A can flow into the liquid cooling film 4 through the outlet 102 and the inlet 411 in sequence. The liquid cooling medium cooled by heat exchange through the liquid cooling film 4 can flow into the first cavity A through the outlet 412 and the inlet 101 in sequence, forming a liquid cooling cycle. The pump 5 is set in the passage between the inlet 411 and the outlet 102, which can provide the flow power for the liquid cooling medium and continuously remove the heat from the first cavity using the liquid cooling medium. That is, it provides an immersion active liquid cooling solution for the first device 1, which effectively improves the heat dissipation effect and avoids the adverse effects caused by the first device on the board being too hot.

[0051] The liquid inlet 411 of the liquid cooling film 4 is connected to the outlet 102 of the first cavity A via the liquid inlet pipe 61, and the liquid outlet 412 of the liquid cooling film 4 is connected to the inlet 101 of the first cavity A via the liquid outlet pipe 62. The pump 5 can be used as follows: Figure 1 The pump 5, as shown, is installed on the inlet pipe 61, which can quickly pump the high-temperature working fluid in the first chamber A to the liquid cooling film 4. In other specific implementations, the pump 5 can be installed on the outlet pipe 62, which can quickly pump the low-temperature working fluid from the liquid cooling film 4 to the first chamber A. The specific arrangement can be made according to the overall product architecture design, and this application embodiment is not limited thereto.

[0052] Pump 5, serving as the power source, can preferably be a piezoelectric micropump. This piezoelectric micropump features high pumping accuracy, low operating noise, and small size. For terminal electronic devices such as mobile phones or tablets, the benefits of using piezoelectric micropumps in the thickness direction are even more significant. During operation, based on the inverse piezoelectric effect of piezoelectric materials, repeated application of an electric field causes the piezoelectric component made of piezoelectric material to undergo mechanical deformation. This creates a pressure difference between the pump inlet and outlet of the piezoelectric micropump, achieving the pumping function of the liquid-cooled working fluid. Further details are omitted here.

[0053] In practical implementation, the shape of the liquid cooling film 4 can be adapted to different joining components to obtain the required heat exchange contact area. Please refer to [link / reference]. Figure 2 and Figure 3 in, Figure 2 This is a schematic diagram of the structure of a liquid cooling film provided in an embodiment of this application. Figure 3 for Figure 2 The diagram shows an assembly relationship of the liquid cooling film.

[0054] like Figure 2 As shown, the liquid cooling film 4 is generally bent, with the inlet 411 and outlet 412 of the flow channel 41 located on the same end side for connection to the first cavity side. The flow channels 41 within the liquid cooling film 4 body are arranged within a width range to fully exchange heat with the connected components. In this embodiment, the pump 5 is installed on the outlet pipe 62 connected to the outlet 412 of the liquid cooling film 4. The flow channel 41 includes multiple sub-flow channels arranged in parallel: a first sub-flow channel 41a, a second sub-flow channel 41b, and a third sub-flow channel 41c. In other words, each sub-flow channel is arranged in parallel between the inlet 411 and the outlet 412. Thus, along the flow path of the liquid cooling working fluid, the first sub-flow channel 41a, the second sub-flow channel 41b, and the third sub-flow channel 41c, arranged at intervals, can obtain a relatively balanced heat exchange capacity.

[0055] In a specific implementation, the shape of the liquid cooling film 4 can be configured according to the specific structure of the mating components. For example, Figure 2 The liquid cooling film 4 shown is formed by a bent body to create an avoidance area B, thereby preventing interference with the functional structure assembly of the mating components. For example, Figure 3 The scenario shown illustrates a specific application where a liquid cooling film 4 is applied to the back cover 40 of a mobile phone to achieve heat exchange. Figure 3 In the illustrated architecture, the motherboard 50, sub-board 60, and battery 70 are housed within the back cover 40. The motherboard 50 and sub-board 60 are located on either side of the battery 70, and the motherboard 50 is assembled and fixed via a motherboard bracket 80. A liquid cooling film 4 covers the inner wall of the back cover 40, and the camera module 90 is exposed through a clearance area of ​​the liquid cooling film 4 and a through-hole in the back cover 40. Here, the clearance area of ​​the liquid cooling film 4 can be completely aligned with the outline of the camera module 90 and other structures, or a certain gap can be reserved, i.e., there is assembly adaptation margin. This application does not limit the scope of the embodiments.

[0056] To improve the heat transfer efficiency between the liquid cooling film 4 and the back cover 40, in specific implementations, thermally conductive interface materials can be set for both, such as, but not limited to, thermally conductive gel or silicone grease, to improve the heat conduction efficiency according to actual needs.

[0057] In other specific implementations, the liquid cooling film 4 can also be embedded in the mating components. See also... Figure 4 The image is Figure 2 The diagram shows another assembly relationship of the liquid cooling film. This is to clearly illustrate the difference between this embodiment and the aforementioned... Figure 3 The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0058] and Figure 3 Compared to the described mobile phone architecture, the difference in this implementation scheme is that the inner wall of the back cover 40 has a groove 401, and the liquid cooling film 4 is covered within the groove 401 of the back cover 40 to achieve heat exchange. This reduces the space occupied in the thickness direction and also reduces the thermal resistance for heat dissipation through the back cover 40. Here, the depth of the groove 401 can be approximately the same as the thickness of the liquid cooling film 4, that is, flush with the inner wall surface of the back cover 40. While achieving active liquid cooling, this does not affect the basic assembly relationship of the back cover, further improving adaptability.

[0059] Furthermore, in a specific implementation, the liquid cooling film 4 comprises a flexible body formed by a first flexible film 42 and a second flexible film 43. Please refer to [the relevant documentation / reference]. Figure 2 and Figure 5 ,in, Figure 5 for Figure 2 CC cross-section view.

[0060] The first flexible membrane 42 and the second flexible membrane 43 can be formed into the internal flow channel 41 by hot pressing, including the outer perimeter sealing. Alternatively, the internal flow channel 41 can also be formed by adhesive bonding. In comparison, the implementation cost of hot pressing is relatively low, and the accuracy can be reasonably controlled.

[0061] It should be noted that the first flexible membrane 42 and the second flexible membrane 43 can be made of materials that can adapt to pressure fluctuations and bending requirements of the liquid cooling system, such as, but not limited to, polyethylene terephthalate (PET), polypropylene (PP), polyphenylene sulfide (PPS), and polyethylene naphthalate (PEN) polymers, or modified materials of PET, PP, PPS, and PEN. The specific design can be determined according to the overall product design requirements, and this application does not limit the specific design.

[0062] Furthermore, in the implementation scheme described in the foregoing embodiments, pump 5 is located on the liquid outlet pipe 62 connected to the liquid outlet 412 of the liquid cooling film 4. In other specific implementations, pump 5 may also be configured at other passage locations between inlet 101 and outlet 102. Please refer to [link to relevant documentation]. Figure 6This figure is a schematic diagram of another liquid cooling film provided in an embodiment of this application. To clearly illustrate the difference between this embodiment and the aforementioned... Figure 2 The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0063] and Figure 2 Compared to the described implementation scheme, the difference in this implementation scheme is that the pump 5, serving as the power source, is stacked on the liquid-cooled film 4. For multiple sub-channels arranged in parallel, the pump 5 is configured in a one-to-one correspondence with each sub-channel of the liquid-cooled film 4. For example... Figure 6 As shown, pumps 5 are respectively installed in the first sub-channel 41a, the second sub-channel 41b, and the third sub-channel 41c.

[0064] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0065] Furthermore, in the implementation schemes described in the foregoing embodiments, the flow channels 41 of the liquid cooling film 4 all include multiple sub-flow channels arranged in parallel. In other implementations, the flow channel 41 may also be configured as a single flow channel. Please refer to [link to relevant documentation]. Figure 7 This figure is a schematic diagram of another liquid cooling film provided in an embodiment of this application. To clearly illustrate the difference between this embodiment and the aforementioned... Figure 2 The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0066] and Figure 2 and Figure 6 Compared to the described implementation scheme, the difference in this embodiment is that the liquid cooling film 4 includes a flow channel 41 continuously disposed between the liquid inlet 411 and the liquid outlet 412. For example, the body surface of the liquid cooling film 4 is continuous, that is, it does not include a central avoidance area, so the layout of the flow channel 41 can be fully utilized by making full use of the body surface of the liquid cooling film 4.

[0067] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0068] The on-board device heat dissipation module solution described in the foregoing embodiments uses a first circuit board 10, a second circuit board 20, and a frame board 30 as its architectural foundation. In other specific implementations, this chip stacking architecture may only require the first circuit board. Please refer to... Figure 8 This figure is a schematic diagram of another on-board device heat dissipation module provided in an embodiment of this application. To clearly illustrate the difference between this embodiment and the aforementioned... Figure 1 The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0069] and Figure 1Compared to the described on-board device heat dissipation module, the difference in this embodiment is that the on-board device heat dissipation module 100 uses the first circuit board 10 as its architectural basis. In a specific implementation, when the on-board device heat dissipation module 100 is applied to electronic devices with data transmission and communication functions, its radio frequency components (not shown in the figure) can be arranged on the first circuit board 10.

[0070] In comparison, Figure 1 The described on-board device heat dissipation module can be used in electronic devices such as mobile phones where there is limited space for planar layout. Figure 8 The chip stacking architecture described above can be used in electronic devices such as tablet computers where planar layout space is not limited.

[0071] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0072] The foregoing Figure 1 The described on-board device heat dissipation module solution uses a first circuit board to enclose a first cavity A. In other implementations, the first cavity A can also be formed by the combined enclosure of a first circuit board and a second circuit board. Please refer to [link to relevant documentation]. Figure 9 This figure is a schematic diagram of another on-board device heat dissipation module provided in an embodiment of this application. To clearly illustrate the difference between this embodiment and the aforementioned... Figure 1 The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0073] and Figure 1 Compared with the described on-board device heat dissipation module, the difference in this embodiment is that: the second housing 3a of the on-board device heat dissipation module 100 is a cylindrical shape with openings at both ends, and the edges of the openings on both sides are respectively sealed to the opposite surfaces of the first circuit board 10 and the second circuit board 20; that is, the edge of the opening at one end of the second housing 3a is sealed to the opposite surfaces of the first circuit board 10 and the second circuit board 20, and the edge of the opening at the other end of the second housing 3a is sealed to the opposite surfaces of the second circuit board 20 and the first circuit board 10, forming a first cavity A for accommodating liquid cooling fluid.

[0074] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0075] In the on-board device heat dissipation module solution described in the foregoing embodiments, the inlet 101 and outlet 102 of the first cavity A are located on the first circuit board 10. In other specific implementations, the inlet and outlet are also located on the second circuit board 20. Please refer to... Figure 10 This figure is a schematic diagram of another on-board device heat dissipation module provided in an embodiment of this application. To clearly illustrate the difference between this embodiment and the aforementioned... Figure 1The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0076] and Figure 9 Compared with the described on-board device heat dissipation module, the difference in this implementation is that: the second circuit board 20 of the on-board device heat dissipation module 100 has an inlet 201 and an outlet 202. The liquid cooling medium heated in the first cavity A can flow into the liquid cooling film 4 through the outlet 202 and the inlet 411 in sequence. The liquid cooling medium that has completed heat exchange and cooling through the liquid cooling film 4 can flow into the first cavity A through the outlet 412 and the inlet 201 in sequence, which can also form a liquid cooling cycle.

[0077] In other possible implementations, the inlet and outlet of the first cavity A may be located on the first circuit board and the other on the second circuit board (not shown in the figure). This application does not limit the scope of the embodiments.

[0078] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0079] In the on-board device heat dissipation module solutions described in the foregoing embodiments, the first cavity A is formed by enclosing a housing. In other specific implementations, the first cavity A for containing the liquid cooling medium can also be formed by enclosing a first circuit board 10, a second circuit board 20, and a frame plate 30. Please refer to... Figure 11 This figure is a schematic diagram of another on-board device heat dissipation module provided in an embodiment of this application. To clearly illustrate the difference between this embodiment and the aforementioned... Figure 1 , Figure 9 and Figure 10 The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0080] Compared with the on-board device heat dissipation module described in the previous embodiment, the difference in this embodiment is that the frame plate 30 of the on-board device heat dissipation module 100 is solidly connected to the first circuit board 10 and the second circuit board 20, and the three together form a first cavity A that can accommodate liquid cooling medium. The frame plate 30 has an inlet 301 and an outlet 302. The liquid cooling medium heated in the first cavity A can flow into the liquid cooling film 4 through the outlet 302 and the inlet 411 in sequence. The liquid cooling medium cooled by heat exchange through the liquid cooling film 4 can flow into the first cavity A through the outlet 412 and the inlet 301 in sequence, thus forming a liquid cooling cycle.

[0081] In other possible implementations, the inlet and outlet of the first cavity A may both be located on the first circuit board 10, or both may be located on the second circuit board 20, or one may be located on the first circuit board and the other on the second circuit board (not shown in the figure). This application does not limit the implementation.

[0082] It should be understood that, under the same conditions of other basic structural configurations, the aforementioned embodiment, which uses a shell to enclose and form the first cavity A, can relatively reduce the amount of heat dissipation working fluid required, facilitating lightweight management. In other words, in scenarios that meet heat dissipation requirements, the implementation method of forming the first cavity using a shell enclosure is preferred.

[0083] The specific implementation of other functional components can adopt the same implementation method as the aforementioned embodiments. Further details will not be provided here.

[0084] Furthermore, regarding the second device 2 on the first circuit board 10, in practical applications, when the heat generated by the second device 2 during operation is transferred to the first side via the board body of the first circuit board 10, the heat can also be carried away by the liquid cooling medium in the first cavity A, further improving the heat dissipation effect of the second device 2. In other specific implementations, immersion active liquid cooling can also be provided. Please refer to [link to relevant documentation]. Figure 12 This figure is a schematic diagram of another on-board device heat dissipation module provided in an embodiment of this application. To clearly illustrate the difference between this embodiment and the aforementioned... Figure 9 The differences and connections between the described schemes, as well as the components and structures with the same functions, are illustrated in the diagram using the same symbols.

[0085] Compared with the on-board device heat dissipation module described in the previous embodiments, the difference in this embodiment is that the on-board device heat dissipation module 100 further includes a third housing 3b. The third housing 3b is a cover-shaped structure with an open end, and is sealed to the second surface of the first circuit board 10 through the edge of the open end, forming a second cavity D for accommodating the liquid cooling medium. The second device 2 is located in the second cavity D and can be immersed in the liquid cooling medium. In this way, the heat generated by the operation of the second device 2 can be exchanged to the liquid cooling medium side.

[0086] The second cavity D is connected to the first cavity A located on the first surface of the first circuit board 10, such as Figure 12As shown, the second cavity D is connected to the first cavity A through the inlet 101 and outlet 102 on the first circuit board 10. Correspondingly, the inlet 411 and outlet 412 of the liquid cooling film 4 are connected to the second cavity D, that is, indirectly connected to the first cavity A through the second cavity D. The liquid cooling medium heated in the first cavity A flows into the second cavity D through the outlet 202, and merges with the heated liquid cooling medium in the second cavity D. Together, they flow into the liquid cooling film 4 through the inlet 411. The liquid cooling medium that has completed heat exchange and cooling through the liquid cooling film 4 flows into the second cavity D through the outlet 412, and further flows into the first cavity A through the inlet 201, thus forming a liquid cooling cycle.

[0087] Here, the third housing 3b can be made of metal, providing both good heat transfer and electromagnetic shielding. The number of second devices 2 within the second cavity D can be one or more. Multiple second devices 2 requiring heat dissipation can be of the same or different types, determined according to the overall product design requirements. This application does not limit the specific number of such devices.

[0088] In a specific implementation, the third housing 3b and the first circuit board 10 can be connected by welding or bonding, such as, but not limited to, wire bonding or adhesive bonding, as long as the sealing and fixing function between the two can be met.

[0089] The on-board device heat dissipation module described in the foregoing embodiments can be widely used in various application scenarios, such as the PCBA architecture of electronic devices like mobile phones, tablets, or computers. It should be understood that other major functional components of this electronic device can be implemented using existing technologies, and therefore will not be elaborated upon herein.

[0090] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A heat dissipation module for on-board components, characterized in that, The on-board device heat dissipation module comprises a first circuit board, a first device, a pump, a liquid cooling medium and a liquid cooling film; the first circuit board comprises a first surface and a second surface arranged oppositely, the first surface of the first circuit board is provided with a first cavity capable of accommodating the liquid cooling medium, the first device is connected to the first surface and arranged in the first cavity; the liquid cooling medium is arranged in the first cavity to cover the first device, the liquid cooling film comprises a flow channel, the flow channel comprises an inlet and an outlet, the first cavity comprises an inlet and an outlet, the inlet of the flow channel is communicated with the outlet of the first cavity, and the outlet of the flow channel is communicated with the inlet of the first cavity; the pump is arranged on a passage between the inlet of the first cavity and the outlet of the first cavity.

2. The on-board device heat dissipation module according to claim 1, wherein, The on-board device heat dissipation module further comprises a first shell, and the first shell is sealingly connected with the first surface of the first circuit board to form the first cavity.

3. The on-board device heat dissipation module according to claim 2, wherein, The inlet and the outlet are arranged on the first circuit board.

4. The on-board device heat dissipation module of claim 1, wherein, The on-board device heat dissipation module further comprises a second circuit board, and the second circuit board is connected with the first circuit board through a frame plate; the first circuit board, the second circuit board and the frame plate form an accommodation space, and the first device is located in the accommodation space.

5. The on-board device heat dissipation module according to claim 4, wherein, The on-board device heat dissipation module further comprises a second shell, and two ends of the second shell are sealingly connected with the first circuit board and the second circuit board respectively to form the first cavity.

6. The on-board device heat dissipation module according to claim 5, wherein, The inlet and the outlet are arranged on the first circuit board or the second circuit board.

7. The on-board device heat dissipation module of claim 4, wherein, The frame plate is sealingly connected with the first circuit board and the second circuit board respectively, and the accommodation space is the first cavity.

8. The on-board device heat dissipation module according to claim 7, wherein, The inlet and the outlet are arranged on the first circuit board or the second circuit board or the frame plate.

9. The on-board device heat dissipation module according to any one of claims 1 to 8, characterized in that, The on-board device heat dissipation module further comprises a second device, and the second device is located on the second surface of the first circuit board.

10. The on-board device heat dissipation module of claim 9, wherein, The second surface of the first circuit board is provided with a second cavity capable of accommodating the liquid cooling medium, and the liquid cooling medium is also arranged in the second cavity to cover the second device; the inlet is communicated with the outlet through the second cavity, and the outlet is communicated with the inlet through the second cavity.

11. The on-board device heat dissipation module of claim 10, wherein, The on-board device heat dissipation module further comprises a third shell, and the third shell is sealingly connected with the second surface of the first circuit board to form the second cavity.

12. The on-board device heat dissipation module of claim 1, wherein, The flow channel comprises a plurality of sub-flow channels arranged in parallel.

13. The on-board device heat dissipation module of claim 12, wherein, The pump is a piezoelectric micropump, and the piezoelectric micropump is arranged on the liquid cooling film and corresponds to the sub-flow channels one by one.

14. The on-board device heat dissipation module of claim 1, wherein, The liquid cooling film is in a bent shape and encloses an avoiding area.

15. An electronic device, comprising: The electronic device further comprises a middle frame and a liquid cooling film covering the middle frame.

16. The electronic device of claim 15, wherein, The inner wall of the shell has a groove, and the liquid cooling film is arranged in the groove.

17. The electronic device of claim 15 or 16, wherein, The electronic device further comprises a middle frame and a liquid cooling film covering the middle frame.

18. An electronic device, comprising: The electronic device comprises a shell, a middle frame and a circuit board assembly arranged in the shell, the circuit board assembly adopts the on-board device heat dissipation module according to any one of claims 1 to 14, and the liquid cooling film of the on-board device heat dissipation module is covered on the middle frame.

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