Wafer processing device and laser processing equipment

Abstract

The utility model discloses a wafer processing device and laser processing equipment, the wafer processing device comprises a rack, a protection mechanism, a rotating mechanism, a sliding mechanism and a lifting assembly, the protection mechanism comprises a first mounting seat, the rotating mechanism comprises a second mounting seat, and the first mounting seat is provided with a through hole for the second mounting seat to pass through; the sliding mechanism is arranged around the periphery of the second mounting seat, so that the second mounting seat is in sliding connection with the rack, and the sliding direction is in the axial direction of the through hole; the lifting mechanism is arranged below the second mounting base and used for driving the rotating mechanism to slide in the axial direction of the through hole. Due to the surrounding arrangement of the plurality of groups of sliding mechanisms, the circumferential and radial degrees of freedom of the second mounting seat are restrained, even if the rotating mechanism generates vibration, the connection between the rack and the second mounting seat is tighter, the fit clearance is smaller, the amplitude of the rack and the second mounting seat is greatly reduced, and the effect of reducing vibration is achieved.

Description

Technical Field

[0001] This application relates to the field of wafer processing, and in particular to a wafer processing apparatus and a laser processing device. Background Technology

[0002] The semiconductor wafer laser grooving process comprises three steps: wafer coating (applying a protective solution to the wafer to protect the die from damage during laser grooving), wafer laser grooving (using laser etching to form grooves), and wafer cleaning (using pure water to remove the protective solution and impurities generated during laser grooving). In the coating and cleaning processes, to ensure uniform coating and good cleaning, the wafer needs to rotate at high speed, often reaching 1000-3000 rpm, with a rotation time of 100-300 seconds and short acceleration / deceleration times. Significant vibrations generated during this process will inevitably affect the moving platform and the vision CCD camera, thus impacting processing accuracy. Utility Model Content

[0003] This application proposes a wafer processing apparatus and laser processing equipment that can reduce the vibration generated inside the processing apparatus when the wafer is rotating.

[0004] This application discloses a wafer processing apparatus, comprising:

[0005] frame;

[0006] The protective mechanism includes a first mounting base disposed on the frame, the first mounting base having a through hole;

[0007] A rotating mechanism, including a second mounting base disposed in the through hole;

[0008] A sliding mechanism is provided on the second mounting base and includes a sliding part connected to the frame. The sliding mechanism is arranged around the outer periphery of the second mounting base.

[0009] A lifting mechanism, located below the second mounting base, is used to drive the rotating mechanism to slide along the axial direction of the through hole.

[0010] In some embodiments, the wafer processing apparatus includes four sets of sliding mechanisms, the outer periphery of which includes four sidewalls connected in sequence, and the sliding mechanism and the sidewalls are arranged in a one-to-one correspondence.

[0011] In some embodiments, the second mounting base is hollow, and the rotating mechanism further includes:

[0012] The motor is located at the lower end of the second mounting base;

[0013] The mounting component is located at the upper end of the second mounting base;

[0014] The carrier plate assembly is located above the mounting component;

[0015] A rotary seal is mounted on the mounting component and located in the second mounting base. The upper end of the rotary seal is connected to the carrier plate assembly, and the lower end is also connected to the motor drive.

[0016] In some embodiments, the protective mechanism further includes a first annular baffle disposed on the upper side of the mounting member and surrounding the mounting hole, and a first annular groove disposed on the lower side of the carrier plate assembly, wherein the upper end of the first annular baffle can be located in the first annular groove.

[0017] In some embodiments, the first mounting base is provided with a first groove located around the through hole and a second groove located around the first groove; the wafer processing apparatus further includes a cover located on the top of the first groove, the cover being used to cover the first groove; the lower end of the cover is inserted into the second groove and forms a channel with the inner wall of the second groove communicating with the first groove.

[0018] In some embodiments, the protective mechanism further includes a second annular baffle disposed on the upper side of the cover and surrounding the through hole, and a second annular groove disposed on the mounting member, wherein the upper end of the second annular baffle can be located in the second annular groove.

[0019] In some embodiments, the protective mechanism further includes a housing disposed on the first mounting base, the housing having an opening at its upper end and an internal accommodating cavity for accommodating the mounting member and the carrier plate assembly.

[0020] In some embodiments, the protective mechanism further includes a retaining ring disposed within the housing, one end of which is connected to the inner wall of the housing, and the other end is narrowed, the retaining ring dividing the accommodating cavity into an upper chamber and a lower chamber.

[0021] In some embodiments, the wafer processing apparatus further includes a sensor disposed on the second mounting base, the sensor being used to detect rotational parameters of the rotating mechanism.

[0022] This application also proposes a laser processing device, including the aforementioned wafer processing apparatus.

[0023] This application discloses a wafer processing apparatus and laser processing equipment. The wafer processing apparatus includes a frame, a protective mechanism, a rotating mechanism, a sliding mechanism, and a lifting assembly. The protective mechanism includes a first mounting base, and the rotating mechanism includes a second mounting base. The first mounting base has a through hole for the second mounting base to pass through. The sliding mechanism is arranged around the outer periphery of the second mounting base, allowing the second mounting base to slide against the frame, with the sliding direction along the axial direction of the through hole. The lifting mechanism is located below the second mounting base and is used to drive the rotating mechanism to slide along the axial direction of the through hole. The surrounding arrangement of multiple sliding mechanisms constrains the circumferential and radial degrees of freedom of the second mounting base. Even if vibration occurs due to the rotating mechanism, the connection between the frame and the second mounting base is tighter, the clearance is smaller, and the amplitude is greatly reduced, thus mitigating vibration. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of a wafer processing apparatus in one embodiment of this application;

[0025] Figure 2 This is a cross-sectional view of the rotating mechanism at the machining station in one embodiment of this application;

[0026] Figure 3 for Figure 1 A schematic diagram of the rotating mechanism in the embodiment;

[0027] Figure 4 This is a cross-sectional view of the rotating mechanism at the lifting position in one embodiment of this application;

[0028] Figure 5 for Figure 4 A magnified view of a portion of point A in the embodiment.

[0029] Label Explanation:

[0030] 10. First mounting base; 11. First groove; 12. Second groove; 13. Cover; 14. Second annular baffle; 15. First interface; 16. Second interface; 17. Connecting block; 18. Through hole; 21. Second mounting base; 22. Motor; 23. Mounting component; 231. First annular baffle; 232. Second annular groove; 24. Rotary seal; 25. Coupling; 26. Carrier plate assembly; 261. First annular groove; 27. Lifting plate; 28. Support rod; 29. ​​Detector plate; 30. Sliding mechanism; 31. Slide rail; 32. Slider; 33. Connector; 34. Liquid receiving box; 40. Lifting mechanism; 41. Cylinder; 42. Buffer; 51. Housing; 52. Retaining ring.

[0031] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0032] The solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments in this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0033] It should be noted that all directional indications in the embodiments of this application, such as up, down, left, right, front, back, etc., are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indication will also change accordingly.

[0034] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0035] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0036] This application provides a wafer processing apparatus, with reference to... Figure 1 The wafer processing apparatus includes: a frame (not shown in the figure); a protective mechanism 50, including a first mounting base 10 disposed on the frame, the first mounting base 10 having a through hole 18; a rotating mechanism, including a second mounting base 21 disposed in the through hole 18; a sliding mechanism 30, disposed around the outer periphery of the second mounting base 21, for slidingly connecting the second mounting base 21 to the frame, and the sliding direction being along the axial direction of the through hole; and a lifting mechanism 40, disposed below the second mounting base 21, for driving the rotating mechanism to slide along the axial direction of the through hole.

[0037] In this embodiment, multiple sets of sliding mechanisms 30 are arranged around the second mounting base 21, so that the second mounting base 21 is slidably connected to the frame. The circumferential and radial degrees of freedom of the second mounting base 21 are constrained. Even if vibration is generated by the rotating mechanism, the connection between the frame and the second mounting base 21 is tighter and the fit gap is smaller, and the amplitude will be greatly reduced, which has the effect of mitigating vibration.

[0038] It is worth noting that, due to the presence of the lifting mechanism 40, when it drives the rotating mechanism to rise, the upper end of the rotating mechanism can be used to receive or release the wafer, at which point the rotating mechanism is in the lifting position. When it drives the rotating mechanism to descend to the set height, external laser devices, cleaning devices, and / or coating devices can process the wafer surface, at which point the rotating mechanism is in the processing position.

[0039] In some embodiments, refer to Figure 3 The wafer processing apparatus may include four sets of sliding mechanisms 30. The outer periphery of each sliding mechanism 30 includes four sidewalls connected in sequence, with each sliding mechanism 30 corresponding to one of the sidewalls. In this embodiment, the sliding mechanism 30 may include a slide rail 31 disposed on the sidewall of the second mounting base 21 and a slider 32 disposed on the slide rail 31. The slider 32 is connected to the frame via a connecting block. (Refer to...) Figure 1 The first mounting base 10 can be fixedly mounted on the frame, and the lifting mechanism 40 is also fixedly mounted on the frame. The lifting mechanism 40 can be either a pneumatic cylinder 41 or an electric cylinder. The push rod of the pneumatic cylinder 41 is connected to the upper second mounting base 21. The extension of the pneumatic cylinder 41 can push the upper part of the rotating mechanism upward. Four sets of sliding mechanisms 30 further limit the distance between the second mounting base 21 and the first mounting base 10, further reducing the vibration of the rotating mechanism. Of course, the number of the above-mentioned sliding mechanisms 30 can also be three or five, etc.; the structure of the sliding mechanism 30 can also be in the form of guide rods and linear bearings. In addition, refer to Figure 3 The outer wall of the second mounting base 21 can also be provided with a liquid receiving box 34. The liquid receiving box 34 is located at the lower end of the slide rail 31 and can be used to collect the lubricating liquid dripping from the slide rail 31 to avoid contamination.

[0040] In some embodiments, refer to Figure 2The rotating mechanism may further include: a motor 22, located at the lower end of the second mounting base 21; a mounting member 23, located at the upper end of the second mounting base 21; a rotary seal 24, located in the second mounting base 21, and the rotary seal 24 is also drivenly connected to the motor 22; and a carrier plate assembly 26, located above the mounting member 23 and drivenly connected to the rotary seal 24. In this embodiment, the second mounting base 21 is hollow, and the upper mounting member 23 can be a mounting plate. The rotary seal 24 includes a rotating seat mounted on the mounting plate and a rotating shaft rotatably mounted on the rotating seat. The rotating shaft and the rotating seat form a rotary seal, and one end of the rotating shaft extends from the mounting plate and is connected to the carrier plate assembly 26. The carrier plate assembly 26 has a negative pressure gas path for adsorbing wafers, and the negative pressure gas path is connected to an external negative pressure generator through the rotary seal 24. The motor 22 is located at the bottom of the first mounting base 10 and is connected to the lower end of the rotating shaft of the upper rotary seal 24 via a coupling 25. The rotary seal 24 serves a transmission function, and its rotary sealing function prevents processing liquids from entering the second mounting base 21. The rotation of the motor 22 drives the upper carrier plate assembly 26 to rotate. The hollow structure of the second mounting base 21 can accommodate the rotary seal 24, coupling 25, and part of the motor 22 shaft, providing some protection for these components and further saving space. The external sidewalls can accommodate the sliding mechanism 30, making the overall structure more compact and the center of gravity more central, further reducing vibration.

[0041] Reference Figure 2 The rotating mechanism may further include a lifting plate 27 located at the bottom of the motor 22 and a support rod 28 located on the lifting plate 27. The motor 22 is mounted between the lifting plate 27 and the second mounting base 21. The end of the support rod 28 is connected to the second mounting base 21, providing a certain supporting function. The lifting plate 27 and the support rod 28 can provide a certain degree of protection for the motor 22 and are integrated with the motor 22 and the second mounting base 21. (Refer to...) Figure 1 The cylinder 41 is located on the lower side of the lifting plate 27, and its push rod is connected to the lifting plate 27. The cylinder body of the cylinder 41 is also equipped with a buffer 42, which is used to reduce the impact of the rotating mechanism on the cylinder body when the push rod retracts, and further reduce the vertical vibration.

[0042] In some embodiments, refer to Figure 1 and Figure 4The first mounting base 10 is provided with a first groove 11 located around the through hole 18 and a second groove 12 located around the first groove 11. The protective mechanism 50 may also include a cover 13 located on the top of the first groove 11, which is used to cover the first groove 11. The lower end of the cover 13 is inserted into the second groove 12 and forms a channel with the inner wall of the second groove 12 to communicate with the first groove 11. In this embodiment, the first groove 11 and the second groove 12 may be annular grooves, and their specific shapes are not limited to circular rings, square rings, or irregular rings. Of course, a circular ring shape is preferred. The first groove 11 is located on the upper surface of the first mounting base 10. The cover 13 may be an annular component, similar to a horn structure. One end of the cover is installed in the outer peripheral area of ​​the through hole 18, and the other end extends obliquely downward and outward to cover the upper part of the first groove 11. A first flange extends downward from the outer edge of the horn structure to form a first flange that can be inserted into the second groove 12. This can prevent dust and cleaning fluid droplets generated during processing from escaping directly from the through hole 18. Meanwhile, the flared structure of the cover 13 also serves as a guide, directing the cleaning fluid droplets into the second groove 12. (Refer to...) Figure 1 The bottom of the first mounting base 10 may also be provided with a second interface 16 communicating with the second groove 12, through which the cleaning fluid collected in the second groove 12 can be discharged. Alternatively, the aforementioned first flange and the inner wall of the second groove 12 can maintain a certain distance to form the aforementioned channel. The bottom of the first mounting base 10 may also be provided with a first interface 15 communicating with the first groove 11. The first interface 15 can be connected to an external air purification device, allowing water mist and smoke generated during processing to enter the first groove 11 through the aforementioned channel and be discharged through the first interface 15, thus preventing contamination of other components.

[0043] In some embodiments, refer to Figure 4 and Figure 5 The protective mechanism 50 also includes a first annular baffle 231 disposed on the upper side of the mounting member 23 and surrounding the mounting hole, and a first annular groove 261 disposed on the lower side of the carrier plate assembly 26. The upper end of the first annular baffle 231 can be located in the first annular groove 261. In this embodiment, the first annular baffle 231 is disposed on the upper surface of the mounting member 23. The first annular groove 261 can be directly disposed on the lower surface of the carrier plate assembly 26. Alternatively, an annular sheet metal part can be disposed on the lower surface of the carrier plate assembly 26, with the aforementioned first annular groove 261 disposed on one side of the sheet metal part, and the groove opening facing downward and adapted to the aforementioned first annular baffle 231. The aforementioned first annular baffle 231 and first annular groove 261 are respectively located between the carrier plate assembly 26 and the mounting member 23, which can prevent the fumes and droplets generated during processing from entering the interior of the rotating mechanism through the gap between them, so as to avoid contamination.

[0044] In addition, refer to Figure 4The protective mechanism may further include a second annular baffle 14 disposed on the upper side of the cover 13 and surrounding the through hole 18, and a second annular groove 232 disposed on the mounting member 23, wherein the upper end of the second annular baffle 14 can be located in the second annular groove 232. In this embodiment, an annular protective cover is provided on the mounting member 23, and the outer edge of the protective cover extends downward to form a second flange. The mounting member 23 is located in the protective cover, and the second annular groove 232 is formed between its outer periphery sidewall and the second flange of the protective cover. Of course, the second annular groove 232 may also be directly disposed on the lower surface of the mounting member 23. The second annular baffle 14 may be a third flange extending upward from the inner edge of the cover 13, which is adapted to the second annular groove 232. When the lifting mechanism 40 drives the rotating mechanism to descend to the set position (processing station) and process the wafer, the second annular baffle 14 is inserted into the second annular groove 232, which can provide a certain shielding and protection for the upper end of the through hole 18, preventing the smoke or droplets generated during processing from entering the through hole 18 and causing pollution.

[0045] In some embodiments, refer to Figure 2 The protective mechanism 50 also includes a housing 51 disposed on the first mounting base 10. The upper end of the housing 51 is open, and an accommodating cavity is formed inside for accommodating the mounting member 23 and the carrier assembly 26. In this embodiment, the housing 51 may also be annular, with its lower end disposed in the second groove 12. During processing, the wafer is located in the accommodating cavity and is protected by the housing 51, which can prevent droplets or dust from escaping.

[0046] Furthermore, the protective mechanism 50 also includes a retaining ring 52 disposed within the housing 51. One end of the retaining ring 52 is connected to the inner wall of the housing 51, and the other end is tapered. The retaining ring 52 divides the accommodating cavity into an upper chamber and a lower chamber. The tapered upper part of the retaining ring 52 can prevent droplets from splashing out when the wafer rotates in the lower chamber, further improving the protective effect.

[0047] In addition, the wafer processing apparatus also includes a sensor (not shown in the figure) mounted on the second mounting base 21. The sensor is used to detect the rotation parameters of the rotating mechanism. The outer wall of the second mounting base 21 can be hollowed out, and the sensor can be placed in the hollowed-out area without interfering with the sliding mechanism 30. The sensor can be a photoelectric sensor, and a detection plate 29 can be mounted on the coupling 25. When the detection plate 29 rotates with the coupling 25, it approaches the sensor at a certain position, causing a change in the sensor's signal. The frequency of the signal change can be used to detect the rotational speed of the rotating mechanism.

[0048] Furthermore, the components in the aforementioned protective mechanism 50 can be selected to have a circular shape, which can minimize the volume and ensure the compactness of the structure.

[0049] This application also proposes a laser processing device, referring to... Figures 1 to 5 Laser processing equipment includes a vision positioning device and a laser processing head mounted on a rack and located above the wafer processing unit. A marble counterweight can be added to the rack to further reduce equipment vibration caused by the rotation of the rotating mechanism. The vision positioning device positions the wafer. The laser processing head focuses a short-pulse laser onto the wafer surface. The Low-K layer on the wafer surface absorbs the energy carried by the laser and rapidly heats up and vaporizes. Because the laser beam diameter is small and the energy is concentrated, the processing occurs instantaneously, so only the target area is etched, without affecting other areas, thus forming smooth grooves. The grooving process, as a pre-processing step before the diamond wheel cutting process, is essentially a pretreatment for the diamond wheel cutting process. After etching the Low-K material layer, a diamond wheel can be used to directly cut the chip, improving cutting efficiency, preventing chipping and surface peeling at the cutting position, and increasing the chip yield.

[0050] The working principle of the wafer processing apparatus and laser processing equipment in this embodiment is as follows: The wafer processing apparatus includes a frame, a protective mechanism 50, a rotating mechanism, a sliding mechanism 30, and a lifting assembly. The rotating mechanism includes a second mounting base 21, and the protective mechanism 50 includes a first mounting base 10. The first mounting base 10 has a through hole 18 for the second mounting base 21 to pass through. The sliding mechanism 30 is arranged around the outer periphery of the second mounting base 21, so that the second mounting base 21 is slidably connected to the frame, and the sliding direction is along the axial direction of the through hole 18. The lifting mechanism 40 is arranged below the second mounting base 21 and is used to drive the rotating mechanism to slide along the axial direction of the through hole 18. The surrounding arrangement of multiple sets of sliding mechanisms 30 restricts the circumferential and radial degrees of freedom of the second mounting base 21, making the connection between it and the frame tighter, the fit gap smaller, and the amplitude smaller, which can reduce vibration.

[0051] The above are only some or preferred embodiments of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A wafer processing apparatus characterized by comprising: The application relates to a wafer processing device. The device comprises a rack, a protection mechanism, a rotating mechanism, a sliding mechanism and a lifting mechanism. The protection mechanism comprises a first mounting base arranged on the rack, and a through hole arranged on the first mounting base. The rotating mechanism comprises a second mounting base arranged in the through hole. The sliding mechanism is arranged on the second mounting base and comprises a sliding part connected with the rack. The lifting mechanism is arranged below the second mounting base and is used for driving the rotating mechanism to slide along the axial direction of the through hole.

2. The wafer processing apparatus according to claim 1, wherein The wafer processing device comprises four sets of the sliding mechanism, and the periphery of the sliding mechanism comprises four side walls connected in sequence.

3. The wafer processing apparatus of claim 1, wherein The second mounting base is hollow, and the rotating mechanism further comprises a motor arranged at the lower end of the second mounting base, a mounting part arranged at the upper end of the second mounting base, a carrier plate assembly arranged above the mounting part, a rotary seal arranged on the mounting part and located in the second mounting base, and an installation hole arranged on the mounting part and used for mounting the rotary seal. The protection mechanism further comprises a first annular baffle arranged on the upper side of the mounting part and surrounding the installation hole, and a first annular groove arranged on the lower side of the carrier plate assembly. The upper end of the first annular baffle can be located in the first annular groove. The first mounting base is provided with a first groove located at the periphery of the through hole and a second groove arranged at the periphery of the first groove. The wafer processing device further comprises a cover arranged at the top of the first groove and used for shielding the first groove.

4. The wafer processing apparatus according to claim 3, wherein The lower end of the cover is inserted into the second groove and is connected with the inner wall of the second groove to form a channel communicating with the first groove.

5. The wafer processing apparatus according to claim 3, wherein The protection mechanism further comprises a second annular baffle arranged on the upper side of the cover and surrounding the through hole, and a second annular groove arranged on the mounting part.

6. The wafer processing apparatus according to claim 5, wherein The upper end of the second annular baffle can be located in the second annular groove.

7. The wafer processing apparatus according to claim 3, wherein The protection mechanism further comprises a shell arranged on the first mounting base, and the shell is open at the upper end and forms an accommodation cavity in the interior for accommodating the mounting part and the carrier plate assembly.

8. The wafer processing apparatus according to claim 7, wherein The protection mechanism further comprises a stop ring arranged in the shell, one end of the stop ring is connected with the inner wall of the shell, and the other end is closed.

9. The wafer processing apparatus according to any one of claims 1 to 8, characterized by The wafer processing device further comprises a sensor arranged on the second mounting base, and the sensor is used for detecting the rotation parameter of the rotating mechanism.

10. A laser processing apparatus characterized by comprising: The wafer processing device comprises the device according to any one of claims 1 to 9.

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