Gluing device for power module component processing

Abstract

The utility model discloses a gluing device for processing a power supply module component, which relates to the technical field of component gluing and comprises a gluing machine main body, a backing plate is fixed on the outer wall of the gluing machine main body, and a placing plate is controlled to slide on the inner wall of a groove plate until the idle placing plate is moved below a gluing opening of the gluing machine main body. The placement plate can be conveniently and quickly taken out from the interior of the groove plate after processing, and the situation that the next power module component is damaged due to excessive glue caused by gluing processing is avoided, so that the practicability of the device is improved favorably, and the inner wall of the limiting plate slides relative to the outer wall of the placement plate; the gluing machine main body is controlled to glue power supply module components on the placing plate, so that the mounting stability of the placing plate during processing on the inner wall of the groove plate is conveniently ensured, the device can better glue the power supply module components, a fan blows wind into an air guide pipe, and the processing speed of the device on the power supply module components is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of component coating technology, specifically a coating device for processing power module components. Background Technology

[0002] The adhesive coating device for power module components is a device used to apply adhesive to power module components during the production process.

[0003] Based on the above, the inventors have discovered that: Currently, there are many adhesive coating devices for processing power module components on the market. However, these devices typically involve workers placing the power module components into the inner wall of a designated placement slot for adhesive coating. During the adhesive coating process, adhesive overflows into the placement slot, which can easily affect the coating of the next power module component. This severely reduces the adhesive coating effect for workers and diminishes the practicality of the device. Therefore, in view of this, the inventors have researched and improved the existing structure to provide an adhesive coating device for processing power module components, aiming to achieve greater practical value. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0005] This utility model discloses a gluing device for processing power module components, including a gluing machine body, a pad fixed on the outer wall of the gluing machine body, an installation mechanism at the top of the pad, and a cooling mechanism on one side of the gluing machine body.

[0006] The installation mechanism includes:

[0007] A groove plate is disposed on the top of a pad plate. Several placement plates slide on the inner wall of the groove plate, and sliding columns slide on the outer wall of the placement plates. One side of each sliding column is fixed to the inner wall of the groove plate. A rotating shaft rotates on the inner wall of the groove plate, and a connecting plate is fixed to the outer wall of the rotating shaft.

[0008] As a preferred embodiment of this utility model, the top of the pad is provided with a groove, the inner wall of the groove is provided with a protrusion, and the top of the protrusion is fixed to the bottom of the groove plate.

[0009] As a preferred embodiment of this utility model, a perforated plate is fixed to one side of the groove plate, a push rod is sleeved on the inner wall of the perforated plate, and a fixing plate is fixed to one side of the push rod.

[0010] As a preferred technical solution of this utility model, two limiting plates slide on the outer wall of the plurality of placement plates, and both limiting plates are disposed at the top of the groove plate.

[0011] As a preferred embodiment of this utility model, the cooling mechanism includes:

[0012] The base has one side fixed to one side of the glue applicator body. A fan is fixed to the top of the base. One end of the fan is provided with an air guide pipe. A support column is fixed to the outer wall of the air guide pipe. The bottom end of the support column is fixed to the top of the base.

[0013] As a preferred technical solution of this utility model, two locking blocks are fixed at the bottom of each of the two limiting plates, and four locking slots are opened at the top of the slot plate, with the inner walls of the four locking slots matching the outer walls of the locking blocks.

[0014] As a preferred embodiment of this utility model, the vertical cross-sectional area of ​​the inner wall of each of the four slots is matched with the vertical cross-sectional area of ​​the outer wall of the card block.

[0015] The beneficial effects of this utility model are:

[0016] 1. This solution controls the sliding of the placement plate on the inner wall of the slot plate until the idle placement plate is moved below the glue applicator nozzle of the glue applicator body. The connecting plate drives the rotating shaft to rotate on the inner wall of the slot plate, and external force is applied to the fixed plate to make the push rod fit on the inner wall of the perforated plate, thereby driving the placement plate to separate from the sliding column. Thus, the placement plate is quickly removed from the inner wall of the slot plate, which is convenient for quick removal of the placement plate from the inside of the slot plate after processing. This avoids glue overflow caused by glue application process from damaging the next power module components, thus improving the practicality of the device.

[0017] 2. This solution utilizes the sliding of the inner wall of the limiting plate against the outer wall of the placement plate, allowing the locking block fixed at the bottom of the limiting plate to insert into the slot. This securely mounts the placement plate on the inner wall of the slot plate. The main body of the glue applicator applies glue to the power module components on the placement plate, ensuring the stability of the placement plate during processing on the inner wall of the slot plate. This facilitates better glue application to the power module components. Turning on the power switch of the external control fan allows the fan to blow air into the air duct, accelerating the cooling efficiency of the power module components inside the placement plate and effectively improving the processing speed of the power module components. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0019] Figure 1 This is a schematic diagram of the structure of a gluing device for processing power module components according to this utility model;

[0020] Figure 2This is an exploded view of the pad and groove plate of a gluing device for processing power module components according to this utility model.

[0021] Figure 3 This is an exploded view of the placement plate and the slot plate of the gluing device for processing power module components according to this utility model.

[0022] Figure 4 This is a schematic diagram of the cooling mechanism of a gluing device for processing power module components according to this utility model.

[0023] In the diagram: 1. Main body of the glue applicator; 2. Pad plate; 3. Mounting mechanism; 31. Groove plate; 32. Placement plate; 33. Sliding column; 34. Rotating shaft; 35. Connecting plate; 36. Perforated plate; 37. Push rod; 38. Fixing plate; 4. Cooling mechanism; 41. Base; 42. Fan; 43. Air duct; 44. Support column; 5. Groove; 6. Protrusion; 7. Limiting plate; 8. Locking block; 9. Locking slot. Detailed Implementation

[0024] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0025] Example: Figures 1-4 As shown, the present invention provides a gluing device for processing power module components, including a gluing machine body 1, a pad 2 fixed on the outer wall of the gluing machine body 1, an installation mechanism 3 at the top of the pad 2, and a cooling mechanism 4 on one side of the gluing machine body 1.

[0026] Installation mechanism 3 includes:

[0027] A groove plate 31 is disposed at the top of the pad plate 2. Several placement plates 32 slide on the inner wall of the groove plate 31. Sliding columns 33 slide on the outer wall of the placement plates 32. One side of the sliding column 33 is fixed to the inner wall of the groove plate 31. A rotating shaft 34 rotates on the inner wall of the groove plate 31. A connecting plate 35 is fixed on the outer wall of the rotating shaft 34. A perforated plate 36 is fixed on one side of the groove plate 31. A push rod 37 is sleeved on the inner wall of the perforated plate 36. A fixing plate 38 is fixed on one side of the push rod 37.

[0028] As attached Figure 2 As shown, the top of the pad 2 is provided with a groove 5, and the inner wall of the groove 5 is provided with a protrusion 6. The top of the protrusion 6 is fixed to the bottom of the groove plate 31, which facilitates the fastening and installation of the pad 2 and the groove plate 31.

[0029] As attached Figure 1 and Figure 3As shown, two limiting plates 7 slide on the outer wall of several placement plates 32. Both limiting plates 7 are set at the top of the groove plate 31. Two locking blocks 8 are fixed at the bottom of each limiting plate 7. Four locking slots 9 are opened at the top of the groove plate 31. The inner walls of the four locking slots 9 are matched with the outer walls of the locking blocks 8. The vertical cross-sectional area of ​​the inner walls of the four locking slots 9 is matched with the vertical cross-sectional area of ​​the outer walls of the locking blocks 8, which facilitates the stability of the placement plates 32 when they are processed on the inner wall of the groove plate 31.

[0030] As attached Figure 1 and Figure 4 As shown, the cooling mechanism 4 includes:

[0031] The base 41 is fixed to one side of the glue coating machine body 1. A fan 42 is fixed to the top of the base 41. A duct 43 is provided at one end of the fan 42. A support column 44 is fixed to the outer wall of the duct 43. The bottom end of the support column 44 is fixed to the top of the base 41, which facilitates the cooling efficiency of the power module components inside the quick-placement plate 32 and effectively improves the processing speed of the power module components by the device.

[0032] Working principle: In use, place the slot plate 31 on top of the pad plate 2, so that the protrusion 6 fixed at the bottom of the slot plate 31 is inserted into the groove 5, thereby stably installing the slot plate 31 on top of the pad plate 2. Place the power module components inside the placement plate 32, and control the placement plate 32 to slide on the inner wall of the slot plate 31 until the placement plate 32 is moved below the glue applicator nozzle of the glue applicator body 1. Use the inner wall of the limiting plate 7 to slide against the outer wall of the placement plate 32, so that the locking block 8 fixed at the bottom of the limiting plate 7 is inserted into the slot 9, thereby stably installing the placement plate 32 on the inner wall of the slot plate 31. Control the glue applicator body 1 to supply power to the placement plate 32. The module components are coated with glue. The power switch of the external control fan 42 is turned on, so that the fan 42 blows air into the air duct 43, thereby accelerating the cooling efficiency of the power module components inside the placement plate 32. After processing, the placement plate 32 is controlled to slide on the inner wall of the slot plate 31 until the free placement plate 32 is moved to the bottom of the glue application port of the glue coating machine body 1. The connecting plate 35 drives the rotating shaft 34 to rotate on the inner wall of the slot plate 31. External force is applied to the fixing plate 38, so that the push rod 37 is sleeved on the inner wall of the perforated plate 36, thereby driving the placement plate 32 to separate from the sliding column 33, thus quickly removing the placement plate 32 from the inner wall of the slot plate 31.

[0033] Finally, it should be noted that in the description of this utility model, the terms "vertical," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0034] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0035] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A gluing device for processing power module components, comprising a gluing machine main body (1), the outer wall of the gluing machine main body (1) is fixed with a backing plate (2), characterized in that, The top end of the backing plate (2) is provided with a mounting mechanism (3), one side of the glue applying machine body (1) is provided with a cooling mechanism (4); The mounting mechanism (3) comprises: The groove plate (31) is arranged at the top end of the backing plate (2), the inner wall of the groove plate (31) is slidably provided with a plurality of placement plates (32), the outer wall of the plurality of placement plates (32) is slidably provided with a slide column (33), one side of the slide column (33) is fixed with the inner wall of the groove plate (31), the inner wall of the groove plate (31) is rotatably provided with a rotating shaft (34), the outer wall of the rotating shaft (34) is fixedly provided with a connecting plate (35).

2. The gluing device for processing power module components according to claim 1, characterized in that, The top end of the backing plate (2) is provided with a mounting mechanism (3), one side of the glue applying machine body (1) is provided with a cooling mechanism (4); 3. The gluing device for processing power module components according to claim 1, characterized in that, One side of the groove plate (31) is fixedly provided with a hole plate (36), the inner wall of the hole plate (36) is sleeved with a push rod (37), one side of the push rod (37) is fixedly provided with a fixed plate (38).

4. The gluing device for processing power module components according to claim 1, characterized in that, The outer wall of the plurality of placement plates (32) is slidably provided with two limiting plates (7), both of the two limiting plates (7) are arranged at the top end of the groove plate (31).

5. The gluing device for processing power module components according to claim 1, characterized in that, The cooling mechanism (4) comprises: One side of the base (41) is fixed with one side of the glue applying machine body (1), the top end of the base (41) is fixedly provided with a fan (42), one end of the fan (42) is provided with an air guide pipe (43), the outer wall of the air guide pipe (43) is fixedly provided with a support column (44), the bottom end of the support column (44) is fixed with the top end of the base (41).

6. The gluing device for processing power module components according to claim 4, characterized in that, The bottom end of the two limiting plates (7) is fixedly provided with two clamping blocks (8), the top end of the groove plate (31) is provided with four clamping grooves (9), the inner wall of the four clamping grooves (9) is matched with the outer wall of the clamping block (8).

7. The gluing device for processing power module components according to claim 6, characterized in that, The vertical sectional area size of the inner wall of the four clamping grooves (9) is matched with the vertical sectional area size of the outer wall of the clamping block (8).

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