Residual glue cleaning mechanism for semiconductor packaging

Abstract

The utility model discloses a residual glue cleaning mechanism for semiconductor packaging, which relates to the technical field of semiconductor residual glue cleaning and comprises a residual glue cleaning assembly. The residual glue cleaning assembly comprises a supporting frame; symmetrical circulating belts are arranged in the supporting frame. A plurality of placing plates are fixedly mounted on the circulating belt; a U-shaped box is fixedly mounted on the support frame; a hanging bracket is fixedly mounted in the U-shaped box; a plurality of nozzles are arranged at the bottom of the hanger; a dry ice crushing box and an air increasing pump are fixedly mounted at the top of the U-shaped box; the dry ice crushing box is connected with the spray head through a dry ice conveying pipe; an air pump is additionally arranged and hermetically connected with the dry ice conveying pipe through an air pipe; a semiconductor is transferred into the residual glue cleaning assembly through the first transferring assembly, the interior of a dry ice conveying pipe is pressurized by additionally arranging an air pump and an air pipe, dry ice crushed into particles acts on residual glue through a spray head, certain momentum and impact force are generated in the spraying process, the residual glue is mechanically impacted, and the residual glue cleaning efficiency is improved. And the embrittled residual glue layer is gradually broken and falls off.

Description

Technical Field

[0001] This utility model specifically relates to the field of semiconductor excess adhesive cleaning technology, and more specifically to an excess adhesive cleaning mechanism for semiconductor packaging. Background Technology

[0002] Semiconductor packaging is a crucial process for connecting semiconductor chips to external circuits and providing physical protection and mechanical support. During packaging, steps such as molding and potting involve the use of large amounts of adhesive to secure and insulate the chip from the package. However, this adhesive can easily overflow, forming excess adhesive. This excess adhesive can cover chip pins, solder joints, and other areas, leading to poor electrical connections, increased instability in parameters such as resistance and capacitance, and affecting signal transmission and overall performance of the semiconductor device. Excess adhesive can also make the package surface uneven and rough, affecting the product's appearance. For some semiconductor packaging products with extremely high dimensional accuracy requirements, excess adhesive can even cause the package dimensions to exceed tolerances, affecting its assembly with other components.

[0003] Existing methods for cleaning residual adhesive on semiconductors typically involve manual cleaning, which is inefficient. For semiconductor devices with small package sizes and complex structures, manual cleaning struggles to guarantee accuracy and consistency, easily causing chip damage. It also involves high labor intensity and costs. Simple mechanical cleaning, using scrapers and other simple tools, can remove residual adhesive to some extent, but it's difficult to clean corners and crevices thoroughly, and it can also cause mechanical damage to the semiconductor package, leading to chip breakage, pin deformation, and other problems. Alternatively, chemical solvent cleaning may corrode semiconductor materials and package structures, affecting product performance and quality. Furthermore, the use of chemical solvents poses environmental pollution and safety hazards, requiring specialized treatment and protection.

[0004] A search revealed Chinese Patent Publication No. CN202222154011.8, which discloses a residual adhesive cleaning device for solar photovoltaic panel production. The device includes a support mechanism and a limiting mechanism for positioning the solar photovoltaic panel, with the limiting mechanism fixed above the support mechanism. This invention, through its cleaning mechanism, begins by retracting an electric push rod, which lowers the scraper to contact the photovoltaic panel surface. This activates a first motor, which drives a lead screw to rotate forward. The lead screw rotation moves a movable seat, which in turn moves the scraper. The scraper performs initial cleaning of the adhesive on the photovoltaic panel surface. After the scraper reaches the appropriate position, the first motor stops, the electric push rod extends, and the scraper rises. A second motor rotates the scraper 180 degrees, and the electric push rod retracts, bringing the scraper into contact with the photovoltaic panel surface. The first motor then reverses the lead screw, and the scraper continues cleaning the photovoltaic panel surface, thus performing a secondary cleaning.

[0005] The aforementioned patent's cleaning device, in its process of removing residual adhesive, uses a first motor to drive a lead screw to rotate forward, which in turn moves a movable seat, which in turn moves a scraper. The scraper performs initial cleaning of the adhesive on the photovoltaic panel surface. A second motor then rotates the scraper 180°, moving the movable seat in the opposite direction. However, this method, during residual adhesive removal, can cause scratches on the semiconductor surface, compromising semiconductor quality. Furthermore, during scraping, the leads on the semiconductor may interfere with the scraper, further compromising the quality of the scraping process. Utility Model Content

[0006] The purpose of this invention is to provide a residual adhesive removal mechanism for semiconductor packaging. In this device, the semiconductor requiring residual adhesive removal is transferred to the residual adhesive removal component via a first transfer component. The placement board is transported via a circulating belt. During the transfer of the placement board, a pressurization is achieved by adding an air pump and air pipe to the dry ice transfer pipe, so that the dry ice, broken into particles, acts on the residual adhesive through a nozzle. When the dry ice comes into contact with the residual adhesive, it rapidly absorbs the heat from the surface of the residual adhesive, causing the temperature of the residual adhesive to drop sharply. Most adhesives will become brittle at low temperatures, and their molecular structure will become loose, reducing their flexibility and viscosity. During the dry ice spraying process, the dry ice particles are sprayed at high speed onto the surface of the residual adhesive, possessing a certain momentum and impact force. When these high-speed moving dry ice particles impact the surface of the residual adhesive, they produce an effect similar to sandblasting, mechanically impacting the residual adhesive and causing the brittle residual adhesive layer to gradually break and fall off, thereby solving the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A residual adhesive cleaning mechanism for semiconductor packaging includes a residual adhesive cleaning assembly; the residual adhesive cleaning assembly includes a support frame; the support frame has symmetrically arranged circulating belts inside; multiple placement plates are fixedly installed on the two circulating belts; the placement plates have grooves; a U-shaped box is fixedly installed on the support frame; a hanger is fixedly installed inside the U-shaped box; and multiple nozzles are provided at the bottom of the hanger.

[0009] The top of the U-shaped box is fixedly equipped with a dry ice crushing box and an additional air pump; wherein; the dry ice crushing box is connected to the nozzle through a dry ice transmission pipe; the additional air pump is sealed to the dry ice transmission pipe through an air pipe; by adding an air pump and an air pipe, the dry ice inside the dry ice crushing box is crushed into particles and then applied to the residual adhesive on the semiconductor surface through the nozzle, thereby changing the structure of the residual adhesive. During high-speed spraying, the impact force separates the residual adhesive from the semiconductor.

[0010] As a further technical solution of this utility model, a horizontal plate is fixedly provided at one end of the U-shaped box; multiple fans are fixedly installed on the horizontal plate; after the residual adhesive is cleaned, the fans blow air onto the surface of the semiconductor to achieve complete separation of the cleaned residual adhesive from the semiconductor and avoid secondary adhesion.

[0011] As a further technical solution of this utility model, a first transfer component is provided at one end of the residual adhesive cleaning component; the first transfer component is arranged perpendicularly to the support frame; the first transfer component includes a support frame; a first rodless cylinder is fixedly installed on the top of the support frame; an electric push cylinder is fitted on the first rodless cylinder; a transfer plate is fixedly installed at the bottom of the electric push cylinder; symmetrical adjustment grooves are opened on the four corners of the transfer plate; a sliding rod is detachably installed in the adjustment groove; a suction cup is fixedly installed at the bottom of the sliding rod; a spring is sleeved on the sliding rod between the suction cup and the bottom of the transfer plate; in this way, when the suction cup adsorbs the semiconductor, the sliding rod is automatically adjusted by the spring to avoid squeezing the semiconductor during adsorption, thus affecting the quality of the semiconductor;

[0012] As a further technical solution of this utility model, a transmission component is provided at the end of the residual adhesive cleaning component away from the first transfer component; the transmission component includes a fixed frame; the fixed frame is provided with symmetrical chains; a transmission plate is fixedly installed on the two chains; the two ends of the chains are installed with a transmission roller through a sprocket; one end of the transmission roller is fixedly installed with a stepper motor.

[0013] As a further technical solution of this utility model, a second transfer assembly is provided on one side of the fixed frame; the second transfer assembly includes a vertical frame; a second rodless cylinder is fixedly installed on the vertical frame; a second electric push cylinder is fitted on the second rodless cylinder; a second transfer plate is fixedly installed at the bottom of the second electric push cylinder; the second transfer plate has the same structure as the first transfer plate; the second transfer assembly is located between the residual adhesive cleaning assembly and the transmission assembly.

[0014] As a further technical solution of this utility model, a transmission frame is provided on the side of the second transfer component away from the transmission component, and a transmission belt is provided inside the transmission frame; baffles are provided at equal intervals on the transmission belt; a control box is provided on the side of the first transfer component away from the transmission belt and the residual adhesive cleaning component.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] In this utility model, the semiconductor that needs to be de-adhesive removed is transported by a conveyor belt. When the conveyor belt transports the semiconductor to one end near the first transfer component, the first rodless cylinder installed on the support frame drives the electric push cylinder to move left and right. When the electric push cylinder moves onto the conveyor belt, it drives the first transfer plate to move downward, so that the suction cup at the bottom of the first transfer plate can adsorb the semiconductor. Then, the first rodless cylinder moves the electric push cylinder to the top of the support frame, and places the semiconductor adsorbed by the suction cup into the sink groove opened on the placement plate.

[0017] This invention uses a circulating belt to transport the placement plate, thereby transferring the semiconductor into the U-shaped box. At this time, by adding an air pump and air pipe to increase the air pressure to the dry ice transfer pipe, the dry ice crushed into particles in the dry ice crushing box is transferred to the nozzle through negative pressure. The nozzle sprays the dry ice onto the residual adhesive at high speed, causing the structure of the residual adhesive to change. During the spraying process, the impact force separates the residual adhesive from the semiconductor, thereby ensuring the quality of residual adhesive cleaning.

[0018] In this invention, after the residual adhesive is cleaned and separated, in order to prevent the residual adhesive from remaining on the semiconductor, multiple fans installed on the horizontal plate blow air onto the surface of the semiconductor to ensure that the cleaned residual adhesive is completely separated from the semiconductor. The circulating belt drives the placement plate to continue to be transported forward. When it is transported to one end near the transfer component, the cleaned semiconductor is transferred to the transfer plate by the second transfer component. The working principle of the second transfer component is the same as that of the first transfer component. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0020] Figure 2 This utility model Figure 1 Another perspective structural diagram.

[0021] Figure 3 This utility model Figure 2 A schematic diagram of the rear structure.

[0022] Figure 4 This utility model Figure 3 Another perspective structural diagram.

[0023] Figure 5 This utility model Figure 4 Bottom view of the structure of each component.

[0024] Figure 6 This utility model Figure 5 Another perspective on the breakdown diagram.

[0025] Figure 7 This utility model Figure 6Schematic diagram of the internal structure of the U-shaped box.

[0026] Figure 8 This utility model Figure 4 Enlarged view of the local structure at point A in the middle.

[0027] Figure 9 This utility model Figure 6 Enlarged view of the local structure at point B in the middle.

[0028] In the diagram: 1-Control box, 2-Conveyor belt, 3-First transfer assembly, 30-Support frame, 31-Electric pusher cylinder, 32-First transfer plate, 33-First rodless cylinder, 34-Suction cup, 35-Spring, 36-Adjustment groove, 37-Slide rod, 4-Residual adhesive cleaning assembly, 40-Support frame, 41-U-shaped box, 42-Dry ice crushing box, 43-Addition air pump, 44-Circulation belt, 45-Placement plate, 46-Settling trough, 47-Hanger, 48-Nozzle, 49-Fan, 410-Air pipe, 411-Dry ice transfer pipe, 412-Horizontal plate, 5-Transfer assembly, 50-Fixing frame, 51-Transfer plate, 52-Chain, 53-Stepper motor, 6-Second transfer assembly, 60-Upright frame, 61-Second rodless cylinder, 62-Second electric pusher cylinder, 63-Second transfer plate, 7-Baffle bar. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figure 1-9 In this embodiment of the present invention, a residual adhesive cleaning mechanism for semiconductor packaging includes a residual adhesive cleaning component 4; the residual adhesive cleaning component 4 includes a support frame 40; the support frame 40 has symmetrically arranged circulating belts 44 inside; multiple placement plates 45 are fixedly installed on the two circulating belts 44; the placement plates 45 have grooves 46 formed on them; a U-shaped box 41 is fixedly installed on the support frame 40; a hanger 47 is fixedly installed inside the U-shaped box 41; and multiple nozzles 48 are provided at the bottom of the hanger 47.

[0031] The top of the U-shaped box 41 is fixedly equipped with a dry ice crushing box 42 and an air pump 43; wherein, the dry ice crushing box 42 is connected to the nozzle 48 through a dry ice transmission pipe 411; and the air pump 43 is sealed to the dry ice transmission pipe 411 through an air pipe 410.

[0032] A horizontal plate 412 is fixedly installed at one end of the U-shaped box 41; multiple fans 49 are fixedly installed on the horizontal plate 412.

[0033] By adopting the above technical solution, during use, the semiconductor that needs to be de-adhesive removed is transported through the conveyor belt 2. When the conveyor belt 2 transports the semiconductor to one end near the first transfer component 3, the first rodless cylinder 33 installed on the support frame 30 drives the electric push cylinder 31 to move left and right. When the electric push cylinder 31 moves onto the conveyor belt 2, the electric push cylinder 31 drives the first transfer plate 32 to move downward, so that the suction cup 34 at the bottom of the first transfer plate 32 can adsorb the semiconductor. Then, the first rodless cylinder 33 moves the electric push cylinder 31 to the top of the support frame 40, and places the semiconductor adsorbed by the suction cup 34 into the sink 46 opened on the placement plate 45.

[0034] In this embodiment, a first transfer component 3 is provided at one end of the residual adhesive cleaning component 4; the first transfer component 3 is arranged perpendicularly to the support frame 40; the first transfer component 3 includes a support frame 30; a first rodless cylinder 33 is fixedly installed on the top of the support frame 30; an electric push cylinder 31 is fitted on the first rodless cylinder 33; a transfer plate 32 is fixedly installed at the bottom of the electric push cylinder 31; symmetrical adjustment grooves 36 are opened on the four corners of the transfer plate 32; a sliding rod 37 is detachably installed in the adjustment groove 36; a suction cup 34 is fixedly installed at the bottom of the sliding rod 37; a spring 35 is sleeved on the sliding rod 37 between the suction cup 34 and the bottom of the transfer plate 32.

[0035] In this embodiment, a transmission component 5 is provided at the end of the residual adhesive cleaning component 4 away from the first transfer component 3; the transmission component 5 includes a fixing frame 50; the fixing frame 50 is provided with symmetrical chains 52 inside; a transmission plate 51 is fixedly installed on the two chains 52; the two ends of the chains 52 are installed with a drive roller through a sprocket; one end of the drive roller is fixedly installed with a stepper motor 53.

[0036] By adopting the above technical solution, the semiconductor is transferred into the U-shaped box 41 by the transmission of the placement plate 45 driven by the circulation belt 44. At this time, the air pressure is increased to the dry ice transfer pipe 411 by increasing the air pump 43 and the air pipe 410. The dry ice crushed into particles in the dry ice crushing box 42 is transferred to the nozzle 48 by negative pressure. The nozzle 48 sprays the residual glue at high speed, causing the structure of the residual glue to change. During the spraying process, the impact force achieves the separation between the residual glue and the semiconductor, thereby ensuring the quality of residual glue cleaning.

[0037] Furthermore, a second transfer assembly 6 is provided on one side of the fixed frame 50; the second transfer assembly 6 includes a stand 60; a second rodless cylinder 61 is fixedly installed on the stand 60; a second electric push cylinder 62 is installed on the second rodless cylinder 61; a second transfer plate 63 is fixedly installed at the bottom of the second electric push cylinder 62; the second transfer plate 63 has the same structure as the first transfer plate 32.

[0038] In this embodiment, a transmission frame is provided on the side of the second transfer component 6 away from the transmission component 5, and a transmission belt 2 is provided inside the transmission frame; baffles 7 are provided at equal intervals on the transmission belt 2; a control box 1 is provided on the side of the first transfer component 3 away from the transmission belt 2 and the residual glue cleaning component 4.

[0039] By adopting the above technical solution, after the residual adhesive is cleaned and separated, in order to prevent the residual adhesive from remaining on the semiconductor, multiple fans 49 installed on the horizontal plate 412 blow air onto the surface of the semiconductor to ensure that the cleaned residual adhesive is completely separated from the semiconductor. The circulation belt 44 drives the placement plate 45 to continue to be transported forward. When it is transported to one end near the transfer component 5, the cleaned semiconductor is transferred to the transfer plate 51 by the second transfer component 6. The working principle of the second transfer component 6 is the same as that of the first transfer component 3.

[0040] The working principle of this utility model is as follows: When in use, the semiconductor that needs to be de-adhesive removed is transported through the conveyor belt 2. When the conveyor belt 2 transports the semiconductor to one end near the first transfer component 3, the first rodless cylinder 33 installed on the support frame 30 drives the electric push cylinder 31 to move left and right. When the electric push cylinder 31 moves onto the conveyor belt 2, the electric push cylinder 31 drives the first transfer plate 32 to move downward, so that the suction cup 34 at the bottom of the first transfer plate 32 can adsorb the semiconductor. Then, the first rodless cylinder 33 moves the electric push cylinder 31 to the top of the support frame 40, and places the semiconductor adsorbed by the suction cup 34 into the sink 46 opened on the placement plate 45.

[0041] The semiconductor is transferred into the U-shaped box 41 by the conveyor belt 44 driving the placement plate 45. At this time, the air pressure is increased to the dry ice transfer pipe 411 by the air pump 43 and the air pipe 410. The dry ice crushed into particles in the dry ice crushing box 42 is transferred to the nozzle 48 by the negative pressure. The nozzle 48 sprays the residual glue at high speed, which changes the structure of the residual glue. During the spraying process, the impact force separates the residual glue from the semiconductor, thereby ensuring the quality of residual glue cleaning.

[0042] After the residual adhesive is cleaned and separated, in order to prevent the residual adhesive from remaining on the semiconductor, multiple fans 49 installed on the horizontal plate 412 blow air onto the surface of the semiconductor to ensure that the cleaned residual adhesive is completely separated from the semiconductor. The circulation belt 44 drives the placement plate 45 to continue to be transported forward. When it is transported to one end near the transfer component 5, the cleaned semiconductor is transferred to the transfer plate 51 by the second transfer component 6. The working principle of the second transfer component 6 is the same as that of the first transfer component 3.

[0043] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0044] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor package surplus adhesive cleaning mechanism comprising a surplus adhesive cleaning assembly (4); characterized by: The excess glue cleaning assembly (4) is provided with a support frame (40), the inside of the support frame (40) is provided with symmetrical circulating belts (44), a plurality of placing plates (45) are fixedly installed on the two circulating belts (44), the placing plates (45) are provided with sink grooves (46), the support frame (40) is fixedly installed with a U-shaped box (41), the U-shaped box (41) is fixedly installed with a hanging bracket (47), and the bottom of the hanging bracket (47) is provided with a plurality of spray heads (48). The U-shaped box (41) is fixedly installed with a dry ice crushing box (42) and an air pump (43) at the top, the dry ice crushing box (42) is connected with the spray head (48) through a dry ice conveying pipe (411), and the air pump (43) is in sealed connection with the dry ice conveying pipe (411) through an air pipe (410).

2. The excess adhesive cleaning mechanism for a semiconductor package according to claim 1, wherein: One end of the U-shaped box (41) is fixedly provided with a horizontal plate (412), and a plurality of fans (49) are fixedly installed on the horizontal plate (412).

3. The excess adhesive cleaning mechanism for a semiconductor package according to claim 1, wherein: One end of the excess glue cleaning assembly (4) is provided with a first transfer assembly (3), the first transfer assembly (3) is vertically arranged with the support frame (40), the first transfer assembly (3) comprises a support frame (30), the top of the support frame (30) is fixedly installed with a first rodless air cylinder (33), the first rodless air cylinder (33) is matchedly installed with an electric push cylinder (31), the bottom of the electric push cylinder (31) is fixedly installed with a transfer plate (32), the four corners of the transfer plate (32) are provided with symmetrical adjusting grooves (36), the adjusting grooves (36) are detachably installed with slide rods (37), the bottom of the slide rod (37) is fixedly installed with a suction disc (34), and the slide rod (37) between the suction disc (34) and the bottom of the transfer plate (32) is sleeved with a spring (35).

4. The excess adhesive cleaning mechanism for a semiconductor package according to claim 3, wherein: The end, away from the first transfer assembly (3), of the excess glue cleaning assembly (4) is provided with a conveying assembly (5), the conveying assembly (5) comprises a fixed frame (50), the inside of the fixed frame (50) is provided with symmetrical chains (52), and a conveying plate (51) is fixedly installed on the two chains (52); the two ends of the chain (52) are matchedly installed with a transmission roller through a sprocket, and one end of the transmission roller is fixedly installed with a stepping motor (53).

5. The excess adhesive cleaning mechanism for a semiconductor package according to claim 4, wherein: One side of the fixed frame (50) is provided with a second transfer assembly (6), the second transfer assembly (6) comprises an upright frame (60), the upright frame (60) is fixedly installed with a second rodless air cylinder (61), the second rodless air cylinder (61) is matchedly installed with a second electric push cylinder (62), the bottom of the second electric push cylinder (62) is fixedly installed with a second transfer plate (63), and the second transfer plate (63) is provided with the same structure as the first transfer plate (32).

6. The excess adhesive cleaning mechanism for a semiconductor package according to claim 5, wherein: The side, away from the conveying assembly (5), of the second transfer assembly (6) is provided with a conveying frame, the inside of the conveying frame is provided with a conveying belt (2), and the conveying belt (2) is provided with barrier strips (7) at equal intervals.

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