Mold cleaning equipment with chip removal function
By incorporating a suction port and a vacuum chip conveyor into the mold cleaning equipment, along with a guide plate and drainage pipeline, the problem of debris and cleaning fluid splashing during mold cleaning is solved, achieving efficient debris collection and improved mold stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-19
- Publication Date
- 2026-03-17
AI Technical Summary
In existing mold cleaning devices, debris and cleaning fluid move haphazardly along the mold surface during the cleaning process, resulting in a decrease in the overall cleanliness of the production site.
Design a mold cleaning device with chip removal function. The device uses suction ports symmetrically set on both sides of the mold placement position, connected to a vacuum chip remover. It uses negative pressure to suck up debris and cleaning fluid, and collects the cleaning fluid through a guide plate and drainage pipe. Combined with a clamping mechanism, it improves the stability of the mold.
It effectively reduces the splashing of debris and cleaning fluid during mold cleaning, improves the cleanliness of the production site and the stability of the mold, and increases cleaning efficiency.
Smart Images
Figure CN223998067U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of mold processing, and in particular to a mold cleaning device with chip removal function. Background Technology
[0002] In the process of mass production of molds, grinding and finishing are key steps to ensure the precision, surface finish and functionality of the molds. By removing burrs, adjusting dimensional deviations and repairing minor defects, we can improve the molding quality and service life of the molds, ensure the dimensional consistency and surface finish of the products produced in batches, reduce demolding resistance, optimize product appearance, and ultimately improve production efficiency and finished product qualification rate.
[0003] A mold cleaning device is provided, including a frame and a six-axis robotic arm mounted on the frame. The tool end of the six-axis robotic arm is equipped with a cleaning mechanism, which includes a grinding component, a cleaning agent spraying component, and an air blowing component. The grinding component is controlled by the controller of the cleaning device to grind the mold located on the frame, the cleaning agent spraying component sprays cleaning liquid onto the mold surface, and the air blowing component blows out the debris or cleaning liquid generated after grinding, thereby achieving the purpose of efficient grinding of the mold.
[0004] However, in actual application, during the process of cleaning the mold by blowing the air assembly, the cleaning fluid and / or debris on the mold surface are impacted by the compressed air and move disorderly along the frame, which greatly reduces the overall cleanliness of the production site and there is room for improvement. Utility Model Content
[0005] To facilitate the collection of debris generated during mold cleaning, this application provides a mold cleaning device with a debris removal function.
[0006] The mold cleaning equipment with chip removal function provided in this application adopts the following technical solution:
[0007] A mold cleaning device with chip removal function includes a frame and a mold cleaning device mounted on the frame. The mold cleaning device is used to grind the molds on the frame. The frame has a mold placement position for placing the mold to be processed. Suction ports are symmetrically arranged on both sides of the mold placement position along the width direction. The suction ports are inclined along the frame to the center line of the mold placement position along the width direction. The suction ports are connected to a vacuum chip conveyor mounted on the frame. The frame located at the mold placement position has a clamping mechanism and a drain pipe. The clamping mechanism is used to clamp the mold placed on the mold placement position, and the drain pipe is used to discharge a portion of the cleaning liquid accumulated on the mold placement position.
[0008] By adopting the above technical solution, the mold is polished using a mold cleaning device. During the polishing process, suction ports are symmetrically arranged on both sides of the mold placement position along the width direction, and these ports are connected to a vacuum chip conveyor. When the vacuum chip conveyor is working, a negative pressure is formed at the suction ports. The debris generated during the mold cleaning process, along with some of the cleaning liquid sprayed by the cleaning agent spraying component of the mold cleaning device, are sucked into the vacuum chip conveyor due to the negative pressure. At the same time, because a drain pipe is installed on the frame located at the mold placement position, the cleaning liquid or cleaning liquid mixed with oil debris will flow out along the drain pipe. Through the above process, the amount of debris or cleaning liquid splashed onto the production site during the mold polishing process is greatly reduced, which plays a positive guiding role in improving the convenience of collecting debris generated during the mold cleaning process.
[0009] Preferably, the suction port is provided with a guide plate, and when the mold is placed on the mold placement position, the height of the guide plate is higher than the surface of the mold.
[0010] By adopting the above technical solution, since the height of the guide plate is higher than the mold surface, it blocks the debris and cleaning fluid generated during the mold processing from splashing along the frame. Through the guiding effect of the guide plate, the suction efficiency of the suction port is improved.
[0011] Preferably, a flow channel is provided on the frame located at the mold placement position, the flow channel being used for the discharge of cleaning liquid and / or cleaning debris along the flow channel.
[0012] By adopting the above technical solution, the flow channel helps to improve the efficiency of discharge of debris and / or cleaning fluid on the frame located at the mold placement position along the mold placement position, and reduces the amount of cleaning fluid and / or debris accumulating at the mold placement position.
[0013] Preferably, a support seat is provided on the mold placement position, the support seat is used to support the mold, and when the mold is placed on the mold placement position, the mold abuts against the surface of the support seat.
[0014] By adopting the above technical solution, when the mold is placed on the mold placement position, the mold abuts against the surface of the support seat, which plays a supporting role for the mold. This helps to reduce the mechanical vibration generated by the mold cleaning device during the mold processing process, reduce the vibration marks caused by mechanical vibration during the mold processing equipment, and improve the surface finish of the processed mold.
[0015] Preferably, the clamping mechanism includes a first clamping component and a second clamping component. The first clamping component is disposed on the frame along the length direction of the mold placement position, and the second clamping component is disposed on the frame along the width direction of the mold placement position. The first clamping component is used to clamp one side of the mold along the length direction, and the second clamping component is used to clamp one side of the mold along the width direction.
[0016] By adopting the above technical solution, the mold placed on the mold placement position is clamped through the cooperation of the first clamping assembly and the second clamping assembly, thereby improving the stability of the mold placed on the mold placement position and reducing the displacement caused by vibration during the mold processing equipment's processing of the mold.
[0017] Preferably, the first clamping assembly includes a first driving cylinder and a locking arm. The base of the first driving cylinder is hinged to the frame. The locking arm includes a connecting part and a locking head. The connecting part and the locking head are integrally formed. The piston rod of the first driving cylinder is hinged to the end of the connecting part away from the locking head. The midpoint of the connecting part is hinged to the frame. When the piston rod of the first driving cylinder moves, the piston rod of the first driving cylinder drives the connecting part to carry the locking head to rotate along the hinge point between the connecting part and the frame until the locking head abuts against the mold.
[0018] By adopting the above technical solution, since the base of the first driving cylinder is hinged to the frame and the piston rod of the first driving cylinder is hinged to the connecting part, when the piston rod of the first driving cylinder moves, the piston rod of the first driving cylinder drives the connecting part to rotate along the hinge point between the connecting part and the frame, thereby adapting to the clamping requirements of molds of different widths and having high practicality.
[0019] Preferably, the suction port has a clearance groove on the side facing the locking head, and the locking head is located in the clearance groove.
[0020] By adopting the above technical solution, the movement of the locking head is avoided by the clearance groove, which reduces the probability that the locking head cannot rotate smoothly along the frame due to mechanical interference between the locking head and the suction port during operation.
[0021] Preferably, the second clamping assembly includes a second driving cylinder and a clamping plate. The second driving cylinder is disposed on the frame, and the piston rod of the second driving cylinder faces the mold. The clamping plate is fixedly connected to the piston rod of the second driving cylinder. The clamping plate is provided with a slot that matches the contour of the corner of the mold, and the slot engages with the corner of the mold.
[0022] By adopting the above technical solution, since the clamping plate has a slot that matches the contour of the mold corner, the slot can engage with the mold corner when the clamping plate abuts against the mold, thus demonstrating the purpose of clamping the mold on one side along the width direction, and further improving the stability of the mold when placed in the mold placement position.
[0023] In summary, this application includes at least one of the following beneficial technical effects:
[0024] 1. Because suction ports are symmetrically arranged on both sides of the mold placement position along the width direction, and the suction ports are connected to a vacuum chip conveyor, a negative pressure is formed at the suction port when the vacuum chip conveyor is working. The debris generated during the mold cleaning process by the mold cleaning device, and some of the cleaning liquid sprayed by the cleaning agent spraying component of the mold cleaning device, are sucked into the vacuum chip conveyor under the influence of the negative pressure. At the same time, because a drain pipe is set on the frame located at the mold placement position, the cleaning liquid or cleaning liquid mixed with oil debris will flow out along the drain pipe, which plays a positive guiding role in improving the convenience of collecting debris generated during the mold cleaning process.
[0025] 2. The flow channel helps to improve the efficiency of the discharge of debris and / or cleaning fluid on the frame located at the mold placement position along the mold placement position, and reduces the amount of cleaning fluid and / or debris accumulating at the mold placement position;
[0026] 3. By cooperating with the first clamping assembly and the second clamping component, the mold placed on the mold placement position is clamped, thereby improving the stability of the mold placed on the mold placement position and reducing the displacement caused by vibration during the mold processing equipment's processing of the mold. Attached Figure Description
[0027] Figure 1 This is a schematic diagram of the overall structure of a mold cleaning device with chip removal function according to an embodiment of this application.
[0028] Figure 2 yes Figure 1 An enlarged structural diagram of part A in a mold cleaning device with chip removal function.
[0029] Figure 3 This is a schematic diagram of the structure of the first clamping component in a mold cleaning device with chip removal function according to an embodiment of this application.
[0030] Explanation of reference numerals in the attached drawings: 1. Frame; 2. Mold cleaning device; 3. Mold placement position; 4. Suction port; 41. Guide plate; 42. Clearance groove; 5. Vacuum chip conveyor; 6. Clamping mechanism; 61. First clamping assembly; 611. First drive cylinder; 612. Locking arm; 6121. Connecting part; 6122. Locking head; 62. Second clamping assembly; 621. Second drive cylinder; 622. Clamping plate; 7. Drainage pipe; 8. Flow groove; 9. Bearing seat; 10. Mounting seat; 101. Limiting groove; 11. Rotating shaft. Detailed Implementation
[0031] First, it should be noted that the vacuum chip conveyor 5 mainly consists of a vacuum generator, separator, filter, conveying pipeline, chip collection box, and electrical control system. Its working principle is to use the vacuum generator to create negative pressure, drawing the mixture of metal chips, coolant, and other materials generated during processing into the equipment through the pipeline. As this is an existing chip conveying device, its specific components and working principle will not be elaborated upon here.
[0032] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail.
[0033] This application discloses a mold cleaning device with a chip removal function. (Refer to...) Figure 1 and Figure 2 A mold cleaning device with chip removal function includes a frame 1 and a mold cleaning device 2 set on the frame 1. The mold cleaning device 2 is used to grind the mold on the frame 1. The frame 1 is provided with a mold placement position 3 for placing the mold to be processed. Suction ports 4 are symmetrically arranged on both sides of the mold placement position 3 along the width direction. The suction ports 4 are inclined along the frame 1 to the center line of the mold placement position 3 along the width direction. The suction ports 4 are connected to a vacuum chip remover 5. The vacuum chip remover 5 is set on the frame 1. The frame 1 located at the mold placement position 3 is provided with a clamping mechanism 6 and a drain pipe 7. The clamping mechanism 6 is used to clamp the mold placed on the placement position. The drain pipe 7 is used to discharge part of the cleaning liquid accumulated on the mold placement position 3.
[0034] First, it should be noted that the mold cleaning device 2 is a mechanical component used for grinding and cleaning the mold. Its specific composition and working principle will not be elaborated here.
[0035] Specifically, a guide plate 41 is provided on the suction port 4. When the mold is placed on the mold placement position 3, the height of the guide plate 41 is higher than the surface of the mold. The guide plate 41 and the suction port 4 are integrally formed by welding. Because the height of the guide plate 41 is higher than the surface of the mold, some of the debris and cleaning fluid generated during the mold processing are limited in the direction of splashing along the frame 1. Through the guiding effect of the guide plate 41, the suction efficiency of the suction port 4 is improved.
[0036] Four sets of drainage pipes 7 are arranged in a rectangular array on the frame 1 located at the mold placement position 3. The drainage pipes 7 receive a collection container (e.g., a box or tank). Some debris and / or cleaning fluid located at the mold placement position 3 will flow into the collection container through the drainage pipes 7.
[0037] Furthermore, a flow channel 8 is provided on the frame 1 located at the mold placement position 3. The flow channel 8 is used for the discharge of cleaning fluid and / or cleaning debris along the flow channel 8. The flow channel 8 is located on both sides of the frame 1 along the width direction of the mold placement position 3. The flow channel 8 helps to improve the efficiency of the discharge of debris and / or cleaning fluid on the frame 1 located at the mold placement position 3 along the mold placement position 3, and reduces the amount of cleaning fluid and / or debris accumulating at the mold placement position 3.
[0038] Meanwhile, a support seat 9 is provided on the mold placement position 3. The support seat 9 is used to support the mold. When the mold is placed on the mold placement position 3, the mold abuts against the surface of the support seat 9. The support seat 9 is formed by protruding along the frame 1 from the geometric center of the mold placement position 3. When the mold is placed on the mold placement position 3, the surface of the mold facing the flow channel can abut against the support seat 9.
[0039] Its function is that when the mold is placed on the mold placement position 3, the mold abuts against the surface of the bearing seat 9, which supports the mold and helps to reduce the mechanical vibration generated by the mold cleaning device 2 during the mold processing process. It also reduces the vibration marks caused by mechanical vibration during the mold processing equipment, which helps to improve the surface finish of the processed mold.
[0040] Reference Figures 1-3 The clamping mechanism 6 includes a first clamping component 61 and a second clamping component 62. The first clamping component 61 is disposed on the frame 1 along the length direction of the mold placement position 3, and the second clamping component 62 is disposed on the frame 1 along the width direction of the mold placement position 3. The first clamping component 61 is used to clamp one side of the mold along the length direction, and the second clamping component 62 is used to clamp one side of the mold along the width direction.
[0041] Specifically, the first clamping assembly 61 includes a first driving cylinder 611 and a locking arm 612. The base of the first driving cylinder 611 is hinged to the frame 1. The locking arm 612 includes a connecting part 6121 and a locking head 6122. The connecting part 6121 and the locking head 6122 are integrally formed. The piston rod of the first driving cylinder 611 is hinged to the end of the connecting part 6121 away from the locking head 6122. The midpoint of the connecting part 6121 is hinged to the frame 1. When the piston rod of the first driving cylinder 611 moves, the piston rod of the first driving cylinder 611 drives the connecting part 6121 to carry the locking head 6122 to rotate along the hinge point between the connecting part 6121 and the frame 1 until the locking head 6122 abuts against the mold.
[0042] In this embodiment, two sets of first clamping components 61 are provided. The two sets of first clamping components 61 are symmetrically arranged on the frame 1 along the center line of the length direction of the mold placement position 3. Since the components and installation methods of the two sets of first clamping components 61 are the same, for ease of explanation, one set of first clamping components 61 will be described in detail in this embodiment.
[0043] Correspondingly, a clearance groove 42 is provided on the side of the suction port 4 facing the locking head 6122. The locking head 6122 is located in the clearance groove 42. The clearance groove 42 is formed by a concave bending after suction. The width of the clearance groove 42 is greater than the width of the locking head 6122, so that the locking head 6122 can move smoothly along the clearance groove 42. By using the clearance groove 42 to avoid the movement of the locking head 6122, the probability of the locking head 6122 being unable to rotate smoothly along the frame 1 due to mechanical interference between the locking head 6122 and the suction port 4 during operation is reduced.
[0044] Correspondingly, a mounting base 10 is installed in the clearance groove 42. A limiting groove 101 is formed in the mounting base 10. The connecting part 6121 is located in the limiting groove 101. The width of the connecting part 6121 and the groove width tolerance of the limiting groove 101 are in clearance fit. A rotating hole is formed through the limiting groove 101 along the thickness direction. A rotating shaft 11 passes through the rotating hole. At the same time, a movable hole is also formed on the connecting part 6121. When the connecting part 6121 is located in the limiting groove 101, the rotating shaft 11 is simultaneously moved through the rotating hole and the movable hole, so that the connecting part 6121 can rotate along the mounting base 10 through the rotating shaft 11.
[0045] Therefore, since the base of the first drive cylinder 611 is hinged to the frame 1, and the piston rod of the first drive cylinder 611 is hinged to the connecting part 6121, when the piston rod of the first drive cylinder 611 moves, the piston rod of the first drive cylinder 611 drives the connecting part 6121 to carry the locking head 6122 to rotate along the connection between the connecting part 6121 and the rotating shaft 11, thereby adapting to the clamping requirements of molds of different widths and having high practicality.
[0046] Reference Figure 1 and Figure 2 The second clamping assembly 62 includes a second driving cylinder 621 and a clamping plate 622. The second driving cylinder 621 is mounted on the frame 1, and the piston rod of the second driving cylinder 621 faces the mold. The clamping plate 622 is fixedly connected to the piston rod of the second driving cylinder 621. The clamping plate 622 has a slot that matches the contour of the corner of the mold. The slot engages with the corner of the mold. Because the clamping plate 622 has a slot that matches the contour of the corner of the mold, when the clamping plate 622 abuts against the mold, the slot can engage with the corner of the mold, which shows the purpose of clamping the mold on one side along the width direction, further improving the stability of the mold placed in the mold placement position 3.
[0047] The implementation principle of a mold cleaning device with chip removal function in this application embodiment is as follows: The mold is polished by the mold cleaning device 2. When polishing the mold, suction ports 4 are symmetrically arranged on both sides of the mold placement position 3 along the width direction, and the suction ports 4 are connected to a vacuum chip remover 5. When the vacuum chip remover 5 is working, a negative pressure is formed at the suction ports 4. The debris generated by the mold cleaning device 2 during the mold processing, and part of the cleaning liquid sprayed by the cleaning agent spraying component of the mold cleaning device 2, are sucked into the vacuum chip remover 5 under the influence of the negative pressure. At the same time, since a drain pipe 7 is provided on the frame 1 located at the mold placement position 3, the cleaning liquid or cleaning liquid mixed with oil debris will flow out along the drain pipe 7. Through the above process, the amount of debris or cleaning liquid splashed to the production site during the mold polishing process is greatly reduced, which plays a positive guiding role in improving the convenience of collecting debris generated during the mold cleaning process.
[0048] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A mold cleaning device with chip removal function, comprising a frame (1) and a mold cleaning device (2) disposed on the frame (1), wherein the mold cleaning device (2) is used to grind the mold on the frame (1), characterized in that: The rack (1) is provided with a mold placing position (3) for placing a mold to be processed. Two suction ports (4) are symmetrically arranged on both sides of the mold placing position (3) along the width direction. The suction ports (4) are arranged obliquely along the center line of the rack (1) towards the mold placing position (3) along the width direction. The suction ports (4) are connected with a vacuum chip removal machine (5) arranged on the rack (1) at the mold placing position (3). A clamping mechanism (6) and a liquid discharge pipeline (7) are arranged on the rack (1) at the mold placing position (3). The clamping mechanism (6) is used for clamping the mold placed on the mold placing position (3). The liquid discharge pipeline (7) is used for discharging part of the cleaning liquid accumulated on the mold placing position (3).
2. The mold cleaning apparatus having a chip removal function according to claim 1, characterized in that: The suction port (4) is provided with a flow guide plate (41). When the mold is placed on the mold placing position (3), the height of the flow guide plate (41) is higher than the surface of the mold.
3. The die cleaning apparatus having a chip removal function according to claim 2, characterized in that: The rack (1) at the mold placing position (3) is provided with a flow-through groove (8) for discharging the cleaning liquid and / or the generated debris along the flow-through groove (8).
4. The die cleaning apparatus having a chip removal function according to claim 3, characterized in that: The mold placing position (3) is provided with a bearing seat (9) for bearing the mold. When the mold is placed on the mold placing position (3), the mold abuts against the surface of the bearing seat (9).
5. The die cleaning apparatus having a chip removal function according to claim 4, characterized in that: The clamping mechanism (6) includes a first clamping assembly (61) and a second clamping assembly (62). The first clamping assembly (61) is arranged on the rack (1) along the length direction of the mold placing position (3). The second clamping assembly (62) is arranged on the rack (1) along the width direction of the mold placing position (3). The first clamping assembly (61) is used for clamping one side of the mold along the length direction. The second clamping assembly (62) is used for clamping one side of the mold along the width direction.
6. The die cleaning apparatus having a chip removal function according to claim 5, characterized in that: The first clamping assembly (61) includes a first driving cylinder (611) and a locking arm (612). The base of the first driving cylinder (611) is hinged to the rack (1). The locking arm (612) includes a connecting portion (6121) and a locking head (6122). The connecting portion (6121) and the locking head (6122) are integrally formed. The piston rod of the first driving cylinder (611) is hinged to one end of the connecting portion (6121) away from the locking head (6122). The midpoint of the connecting portion (6121) is hinged to the rack (1). When the piston rod of the first driving cylinder (611) acts, the piston rod of the first driving cylinder (611) drives the connecting portion (6121) to carry the locking head (6122) to rotate along the hinged position of the connecting portion (6121) and the rack (1) until the locking head (6122) abuts against the mold.
7. The die cleaning apparatus having a chip removal function according to claim 6, characterized in that: The suction port (4) is provided with an avoiding groove (42) on the side facing the locking head (6122). The locking head (6122) is located in the avoiding groove (42).
8. The die cleaning apparatus having a chip removal function according to claim 7, characterized in that: The second clamping assembly (62) comprises a second driving cylinder (621) and a clamping plate (622), the second driving cylinder (621) is arranged on the frame (1), and the piston rod of the second driving cylinder (621) faces the mold, the clamping plate (622) is fixedly connected with the piston rod of the second driving cylinder (621), and a clamping groove matched with the contour of the corner of the mold is arranged on the clamping plate (622), and the clamping groove is clamped with the corner of the mold.