Chip appearance optical detection device

Abstract

The utility model discloses a chip appearance optical detection device which comprises a base, the outer wall of the top of the base is provided with a detection assembly for carrying out optical detection on a chip main body, the outer wall of the top of the base is fixedly provided with an accommodating seat, the inner wall of the accommodating seat is movably connected with a rotating ring, and the side wall of the rotating ring is fixedly provided with a gear ring; a support is fixed to the circumferential inner wall of the gear ring, two telescopic mechanisms are installed on the surface of the support, and a containing frame is fixed to the ends of the telescopic mechanisms. Through the arrangement of the rotating ring, the gear ring, the driving motor, the driving gear and the two groups of placing frames with the telescopic mechanisms, after the upper surface of the chip main body is detected, the two groups of placing frames are close to each other to wrap the chip main body by utilizing the telescopic mechanisms, and then the driving gear and the gear ring are driven by the driving motor, so that the rotating ring rotates; and finally, the return stroke of the telescopic mechanism is controlled, chip turning is completed, the lower surface of the chip can be conveniently detected, and the comprehensiveness and efficiency of detection are improved.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a chip appearance optical testing device. Background Technology

[0002] In the current booming semiconductor manufacturing industry, chips are the core components of various electronic devices, and their quality control is of paramount importance. The appearance quality of chips not only directly affects the performance and reliability of the chips themselves, but also the overall quality of electronic products that use the chips. Minor appearance defects, such as scratches, damage, or foreign matter, may cause the chips to experience performance instability, short circuits, or even damage during subsequent use.

[0003] Existing optical inspection devices for chip appearance still have shortcomings in practical applications. In the inspection process, some devices are cumbersome to inspect the upper and lower surfaces of the chip, requiring manual intervention to flip the chip. This not only reduces the inspection efficiency but also increases the impact of human factors on the inspection results, making it difficult to adapt to the pace of large-scale, high-efficiency production.

[0004] Therefore, developing an optical inspection device capable of efficiently and accurately flipping chips is of significant practical importance. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a chip appearance optical inspection device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] An optical inspection device for chip appearance includes a base, characterized in that an inspection component for optically inspecting the chip body is installed on the top outer wall of the base, a receiving seat is fixed on the top outer wall of the base, a rotating ring is movably connected to the inner wall of the receiving seat, a toothed ring is fixed on the side wall of the rotating ring, a bracket is fixed on the inner circumference of the toothed ring, two sets of telescopic mechanisms are installed on the surface of the bracket, a placement frame is fixed at the end of the telescopic mechanism, a support ring is welded to the inner wall of the placement frame, and the support ring is used to place the chip body.

[0008] As a further embodiment of this utility model: the telescopic mechanism includes a connecting rod and an electric telescopic rod, the electric telescopic rod is fixed to the outer wall of the bracket, and the connecting rod is fixed to the output end of the electric telescopic rod by a pin, and the connecting rod and the placement frame are fixedly connected.

[0009] As a further embodiment of this utility model: a vertical plate is fixed to the top outer wall of the base, and a drive motor is fixed to one side outer wall of the vertical plate, and the output end of the drive motor is connected to a drive gear that meshes with a gear ring through a coupling.

[0010] As a further embodiment of this utility model: the detection component includes a slide mechanism and an optical detection mechanism. The slide mechanism includes a limiting slide and a slider. The limiting slide is fixed to the outer wall of the top of the base, and the slider is movably connected to the inner wall of the limiting slide.

[0011] As a further embodiment of this utility model: threaded rods are movably connected to the inner walls on both sides of the limiting slide, and the threaded rods and the slider are threadedly connected. A control motor is fixed to one side of the outer wall of the limiting slide, and the output end of the control motor is connected to one end of the threaded rod through a coupling.

[0012] As a further embodiment of this utility model: the optical inspection mechanism includes a visual inspection camera, an intermediate arm and a moving plate, the moving plate is fixed to the top outer wall of the slider, the intermediate arm is fixed to one end of the moving plate, and the visual inspection camera is fixed to the bottom of the intermediate arm.

[0013] As a further improvement of this utility model: a mounting plate is welded to one side of the outer wall of the bracket, and a rechargeable battery is fixed to the top of the mounting plate.

[0014] As a further improvement of this utility model, a control panel is installed on the top outer wall of the base.

[0015] Compared with the prior art, the present invention provides a chip appearance optical inspection device, which has the following beneficial effects:

[0016] 1. By setting up a rotating ring, a gear ring, a drive motor, a drive gear, and two sets of placement frames with telescopic mechanisms, after the upper surface of the chip body is inspected, the telescopic mechanism is used to bring the two sets of placement frames closer together to wrap around the chip body. Then, the drive motor drives the drive gear and gear ring to rotate the rotating ring, realizing the interchange of the positions of the two sets of placement frames. Finally, the telescopic mechanism is controlled to return, completing the chip flipping, which facilitates the inspection of the lower surface of the chip and improves the comprehensiveness and efficiency of the inspection.

[0017] 2. The detection component consists of a slide mechanism and an optical detection mechanism. By controlling the motor to drive the threaded rod to rotate, the slider moves under the guidance of the limiting slide, which in turn drives the visual inspection camera to move laterally, realizing the detection of the chip body at different positions. This enhances the flexibility and applicability of the detection and can meet a variety of detection needs.

[0018] 3. Install a mounting plate on one side of the bracket and fix a rechargeable battery to power the electric telescopic rod. This ensures that the electric telescopic rod can work stably during the rotation of the rotating ring, avoiding the problem of power cord tangling or winding due to rotation, and ensuring the normal operation of the device.

[0019] The parts of this device not covered herein are the same as or can be implemented using existing technologies. This utility model has a simple structure and is easy to operate. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of a chip appearance optical inspection device proposed in this utility model;

[0021] Figure 2 This is a side view structural diagram of a chip appearance optical inspection device proposed in this utility model;

[0022] Figure 3 This is a schematic diagram of the overall structure of the rotating component of a chip appearance optical inspection device proposed in this utility model;

[0023] Figure 4 This is a schematic diagram of the chip body placement structure of a chip appearance optical inspection device proposed in this utility model;

[0024] Figure 5 This is a schematic diagram of the detection component structure of a chip appearance optical inspection device proposed in this utility model.

[0025] In the diagram: 1. Base; 2. Control panel; 3. Gear ring; 4. Drive motor; 5. Vertical plate; 6. Threaded rod; 7. Limit slide; 8. Control motor; 9. Drive gear; 10. Receiving seat; 11. Bracket; 12. Mounting plate; 13. Rechargeable battery; 14. Connecting rod; 15. Electric telescopic rod; 16. Placement frame; 17. Support ring; 18. Rotating ring; 19. Chip body; 20. Vision inspection camera; 21. Intermediate arm; 22. Moving plate; 23. Slider. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0027] An optical inspection device for chip appearance, such as Figures 1 to 5 As shown, the device includes a base 1. A detection component for optically detecting the chip body 19 is installed on the top outer wall of the base 1. A receiving seat 10 is fixed to the top outer wall of the base 1 by bolts. A rotating ring 18 is rotatably connected to the inner wall of the receiving seat 10. A toothed ring 3 is fixed to the side wall of the rotating ring 18 by screws. A bracket 11 is fixed to the inner circumference of the toothed ring 3 by screws. Two sets of telescopic mechanisms are installed on the surface of the bracket 11. A placement frame 16 is fixed to the end of the telescopic mechanism. A support ring 17 is welded to the inner wall of the placement frame 16. The support ring 17 is used to place the chip body 19.

[0028] In the initial state, both sets of placement frames 16 are in a horizontal state. The chip body 19 is placed using the support ring 17 located below. After the chip body 19 is placed, the detection component can perform optical detection on the upper surface of the chip body 19.

[0029] After the upper surface of the chip body 19 has been inspected, the lower surface of the chip body 19 needs to be inspected. Two sets of telescopic mechanisms drive the corresponding placement frames 16 and support rings 17 to move in a forward motion, so that the distance between the two sets of placement frames 16 gradually decreases. When the two sets of placement frames 16 are in contact with each other, the chip body 19 is wrapped between the two placement frames 16. By rotating the rotating ring 18 along the receiving seat 10, the two sets of placement frames 16 are swapped and rotated to a horizontal state. At this time, after the chip body 19 is flipped, it will fall from the original placement frame 16 into another set of placement frames 16 by its own gravity. At this time, by controlling the two sets of telescopic mechanisms to make a return motion, the chip body 19 is flipped over, so that the inspection component can inspect the lower surface of the chip body 19.

[0030] The telescopic mechanism includes a connecting rod 14 and an electric telescopic rod 15. The electric telescopic rod 15 is fixed to the outer wall of the bracket 11 by bolts, and the connecting rod 14 is fixed to the output end of the electric telescopic rod 15 by pins. The connecting rod 14 and the placement frame 16 are fixedly connected by screws.

[0031] The electric telescopic rod 15 can drive the placement frame 16 and the support ring 17 to perform return or forward movement via the connecting rod 14.

[0032] The top outer wall of the base 1 is fixed with a vertical plate 5 by bolts, and a drive motor 4 is fixed with bolts on one side of the outer wall of the vertical plate 5. The output end of the drive motor 4 is connected to a drive gear 9 that meshes with the gear ring 3 through a coupling.

[0033] The drive motor 4 can drive the drive gear 9 to rotate. The meshing between the drive gear 9 and the gear ring 3 allows the gear ring 3 to rotate, which in turn allows the rotating ring 18 to rotate along the receiving seat 10, thereby achieving the flipping of the chip body 19.

[0034] The detection assembly includes a slide mechanism and an optical detection mechanism. The slide mechanism includes a limiting slide 7 and a slider 23. The limiting slide 7 is fixed to the top outer wall of the base 1 by bolts, and the slider 23 is slidably connected to the inner wall of the limiting slide 7. Threaded rods 6 are rotatably connected to the inner walls on both sides of the limiting slide 7, and the threaded rods 6 and the slider 23 are threadedly connected. A control motor 8 is fixed to one outer wall of the limiting slide 7 by bolts, and the output end of the control motor 8 is connected to one end of the threaded rod 6 through a coupling.

[0035] The optical inspection mechanism includes a visual inspection camera 20, an intermediate arm 21 and a moving plate 22. The moving plate 22 is fixed to the top outer wall of the slider 23 by bolts, and the intermediate arm 21 is fixed to one end of the moving plate 22 by bolts. The visual inspection camera 20 is fixed to the bottom of the intermediate arm 21.

[0036] A control motor 8 drives the threaded rod 6 to rotate, allowing the slider 23 to adjust the lateral position of the vision inspection camera 20 under the guidance of the limiting slide 7. The vision inspection camera 20 can inspect the chip body 19. During lateral movement, the vision inspection camera 20 can inspect different chip bodies 19. The vision inspection camera 20 operates using its optical imaging system, which includes optical components such as lenses. When the camera moves laterally above a chip body 19, the lens focuses on the surface of that chip body 19. The lens receives light reflected or scattered from the surface of the chip body 19. This light carries optical information about the chip surface, such as surface texture, color distribution, and shape features. After passing through the lens, the light is processed by the image sensor inside the camera. Imaging is performed on a sensor (such as a CCD or CMOS sensor). The image sensor converts the received light signal into an electrical signal. These electrical signals are further processed by the processing circuit into digital image signals. After the digital image signal is generated, the image processing algorithm built into the camera analyzes the image. From an optical point of view, the algorithm determines whether there are defects on the surface of the chip body 19 based on the optical characteristics such as the gray value changes, color differences, and edge features of the pixels in the image. For example, if there are scratches on the chip surface, the light reflection and scattering at the scratches are different from those on a normal surface. In the image, this will manifest as abnormal local gray values ​​or discontinuous edge features. By identifying these abnormal optical features, the algorithm can determine that the chip has appearance defects. The detection principle of the visual inspection camera 20 is existing technology and will not be described in more detail here.

[0037] A mounting plate 12 is welded to one side of the outer wall of the bracket 11, and a rechargeable battery 13 is fixed to the top of the mounting plate 12 by screws.

[0038] The electric telescopic pole 15 can be powered by a rechargeable battery 13, thus preventing the power cord from getting tangled or wrapped during the rotation of the electric telescopic pole 15. The rechargeable battery 13 is equipped with a charging interface, which allows it to be charged when it is depleted.

[0039] The control panel 2 is installed on the top outer wall of the base 1. The control panel 2 is electrically connected to the electric telescopic rod 15, the drive motor 4, the control motor 8, the vision inspection camera 20, and the rechargeable battery 13.

[0040] The control panel 2 can send commands to the electric telescopic rod 15 to precisely control its progress and return movement, enabling the flipping operation of the chip body 19. Connected to the drive motor 4, it can control the start, stop, rotation direction and speed, and control the rotation angle and timing to complete the flipping. Connected to the control motor 8, it can control the start, stop and speed, and adjust the movement position and speed of the visual inspection camera 20. It can also display the power status of the rechargeable battery 13, remind users to charge or replace the battery, and monitor and adjust the device's operating status to ensure stable and efficient operation.

[0041] Working principle: Initially, both sets of placement frames 16 are horizontal. The chip body 19 is placed on the support ring 17 below. The motor 8 drives the threaded rod 6 to rotate, causing the slider 23 to slide within the limiting slide rail 7, which in turn moves the moving plate 22 laterally. This causes the vision inspection camera 20, fixed at the bottom of the intermediate arm 21, to move laterally and perform optical inspection on the upper surface of the chip body 19. During the lateral movement, the vision inspection camera 20 can inspect the chip body 19 at different positions. After the upper surface of the chip body 19 has been inspected, its lower surface needs to be inspected. The slide rail mechanism drives the vision inspection camera 20 to temporarily move away from the placement frame 16 and the support ring 17. At this time, the two sets of telescopic mechanisms drive the corresponding placement frame 16 and support ring 17 to move forward. The electric telescopic rod 1 in the telescopic mechanism... 5. The placement frame 16 and the support ring 17 are moved by the connecting rod 14, so that the distance between the two sets of placement frames 16 gradually decreases until the two sets of placement frames 16 fit together and wrap the chip body 19 in the middle. Then, the drive motor 4 drives the drive gear 9 to rotate. Since the drive gear 9 meshes with the gear ring 3, the gear ring 3 rotates accordingly, which in turn drives the rotating ring 18 to rotate along the receiving seat 10, so that the two sets of placement frames 16 exchange positions and rotate back to the horizontal state. Finally, the two sets of telescopic mechanisms are controlled to perform a return motion. The electric telescopic rod 15 drives the placement frame 16 and the support ring 17 to move through the connecting rod 14, so that the chip body 19 is flipped. At this time, the visual inspection camera 20 of the detection component can detect the lower surface of the chip body 19. The control panel 2 on the top outer wall of the base 1 can be used to operate and control the entire device.

[0042] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An off-chip optical inspection apparatus comprising a base (1), characterized in that, The outer wall of the top of the base (1) is provided with a detection assembly for optical detection of the chip body (19), the outer wall of the top of the base (1) is fixedly provided with a containing seat (10), the inner wall of the containing seat (10) is movably connected with a rotating ring (18), the side wall of the rotating ring (18) is fixedly provided with a gear ring (3), the circumferential inner wall of the gear ring (3) is fixedly provided with a support (11), the surface of the support (11) is provided with two groups of telescopic mechanisms, the end of the telescopic mechanism is fixedly provided with a placing frame (16), the inner wall of the placing frame (16) is welded with a supporting ring (17), and the supporting ring (17) is used for placing the chip body (19).

2. The off-chip optical inspection apparatus of claim 1, wherein The telescopic mechanism comprises a connecting rod (14) and an electric telescopic rod (15), the electric telescopic rod (15) is fixed to the outer wall of the support (11), the connecting rod (14) is fixed to the output end of the electric telescopic rod (15) through a pin, and the connecting rod (14) and the placing frame (16) are fixedly connected.

3. The off-chip optical inspection apparatus of claim 1, wherein The outer wall of the top of the base (1) is fixedly provided with a vertical plate (5), one side of the outer wall of the vertical plate (5) is fixedly provided with a driving motor (4), and the output end of the driving motor (4) is connected with a driving gear (9) engaged with the gear ring (3) through a shaft coupling.

4. The off-chip optical inspection apparatus of claim 1, wherein The detection assembly comprises a sliding mechanism and an optical detection mechanism, the sliding mechanism comprises a limiting slide (7) and a sliding block (23), the limiting slide (7) is fixed to the outer wall of the top of the base (1), and the sliding block (23) is movably connected to the inner wall of the limiting slide (7).

5. The off-chip optical inspection apparatus of claim 4, wherein The inner walls on both sides of the limiting slide (7) are movably connected with threaded rods (6), the threaded rods (6) and the sliding block (23) are threadedly connected, the outer wall of one side of the limiting slide (7) is fixedly provided with a control motor (8), and the output end of the control motor (8) is connected to one end of the threaded rod (6) through a shaft coupling.

6. The off-chip optical inspection apparatus of claim 5, wherein The optical detection mechanism comprises a visual detection camera (20), an intermediate arm (21) and a moving plate (22), the moving plate (22) is fixed to the outer wall of the top of the sliding block (23), the intermediate arm (21) is fixed to one end of the moving plate (22), and the visual detection camera (20) is fixed to the bottom of the intermediate arm (21).

7. The off-chip optical inspection apparatus of claim 1, wherein The outer wall of one side of the support (11) is welded with a mounting plate (12), and the top of the mounting plate (12) is fixedly provided with a rechargeable battery (13).

8. The off-chip optical inspection apparatus of claim 1, wherein, The outer wall of the top of the base (1) is provided with a control panel (2).

Images