Semiconductor device detection device

Abstract

The utility model discloses a semiconductor device detection device which comprises a base, a top plate, a middle frame located between the base and the top plate, at least three supporting stand columns located between the base and the top plate, and the middle frame with a lifting plate fixed on the upper portion sleeved on the supporting stand columns in a sliding mode. A telescopic rod of an air cylinder fixed to the top plate penetrates through the top plate and is fixedly connected with the lifting plate, a detection module is installed on the middle frame, and a plurality of probes are arranged on the detection module. A spring is arranged in a cylinder pressing column located between the lifting plate and the base, a pressing column fixed to the lower surface of the lifting plate penetrates through the hollowed-out area of the middle frame and is embedded into the cylinder pressing column, a protruding block is arranged on the side wall of the lower end of the pressing column, and a stopping part located above the protruding block is arranged on the upper end face of the cylinder pressing column. According to the semiconductor device detection device, under the condition that the semiconductor device is stably clamped, a plurality of pins of the semiconductor device are automatically and simultaneously detected, and the detection precision and efficiency are improved.

Description

Technical Field

[0001] This utility model relates to a semiconductor device testing device, belonging to the field of device testing technology. Background Technology

[0002] Semiconductor devices are electronic devices whose conductivity lies between that of a good conductor and an insulator. They utilize the unique electrical properties of semiconductor materials to perform specific functions, thereby enabling signal and energy conversion. Current testing devices that test semiconductor devices via their pins require further improvement in accuracy and efficiency. Summary of the Invention

[0003] The purpose of this invention is to provide a semiconductor device testing device that can automatically and simultaneously test several pins of a semiconductor device while holding it stably, thereby improving testing accuracy and efficiency.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a semiconductor device testing device, comprising: a base, a top plate, and an intermediate frame located between the base and the top plate, at least three supporting columns located between the base and the top plate, the intermediate frame with a lifting plate fixed on top slidably mounted on the supporting columns, a telescopic rod of a cylinder fixed to the top plate passing through the top plate and fixedly connected to the lifting plate, and a testing module installed on the intermediate frame, wherein the testing module is provided with a plurality of probes;

[0005] A spring is installed inside a pressure cylinder column located between the lifting plate and the base. A pressure column fixed to the lower surface of the lifting plate passes through the hollow area of ​​the middle frame and is embedded in the pressure cylinder column. A protrusion is provided on the lower end side wall of the pressure column, and a stop part is provided on the upper end face of the pressure cylinder column above the protrusion.

[0006] The following are further improvements to the above technical solution:

[0007] 1. In the above scheme, the supporting column is located at the edge of the base and the top plate, respectively.

[0008] 2. In the above scheme, the probes are arranged at equal intervals.

[0009] 3. In the above scheme, a rubber pad is provided on the upper surface of the base.

[0010] 4. In the above scheme, the number of supporting columns is 4.

[0011] 5. In the above scheme, the base and the top plate are both square in shape.

[0012] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0013] This utility model relates to a semiconductor device testing device. A middle frame of a lifting plate fixed at the top is slidably mounted on a supporting column. A telescopic rod of a cylinder fixed to a top plate passes through the top plate and is fixedly connected to the lifting plate. A spring is installed inside a pressure cylinder column located between the lifting plate and the base. A pressure column fixed to the lower surface of the lifting plate passes through the hollow area of ​​the middle frame and is embedded in the pressure cylinder column. A protrusion is provided on the lower end side wall of the pressure column, and a stop portion is provided on the upper end face of the pressure cylinder column above the protrusion. While stably clamping the semiconductor device, it automatically and simultaneously tests several pins of the semiconductor device, improving testing accuracy and efficiency. Attached Figure Description

[0014] Appendix Figure 1 This is a schematic diagram of the semiconductor device testing device of this utility model;

[0015] Appendix Figure 2 This is a bottom view of the semiconductor device testing device of this utility model;

[0016] Appendix Figure 3 This is a partial structural schematic diagram of the semiconductor device detection device of this utility model.

[0017] In the attached diagrams: 1. Base; 2. Top plate; 3. Middle frame; 31. Hollowed-out area; 4. Support column; 5. Lifting plate; 6. Cylinder; 61. Telescopic rod; 7. Detection module; 8. Probe; 9. Pressure column; 91. Protrusion; 10. Pressure cylinder column; 101. Stop; 11. Spring; 12. Rubber pad. Detailed Implementation

[0018] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0019] Example 1: A semiconductor device testing device includes: a base 1, a top plate 2, and an intermediate frame 3 located between the base 1 and the top plate 2; at least three supporting columns 4 located between the base 1 and the top plate 2; the intermediate frame 3, with a lifting plate 5 fixed above it, is slidably fitted onto the supporting columns 4; the telescopic rod 61 of a cylinder 6 fixed to the top plate 2 passes through the top plate 2 and is fixedly connected to the lifting plate 5; a testing module 7 is installed on the intermediate frame 3; and the testing module 7 is provided with a plurality of probes 8.

[0020] A spring 11 is installed inside a pressure cylinder 10 located between the lifting plate 5 and the base 1. A pressure cylinder 9 fixed to the lower surface of the lifting plate 5 passes through the hollow area 31 of the middle frame 3 and is embedded in the pressure cylinder 10. A protrusion 91 is provided on the lower end side wall of the pressure cylinder 9. A stop part 101 is provided on the upper end face of the pressure cylinder 10 above the protrusion 91.

[0021] The aforementioned support column 4 is located at the edges of the base 1 and the top plate 2, respectively.

[0022] The aforementioned probes 8 are arranged at equal intervals.

[0023] The number of the aforementioned supporting columns 4 is 4.

[0024] Both the base 1 and the top plate 2 mentioned above are square in shape.

[0025] Example 2: A semiconductor device testing device includes: a base 1, a top plate 2, and an intermediate frame 3 located between the base 1 and the top plate 2; at least three supporting columns 4 located between the base 1 and the top plate 2; the intermediate frame 3, with a lifting plate 5 fixed above it, is slidably fitted onto the supporting columns 4; a telescopic rod 61 of a cylinder 6 fixed to the top plate 2 passes through the top plate 2 and is fixedly connected to the lifting plate 5; a testing module 7 is installed on the intermediate frame 3; and the testing module 7 is provided with a plurality of probes 8.

[0026] A spring 11 is installed inside a pressure cylinder 10 located between the lifting plate 5 and the base 1. A pressure cylinder 9 fixed to the lower surface of the lifting plate 5 passes through the hollow area 31 of the middle frame 3 and is embedded in the pressure cylinder 10. A protrusion 91 is provided on the lower end side wall of the pressure cylinder 9. A stop part 101 is provided on the upper end face of the pressure cylinder 10 above the protrusion 91.

[0027] The aforementioned support column 4 is located at the edges of the base 1 and the top plate 2, respectively.

[0028] A rubber pad 12 is provided on the upper surface of the base 1.

[0029] The number of the aforementioned supporting columns 4 is 4.

[0030] The working principle of this patent is as follows: The semiconductor device is placed between the base 1 and the pressure cylinder 10. After the telescopic rod 61 of the cylinder 6 extends, it drives the lifting plate 5 to move downward, thereby driving the detection module 7 and the middle frame 3 to move downward. At the same time, the lifting plate 5 presses down on the pressure cylinder 9, and the spring 11 contracts. When the detection is completed, the telescopic rod 61 of the cylinder 6 contracts, and the pressure cylinder 9 moves upward under the push of the spring 11. Since a protrusion 91 is provided on the lower end side wall of the pressure cylinder 9, and a stop part 101 located above the protrusion 91 is provided on the upper end surface of the pressure cylinder 10, the pressure cylinder 9 will not detach from the pressure cylinder 10. At this time, the semiconductor device can be removed from between the base 1 and the pressure cylinder 10.

[0031] When using the above-mentioned semiconductor device testing device, the middle frame 3 of the lifting plate 5 fixed above it is slidably fitted onto the support column 4. The telescopic rod 61 of the cylinder 6 fixed to the top plate 2 passes through the top plate 2 and is fixedly connected to the lifting plate 5. A spring 11 is provided inside the pressure cylinder column 10 located between the lifting plate 5 and the base 1. A pressure column 9 fixed to the lower surface of the lifting plate 5 passes through the hollow area 31 of the middle frame 3 and is embedded in the pressure cylinder column 10. A protrusion 91 is provided on the lower end side wall of the pressure column 9. A stop part 101 is provided on the upper end face of the pressure cylinder column 10 above the protrusion 91. When the semiconductor device is stably clamped, several pins of the semiconductor device are automatically and simultaneously tested, which improves the testing accuracy and efficiency.

[0032] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A semiconductor device inspection apparatus characterized by comprising: Include: Base (1), top plate (2) and intermediate frame (3) between the base (1), top plate (2), at least 3 support column (4) between the base (1), top plate (2), a fixed above the lifting plate (5) the intermediate frame (3) is slidingly sleeved on the support column (4), a cylinder (6) with the top plate (2) fixed telescopic rod (61) through the top plate (2) and fixed connection with the lifting plate (5), a detection module (7) is installed on the intermediate frame (3), the detection module (7) is provided with a plurality of probes (8); A press cylinder column (10) is located between the lifting plate (5) and the base (1), a spring (11) is arranged in the press cylinder column (10), a press column (9) fixed to the lower surface of the lifting plate (5) passes through the hollow area (31) of the intermediate frame (3) and is embedded in the press cylinder column (10), the lower end of the side wall of the press column (9) is provided with a protrusion (91), and the upper end surface of the press cylinder column (10) is provided with a stop portion (101) located above the protrusion (91).

2. The semiconductor device inspection apparatus according to claim 1, wherein The support column (4) is located at the edge of the base (1) and the top plate (2) respectively.

3. The semiconductor device inspecting apparatus according to claim 1, wherein The plurality of probes (8) are arranged at equal intervals.

4. The semiconductor device inspecting apparatus according to claim 1, wherein The upper surface of the base (1) is provided with a rubber pad (12).

5. The semiconductor device inspecting apparatus according to claim 1, wherein The number of support columns (4) is 4.

6. The semiconductor device inspecting apparatus according to claim 1, wherein The base (1) and the top plate (2) are both square in shape.

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