Accelerating device for high-temperature aging test of semiconductor device

Abstract

The utility model discloses a semiconductor device high temperature aging test acceleration device, which comprises a test device body, the test device body comprises a test frame and a semiconductor chilling plate arranged on the rear side of the test frame and fixedly connected with the test frame, the top of the test frame is provided with a heating plate, one side of the heating plate is connected with a heating pipe, and the other side of the heating plate is connected with a power supply. A heat dissipation fan is arranged above the heating pipe, the heating surface of the semiconductor chilling plate is attached to the back of the test frame, a cooling fin is attached to the refrigeration surface of the semiconductor chilling plate, the cooling fin is connected with a radiator through a water pipe, and a data processing module is arranged above the radiator. A sensor used for collecting data is further arranged on the testing frame and electrically connected with the data processing module, high-temperature aging testing acceleration of the semiconductor device can be achieved, meanwhile, the back of the testing frame is cooled through a semiconductor chilling plate, damage to equipment caused by high temperature is avoided, and the testing frame is simple in structure and convenient to use. And the stability and the test precision of the equipment are improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor aging test technology, specifically to a high-temperature aging test acceleration device for semiconductor devices. Background Technology

[0002] Semiconductor memories have a certain probability of failure, and the relationship between this probability and the number of uses follows a bathtub curve. Initially, the failure probability is high, then decreases significantly after a certain number of uses, until it approaches or reaches its lifespan, at which point the failure probability rises again. This issue is typically addressed by accelerating the onset of memory failure through aging tests, allowing the memory to directly enter its stable production phase.

[0003] However, existing high-temperature aging test acceleration devices for semiconductor devices may damage the equipment itself if the high temperatures generated by the semiconductor devices are not dissipated in time inside the equipment, leading to equipment failure or a decrease in test accuracy. Utility Model Content

[0004] The purpose of this invention is to provide a high-temperature aging test acceleration device for semiconductor devices to solve the above-mentioned technical problems.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-temperature aging test acceleration device for semiconductor devices, comprising a test device body, the test device body including a test frame and a semiconductor cooling chip fixedly connected to the rear side of the test frame, a heating plate being provided on the top of the test frame, a heating tube being connected to one side of the heating plate, a cooling fan being provided above the heating tube, the heating surface of the semiconductor cooling chip being attached to the back of the test frame, the cooling surface of the semiconductor cooling chip being attached to a heat sink, the heat sink being connected to a radiator via a water pipe, a data processing module being provided above the radiator, and a sensor for collecting data being provided on the test frame, the sensor being electrically connected to the data processing module.

[0006] Preferably, thermally conductive silicone grease is applied between the cooling surface of the semiconductor refrigeration chip and the heat sink to improve thermal conductivity.

[0007] Preferably, a control panel is provided on one side of the testing device body, and an emergency stop button is provided below the control panel.

[0008] Preferably, the test frame is provided with a heat insulation layer around its perimeter.

[0009] Preferably, the test device body is also fixedly installed with a cover plate for sealing the test frame.

[0010] Preferably, the size of the heat sink is equal to the size of the semiconductor cooling chip.

[0011] Preferably, the area of ​​the semiconductor cooling chip is larger than the area of ​​the back of the test fixture.

[0012] Preferably, the testing device also includes a power supply, which drives the data processing module, radiator, heating element, and cooling fan.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] By incorporating a thermoelectric cooler, heating element, heating tube, cooling fan, radiator, and data processing module, high-temperature aging tests on semiconductor devices can be accelerated. Simultaneously, the thermoelectric cooler dissipates heat from the back of the test fixture, preventing damage to the equipment from high temperatures and improving stability and testing accuracy. The application of thermal grease enhances heat transfer efficiency between the thermoelectric cooler and the heat sink, further improving heat dissipation. The control panel and emergency stop button facilitate user operation and control, enhancing safety and ease of use. The insulation layer reduces heat loss during testing, improving testing efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is an overall schematic diagram of a high-temperature aging test acceleration device for semiconductor devices according to this embodiment;

[0017] Figure 2 This is a front view of a high-temperature aging test acceleration device for semiconductor devices according to this embodiment;

[0018] Figure 3 This is a structural diagram of the heating element and heating tube of a high-temperature aging test acceleration device for semiconductor devices according to this embodiment;

[0019] Figure 4 This is a schematic diagram of a semiconductor cooling chip in a high-temperature aging test acceleration device for semiconductor devices according to this embodiment.

[0020] The attached diagram lists the components represented by each number as follows:

[0021] 1. Test device body; 2. Test frame; 3. Semiconductor cooling chip; 4. Heating element; 5. Heating tube; 6. Cooling fan; 7. Heating surface; 8. Cooling surface; 9. Heat sink; 10. Radiator; 11. Data processing module; 12. Sensor; 13. Control panel; 14. Button; 15. Insulation layer; 16. Cover plate; 17. Power supply. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 This utility model provides a technical solution: a high-temperature aging test acceleration device for semiconductor devices, including a test device body 1. The test device body 1 includes a test frame 2 and a semiconductor cooling chip 3 fixedly connected to the rear side of the test frame 2. A heating element 4 is provided on the top of the test frame 2. A heating tube 5 is connected to one side of the heating element 4. A cooling fan 6 is provided above the heating tube 5. The heating surface 7 of the semiconductor cooling chip 3 is attached to the back of the test frame 2. The cooling surface 8 of the semiconductor cooling chip 3 is attached to a heat sink 9. The heat sink 9 is connected to a radiator 10 through a water pipe. A data processing module 11 is provided above the radiator 10. A sensor 12 for collecting data is also provided on the test frame 2. The sensor 12 is electrically connected to the data processing module 11.

[0024] Specifically, thermally conductive silicone grease is applied between the cooling surface 8 of the thermoelectric cooler 3 and the heat sink 9 to improve thermal conductivity. By applying the thermally conductive silicone grease, the thermal conductivity between the cooling surface 8 of the thermoelectric cooler 3 and the heat sink 9 is higher, enabling the cooling energy generated by the cooler to be quickly transferred to the heat sink 9. The heat is then dissipated from the device through water pipes and the radiator 10, thus improving the device's heat dissipation efficiency.

[0025] Specifically, a control panel 13 is provided on one side of the test device body 1, and an emergency stop button 14 is provided below the control panel 13. By providing the control panel 13 and the emergency stop button 14, the tester can easily control the test process and quickly press the emergency stop button 14 in an emergency to ensure the safety of the test process. The control panel 13 can help the tester intuitively understand the status of the semiconductor device in the high temperature aging test, and facilitate timely adjustment of test parameters or taking corresponding measures.

[0026] Specifically, the test rack 2 is provided with a heat insulation layer 15 around its perimeter. By providing the heat insulation layer 15, the internal temperature of the test rack 2 can be kept stable, reducing the interference of the external environment on the test temperature and improving the accuracy and reliability of the test. The heat insulation layer 15 is made of high temperature resistant and fireproof materials to ensure safety and reliability in high temperature test environments.

[0027] Specifically, a cover plate 16 for sealing the test rack 2 is also fixedly installed on the main body 1 of the test device. By setting the cover plate 16, external impurities can be effectively prevented from entering the interior of the test rack 2 during the test, ensuring the purity and accuracy of the test. The cover plate 16 can be made of transparent high-temperature resistant material, which is convenient for testers to observe the test process without affecting the test results. Testers can intuitively observe the changes of semiconductor devices in high-temperature aging test through the observation window, further improving the reliability and accuracy of the test.

[0028] Specifically, the size of the heat sink 9 is equal to that of the thermoelectric cooler 3. Furthermore, the area of ​​the thermoelectric cooler 3 is larger than the area of ​​the back of the test fixture 2. This arrangement allows the cooling surface 8 of the thermoelectric cooler 3 to fully adhere to the heat sink 9, increasing the heat conduction area and further improving heat conduction efficiency. Simultaneously, because the area of ​​the thermoelectric cooler 3 is larger than the area of ​​the back of the test fixture 2, it can better absorb the heat generated on the back of the test fixture 2 and quickly transfer it to the heat sink 9, which is then discharged outside the device through water pipes and a radiator 10. This more effectively reduces the internal temperature of the test fixture 2, ensuring the smooth conduction of high-temperature aging tests. This design not only improves heat dissipation efficiency but also ensures the accuracy and reliability of the test, providing strong support for high-temperature aging tests of semiconductor devices.

[0029] Specifically, the test device body 1 is also equipped with a power supply 17, which is used to drive the data processing module 11, the radiator 10, the heating tube 5 and the cooling fan 6. By setting up the power supply 17, a stable power supply is provided for the entire test device, ensuring the normal operation of each component.

[0030] A specific application example of this embodiment is as follows:

[0031] When using this device, the tester first places the semiconductor device to be tested on the test rack 2, and then sets the required high-temperature aging test parameters, such as temperature and time, through the control panel 13. Then, the test device is started, the heating element 4 starts to work, and releases heat through the heating tube 5, so that the temperature inside the test rack 2 gradually rises to the set value. At the same time, the cooling fan 6 starts to run to help the heat sink 9 and the radiator 10 dissipate heat to keep the temperature inside the device stable.

[0032] During the test, sensor 12 continuously collects parameters such as temperature and current of the semiconductor device and transmits the data to data processing module 11 for processing and analysis. Test personnel can view the test data and status in real time through the display screen on control panel 13, so as to adjust test parameters or take corresponding measures in a timely manner.

[0033] When the test reaches the set time or an abnormality occurs in the semiconductor device, the testing device will automatically stop working. At this time, the tester can open the cover 16 and remove the semiconductor device for further analysis and evaluation.

[0034] In the description of this utility model, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "side", "top", "inner", "front", "center", "both ends", etc., indicate the orientation or positional relationship based on the drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0035] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that modifications may be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-temperature aging test acceleration device for semiconductor devices, characterized in that: Including test device body (1), test device body (1) includes test frame (2) and is provided with semiconductor refrigeration sheet (3) on the rear side fixed connection of test frame (2), the top of test frame (2) is provided with heating sheet (4), one side of heating sheet (4) is connected with heating pipe (5), the upper of heating pipe (5) is provided with heat dissipation fan (6), the heating surface (7) of semiconductor refrigeration sheet (3) is pasted to the back of test frame (2), the refrigeration surface (8) of semiconductor refrigeration sheet (3) is pasted with radiating fin (9), radiating fin (9) is connected with cold row (10) through water pipe, the upper of cold row (10) is provided with data processing module (11), sensor (12) for collecting data is still provided on test frame (2), sensor (12) is electrically connected with data processing module (11).

2. The apparatus for high temperature burn-in test acceleration of a semiconductor device according to claim 1, wherein: The refrigeration surface (8) of the semiconductor refrigeration sheet (3) and the radiating fin (9) are coated with a heat-conducting silicone grease for improving the heat conduction efficiency.

3. The high-temperature aging test acceleration device for semiconductor devices according to claim 1, characterized in that: The test device body (1) is provided with a control panel (13) on one side, and a button (14) for emergency stop is arranged below the control panel (13).

4. The apparatus of claim 1, wherein: the temperature of the first heat sink is higher than the temperature of the second heat sink. The test frame (2) is provided with a heat preservation layer (15) on the periphery.

5. The apparatus of claim 1, wherein: the temperature of the first heat source is between 100 and 150 degrees Celsius; and the temperature of the second heat source is between 150 and 200 degrees Celsius. The test device body (1) is further provided with a cover plate (16) for closing the test frame (2).

6. The apparatus of claim 1, wherein: The size of the radiating fin (9) is equal to that of the semiconductor refrigeration sheet (3).

7. The apparatus of claim 1, wherein: the temperature of the first heat source is between 100 and 150 degrees Celsius; and the temperature of the second heat source is between 150 and 200 degrees Celsius. The area of the semiconductor refrigeration sheet (3) is greater than that of the back of the test frame (2).

8. The apparatus of claim 1, wherein: The test device body (1) is further provided with a power supply (17) for driving the data processing module (11), the cold row (10), the heating pipe (5) and the heat dissipation fan (6).

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