Novel QSFP-DD packaging optical module

Abstract

The utility model provides a novel QSFP-DD packaging optical module comprising a pedestal, the left side of the pedestal is detachably connected with a reset pull ring, and the interior of the pedestal is fixedly connected with a PCB device group. According to the novel QSFP-DD packaging optical module, the base, the reset pull ring, the upper cover, the heat dissipation teeth, the heat dissipation cover and other structures are arranged, the base serves as a core support, the PCB device set, the reset pull ring and the reset spring are accurately positioned and stably installed through a limiting groove, an installation cavity and a spring groove in the base, cooperative work is ensured, the reset pull ring is installed on the left side of the base, and the upper cover is arranged on the left side of the base. The state of the reset spring can be mastered in real time through the observation groove; the upper cover and the base are tightly connected through screws, internal components are covered and protected, external adverse factors are resisted; assembly and maintenance are also facilitated through screw connection; the heat dissipation teeth and the heat dissipation cover construct an efficient heat dissipation system, and heat dissipation is rapid; influence of over-high temperature on performance is avoided, and stability, reliability and service life of the optical module are improved.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, and more specifically, to a novel QSFP-DD packaged optical module. Background Technology

[0002] With the rapid development of 5G communications, data centers, and other fields, the demand for high-speed, high-capacity data transmission is exploding. As a key component in optical communication systems, optical modules undertake the important task of converting optical signals to electrical signals, and their performance directly affects the efficiency and stability of the entire communication system.

[0003] However, existing packaged optical modules have the following problems when used:

[0004] As data transmission rates continue to increase, the internal operating temperature of optical modules rises continuously. Excessive operating temperature can lead to a decline in the performance of the electronic components inside the optical module, resulting in data transmission errors, signal attenuation, and other problems, seriously affecting communication quality and system reliability. On the other hand, the structural design of traditional optical modules is relatively complex, and the complex internal structure makes maintenance and repair work extremely difficult, requiring a significant amount of manpower and time.

[0005] This invention can ensure the integrity of high-speed signal transmission in a high-density, small space, has good heat dissipation, and saves costs and reduces power consumption. Summary of the Invention

[0006] The present invention aims to solve the technical problems mentioned in the background art and provide a novel QSFP-DD packaged optical module.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a novel QSFP-DD packaged optical module, comprising: a base, a reset pull ring detachably connected to the left side of the base, a PCB device assembly fixedly connected inside the base, a top cover threadedly installed on the upper end of the base, the top cover pressing on the reset pull ring and the PCB device assembly, and pull arms fixedly installed at both the front and rear ends of the reset pull ring, the pull arms engaging with the front and rear ends of the base.

[0008] A further preferred embodiment: heat dissipation fins are fixedly installed on the bottom of the base, and a heat dissipation cover is fixedly installed on the bottom of the base, with the heat dissipation cover covering the area around the heat dissipation fins.

[0009] A further preferred embodiment: the base has limit grooves at both the front and rear ends, and the limit grooves are matched with the pull arm.

[0010] A further preferred embodiment: The upper end of the base is provided with a mounting cavity, and the mounting cavity is fixedly connected to the PCB device assembly.

[0011] A further preferred embodiment: spring grooves are provided on both the front and rear sides of the upper left side of the base, a reset spring is fixedly installed in the spring groove, and a reset pull ring is above the reset spring.

[0012] A further preferred embodiment: observation slots are provided on both the front and rear sides of the upper end of the reset pull ring, and the observation slots are located above the reset spring.

[0013] A further preferred embodiment: The base and the top cover are respectively provided with screw hole 2 and screw hole 1 at the four corners. Screw is connected to screw hole 1 by internal thread, and the screw passes through screw hole 1 and is threaded to screw hole 2. Beneficial effects

[0014] 1. By incorporating heat dissipation fins and a heat dissipation cover, the heat generated by the optical module during operation is rapidly conducted to the heat dissipation fins. The heat dissipation fins increase the heat dissipation area and accelerate the heat dissipation speed, while the heat dissipation cover plays an auxiliary role in heat dissipation. It not only guides airflow, allowing heat to dissipate to the surrounding environment more quickly, but also provides some protection for the heat dissipation fins, preventing dust, debris, and other contaminants from adhering to the fins and affecting the heat dissipation effect. This heat dissipation structure effectively ensures that the optical module operates stably at a suitable temperature, avoiding problems such as performance degradation, data transmission errors, or even damage caused by excessively high temperatures. This improves the reliability and lifespan of the optical module, reduces maintenance costs, and ensures that the optical module can efficiently and stably complete data transmission and reception in various application scenarios.

[0015] 2. The system is equipped with a base, a top cover, and screws. The base serves as the basic support structure, and its carefully designed internal limiting groove, mounting cavity, and spring groove allow for precise positioning and stable assembly of components such as the PCB component assembly, reset pull ring, and reset spring. The top cover is tightly connected to the base by screws, covering the reset pull ring and PCB component assembly to form a physical protective barrier, effectively resisting dust, moisture, and accidental collisions, and preventing damage to internal precision components. The screws, as key connecting parts, are easy to operate and provide a firm connection. During installation, simply pass the screws through the screw holes at the four corners of the top cover and the screw holes at the four corners of the base and tighten them to quickly fix the top cover and the base. This not only makes the assembly and disassembly of the optical module more convenient and facilitates later maintenance and repair, but also ensures the connection strength between the top cover and the base, maintains a long-term stable packaging structure, and ensures the coordinated operation of internal components, enabling the optical module to efficiently and reliably complete data transmission and reception tasks even in complex environments.

[0016] 3. In summary, this novel QSFP-DD packaged optical module, through its structure including a base, reset pull ring, top cover, heat dissipation fins, and heat dissipation cap, features a base as the core support. Its internal limiting groove, mounting cavity, and spring groove precisely position and securely mount the PCB component group, reset pull ring, and reset spring, ensuring coordinated operation. The reset pull ring, located on the left side of the base, engages with the limiting groove via a pull arm, enabling convenient reset in conjunction with the reset spring. An observation slot allows for real-time monitoring of the reset spring's status. The top cover is tightly connected to the base with screws, protecting internal components from adverse external factors. The screw connection also facilitates assembly and maintenance. The heat dissipation fins and heat dissipation cap create an efficient heat dissipation system, rapidly cooling the system and preventing overheating from affecting performance, thus improving the stability, reliability, and lifespan of the optical module. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0018] Figure 2 This is a schematic diagram of the overall exploded structure of this utility model.

[0019] Figure 3 This is a schematic diagram of the base structure of this utility model.

[0020] Figure 4 This is a schematic diagram of the PCB device assembly mounted on the base structure of this utility model.

[0021] Figure 1-4 In the middle: 1. Base; 101. Top cover; 102. Heat sink cover; 103. Limiting groove; 104. Mounting cavity; 105. Spring groove; 106. Reset spring; 107. Screw hole one; 108. Screw; 109. Screw hole two; 2. Reset pull ring; 201. Pull arm; 202. Observation slot; 3. PCB component group. Detailed Implementation

[0022] The following will refer to the appendix in the embodiments of this utility model. Figures 1-4 The technical solutions in the embodiments of this utility model will be clearly and completely described.

[0023] Please see Figure 1-4In this embodiment of the present invention, a novel QSFP-DD packaged optical module includes: a base 1, a reset pull ring 2 detachably connected to the left side of the base 1, a PCB device assembly 3 fixedly connected inside the base 1, a top cover 101 threadedly fixedly installed on the upper end of the base 1, the top cover 101 pressing on the reset pull ring 2 and the PCB device assembly 3, pull arms 201 fixedly installed at both the front and rear ends of the reset pull ring 2, the pull arms 201 engaging with the front and rear ends of the base 1, limiting grooves 103 formed at both the front and rear ends of the base 1, the limiting grooves 103 matching the pull arms 201, and a mounting cavity 104 formed at the upper end of the base 1, the mounting cavity 104 being connected to the P The PCB device assembly 3 is fixedly connected. Observation slots 202 are provided on both the front and rear sides of the upper end of the reset pull ring 2, located above the reset spring 106. Screw holes 109 and 107 are respectively provided at the four corners of the base 1 and the upper cover 101. A screw 108 is threaded into screw hole 107, passing through screw hole 107 and threaded into screw hole 109. The PCB device assembly 3 is fixedly installed in the mounting cavity 104 inside the base 1. Then, the reset spring 106 is installed on the base 1, and the reset pull ring 2 is installed on the left side of the base 1, so that the pull arm 201 engages with the limiting slots 103 at the front and rear ends of the base 1. Then, position the observation slot 202 on the reset pull ring 2 above the reset spring 106. Next, align the upper cover 101 with the base 1, ensuring that the screw holes 107 at the four corners of the upper cover 101 are aligned with the screw holes 109 at the four corners of the base 1. Then, use screws 108 to thread through screw holes 107 and 109, gradually tightening the screws 108 to securely fix the upper cover 101 onto the base 1. The upper cover presses onto the reset pull ring 2 and the PCB component assembly 3. The reset pull ring 2 is engaged with the front and rear ends of the base 1 via the pull arm 201, maintaining a stable position. The reset spring 106 is in its normal state, and the PCB component assembly 3 is securely fixed. The upper cover 101 is fixed to the base 1 by screws 108 within the mounting cavity 104 inside the base 1, protecting the reset pull ring 2 and the PCB device group 3. When the optical module is connected to the system, the PCB device group 3 starts to work, receiving and sending optical signals, and converting the optical signals into electrical signals for data processing and transmission, completing the data transmission and reception work. When the module needs to be reset, the reset pull ring 2 is pulled outward, and the pull arm 201 moves within the limiting groove 103. The reset pull ring 2 is disengaged from the base 1. After the reset pull ring 2 is released, it returns to its initial position under the action of the reset spring 106.

[0024] In this embodiment of the utility model, heat dissipation teeth are fixedly installed on the bottom of the base 1, and heat dissipation cover 102 is fixedly installed on the bottom of the base 1. The heat dissipation cover 102 covers the heat dissipation teeth. The heat dissipation teeth fixedly installed on the bottom of the base 1 and the heat dissipation cover 102 covering the heat dissipation teeth together constitute a heat dissipation structure to prepare for the heat dissipation of the optical module when it is working. The heat generated during the working process will be conducted to the heat dissipation teeth at the bottom of the base 1. The heat dissipation cover 102 assists in heat dissipation, accelerates heat dissipation, and ensures that the optical module operates stably at a suitable temperature.

[0025] In this embodiment of the utility model, spring grooves 105 are provided on the front and rear sides of the upper left side of the base 1. A reset spring 106 is fixedly installed in the spring groove 105. A reset pull ring 2 is above the reset spring 106. When a reset operation is required, the reset pull ring 2 is pulled outward, and the pull arm 201 moves in the limiting groove 103. At the same time, the reset pull ring 2 compresses the reset spring 106 below. The reset pull ring 2 drives the relevant mechanism to perform a reset action on the PCB device group 3. After the reset pull ring 2 is released, the reset pull ring 2 returns to the initial position under the elastic action of the reset spring 106 for the next operation. During the process of pulling the reset pull ring 2, the state of the reset spring 106 can be observed through the observation groove 202.

[0026] Working principle: The heat dissipation fins are fixedly installed at the bottom of the base 1, and then the heat dissipation cover 102 is installed at the bottom of the base 1, covering the heat dissipation fins to ensure a tight fit and good heat dissipation. Reset springs 106 are fixedly installed in the front and rear spring grooves 105 on the upper left side of the base 1. The PCB component group 3 is fixedly installed in the mounting cavity 104 inside the base 1. The reset pull ring 2 is installed on the left side of the base 1, so that the pull arm 201 engages with the limiting grooves 103 at the front and rear ends of the base 1, ensuring that the reset pull ring 2 can move flexibly. The observation groove 202 on the reset pull ring 2 is located above the reset springs 106. Finally, the upper cover 101 is aligned with the base 1, so that the upper cover 101... Align the screw holes 107 at the four corners with the screw holes 109 at the four corners of the base 1. Then, use screws 108 to thread through screw holes 107 and screw holes 109. Tighten the screws 108 gradually to firmly fix the top cover 101 onto the base 1. Press the cover above the reset pull ring 2 and the PCB device group 3. After the optical module is connected to the system, the PCB device group 3 starts to work, receiving and sending optical signals, and converting the optical signals into electrical signals for data processing and transmission, completing the data transmission and reception work. During this process, the heat generated is conducted to the heat dissipation teeth at the bottom of the base 1. The heat dissipation cover 102 assists in heat dissipation, accelerates heat dissipation, and ensures that the optical module operates stably at a suitable temperature.

Claims

1. A novel QSFP-DD packaged optical module comprising: The base (1) left side detachable connection has reset pull ring (2), the base (1) inside fixed connection has PCB device group (3), characterized by: the base (1) upper end thread fixed installation has upper cover (101), the upper cover (101) gland is in reset pull ring (2) and PCB device group (3) above, the reset pull ring (2) front and rear end are fixedly installed with pull arm (201), the pull arm (201) is connected with the front and rear end of base (1) and is clamped.

2. The novel QSFP-DD packaged optical module of claim 1, wherein: The base (1) bottom fixed installation has heat dissipation tooth, the base (1) bottom fixed installation has heat dissipation cover (102), the heat dissipation cover (102) covers around heat dissipation tooth.

3. The novel QSFP-DD packaged optical module of claim 1, wherein: The base (1) front and rear end are all set up with limiting slot (103), the limiting slot (103) is set with pull arm (201) in matching.

4. The novel QSFP-DD packaged optical module of claim 1, wherein: The base (1) upper end is set up with installation cavity (104), the installation cavity (104) is fixedly connected with PCB device group (3) in.

5. The novel QSFP-DD packaged optical module of claim 1, wherein: The base (1) upper end left side front and rear side are all set up with spring slot (105), the spring slot (105) is fixedly installed with reset spring (106) in, the reset spring (106) top is reset pull ring (2).

6. The novel QSFP-DD packaged optical module of claim 5, wherein: The reset pull ring (2) upper end front and rear side are all set up with observation slot (202), the observation slot (202) is located reset spring (106) top.

7. The novel QSFP-DD packaged optical module of claim 1, wherein: The base (1) and upper cover (101) four corners are set up with screw hole two (109) and screw hole one (107) respectively, the screw hole one (107) is screw connected with screw (108), the screw (108) is screw connected through screw hole one (107) and screw hole two (109).

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