Scissor type lifting cavity opening device

By using a scissor-type lifting structure and a limit block design, the problems of off-center loading and collision during the lifting and lowering of the semiconductor equipment cavity cover are solved, achieving smooth lifting and lowering of the cavity cover and improving the safety and efficiency of the equipment.

CN224005669UActive Publication Date: 2026-03-17JIANGSU ALPHA-SEMICON EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-30
Publication Date
2026-03-17

AI Technical Summary

Technical Problem

Existing semiconductor equipment cavity opening devices suffer from off-center loading and collision problems during cavity cover lifting and lowering, affecting the safety and efficiency of the equipment.

Method used

It adopts a scissor-type lifting structure, and ensures that the cavity cover is evenly stressed by symmetrically setting motion modules and limit blocks to prevent drooping and eccentricity. The lifting and lowering movement of the cavity cover is controlled by sensors to avoid collisions.

Benefits of technology

It enables smooth lifting and lowering of the cavity cover, improves the safety and efficiency of semiconductor equipment, reduces the equipment's footprint, and prevents collisions between the cavity cover and important components.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a scissor type lifting cavity opening device. The scissor type lifting cavity opening device comprises a supporting assembly, a driving assembly and at least one pair of movement modules. The supporting assembly is located on the top of the cavity cover. The driving assembly is fixed on the supporting assembly; and each pair of motion modules are arranged on the upper surface of the cavity cover and are symmetrically distributed about the center of the cavity cover. Each motion module comprises a connecting part and a lifting part, and the connecting part is fixed on the cavity cover; the lifting part comprises a first supporting arm and a second supporting arm, the first supporting arm and the second supporting arm are arranged in a crossed mode, and the middle positions of the first supporting arm and the second supporting arm are rotationally connected. The top end of the first supporting arm is connected with the supporting assembly, the bottom end of the first supporting arm is slidably connected with the connecting part, and the first supporting arm can slide in the first direction. The top end of the second supporting arm is connected with the driving assembly, and the bottom end of the second supporting arm is rotationally connected with the connecting part. According to the utility model, the stable lifting of the cavity cover can be realized, and the safety and the use efficiency of semiconductor equipment are improved.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment, specifically to a scissor-type lifting cavity opening device. Background Technology

[0002] During the debugging or production of semiconductor equipment, the upper cavity cover of the semiconductor equipment needs to be opened and closed to facilitate the disassembly, assembly, and maintenance of equipment components. However, existing cavity opening devices for semiconductor equipment have some limitations, particularly in maintaining the stable raising and lowering of the cavity cover.

[0003] Firstly, existing semiconductor equipment's cavity opening devices, designed to avoid the central location of critical components, allow the cavity cover lifting mechanism to be installed only on one side of the cavity cover. Typically, a single electric or pneumatic cylinder is used as the actuating component. However, this type of lifting mechanism causes uneven load on the cavity cover during lifting due to unilateral force, preventing the cover from maintaining a horizontal position and posing a safety hazard to the semiconductor equipment. Furthermore, during cavity closing, the bottom of the cavity cover is prone to colliding with the cavity body, causing the lifting actuator to overload and triggering an alarm in the semiconductor equipment, thus affecting its operational efficiency.

[0004] Secondly, for semiconductor devices that use a flip-type cover operation, this cavity opening method requires a large space, and during the opening or closing process, the cavity cover is prone to collision with important components in the center of the semiconductor device, causing damage to the semiconductor device.

[0005] In summary, existing semiconductor devices exhibit significant technical deficiencies in maintaining stable cavity cover lifting and lowering. These deficiencies lead to cavity cover tilting and eccentricity, affecting the safety and efficiency of the semiconductor device. Therefore, it is necessary to develop a novel cavity opening device to address these issues and achieve stable cavity cover lifting and lowering. Utility Model Content

[0006] The purpose of this invention is to provide a scissor-type lifting cavity opening device to achieve smooth lifting of the cavity cover, prevent the cavity cover from drooping and becoming eccentric, and prevent the cavity cover from being bumped or knocked, thereby improving the safety and efficiency of semiconductor equipment.

[0007] To achieve the above objectives, this utility model provides a scissor-type lifting cavity opening device, comprising:

[0008] Support components are located on top of the cavity cover;

[0009] A drive assembly, fixed to the support assembly, has a drive end capable of providing a driving force along a first direction;

[0010] At least one pair of motion modules are disposed on the upper surface of the cavity cover, and the motion modules are symmetrically distributed about the center of the cavity cover;

[0011] Each motion module includes:

[0012] The connecting part is fixed to the cavity cover;

[0013] The lifting part includes a first support arm and a second support arm, which are arranged crosswise and rotatably connected along the crosswise part.

[0014] The top end of the first support arm is rotatably connected to the support assembly, and its bottom end is slidably connected to the connecting part, allowing it to slide along a first direction;

[0015] The top end of the second support arm is connected to the drive end of the drive assembly, and its bottom end is rotatably connected to the connecting part.

[0016] Optionally, the connecting portion includes:

[0017] A sliding groove is provided on the surface of the cavity cover and is connected to the bottom end of the first support arm;

[0018] The lower fixing block is fixed on the cavity cover and hinged to the bottom end of the second support arm.

[0019] Optionally, a groove is provided on the side of the sliding groove near the lower fixed block, and the depth of the groove is greater than the depth of the sliding groove.

[0020] Optionally, the driving component includes:

[0021] The power unit, fixed to the support assembly, is used to provide driving force along the first direction;

[0022] Several first guide rails are arranged along a first direction and symmetrically fixed on the support assembly;

[0023] A connecting rod is slidably connected to several of the first guide rails and connected to the power unit;

[0024] The upper sliding block is fixedly connected to the connecting rod and hinged to the top end of the second support arm, thereby driving the top end of the second support arm to move along the first direction.

[0025] Optionally, the power unit is located on the axis of symmetry of each pair of motion modules.

[0026] Optionally, the power unit includes:

[0027] Electric motor;

[0028] The lead screw is connected to the output end of the motor via a coupling and to the connecting rod, and can drive the connecting rod to move in the first direction.

[0029] Optionally, the support component includes:

[0030] A frame is disposed on top of the cavity cover;

[0031] The support frame is fixedly installed on both sides of the chamber and fixedly connected to the frame, so that the frame and the support frame together provide support for the drive assembly and motion module;

[0032] Several second guide rails are arranged along the first direction and fixedly connected to the frame;

[0033] An adapter plate, which is slidably connected to the plurality of second guide rails;

[0034] A fixing plate, located below and fixedly connected to the adapter plate, is used to fix the motor;

[0035] The upper fixing block is fixed on the adapter plate and hinged to the top of the first support arm. The adapter plate drives the cavity cover to move along the first direction.

[0036] Optionally, it also includes:

[0037] The first limiting block and the second limiting block both protrude from the surface of the adapter plate and extend toward the connecting rod; the height of the first limiting block and the second limiting block protruding from the adapter plate is greater than or equal to the distance between the connecting rod and the adapter plate, thereby limiting the connecting rod.

[0038] Optionally, the distance between the first limiting block and the second limiting block is less than the length of the sliding groove.

[0039] Optionally, the first limiting block is provided with a first sensor for detecting whether the connecting rod contacts the first sensor; the second limiting block is provided with a second sensor for detecting whether the connecting rod contacts the second sensor.

[0040] Compared with the prior art, the technical solution of this utility model has at least the following beneficial effects:

[0041] This invention achieves uniform force distribution on the cavity cover by symmetrically arranging motion modules around the cavity cover, preventing the cavity cover from sagging and becoming eccentric, and improving the safety of semiconductor devices.

[0042] By setting limit blocks and sensors that transmit signals to the motor, collisions with the cavity cover are prevented, thereby improving the safety and efficiency of the semiconductor.

[0043] The support frame described in this invention is projected onto the edge of the cavity cover, reducing the footprint of the cavity opening device; at the same time, it makes the overall structure of the semiconductor device more compact. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the scissor-type lifting cavity opening device described in this utility model.

[0045] Figure 2 for Figure 1 Side view.

[0046] Figure 3 This is a schematic diagram of the drive component in the scissor-type lifting cavity opening device of this utility model.

[0047] In the diagram, 11-cavity cover, 12-frame, 13-first guide rail, 14-adapter plate, 15-connecting part, 16-lifting part, 17-second guide rail, 141-upper fixed block, 142-first limiting block, 143-second limiting block, 151-sliding groove, 152-lower fixed block, 153-lower sliding block, 161-first support arm, 162-second support arm, 163-pin, 171-second connecting block, 181-fixed plate, 182-lead screw, 183-coupling, 184-motor, 185-connecting rod, 186-first connecting block, 187-upper sliding block. Detailed Implementation

[0048] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0049] In the description of this utility model, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0050] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0051] See Figure 1 and Figure 2 This utility model provides a scissor-type lifting cavity opening device, disposed on the top of a cavity cover 11, for lifting the cavity cover 11 of a semiconductor device. The cavity opening device includes: a support component, a drive component, and at least one pair of motion modules. The support component is located on the top of the cavity cover 11 and provides support for the motion modules and the drive component. The drive component is fixed below the support component, and its drive end can provide a driving force along a first direction (i.e., the horizontal direction). One or more pairs of motion modules are fixed to the upper surface of the cavity cover 11, and each pair of motion modules is symmetrically arranged with the cavity cover 11 as the center. Furthermore, the overall arrangement of multiple pairs of motion modules is symmetrically arranged with the cavity cover 11 as the center, ensuring that the cavity cover 11 is subjected to balanced forces, so that the cavity cover 11 always remains horizontal during lifting. Each motion module has a cross structure, and its top end is connected to the support component and the drive component respectively. It can achieve lifting and lowering of the cavity cover 11 by cooperating with the drive component, effectively avoiding uneven load on the cavity cover 11 during lifting and lowering.

[0052] The support assembly includes a frame 12, a support frame, and an adapter plate 14. The frame 12 is disposed on top of the cavity cover 11, but does not directly contact the cavity cover 11. The support frame (not shown) is fixedly disposed on both sides of the cavity and fixedly connected to both ends of the frame 12, so that the frame 12 and the support frame together provide support for the drive assembly and the motion module. The adapter plate 14 is placed horizontally and fixed to the frame 12 for fixing the motion module.

[0053] In some embodiments, the width of the support frame matches the width of the cavity cover 11, so that the vertical projection of the support frame is at the edge of the cavity cover 11, making the structure of the cavity opening device more compact and reducing the footprint of the semiconductor device using the cavity opening device of this utility model.

[0054] Furthermore, the support assembly also includes a fixing plate 181, which is vertically fixed on the adapter plate 14 and located on the axis of symmetry of the motion module, for fixing the drive assembly.

[0055] The drive assembly includes a power unit, a plurality of first guide rails 13, and a connecting rod 185. The power unit is fixed to the fixed plate 181 and is used to provide kinetic energy to the connecting rod 185; the plurality of first guide rails 13 are fixed parallel to the adapter plate 14 along a first direction; the connecting rod 185 is slidably connected to each of the first guide rails 13, so that it slides along the first guide rail 13.

[0056] Specifically, such as Figure 3As shown, the power unit includes a motor 184 and a lead screw 182. The motor 184 provides kinetic energy; one end of the lead screw 182 passes through a fixing plate 181 and is placed along a first direction, fixing the lead screw 182 to the adapter plate 14 via the fixing plate 181, and positioning the lead screw 182 on the axis of symmetry of each pair of motion modules; the lead screw 182 is connected to the output end of the motor 184 via a coupling 183 to obtain the kinetic energy generated by the motor 184, and fixing the motor 184 to the adapter plate 14 via the lead screw 182. A plurality of first guide rails 13 are fixed to the adapter plate 14 parallel to the lead screw 182, and the plurality of first guide rails 13 are symmetrically distributed on both sides of the lead screw 182. The connecting rod 185 is perpendicular to the lead screw 182, with a lead screw nut at its center. The connecting rod 185 is connected to the lead screw 182 via the lead screw nut, allowing it to move along a first direction as the lead screw 182 rotates. The surface of the connecting rod 185 is provided with several first connecting blocks 186, allowing the connecting rod 185 to slide along the first guide rail 13 via the first connecting blocks 186. When the motor 184 is started, it drives the lead screw 182 to rotate, thereby causing the connecting rod 185 to move along the first guide rail 13.

[0057] In a preferred embodiment, a speed reducer is provided between the motor 184 and the coupling 183 to increase the output torque of the motor 184 and improve the load capacity of the motor 184, so that the drive assembly can drive different models of cavity covers 11 to perform lifting and lowering movements.

[0058] Furthermore, the support assembly also includes: an upper fixing block 141, which is disposed on the adapter plate 14 and is used to connect the top end of one side of the motion module; the drive assembly also includes: an upper sliding block 187, which is fixed on the connecting rod 185 and is used to connect the top end of the other side of the motion module.

[0059] Each motion module includes a connecting part 15 and a lifting part 16. The connecting part 15 is fixed to the cavity cover 11; the lifting part 16 has a cross structure and connects the connecting part 15 to the drive assembly and the support assembly, enabling the cavity cover 11 to be lifted or lowered.

[0060] Specifically, the connecting part 15 includes a sliding groove 151 and a lower fixing block 152. The sliding groove 151 is disposed on the surface of the cavity cover 11 along a first direction. The lower fixing block 152 is fixed on the cavity cover 11 and is placed coaxially with the sliding groove 151, so that the sliding groove 151 and the lower fixing block 152 are located on the same horizontal plane.

[0061] Specifically, the lifting part 16 is connected to the connecting part 15 and includes: a first support arm 161 and a second support arm 162, the first support arm 161 and the second support arm 162 are arranged crosswise, and the first support arm 161 and the second support arm 162 are rotatably connected along the crosswise part; further, a pin 163 is provided at the crosswise part, and the first support arm 161 and the second support arm 162 are rotatably connected along the pin 163; further, the pin 163 is located at the center 162 of the first support arm 161 and the second support arm respectively. The top end of the first support arm 161 is hinged to the upper fixed block 141, and its bottom end is connected to the sliding groove 151, sliding along the sliding groove 151 in a first direction. The top end of the second support arm 162 is hinged to the upper sliding block 187, and can be driven by the motor 184 to slide the connecting rod 185 along the first guide rail 13, thereby causing the upper sliding block 187 to slide along the first direction. The bottom end of the second support arm 162 is hinged to the lower fixed block 152, achieving a rotatable connection with the bottom end of the second support arm 162. During the lifting and lowering of the cavity cover 11, the drive assembly drives the top end of the second support arm 162 to slide along the first direction. Since the bottom end of the first support arm 161 and the top end of the second support arm 162 are both immovable, the bottom end of the first support arm 161 moves along the first direction in the sliding groove 151, changing the angle between the first support arm 161 and the second support arm 162, thereby driving the cavity cover 11 connected to the bottom end of the motion module to lift and lower.

[0062] See Figure 1When the cavity cover 11 is in the unlifted state (i.e., the semiconductor device is not being opened), the bottom end of the first support arm 161 is located on the side of the sliding groove 151 near the lower fixed block 152. At this time, the distance between the upper sliding block 187 and the upper fixed block 141 is minimal. When the semiconductor device is being opened, the motor 184 provides kinetic energy to drive the lead screw 182 to rotate, causing the connecting rod 185 to slide along the first guide rail 13, so that the upper sliding block 187 on the connecting rod 185 moves away from the upper fixed block 141. At this time, the lower sliding block 153 slides along the sliding groove 151, so that the bottom end of the first support arm 161 moves away from the lower fixed block 152, thereby increasing the angle between the first support arm 161 and the second support arm 162, realizing the coordinated operation of the motion component and the drive component to drive the cavity cover 11 to rise. When performing cavity closing operation on the semiconductor device, the motor 184 provides kinetic energy to drive the lead screw 182 to rotate, causing the connecting rod 185 to slide in the opposite direction along the first guide rail 13, so that the upper sliding block 187 moves closer to the upper fixed block 141 and the bottom end of the first support arm 161 moves closer to the lower fixed block 152, reducing the included angle between the first support arm 161 and the second support arm 162, and realizing the coordinated operation of the motion component and the drive component to drive the cavity cover 11 to descend.

[0063] In a preferred embodiment, the motion module is located at the edge of the upper surface of the cavity cover 11, effectively avoiding important components located at the center of the semiconductor device.

[0064] In the preferred embodiment, see Figure 2 The top of the cavity cover 11 is provided with a lower sliding block 153 protruding from the top surface of the cavity cover 11. The surface of the lower sliding block 153 is provided with a sliding groove 151 recessed into the lower sliding block, so as to avoid the bottom end of the first support arm 161 directly contacting the surface of the cavity cover 11 and causing the cavity cover 11 to be scratched.

[0065] In a preferred embodiment, the sliding groove 151 has a groove on the side near the lower fixing block 152, and the depth of the groove is greater than the depth of the sliding groove 151. When the cavity cover 11 is in the unlifted state, the bottom end of the first support arm 161 is located in the groove. This prevents the motor 184 from running idle after the bottom end of the first support arm 161 moves along the sliding groove 151 to the end point of the cavity cover 11's descent (i.e., the cavity cover has completed the cavity closing operation) when the cavity cover 11 is lowered, causing the cavity cover 11 to be excessively pressed down and damaging the semiconductor device.

[0066] Example 1

[0067] See Figure 1In this embodiment, the cavity opening device further includes: a first limiting block 142 and a second limiting block 143. The first limiting block 142 and the second limiting block 143 both protrude from the surface of the adapter plate 14 and extend towards the connecting rod 185, so that the height of the first limiting block 142 and the second limiting block 143 protruding from the adapter plate 14 is greater than or equal to the distance between the connecting rod 185 and the adapter plate 14, thereby limiting the connecting rod 185. The connecting rod 185 moves between the first limiting block 142 and the second limiting block 143 to prevent the connecting rod 185 from moving excessively in the first direction, causing the cavity cover 11 to be excessively lifted or excessively pressed down, thus damaging the semiconductor device.

[0068] Specifically, the first limiting block 142 is disposed above the groove in the sliding groove 151 to limit the sliding of the top end of the second support arm 162 during the descent of the cavity cover 11; the second limiting block 143 is disposed on the side away from the upper fixing block 141 to limit the sliding of the top end of the second support arm 162 during the descent of the cavity cover 11.

[0069] The distance between the first limiting block 142 and the second limiting block 143 is less than the length of the sliding groove 151. This prevents the top of the second support arm 162 from sliding along the first guide rail 13 to the end point of the cavity cover 11's rise (i.e., when the cavity cover 11 completes the cavity opening operation) and then the motor 184 from running idle, causing the cavity cover 11 to be excessively raised and damaging the semiconductor device.

[0070] Furthermore, the first limiting block 142 is provided with a first sensor for detecting whether the connecting rod 185 contacts the first sensor, thereby determining whether the cavity cover 11 has completed the cavity closing operation; the second limiting block 143 is provided with a second sensor for detecting whether the connecting rod 185 contacts the second sensor, thereby determining whether the cavity cover 11 has completed the cavity opening operation.

[0071] Specifically, both the first and second sensors transmit signals to the motor 184, controlling its opening and closing. During the descent of the cavity cover 11, when the first sensor detects that the connecting rod 185 contacts the first sensor, the first sensor sends a signal to the motor 184, controlling the motor 184 to stop moving, preventing the motor 184 from spinning idly and causing the cavity cover 11 to be excessively pressed down. During the ascent of the cavity cover 11, when the second sensor detects that the connecting rod 185 contacts the second sensor, the second sensor sends a signal to the motor 184, controlling the motor 184 to stop moving, preventing the motor 184 from spinning idly and causing the cavity cover 11 to be excessively raised.

[0072] Example 2

[0073] See Figure 1and Figure 2 In this embodiment, the support assembly of the cavity cover 11 further includes a plurality of second guide rails 17. The plurality of second guide rails are fixed side by side on the surface of the frame 12 along the first direction and are located between the adapter plate 14 and the frame 12; each second guide rail 17 is connected to the adapter plate 14 through a second connecting block 171, so that the adapter plate 14 can slide on the second guide rail 17 along the first direction, thereby driving the motion module to move along the first direction and realizing the translation of the cavity cover 11.

[0074] In summary, the cavity opening device provided by this utility model can achieve smooth lifting and lowering of the cavity cover. By symmetrically arranging each pair of motion modules, it prevents the cavity cover from drooping and becoming eccentric. Furthermore, by addressing the issues of excessive lifting or lowering of the cavity cover through the structure and positional relationship of the sliding groove, the first limiting block, and the second limiting block, it effectively prevents the cavity cover from being bumped and improves the safety and efficiency of semiconductor equipment.

[0075] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A scissor-lift open cavity device, characterized in that, The utility model relates to a kind of lifting device, including: Supporting assembly is located at the top of cavity cover; Driving assembly is fixed on the supporting assembly, and the driving end of driving assembly can provide driving force along the first direction; At least one pair of movement module is arranged on the upper surface of the cavity cover, and movement module is symmetrically distributed about the center of cavity cover; Each movement module includes: Connecting part is fixed on the cavity cover; Lifting part includes first support arm and second support arm, and the first support arm and the second support arm are arranged across, and the first support arm and the second support arm are rotatably connected along the intersection part; The top end of the first support arm is rotatably connected with the supporting assembly, and the bottom end is slidably connected with the connecting part, which can slide along the first direction; The top end of the second support arm is connected with the driving end of the driving assembly, and the bottom end is rotatably connected with the connecting part.

2. The scissor lift open cavity apparatus of claim 1, wherein, The connecting part includes: Sliding groove is arranged on the surface of the cavity cover, and the bottom end of the first support arm is connected with the sliding groove; Lower fixed block is fixed on the cavity cover, and the bottom end of the second support arm is hingedly connected with the lower fixed block.

3. The scissor lift open cavity apparatus of claim 2, wherein, The side of the sliding groove close to the lower fixed block is provided with a groove, and the depth of the groove is greater than the depth of the sliding groove.

4. The scissor lift open cavity apparatus of claim 2, wherein, The driving assembly includes: Power part is fixed on the supporting assembly, for providing driving force along the first direction; A plurality of first guide rails are arranged along the first direction and symmetrically fixed on the supporting assembly; Connecting rod is slidably connected on a plurality of first guide rails and connected with the power part; Upper sliding block is fixedly connected with the connecting rod and hingedly connected with the top end of the second support arm, to drive the top end of the second support arm to move along the first direction.

5. The scissor lift open cavity apparatus of claim 4, wherein, The power part is located on the symmetry axis of each pair of movement modules.

6. The scissor lift open cavity apparatus of claim 4, wherein, The power part includes: Motor; Screw rod is connected with the output end of the motor through a coupling and connected with the connecting rod, to drive the connecting rod to move along the first direction.

7. The scissor lift open cavity apparatus of claim 6, wherein, The supporting assembly includes: Rack is arranged on the top of the cavity cover; Support frame is fixedly arranged on both sides of the cavity, and is fixedly connected with the rack, so that the rack and the support frame jointly provide support for the driving assembly and the movement module; A plurality of second guide rails are arranged along the first direction and fixedly connected with the rack; Adapter plate is slidably connected with the plurality of second guide rails; Fixed plate is located below the adapter plate and is fixedly connected with the adapter plate, for fixing the motor; Upper fixed block is fixed on the adapter plate and is hingedly connected with the top end of the first support arm, to drive the cavity cover to move along the first direction through the adapter plate.

8. The scissor lift open cavity apparatus of claim 7, wherein, Further including: First limiting block and second limiting block both protrude from the surface of the adapter plate and extend towards the connecting rod;The height of the first limiting block and the second limiting block protruding from the adapter plate is greater than or equal to the distance between the connecting rod and the adapter plate.

9. The scissor lift open cavity apparatus of claim 8, wherein, The distance between the first limiting block and the second limiting block is less than the length of the sliding groove.

10. The scissor lift open cavity apparatus of claim 9, wherein, First sensor is arranged on the first limiting block, for detecting whether the connecting rod contacts the first sensor;Second sensor is arranged on the second limiting block, for detecting whether the connecting rod contacts the second sensor.