Semiconductor device punching device
By combining clamping components and shock-absorbing components, the mechanical damage and punching failure caused by lack of fixation during the punching process of semiconductor devices are solved, achieving more efficient processing and lower damage risk, and improving the yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-18
- Publication Date
- 2026-03-20
AI Technical Summary
Mechanical damage and punching failures in semiconductor devices due to lack of fixation during the punching process.
The semiconductor device punching device employs a clamping assembly and a shock-absorbing assembly. The clamping assembly fixes the semiconductor wafer and evenly distributes the external force, while the shock-absorbing assembly buffers the impact force generated during punching and reduces the risk of damage.
The increased punching speed reduces the risk of damage to semiconductor devices, thereby improving yield and processing efficiency.
Smart Images
Figure CN224011052U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor, concretely relates to semiconductor device punching device. BACKGROUND
[0002] Semiconductor device is the electronic component made of semiconductor material's unique electrical characteristics, can control, amplify or convert electrical signal, is the cornerstone of modern electronic technology. Its core principle is based on the one-way conductivity of PN junction, forms N type or P type semiconductor through doping. Common types include diode, transistor, field effect transistor, thyristor and integrated circuit.
[0003] Semiconductor device needs to be cut into specific size and shape before packaging to meet the circuit design requirement, and semiconductor device is usually fragile, and will be subjected to certain impact force during punching, and if not fixed well, the device can be cracked, broken or mechanically damaged due to uneven stress.
[0004] Therefore, the semiconductor device punching device is provided. CONTENT OF THE UTILITY MODEL
[0005] The utility model discloses a semiconductor device punching device.
[0006] The utility model discloses a semiconductor device punching device to solve the problem that semiconductor device is not fixed and leads to punching failure.
[0007] The utility model discloses a semiconductor device punching device, including workbench, the bottom all fixedly connected with support leg around workbench, the bottom of workbench is provided with shock absorption subassembly, the left and right sides of workbench top are fixedly connected with support frame, support frame is fixedly connected with top plate between, the top of workbench is set up rectangular groove, the inside fixedly connected with base of rectangular groove, the top center of base is fixedly connected with support plate, the top of support plate is provided with semiconductor wafer, the left and right sides of base top are provided with clamping plate, the top center fixedly connected with punching press mechanism of top plate, the bottom of punching press mechanism is provided with punch plate, the top of workbench is provided with clamping assembly.
[0008] Further, the clamping assembly includes a concave groove formed in the inside of the base, a stepper motor is fixedly connected to the inside bottom end of the concave groove, the output end of the stepper motor is fixedly connected with a rotating shaft, the output end of the rotating shaft is fixedly connected with a gear, the left and right sides of the inside of the concave groove are movably connected with rectangular rods, the side of the rectangular rods that are close to each other is fixedly connected with a rack, the gear and the rack are meshed with each other, the side of the top of the rectangular rods that are away from each other is fixedly connected with a fixed rod.
[0009] Further, the shape and volume of the fixed rod are adapted to the inside of the concave groove.
[0010] Further, the shockproof assembly includes an anti-skid pad arranged at the bottom of the supporting leg, the bottom of the supporting leg is fixedly connected with a fixed plate one, the bottom of the fixed plate one is fixedly connected with a compression spring, the output end of the compression spring is fixedly connected with a movable plate, the bottom of the fixed plate one is fixedly connected with a fixed frame on the left and right sides, the bottom of the fixed frame and the bottom of the movable plate are provided with a damper, and the output end of the damper is fixedly connected with a fixed plate two.
[0011] Further, the shape and volume of the fixed plate two are matched with the inside of the anti-skid pad.
[0012] Further, the output end of the stamping mechanism and the top of the stamping plate are fixedly connected with a rectangular plate, and the rectangular plates are threadedly connected with screws.
[0013] The beneficial effects of the utility model are as follows:
[0014] 1. The utility model discloses a semiconductor sheet cutting device, which comprises a base, a supporting plate is arranged on the base, a supporting leg is arranged on the top of the supporting plate, a clamping assembly is arranged on the top of the supporting plate, a shockproof assembly is arranged on the bottom of the supporting leg, a stamping mechanism is arranged on the top of the supporting plate, and a rectangular plate is arranged on the top of the stamping plate.
[0015] 2. The utility model discloses a semiconductor sheet cutting device, which comprises a base, a supporting plate is arranged on the base, a supporting leg is arranged on the top of the supporting plate, a clamping assembly is arranged on the top of the supporting plate, a shockproof assembly is arranged on the bottom of the supporting leg, a stamping mechanism is arranged on the top of the supporting plate, and a rectangular plate is arranged on the top of the stamping plate. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is the three-dimensional structure schematic diagram of the utility model;
[0017] Figure 2 It is the base schematic diagram of the utility model;
[0018] Figure 3 It is the clamping assembly schematic diagram of the utility model;
[0019] Figure 4 It is the shockproof assembly schematic diagram of the utility model;
[0020] Figure 5 It is the rectangular plate schematic diagram of the utility model;
[0021] Reference signs: 1, workbench; 2, support leg; 3, shockproof assembly; 301, non-slip pad; 302, fixed plate one; 303, compression spring; 304, movable plate; 305, fixed frame; 306, damper; 307, fixed plate two; 4, rectangular groove; 401, base; 402, support plate; 403, semiconductor wafer; 404, clamping plate; 405, punching mechanism; 406, punching plate; 5, clamping assembly; 501, concave groove; 502, stepping motor; 503, rotating shaft; 504, gear; 505, rectangular rod; 506, rack; 507, fixed rod; 6, rectangular plate; 601, screw; 7, support frame; 701, top plate. DETAILED DESCRIPTION
[0022] To make the objects, technical solutions, and advantages of the embodiments of the present application clearer, the following will be a clear and complete description of the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.
[0023] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.
[0024] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0025] In the description of the embodiments of the present application, it should be noted that the directions or position relationships indicated by the terms "inner", "outer", "upper", etc. are based on the directions or position relationships shown in the drawings, or the directions or position relationships commonly placed when the product of the present application is used, which are only for the convenience of describing the present application and simplifying the description, and cannot be understood as indicating or implying that the indicated device or element must have a particular direction, be constructed and operated in a particular direction, therefore, cannot be understood as a limitation on the present application.
[0026] As Figures 1 to 5As shown, the semiconductor device punching device, including the workbench 1, the bottom of the workbench 1 is fixedly connected with support legs 2 around, the bottom of the workbench 1 is provided with a shock absorbing assembly 3 for damping vibration, the top of the workbench 1 is fixedly connected with support frame 7 between the left and right sides, the support frame 7 is fixedly connected with the top plate 701, the top of the workbench 1 is provided with a rectangular slot 4, the inside of the rectangular slot 4 is fixedly connected with the base 401, the top of the base 401 is fixedly connected with the support plate 402 in the center, the top of the support plate 402 is provided with a semiconductor wafer 403, the left and right sides of the top of the base 401 are provided with a clamping plate 404, the top center of the top plate 701 is fixedly connected with a punching mechanism 405, the bottom of the punching mechanism 405 is provided with a punching plate 406, the top of the workbench 1 is provided with a clamping assembly 5 for driving the clamping plate 404 to clamp the semiconductor wafer 403.
[0027] It should be noted that the semiconductor wafer 403 is placed on the top of the support plate 402 first, and the clamping assembly 5 drives the clamping plate 404 to clamp and fix the semiconductor wafer 403, which avoids the situation of punching failure or rework caused by the movement of the semiconductor wafer 403, so as to improve the punching speed, shorten the processing time of a single semiconductor wafer 403, start the punching mechanism 405, the punching mechanism 405 drives the punching plate 406 to punch the semiconductor wafer 403, and the shock absorbing assembly 3 can buffer the impact force generated by punching to reduce the damage risk of the semiconductor wafer 403.
[0028] The clamping assembly 5 comprises a concave groove 501 opened in the inside of the base 401, the inside bottom end of the concave groove 501 is fixedly connected with a stepping motor 502, the output end of the stepping motor 502 is fixedly connected with a rotating shaft 503, the output end of the rotating shaft 503 is fixedly connected with a gear 504, the left and right sides of the inside of the concave groove 501 are movably connected with rectangular rods 505, one side of the rectangular rods 505 close to each other is fixedly connected with a rack 506, the gear 504 and the rack 506 are meshed with each other, the other side of the top of the rectangular rods 505 away from each other is fixedly connected with a fixed rod 507, the output end of the fixed rod 507 penetrates the concave groove 501 and is fixedly connected with the bottom of the clamping plate 404.
[0029] It should be noted that the stepping motor 502 is started, the stepping motor 502 drives the rotating shaft 503 to rotate forward or reverse through the output end, the rotating shaft 503 drives the gear 504 to rotate in the rotating process, the gear 504 drives the rack 506 meshed therewith to move in the rotating process, so that the rack 506 drives the rectangular rods 505 to move towards each other or away from each other, the rectangular rods 505 further drive the clamping plate 404 to move towards each other or away from each other through the fixed rod 507 in the moving process, so that the clamping plate 404 clamps and fixes the bottom of the semiconductor wafer 403, which can evenly distribute external force and protect the semiconductor wafer 403 from being damaged in the punching process, thereby improving the yield of products.
[0030] The shockproof assembly 3 comprises an antiskid pad 301 arranged at the bottom of the supporting leg 2, the bottom of the supporting leg 2 is fixedly connected with a fixed plate one 302, the bottom of the fixed plate one 302 is fixedly connected with a compression spring 303, the output end of the compression spring 303 is fixedly connected with a movable plate 304, the bottom of the fixed plate one 302 is fixedly connected with a fixed frame 305 on the left and right sides, the bottom of the fixed frame 305 and the bottom of the movable plate 304 are provided with a damper 306, the output end of the damper 306 is fixedly connected with a fixed plate two 307, and the fixed plate two 307 is located at the inner bottom end of the antiskid pad 301.
[0031] It should be noted that when the device is subjected to vibration, the compression spring 303 will be compressed or stretched according to the intensity of the vibration, thereby absorbing part of the vibration energy, at the same time, the fluid or gas in the damper 306 will flow, further consuming vibration energy, reducing the amplitude and frequency of vibration, effectively reducing the impact of these vibrations, ensuring the punching precision of the punching plate 406, and ensuring the stability of product quality.
[0032] The output end of the punching mechanism 405 and the top of the punching plate 406 are fixedly connected with a rectangular plate 6, and the rectangular plates 6 are threadedly connected with screws 601.
[0033] It should be noted that by rotating the screws 601 in reverse, the punching plate 406 can be conveniently replaced or repaired when damaged.
[0034] In summary: first, the semiconductor wafer 403 is placed on the top of the supporting plate 402, and the clamping assembly 5 drives the clamping plate 404 to clamp and fix the semiconductor wafer 403, which avoids the situation that punching fails or needs to be reworked due to movement of the semiconductor wafer 403, thereby improving the punching speed and shortening the processing time of a single semiconductor wafer 403, the punching mechanism 405 is started, and the punching mechanism 405 drives the punching plate 406 to punch the semiconductor wafer 403, and the shockproof assembly 3 can buffer the impact force generated by punching to reduce the risk of damage to the semiconductor wafer 403.
[0035] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection required by the present application is defined by the appended claims and their equivalents.
Claims
1. A semiconductor device punching apparatus, characterized in that, The workbench (1) includes a workbench (1), with support legs (2) fixedly connected to the bottom of the workbench (1) and a shock-absorbing component (3) at the bottom of the workbench (1). Support frames (7) are fixedly connected to the left and right sides of the top of the workbench (1), and a top plate (701) is fixedly connected between the support frames (7). A rectangular groove (4) is opened on the top of the workbench (1), and a base (401) is fixedly connected inside the rectangular groove (4). A support plate (402) is fixedly connected to the top center of the base (401), and a semiconductor chip (403) is set on the top of the support plate (402). Clamping plates (404) are set on the left and right sides of the top of the base (401). A stamping mechanism (405) is fixedly connected to the top center of the top of the top plate (701), and a stamping plate (406) is set at the bottom of the stamping mechanism (405). A clamping component (5) is set on the top of the workbench (1).
2. The semiconductor device punching apparatus according to claim 1, characterized in that, The clamping assembly (5) includes a concave groove (501) inside the base (401). A stepper motor (502) is fixedly connected to the bottom of the concave groove (501). A rotating shaft (503) is fixedly connected to the output end of the stepper motor (502). A gear (504) is fixedly connected to the output end of the rotating shaft (503). Rectangular rods (505) are movably connected to the left and right sides inside the concave groove (501). A rack (506) is fixedly connected to the side of the rectangular rods (505) that are close to each other. The gear (504) and the rack (506) mesh with each other. A fixing rod (507) is fixedly connected to the top of the rectangular rods (505) that are far apart from each other.
3. The semiconductor device punching apparatus according to claim 2, characterized in that, The shape and volume of the fixing rod (507) are adapted to the interior of the concave groove (501).
4. The semiconductor device punching apparatus according to claim 1, characterized in that, The shock absorption assembly (3) includes an anti-slip pad (301) set at the bottom of the support leg (2), a fixed plate (302) fixedly connected to the bottom of the support leg (2), a compression spring (303) fixedly connected to the bottom of the fixed plate (302), a movable plate (304) fixedly connected to the output end of the compression spring (303), a fixed frame (305) fixedly connected to the left and right sides of the bottom of the fixed plate (302), a damper (306) set at the bottom of the fixed frame (305) and the bottom of the movable plate (304), and a fixed plate (307) fixedly connected to the output end of the damper (306).
5. The semiconductor device punching apparatus according to claim 4, characterized in that, The shape and volume of the fixing plate 2 (307) are adapted to the interior of the anti-slip pad (301).
6. The semiconductor device punching apparatus according to claim 1, characterized in that, The output end of the stamping mechanism (405) and the top of the stamping plate (406) are fixedly connected to a rectangular plate (6), and screws (601) are threadedly connected between the rectangular plates (6).