Arrangement feeding structure of semiconductor with pins

Abstract

The utility model discloses an arranging and feeding structure for semiconductors with pins, which relates to the technical field of arranging and feeding structures and comprises a feeding device, and one side of the feeding device is fixedly connected with an arranging device. The other side of the arranging device is fixedly connected with the feeding device; according to the automatic feeding device, before feeding, the feeding device drives the first toothed plate through the first gear motor, the first toothed plate is matched with the first guide rail and the first sliding base to achieve automatic movement of the first movable plate, and the first lifting air cylinder and the first rodless air cylinder clamping jaw automatically complete tray clamping; the semiconductor suction cup automatically arranges pin semiconductors through the front-back moving device, the left-right moving device and the up-down moving device, the first lead screw lifting structure automatically adjusts the height of the platform, frequent manual intervention is not needed in the whole process, and compared with traditional manual operation, manpower input can be greatly reduced, the single feeding arrangement period is shortened, and the production efficiency is improved. And the production quantity in unit time is increased, so that the production efficiency is remarkably improved.

Description

Technical Field

[0001] This utility model specifically relates to the field of detection device technology, and more specifically to a feeding structure with leaded semiconductors. Background Technology

[0002] Semiconductor packaging utilizes film technology and microfabrication techniques to attach chips to lead frames using solder paste, flexible solder, and other bonding materials via specialized bonding equipment. This creates terminals, which are then encapsulated and secured with a plastic insulating medium to form the overall structure. With the continuous advancement of semiconductor technology, chip integration is increasing, placing increasingly stringent demands on packaging technology. In the packaging process, the arrangement and loading of semiconductors with leads is a critical step; its precision and efficiency directly impact the quality and production efficiency of the entire packaging process.

[0003] Early semiconductor loading methods relied on manual labor or simple mechanical devices, such as drawer-type loading devices. This method was not suitable for semiconductors with leads, as it made it difficult to achieve precise arrangement and rapid loading, and could not meet the needs of large-scale production.

[0004] For semiconductor components with dense pins and tiny dimensions, it is difficult to ensure the accuracy of component arrangement and the precision of loading position by manual operation or traditional equipment. This can easily lead to problems such as pin damage and poor connection during subsequent packaging or assembly, affecting product quality and performance.

[0005] Different types and specifications of leaded semiconductor components have differences in the number of pins, spacing, and arrangement. Traditional equipment is difficult to adapt flexibly to these changes, requiring frequent equipment replacement or complex debugging, which reduces production efficiency and equipment versatility. Utility Model Content

[0006] The purpose of this invention is to provide a feeding structure with leaded semiconductors. By installing a feeding device, a arranging device, and a feeding device, the feeding structure ensures feeding accuracy while reducing labor costs, thereby solving the technical problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A feeding structure for arranging semiconductors with leads, comprising:

[0009] A feeding device, one side of which is fixedly connected to an arranging device; the other side of the arranging device is fixedly connected to a feeding device.

[0010] The feeding device includes a frame, the inner side of the upper end of the frame is fixedly connected to an upper mounting plate, a gear motor is mounted on the upper surface of the upper mounting plate, the end of the gear motor passes through the upper mounting plate and meshes with a gear plate, and the gear plate is fixedly mounted on the upper surface of the movable plate.

[0011] The lower surface of the upper mounting plate is also symmetrically provided with guide rails. The guide rails are slidably connected to multiple slides. The slides are symmetrically fixedly installed on the upper surface of the movable plate. The lower surface of the movable plate is symmetrically provided with lifting cylinders. The ends of the lifting cylinders are fixedly connected to their respective connecting plates. The lower surface of the connecting plate is symmetrically provided with rodless cylinder grippers.

[0012] As a further technical solution of this utility model, a motor is installed on the upper end of the frame, the bottom of the motor is connected to the lead screw lifting structure, the upper and lower ends of one side of the lead screw lifting structure are fixedly connected to the frame, one side of the lead screw lifting structure is also fixedly connected to the mounting plate arranged symmetrically, and the upper end of the mounting plate is fixedly connected to the rodless cylinder seat arranged symmetrically.

[0013] As a further technical solution of this utility model, the upper end of the rodless cylinder seat is fixedly connected to the moving platform, the upper end of the moving platform is slidably connected to the tray, and the tray is movably connected to the multiple rodless cylinder grippers symmetrically arranged at the upper end; the mounting plate, the rodless cylinder seat, the moving platform and the tray are all arranged inside the frame.

[0014] As a further technical solution of this utility model, one side of the frame is fixedly connected to the placement plate, and the other side of the placement plate is fixedly connected to the frame; the upper end of one side of the frame is fixedly connected to the fixing frame, the fixing frames are symmetrically arranged, and the other fixing frame is fixedly connected to the upper end of one side of the frame.

[0015] As a further technical solution of this utility model, the upper end of the fixed frame is connected to the front and rear moving device, the upper end of the front and rear moving device is connected to the left and right moving device, one side of the left and right moving device is connected to the up and down moving device, and a semiconductor suction cup is installed on the up and down moving device.

[0016] As a further technical solution of this utility model, the upper inner side of the frame 2 is fixedly connected to the upper mounting plate 2, and the upper surface of the upper mounting plate 2 is equipped with a gear motor 2. The end of the gear motor 2 passes through the upper mounting plate 2 and meshes with the gear plate 2. The gear plate 2 is fixedly installed on the upper surface of the movable plate 2.

[0017] As a further technical solution of this utility model, the lower surface of the upper mounting plate two is also symmetrically provided with guide rail two, the guide rail two is slidably connected with multiple slide blocks two, the slide blocks two are symmetrically fixedly installed on the upper surface of the movable plate two, the lower surface of the movable plate two is symmetrically provided with lifting cylinder two, the ends of the lifting cylinder two are fixedly connected to their respective connecting plates two, and the lower surface of the connecting plates two is symmetrically provided with rodless cylinder grippers two.

[0018] As a further technical solution of this utility model, a motor is installed on the upper end of the frame two, the bottom of the motor two is connected to the lead screw lifting structure two, the upper and lower ends of one side of the lead screw lifting structure two are fixedly connected to the frame two, one side of the lead screw lifting structure two is also fixedly connected to the mounting plate two arranged symmetrically, the upper end of the mounting plate two is fixedly connected to the placement platform, and the upper end of the placement platform is movably connected to multiple arranged trays.

[0019] As a further technical solution of this utility model, the arrangement tray is movably connected to a plurality of rodless cylinder grippers symmetrically arranged at the upper end; the mounting plate, the placement platform and the arrangement tray are all arranged on the inner side of the frame.

[0020] Compared with the prior art, the beneficial effects of this utility model are:

[0021] In this invention, before feeding, the feeding device uses a gear motor to drive a toothed plate, which, together with a guide rail and a slide, enables the automatic movement of the moving plate. A lifting cylinder and a rodless cylinder gripper automatically clamp the tray. The semiconductor suction cup automatically arranges the lead semiconductors through a front-back moving device, a left-right moving device, and a up-down moving device. The lead screw lifting structure automatically adjusts the platform height. The entire process requires no frequent manual intervention. Compared with traditional manual operation, it can significantly reduce manpower input, shorten the single feeding and arrangement cycle, and increase the production quantity per unit time, thereby significantly improving production efficiency, reducing labor intensity, and meeting the needs of large-scale production.

[0022] In this invention, the precise meshing transmission between gear motor one and gear plate one and gear motor two and gear plate two, combined with the guiding effect of guide rail one and slide one and guide rail two and slide two, can control the positional error of moving plate one and moving plate two within a very small range, achieving precise horizontal movement; lifting cylinder one and lifting cylinder two can respectively precisely control the lifting height of rodless cylinder gripper one and rodless cylinder gripper two, ensuring the vertical positioning accuracy of the pallet and the arranged pallets;

[0023] This utility model, under the coordinated control of the front-to-back moving device, the left-to-right moving device and the up-to-down moving device, can accurately adsorb and arrange the lead semiconductors onto the arrangement tray according to a preset program, effectively avoiding misalignment of the lead semiconductors, improving product quality and reducing the scrap rate. At the same time, by adjusting the control program, it can adapt to lead semiconductors of different shapes and sizes, as well as different arrangement rules and requirements, enhancing the equipment's versatility.

[0024] In this utility model, the first and second lead screw lifting structures are driven by motor one and motor two respectively. The height of the moving platform one and the placement platform can be flexibly adjusted according to the size and quantity of the pallets and the arrangement of pallets in actual production, so as to make reasonable use of equipment space. Whether it is small batch production or large-scale mass production, it can meet the pallet storage needs and improve the versatility and adaptability of the equipment. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0026] Figure 2 This utility model Figure 1 Top view.

[0027] Figure 3 This utility model Figure 2 A bottom view.

[0028] Figure 4 This utility model Figure 2 A schematic diagram of the split structure.

[0029] Figure 5 This utility model Figure 4 Front view.

[0030] Figure 6 This utility model Figure 4 A schematic diagram of the split structure.

[0031] Figure 7 This utility model Figure 6 Top view.

[0032] Figure 8 This utility model Figure 7 A bottom view.

[0033] In the diagram: 1-feeding device, 2-arranging device, 3-loading device;

[0034] 11-Frame 1, 12-Upper mounting plate 1, 13-Gear motor 1, 14-Guide rail 1, 15-Slide 1, 16-Moving plate 1, 17-Gear plate 1, 18-Lifting cylinder 1, 19-Connecting plate 1, 110-Rodless cylinder gripper 1, 111-Motor 1, 112-Screw lifting structure 1, 113-Mounting plate 1, 114-Rodless cylinder seat 1, 115-Moving platform 1, 116-Pattern;

[0035] 21-Placement plate, 22-Fixing frame, 23-Front-back moving device, 24-Left-right moving device, 25-Up-down moving device, 26-Semiconductor chuck;

[0036] 31-Frame 2, 32-Upper mounting plate 2, 33-Gear motor 2, 34-Guide rail 2, 35-Slide 2, 36-Moving plate 2, 37-Gear plate 2, 38-Lifting cylinder 2, 39-Connecting plate 2, 310-Rodless cylinder gripper 2, 311-Motor 2, 312-Screw lifting structure 2, 313-Mounting plate 2, 314-Placement platform, 315-Arrangement tray. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] Please see Figure 1-8 In this embodiment of the present invention, a feeding structure with leaded semiconductors includes a feeding device 1, one side of which is fixedly connected to a feeding device 2; the other side of the feeding device 2 is fixedly connected to a feeding device 3.

[0039] The feeding device 1 includes a frame 11, the upper inner side of which is fixedly connected to an upper mounting plate 12. A gear motor 13 is mounted on the upper surface of the upper mounting plate 12. The end of the gear motor 13 passes through the upper mounting plate 12 and meshes with a toothed plate 17. The toothed plate 17 is fixedly mounted on the upper surface of a movable plate 16.

[0040] The lower surface of the upper mounting plate 12 is also symmetrically provided with guide rails 14. The guide rails 14 are slidably connected with multiple slides 15. The slides 15 are symmetrically fixedly installed on the upper surface of the movable plate 16. The lower surface of the movable plate 16 is symmetrically provided with lifting cylinders 18. The ends of the lifting cylinders 18 are fixedly connected to their respective connecting plates 19. The lower surface of the connecting plate 19 is symmetrically provided with rodless cylinder grippers 110.

[0041] The frame 11 is equipped with a motor 111 at its upper end. The bottom of the motor 111 is connected to the lead screw lifting structure 112. The upper and lower ends of one side of the lead screw lifting structure 112 are fixedly connected to the frame 11. One side of the lead screw lifting structure 112 is also fixedly connected to the mounting plate 113 which is symmetrically arranged. The upper end of the mounting plate 113 is fixedly connected to the rodless cylinder seat 114 which is symmetrically arranged.

[0042] The upper end of the rodless cylinder seat 114 is fixedly connected to the moving platform 115, the upper end of the moving platform 115 is slidably connected to the tray 116, and the tray 116 is movably connected to a plurality of rodless cylinder grippers 110 symmetrically arranged at the upper end; the mounting plate 113, the rodless cylinder seat 114, the moving platform 115 and the tray 116 are all located on the inner side of the frame 11.

[0043] By adopting the above technical solution, before feeding, the feeding device 1 uses a gear motor 13 to drive the toothed plate 17, which, together with the guide rail 14 and the slide block 15, realizes the automatic movement of the moving plate 16. The lifting cylinder 18 and the rodless cylinder gripper 110 automatically clamp the tray 116. The semiconductor suction cup 26 automatically arranges the lead semiconductors through the front and rear moving device 23, the left and right moving device 24 and the up and down moving device 25. The screw lifting structure 112 automatically adjusts the platform height. The whole process does not require frequent manual intervention. Compared with traditional manual operation, it can greatly reduce manpower input, shorten the single feeding and arrangement cycle, and increase the production quantity per unit time, thereby significantly improving production efficiency, reducing labor intensity, and meeting the needs of large-scale production.

[0044] In this embodiment, one side of the frame 11 is fixedly connected to the placement plate 21, and the other side of the placement plate 21 is fixedly connected to the frame 21; the upper end of one side of the frame 11 is fixedly connected to the fixing frame 22, the fixing frames 22 are symmetrically arranged, and the other fixing frame 22 is fixedly connected to the upper end of one side of the frame 21.

[0045] The upper end of the fixed frame 22 is connected to the front and rear moving device 23, the upper end of the front and rear moving device 23 is connected to the left and right moving device 24, one side of the left and right moving device 24 is connected to the up and down moving device 25, and a semiconductor chuck 26 is installed on the up and down moving device 25.

[0046] By adopting the above technical solution, the semiconductor chuck 26, under the coordinated control of the front and rear moving device 23, the left and right moving device 24, and the up and down moving device 25, can accurately adsorb and arrange the lead semiconductors onto the arrangement tray 315 according to the preset program, effectively avoiding misalignment of the lead semiconductors, improving product quality, and reducing the scrap rate. At the same time, by adjusting the control program, it can adapt to lead semiconductors of different shapes and sizes, as well as different arrangement rules and requirements, enhancing the equipment's versatility.

[0047] In this embodiment, the inner side of the upper end of the frame 2 31 is fixedly connected to the upper mounting plate 2 32. A gear motor 2 33 is installed on the upper surface of the upper mounting plate 2 32. The end of the gear motor 2 33 passes through the upper mounting plate 2 32 and meshes with the toothed plate 2 37. The toothed plate 2 37 is fixedly installed on the upper surface of the movable plate 2 36.

[0048] The lower surface of the upper mounting plate 2 32 is also symmetrically provided with guide rail 2 34. The guide rail 2 34 is slidably connected with multiple slide blocks 2 35. The slide blocks 2 35 are symmetrically fixedly installed on the upper surface of the movable plate 2 36. The lower surface of the movable plate 2 36 is symmetrically provided with lifting cylinder 2 38. The ends of the lifting cylinder 2 38 are fixedly connected to their respective connecting plates 2 39. The lower surface of the connecting plate 2 39 is symmetrically provided with rodless cylinder grippers 2 310.

[0049] By adopting the above technical solution, the precise meshing transmission between gear motor 13 and gear plate 17 and gear motor 23 and gear plate 27, combined with the guiding effect of guide rail 14 and slide 15 and guide rail 24 and slide 25, can control the position error of moving plate 16 and moving plate 236 within a very small range, achieving precise horizontal movement; lifting cylinder 18 and lifting cylinder 238 can respectively precisely control the lifting height of rodless cylinder gripper 110 and rodless cylinder gripper 2310, ensuring the vertical positioning accuracy of the pallet and the arranged pallet 315.

[0050] In this embodiment, a motor 311 is installed on the upper end of the frame 31. The bottom of the motor 311 is connected to the lead screw lifting structure 312. The upper and lower ends of one side of the lead screw lifting structure 312 are fixedly connected to the frame 31. One side of the lead screw lifting structure 312 is also fixedly connected to the mounting plate 313 arranged symmetrically. The upper end of the mounting plate 313 is fixedly connected to the placement platform 314. The upper end of the placement platform 314 is movably connected to multiple arranged trays 315.

[0051] The arrangement tray 315 is movably connected to a plurality of rodless cylinder grippers 310 arranged symmetrically at the upper end; the mounting plate 313, the placement platform 314 and the arrangement tray 315 are all located on the inner side of the frame 31.

[0052] By adopting the above technical solution, the screw lifting structure 112 and the screw lifting structure 312 are driven by motor 111 and motor 311 respectively. The height of the moving platform 115 and the placement platform 314 can be flexibly adjusted according to the size and quantity of the pallets and the arrangement of pallets in actual production, so as to make reasonable use of equipment space. Whether it is small batch production or large batch production, it can meet the pallet storage needs and improve the versatility and adaptability of the equipment.

[0053] The working principle of this utility model is as follows: After the gear motor 13 starts, the gear plate 17 will generate linear motion under the drive of the gear. The gear plate 17 drives the moving plate 16 to move in the same direction. At the same time, the cooperation of the guide rail 14 and the slide block 15 plays the role of guiding and stabilizing the movement of the moving plate 16, ensuring that the moving plate 16 slides smoothly along the predetermined direction. The lifting cylinder 18 symmetrically installed on the lower surface of the moving plate 16 can realize the height adjustment of the rodless cylinder gripper 110 under the action of the lifting cylinder 18. When the moving plate 16 moves to a suitable position above the tray 116, the lifting cylinder 18 extends, driving the rodless cylinder gripper 110 to descend. The rodless cylinder gripper 110 clamps the tray 116. Then the lifting cylinder 18 retracts, lifting the tray 116. Then, through the movement of the gear motor 13 and the gear plate 17, the tray 116 is moved to the placement plate 21.

[0054] Motor 111 drives the lead screw lifting structure 112 to move, thereby adjusting the height of the moving table 115; the rodless cylinder seat 114 at the bottom of the moving table 115 facilitates the placement of the tray 116 containing the lead semiconductor onto the moving table 115 by the conveyor belt or by manual labor, thus realizing the feeding operation.

[0055] Before feeding, the feeding device 1 uses a gear motor 13 to drive the toothed plate 17, which, together with the guide rail 14 and the slide 15, realizes the automatic movement of the moving plate 16. The lifting cylinder 18 and the rodless cylinder gripper 110 automatically clamp the tray 116. The semiconductor suction cup 26 automatically arranges the lead semiconductors through the front and back moving device 23, the left and right moving device 24 and the up and down moving device 25. The screw lifting structure 112 automatically adjusts the platform height. The whole process does not require frequent manual intervention. Compared with traditional manual operation, it can greatly reduce the input of manpower, shorten the single feeding and arrangement cycle, and increase the production quantity per unit time, thereby significantly improving production efficiency, reducing labor intensity, and meeting the needs of large-scale production.

[0056] The precise meshing transmission between gear motor 13 and gear plate 17, and gear motor 23 and gear plate 27, combined with the guiding effect of guide rail 14 and slide 15, guide rail 24 and slide 25, can control the positional error of moving plate 16 and moving plate 26 within a very small range, achieving precise horizontal movement; lifting cylinder 18 and lifting cylinder 28 can respectively precisely control the lifting height of rodless cylinder gripper 110 and rodless cylinder gripper 210, ensuring the vertical positioning accuracy of the pallet and the arranged pallet 315;

[0057] After the tray 116 is placed on the placement plate 21, the semiconductor chuck 26 moves above the placement plate 21 under the drive of the front-back, left-right, and up-down moving device. Using the suction force of the semiconductor chuck 26, the randomly placed lead semiconductors are picked up one by one. At this time, the gear motor 23 and the toothed plate 27 move, driving the guide rail 24 and the slide 25 to slide. At the same time, the lifting cylinder 28, which is symmetrically arranged on the lower surface of the moving plate 26, moves downward. The rodless cylinder gripper 210 moves downward as well, gripping the arrangement tray 315. After gripping, it moves below the semiconductor chuck 26. Then, the semiconductor chuck 26 arranges the picked-up lead semiconductors in an orderly manner on the arrangement tray 315, realizing the arrangement and sorting of the lead semiconductors. After the arrangement is completed, the arrangement tray 315 returns to the placement table 314 through the gear motor 23 and other structures for loading.

[0058] Under the coordinated control of the front-to-back moving device 23, the left-to-right moving device 24, and the up-to-down moving device 25, the semiconductor chuck 26 can accurately pick up and arrange the lead semiconductors onto the arrangement tray 315 according to a preset program, effectively avoiding misalignment of the lead semiconductors, improving product quality, and reducing the scrap rate. At the same time, by adjusting the control program, it can adapt to lead semiconductors of different shapes and sizes, as well as different arrangement rules and requirements, enhancing the equipment's versatility.

[0059] The working principle of the feeding device 3 is similar to that of the feeding device 1. The gear motor 33 installed on the upper surface of the upper mounting plate 32 on the inner side of the upper end of the frame 31 drives the moving plate 36 to move by meshing with the toothed plate 37. The movement of the moving plate 36 is also guided and stabilized by the guide rail 34 and the slide 35. The lifting cylinder 38 symmetrically installed on the lower surface of the moving plate 36 can realize the height adjustment of the rodless cylinder gripper 310. When the arrangement tray 315 is placed on the placement table 314, the moving plate 36 moves to a suitable position above the arrangement tray 315. The lifting cylinder 38 drives the rodless cylinder gripper 310 to descend, clamp the arrangement tray 315, and then move it to the designated position for feeding.

[0060] The motor 311 installed at the upper end of the frame 31 is connected to the screw lifting structure 312. The height of the placement platform 314 can be adjusted by driving the screw lifting structure 312 through the motor 311, which facilitates the stacking and retrieval of the trays 315.

[0061] The screw lifting structure 112 and the screw lifting structure 312 are driven by motor 111 and motor 311 respectively. The height of the moving platform 115 and the placement platform 314 can be flexibly adjusted according to the size and quantity of the pallets and the arrangement of pallets in actual production, so as to make reasonable use of equipment space. Whether it is small batch production or large batch production, it can meet the pallet storage needs and improve the versatility and adaptability of the equipment.

[0062] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0063] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A feeding structure for arranging semiconductor leads, characterized in that: include Feeding device (1), one side of which is fixedly connected to the arranging device (2); the other side of the arranging device (2) is fixedly connected to the feeding device (3); The feeding device (1) includes a frame (11), the upper inner side of the frame (11) is fixedly connected to the upper mounting plate (12), the upper surface of the upper mounting plate (12) is equipped with a gear motor (13), the end of the gear motor (13) passes through the upper mounting plate (12) and meshes with the toothed plate (17), the toothed plate (17) is fixedly installed on the upper surface of the moving plate (16); The lower surface of the upper mounting plate (12) is also symmetrically provided with guide rails (14). The guide rails (14) are slidably connected with multiple slide blocks (15). The slide blocks (15) are symmetrically fixedly installed on the upper surface of the moving plate (16). The lower surface of the moving plate (16) is symmetrically provided with lifting cylinders (18). The ends of the lifting cylinders (18) are fixedly connected to their respective connecting plates (19). The lower surface of the connecting plates (19) is symmetrically provided with rodless cylinder grippers (110).

2. The semiconductor arrangement and feeding structure according to claim 1, characterized in that: The upper end of the frame (11) is equipped with a motor (111). The bottom of the motor (111) is connected to the screw lifting structure (112). The upper and lower ends of one side of the screw lifting structure (112) are fixedly connected to the frame (11). One side of the screw lifting structure (112) is also fixedly connected to the mounting plate (113) which is symmetrically arranged. The upper end of the mounting plate (113) is fixedly connected to the rodless cylinder seat (114) which is symmetrically arranged.

3. The semiconductor arrangement and feeding structure according to claim 2, characterized in that: The upper end of the rodless cylinder seat (114) is fixedly connected to the moving platform (115), the upper end of the moving platform (115) is slidably connected to the tray (116), and the tray (116) is movably connected to a plurality of rodless cylinder grippers (110) symmetrically arranged at the upper end; the mounting plate (113), the rodless cylinder seat (114), the moving platform (115) and the tray (116) are all located on the inner side of the frame (11).

4. The semiconductor arrangement and feeding structure according to claim 3, characterized in that: One side of the frame one (11) is fixedly connected to the placement plate (21), and the other side of the placement plate (21) is fixedly connected to the frame two (31); the upper end of one side of the frame one (11) is fixedly connected to the fixing frame (22), the fixing frames (22) are symmetrically arranged, and the other fixing frame (22) is fixedly connected to the upper end of one side of the frame two (31).

5. The semiconductor arrangement and feeding structure according to claim 4, characterized in that: The upper end of the fixed frame (22) is connected to the front and rear moving device (23), the upper end of the front and rear moving device (23) is connected to the left and right moving device (24), one side of the left and right moving device (24) is connected to the up and down moving device (25), and a semiconductor chuck (26) is installed on the up and down moving device (25).

6. The semiconductor arrangement and feeding structure according to claim 5, characterized in that: The upper inner side of the frame 2 (31) is fixedly connected to the upper mounting plate 2 (32). The upper surface of the upper mounting plate 2 (32) is equipped with a gear motor 2 (33). The end of the gear motor 2 (33) passes through the upper mounting plate 2 (32) and meshes with the toothed plate 2 (37). The toothed plate 2 (37) is fixedly installed on the upper surface of the movable plate 2 (36).

7. The semiconductor arrangement and feeding structure according to claim 6, characterized in that: The lower surface of the upper mounting plate 2 (32) is also symmetrically provided with guide rail 2 (34), guide rail 2 (34) is slidably connected with multiple slide blocks 2 (35), slide blocks 2 (35) are symmetrically fixedly installed on the upper surface of the moving plate 2 (36), and lifting cylinder 2 (38) is symmetrically installed on the lower surface of the moving plate 2 (36). The ends of the lifting cylinder 2 (38) are fixedly connected to their respective connecting plates 2 (39), and rodless cylinder grippers 2 (310) are symmetrically provided on the lower surface of the connecting plates 2 (39).

8. The semiconductor arrangement and feeding structure according to claim 7, characterized in that: The upper end of the frame two (31) is equipped with a motor two (311). The bottom of the motor two (311) is connected to the screw lifting structure two (312). The upper and lower ends of one side of the screw lifting structure two (312) are fixedly connected to the frame two (31). One side of the screw lifting structure two (312) is also fixedly connected to the mounting plate two (313) which are symmetrically arranged. The upper end of the mounting plate two (313) is fixedly connected to the placement platform (314). The upper end of the placement platform (314) is movably connected to multiple arranged trays (315).

9. The semiconductor arrangement and feeding structure according to claim 8, characterized in that: The arrangement tray (315) is movably connected to multiple rodless cylinder grippers (310) arranged symmetrically at the upper end; the mounting plate (313), the placement platform (314) and the arrangement tray (315) are all located on the inner side of the frame (31).

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