Vacuum glass with metal net sealing structure

Abstract

The utility model provides vacuum glass with a metal net sealing structure, and relates to the technical field of vacuum glass sealing. The vacuum glass with the metal net sealing structure comprises a first glass layer and a second glass layer, the second glass layer and the first glass layer are arranged side by side at an interval; the sealing structure layer comprises a first bonding layer, a second bonding layer and a solder layer, the first bonding layer is arranged on one side of the first glass layer, the second bonding layer is arranged on one side, opposite to the first glass layer, of the second glass layer, and the solder layer is arranged between the first bonding layer and the second bonding layer; and the metal net is arranged in the solder layer. According to the vacuum glass with the metal net sealing structure, the metal net is additionally arranged in the solder layer of the sealing structure layer, so that the first glass layer and the second glass layer are better in air tightness after being sealed, the yield is improved, and the problem that the yield is not high when tin solder is used for air tightness sealing under the existing vacuum condition is effectively solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vacuum glass sealing technology, in particular to a vacuum glass with a metal mesh sealing structure. BACKGROUND

[0002] Vacuum glass without an air exhaust port does not need to drill holes on the glass surface, and is more beautiful, which is the current development trend, but this is a big challenge to the use of metal low-temperature solder sealing technology. For example, patent CN102079619B describes vacuum glass that sintered metal paste is used as a bonding layer, and then metal solder is used for sealing. If there is no air exhaust port, the solder needs to be heated and melted under vacuum to achieve airtight sealing.

[0003] However, even if the sealing is successful, the yield is low. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the present application is to provide a vacuum glass with a metal mesh sealing structure, which can improve the problem of low yield after sealing of the existing vacuum glass.

[0005] The embodiments of the present application are implemented as follows:

[0006] The embodiments of the present application provide a vacuum glass with a metal mesh sealing structure, comprising:

[0007] a first glass layer;

[0008] a second glass layer, which is arranged side by side with the first glass layer and has a spacing;

[0009] a sealing structure layer, which comprises a first adhesive layer, a second adhesive layer and a solder layer, the first adhesive layer is arranged on one side of the first glass layer, the second adhesive layer is arranged on the side of the second glass layer opposite to the first glass layer, and the solder layer is arranged between the first adhesive layer and the second adhesive layer; and

[0010] a metal mesh, which is arranged in the solder layer.

[0011] In addition, the vacuum glass with a metal mesh sealing structure provided by the embodiments of the present application can also have the following additional technical features:

[0012] In the optional embodiments of the present application, the expansion coefficient of the metal mesh is <20x10 -6 mm / (mm·℃).

[0013] In the optional embodiments of the present application, the metal mesh is a copper mesh, a titanium alloy mesh or a steel mesh.

[0014] In an optional embodiment of the present application, the width of the metal mesh is W2, the width of the sealing structure layer when sealed is sealing width W1, and the relationship between W2 and W1 satisfies: W1x0.3≤W2≤W1.

[0015] In an optional embodiment of the present application, the mesh of the metal mesh is 8-100 mesh.

[0016] In an optional embodiment of the present application, the mesh of the metal mesh is diamond or square.

[0017] In an optional embodiment of the present application, the thickness of the metal mesh is ≤0.6mm.

[0018] In an optional embodiment of the present application, the solder layer has at least one metal mesh.

[0019] In an optional embodiment of the present application, the first adhesive layer and the second adhesive layer are both sintered and / or deposited copper alloy layers.

[0020] Or, silver paste sintered silver layer.

[0021] Or, tin alloy containing Zn or Ti.

[0022] In an optional embodiment of the present application, the solder layer is tin alloy or indium alloy, and the melting point of the solder layer is 110-280℃.

[0023] The present application has the following advantages:

[0024] The vacuum glass with metal mesh sealing structure of the present application adds a metal mesh in the solder layer of the sealing structure layer, so that the first glass layer and the second glass layer have better air tightness after being sealed, and the yield is improved, effectively solving the problem of low yield when using tin solder for air tightness sealing under existing vacuum conditions. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0026] Fig. 1 The schematic diagram of the vacuum glass with metal mesh sealing structure provided by the embodiments of the present application;

[0027] Fig. 2 The schematic diagram of the diamond mesh metal mesh;

[0028] Fig. 3This is a schematic diagram of a square-mesh metal mesh.

[0029] Icons: 10 - First glass layer; 20 - Second glass layer; 31 - First adhesive layer; 32 - Second adhesive layer; 33 - Solder layer; 40 - Metal mesh. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0033] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product is conventionally placed during use. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0034] In the description of this application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] Example

[0036] Please refer to Figs. 1 to 3The embodiment of the present application provides a vacuum glass with a metal mesh sealing structure, comprising:

[0037] a first glass layer 10;

[0038] a second glass layer 20, the second glass layer 20 is arranged side by side with the first glass layer 10 and has a spacing;

[0039] a sealing structure layer, the sealing structure layer comprises a first adhesive layer 31, a second adhesive layer 32 and a solder layer 33, the first adhesive layer 31 is arranged on one side of the first glass layer 10, the second adhesive layer 32 is arranged on the side of the second glass layer 20 opposite to the first glass layer 10, and the solder layer 33 is arranged between the first adhesive layer 31 and the second adhesive layer 32; and

[0040] a metal mesh 40, the metal mesh 40 is arranged in the solder layer 33.

[0041] It should be noted that the first glass layer 10 and the second glass layer 20 are only respectively described for the adjacent two glass layers, and do not limit the product of the present application to only two glass layers. In addition, the support structure between the glass is relatively mature in the prior art, and will not be described here.

[0042] Briefly, by adding the metal mesh 40, the oxide film of the solder layer 33 is broken, the air tightness after sealing is improved, and the purpose of improving the yield is achieved.

[0043] Specifically, the expansion coefficient of the metal mesh 40 of the present application is <20x10 -6 mm / (mm·℃), more preferably <10x10 -6 mm / (mm·℃). Optionally, the metal mesh 40 is a copper mesh, a titanium alloy mesh or a steel mesh. Of course, these are examples and are not limited to only these types. As long as the expansion coefficient meets the requirements, other types of metals or alloys can also be selected as the metal mesh 40 according to the needs.

[0044] This is because the practical man of the present application finds through practical research on the prior art that the reason for the low yield of the prior art is that the solder used for sealing has an oxide film on the surface of tin, which is difficult to break during vacuum sealing, which reduces the yield. And, the expansion coefficient of tin is 23x10 -6 mm / (mm·℃), the expansion coefficient of glass is 9.0x10 -6 mm / (mm·℃), and there is a large difference between the two, which leads to a large stress during sealing. Therefore, the yield after sealing of the prior art has been low.

[0045] It is just this situation that provides a new scheme for improving the yield.

[0046] Further, the width of the metal mesh 40 of the present application is W2, and the width of the sealing structure layer when sealed is sealing width W1, and the relationship between W2 and W1 satisfies: W1 x 0.3 ≤ W2 ≤ W1. The width of the metal mesh 40 cannot be greater than the sealing width, but also cannot be too narrow, otherwise the effect is limited.

[0047] The mesh number of the metal mesh 40 is 8-100 mesh. If the mesh number is too large / the mesh is too small, it will lead to less solder tin, affecting the sealing strength, and if the mesh number is too small / the mesh is too large, the effect of breaking the oxide film is limited, resulting in a higher void rate after sealing.

[0048] Fig. 2 And Fig. 3 In the present application, the mesh of the metal mesh 40 is rhombic or square. It can be understood that this is only an example, and other shapes of the mesh are not limited to use, as long as the tin liquid can flow in the mesh to break the oxide film.

[0049] The thickness of the metal mesh 40 of the present application is ≤0.6mm. The embodiment of the present application uses one layer of metal mesh 40, but if the product is some large size vacuum glass, the number of layers of the metal mesh 40 can be more, that is, the solder layer 33 has at least one layer of metal mesh 40. This can make the tin liquid flow more fully when heated. Of course, the multi-layer described here does not limit that each layer must be independently separated, and can be connected or even staggered, as long as most of the structures are spaced apart, that is, the tin liquid flow requirement is met, thereby ensuring the breaking of the oxide film and improving the yield.

[0050] In the present application, the first adhesive layer 31 and the second adhesive layer 32 are both sintered and / or deposited copper alloy layers;

[0051] Or, a silver layer sintered by silver paste;

[0052] Or, a tin alloy containing Zn or Ti. Among them, Zn or Ti are active elements, and those skilled in the art can use other active elements accordingly, which are not limited to only these two.

[0053] No matter which adhesive layer, the enterprise or manufacturer can choose the appropriate material as the adhesive layer according to the material cost or the existing equipment.

[0054] Further, the solder layer 33 of the present application is a tin alloy or an indium alloy, and the melting point of the solder layer 33 is 110-280℃. The specific composition of the tin alloy or the indium alloy can have many choices, and those skilled in the art can use it as the solder layer 33 as long as the melting point of the selected material meets the range of the present application.

[0055] In addition, in the sealing stage, the metal mesh 40 can be pre-set in the solder layer 33 before sealing, or a layer of tin can be plated on the surface of the metal mesh 40, and then the metal mesh 40 is placed in the solder layer 33, and then sealing is performed.

[0056] For example:

[0057] In this embodiment, a certain mesh copper mesh is placed in the tin layer to realize sealing, which can improve the air tightness and reduce the sealing stress. For example, if the metal mesh 40 is made of copper, the expansion coefficient of copper is 17x10 -6 mm / (mm·℃), which is smaller than that of tin, and can be used as a framework in the solder to reduce the expansion degree of tin under heating, thereby relieving stress. At the same time, when heated in a vacuum, the tin in the holes of the metal mesh 40 flows under the action of pressure, which can break the oxide film of the tin, thereby improving the air tightness and yield of the sealing.

[0058] That is, the scheme of the present application not only improves the yield, but also improves the air tightness of the final product, and the performance of the product is better.

[0059] Compared with the known prior art, such as the 65th line of patent (CN102079619B), which also mentions placing a U-shaped metal sheet in the solder, but in practice, the yield is not high. Through research, it is found that although the metal sheet is added, the flat metal sheet is difficult to break the oxide film, so the yield is affected. It does not find the problem of the oxide film, and does not select the appropriate expansion coefficient, so the prior art does not find the key to break through the yield.

[0060] The vacuum glass with the metal mesh sealing structure of the present application is the result of practical research to find the key to solving the problem, and proposes the scheme of adding a metal mesh 40 to the solder layer 33. In the challenge of using tin solder to realize air tightness sealing in a vacuum and reduce the sealing stress, the problem is successfully solved, and the yield is improved. Through further research, the metal mesh 40 is diversified in material selection, mesh size design, thickness design, expansion coefficient selection, and width design, and the parameter selection that can successfully improve the yield is proposed, which effectively improves the existing problems.

[0061] In summary, the vacuum glass with the metal mesh sealing structure of the present application adds a metal mesh 40 to the solder layer 33 of the sealing structure layer, so that the first glass layer 10 and the second glass layer 20 have better air tightness after being sealed, and the yield is improved, which effectively improves the problem of low yield when using tin solder for air tightness sealing under existing vacuum conditions.

[0062] The above descriptions are only the preferred embodiments of the present application, and are not intended to limit the present application. The present application can have various modifications and changes for those skilled in the art. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A vacuum glass with a metal mesh sealing structure, characterized in that, include: First glass layer; A second glass layer is arranged side by side with a gap from the first glass layer; A sealing structure layer, comprising a first adhesive layer, a second adhesive layer, and a solder layer, wherein the first adhesive layer is disposed on one side of the first glass layer, the second adhesive layer is disposed on the side of the second glass layer opposite to the first glass layer, and the solder layer is disposed between the first adhesive layer and the second adhesive layer; as well as A metal mesh is disposed within the solder layer.

2. The vacuum glass with a metal mesh sealing structure according to claim 1, characterized in that, The coefficient of thermal expansion of the metal mesh is <20×10. -6 mm / (mm·℃).

3. The vacuum glass with a metal mesh sealing structure according to claim 1, characterized in that, The metal mesh is a copper mesh, a titanium alloy mesh, or a steel mesh.

4. The vacuum glass with a metal mesh sealing structure according to any one of claims 1-3, characterized in that, The width of the metal mesh is W2, and the width of the sealing structure layer during sealing is the sealing width W1. The relationship between W2 and W1 satisfies: W1×0.3≤W2≤W1.

5. The vacuum glass with a metal mesh sealing structure according to any one of claims 1-3, characterized in that, The mesh size of the metal mesh is 8 to 100 meshes.

6. The vacuum glass with a metal mesh sealing structure according to claim 5, characterized in that, The mesh of the metal mesh is diamond-shaped or square-shaped.

7. The vacuum glass with a metal mesh sealing structure according to any one of claims 1-3, characterized in that, The thickness of the metal mesh is ≤0.6mm.

8. The vacuum glass with a metal mesh sealing structure according to any one of claims 1-3, characterized in that, The solder layer contains at least one layer of metal mesh.

9. The vacuum glass with a metal mesh sealing structure according to claim 1, characterized in that, Both the first adhesive layer and the second adhesive layer are sintered and / or deposited copper alloy layers; Or, a silver layer sintered from silver paste; Alternatively, it could be a tin alloy containing Zn or Ti.

10. The vacuum glass with a metal mesh sealing structure according to claim 1, characterized in that, The solder layer is a tin alloy or an indium alloy, and the melting point of the solder layer is 110–280°C.

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