Airflow sensor and electronic atomizer with same

Abstract

The utility model relates to the field of airflow sensor manufacturing, and provides an airflow sensor and an electronic atomizer with the same. According to the airflow sensor, an MEMS chip and an ASIC chip are integrated on the same circuit board and are packaged by a device shell to form a compact sensing unit. The periphery of the circuit board is covered with the protective shell, and the protective shell and the circuit board form a protective cavity through the supporting ring, so that the sensing unit is shielded and supported. And the protective shell, the device shell and the circuit board are provided with multi-stage airflow holes for guiding airflow. The technology of MEMS, interconnection packaging, multi-stage protection and the like is comprehensively utilized, the integration level and reliability of the airflow sensor are greatly improved, the manufacturing process is simplified, the cost is reduced, meanwhile, intelligent control over the atomization process is achieved through application in an electronic atomizer, and a new application scene is developed for intelligent health electronic products.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of airflow sensor manufacturing, in particular to an airflow sensor and an electronic atomizer with the same. BACKGROUND

[0002] An airflow sensor is a device capable of detecting airflow speed and direction, widely used in meteorological observation, ventilation equipment control, air quality monitoring and other fields. Its core function is to calculate the parameters of airflow by measuring the physical effects caused by gas flow, such as temperature, pressure or speed changes.

[0003] Currently, the main types of airflow sensors include thermal, differential pressure, ultrasonic, etc. Among them, thermal airflow sensors are favored in many occasions due to their high precision, fast response, wide application range and other advantages. However, traditional thermal airflow sensors have complex structures, usually composed of airflow channels, heating elements, temperature sensing elements and other parts, requiring multiple assembly and connection steps, complicated production process and high cost. Currently, airflow sensor assembly structures are diverse, but generally include the following key parts: sensing element: usually a thermal element (such as a hot wire, a hot film) or a mechanical element (such as a moving piece, a vortex generator), used to sense changes in airflow. Signal processing unit: converts physical signals detected by the sensing element into electrical signals and performs amplification, filtering and other processing for subsequent analysis and display. Protective shell and support structure: provides protection for the sensor to ensure stable operation in harsh environments and supports the relative positions between components. During assembly, these components are combined through precise machining and assembly processes to form a complete sensor unit.

[0004] To improve the shortcomings of traditional thermal airflow sensors, some new technical solutions have emerged in the industry. One is to use MEMS technology to integrate the core components of the sensor on a chip, achieving miniaturization and integration, such as MEMS thermal flow sensors. Another is based on 3D printing technology to directly print the overall structure of the sensor, simplifying the assembly process, such as 3D printed airflow sensors.

[0005] However, these emerging technologies, while optimizing the structure and manufacturing process of the sensor to some extent, still have limitations. MEMS technology, while achieving miniaturization, has high costs, and reliability and consistency need to be improved. 3D printing technology, while simplifying the manufacturing process, has suboptimal performance and precision of printed materials, and complex post-processing. In addition, these solutions have high requirements for production equipment and processes, making them difficult to apply.

[0006] Therefore, how to further optimize the structural design, simplify the manufacturing process, reduce production costs and improve production efficiency while ensuring sensor performance is a problem that needs to be solved by those skilled in the art. Utility model content

[0007] In view of the above technical problems, the skilled in the art proposes an airflow sensor and an atomizer with the same, which can ensure the performance of the sensor while further optimizing the structural design, simplifying the manufacturing process, reducing the production cost, and improving the production efficiency.

[0008] An airflow sensor comprises a circuit board, a MEMS chip and an ASIC chip, the MEMS chip and the ASIC chip are arranged on the same circuit board, and a device housing that encompasses the MEMS chip and the ASIC chip is further arranged on the circuit board.

[0009] By arranging the MEMS chip and the ASIC chip on the same circuit board and encompassing them with the device housing, the airflow sensor is highly integrated. This design closely combines the sensing element and the signal processing unit, shortens the signal transmission path, reduces noise interference, and at the same time, reduces the size of the device and improves the reliability. The introduction of the device housing not only plays a protective role, but also shields external electromagnetic interference, further enhancing the anti-interference ability.

[0010] Further, a protective shell is arranged on the outer periphery of the circuit board, a support ring is arranged between the protective shell and the circuit board, one end surface of the support ring abuts against the circuit board, and the other end surface of the support ring abuts against the end surface of the protective shell; the device housing is located in a protective cavity formed between the support ring, the end surface of the protective shell and the PCB.

[0011] By arranging the protective shell on the outer periphery of the circuit board and arranging the support ring between the protective shell and the circuit board, a protective cavity is formed to accommodate the device housing, which improves the environmental adaptability and mechanical stability of the airflow sensor. The protective shell can isolate external pollution, corrosion and other factors, and the support ring plays a supporting and buffering role, so that the device can work normally under harsh conditions such as vibration and impact. The whole structure is tightly matched to form multiple protections, greatly enhancing the reliability of the device.

[0012] Further, the edge of the opening on the side of the protective shell is embedded in the side of the circuit board away from the device housing.

[0013] By embedding the edge of the opening on the side of the protective shell in the back of the circuit board and fixing it, reliable connection between the protective shell and the circuit board is achieved. This connection method avoids using welding, bonding and other processes, simplifies the assembly process and improves the production efficiency. At the same time, the embedded connection also increases the connection area and improves the connection strength, so that the protective shell can better play the protective role.

[0014] Further, the first airflow hole is centrally symmetrically distributed along the center of the end surface of the protective shell.

[0015] By arranging the first airflow holes on the end face of the protective shell in a central symmetric distribution, uniform introduction of airflow is achieved. The central symmetric arrangement of the airflow holes can cause the airflow to enter from various directions at the same speed and pressure, reducing turbulence and eddy of the airflow and improving the stability of the flow field, thereby improving the measurement accuracy. At the same time, this arrangement also facilitates the machining and cleaning of the airflow holes, improving the maintainability of the device.

[0016] Further, the end face of the PCB circuit board and the protective shell are circular; and / or, the end face of the device shell is rectangular.

[0017] By designing the end face of the PCB circuit board and the protective shell as circular and the end face of the device shell as rectangular, the shape structure of the airflow sensor is optimized. The circular circuit board and protective shell are conducive to the sealing and protection of the device, reducing the aerodynamic resistance and improving the smoothness of the airflow. The rectangular device shell facilitates the installation and wiring of components, improving the space utilization. The reasonable shape design not only improves the performance of the device, but also facilitates its installation and use in different occasions.

[0018] Further, the end face of the protective shell is provided with a plurality of first airflow holes, the device shell is provided with a second airflow hole, and the circuit board is provided with a third airflow hole corresponding to the position of the MEMS chip.

[0019] By arranging the first airflow holes on the end face of the protective shell, the second airflow hole on the device shell, and the third airflow hole on the circuit board, a guiding channel for airflow is formed. The airflow passes through the three levels of airflow holes in sequence, realizing the guidance and regulation of the airflow, reducing the turbulence and loss of the airflow, and improving the accuracy of the measurement. At the same time, the arrangement of multiple levels of airflow holes also plays a filtering role, preventing the entry of dust, particles and other impurities, and protecting the internal components.

[0020] Further, the end face of the protective shell is further covered with an oil-proof mesh.

[0021] By covering the end face of the protective shell with an oil-proof mesh, the protection level of the airflow sensor is further improved. The oil-proof mesh can effectively block liquid pollutants such as oil stains and water vapor, preventing them from invading the interior of the device and causing component damage or short circuit failures. At the same time, the mesh size of the oil-proof mesh can be adjusted as needed, while meeting the smoothness of airflow, realizing the blocking of pollutants of different particle sizes, and improving the application range of the device.

[0022] Further, the functional pins of the MEMS chip, the functional pins of the ASIC chip and the pads on the PBC are connected to each other by gold wires.

[0023] The function pins of the MEMS chip and the ASIC chip are connected with the pads on the PBC by gold wires, so that the interconnection at the chip level is realized. The gold wire has good conductivity and plasticity, and can realize reliable connection under a small spacing. Meanwhile, the gold wire welding process is mature and has high automation, which can greatly improve the production efficiency. Compared with the traditional welding or crimping method, the gold wire interconnection is more precise and reliable, the interconnection length is short, the parasitic effect is small, and the signal integrity is improved.

[0024] Further, the PCB circuit board is provided with pin feet respectively electrically connected with different pads on the side away from the device shell, and the pin feet include a power pin foot, a ground pin foot and an output pin foot.

[0025] By arranging the power pin foot, the ground pin foot and the output pin foot on the back of the PCB circuit board, the external electrical connection of the airflow sensor is realized. The reserved pin foot interface facilitates the integration and interconnection of the device and the external circuit, and the function division of different pin feet is clear, preventing problems such as misconnection and short circuit. At the same time, the design of the pin feet also provides mechanical support for the installation and fixation of the device, improving the firmness of the connection. Reasonable pin foot layout is conducive to improving the electrical performance and reliability of the device.

[0026] An electronic atomizer comprises the above-mentioned airflow sensor.

[0027] By applying the above-mentioned airflow sensor to the electronic atomizer, intelligent control of the atomizer is realized. The airflow sensor can monitor the airflow state inside the atomizer in real time, such as flow rate, pressure and other parameters, and feed back the measurement results to the control circuit. The control circuit adjusts the working state of the atomizer, such as heating power and atomization frequency, according to the measurement results, so as to realize optimal control of the atomization effect. The combination of the airflow sensor and the atomizer can improve the performance and efficiency of the atomizer, while reducing energy consumption and noise. This intelligent solution opens up new space for the application of electronic atomizers. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a schematic diagram of the overall structure of the airflow sensor provided by the embodiments of the present application.

[0029] Figure 2 is a schematic diagram of the cross-sectional structure of the airflow sensor provided by the embodiments of the present application.

[0030] Figure 3 is an exploded schematic diagram of the airflow sensor provided by the embodiments of the present application.

[0031] Figure 4 is a schematic diagram of the internal structure arrangement provided by the embodiments of the present application.

[0032] In the diagram, 10 is the circuit board; 11 is the third air vent; 12 is the solder pad; 13 is the gold wire; and 14 is the pin.

[0033] 20. MEMS chips; 30. ASIC chips;

[0034] 40. Device housing; 41. Second airflow hole;

[0035] 50. Protective outer shell; 51. First air vent; 52. Oil-proof mesh;

[0036] 60. Support ring. Detailed Implementation

[0037] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0038] Example 1

[0039] like Figure 1 As shown, this embodiment provides an airflow sensor, including a circuit board 10, a MEMS chip 20 (Micro-Electro-Mechanical Systems) chip, and an ASIC chip 30 (Application Specific Integrated Circuit). The MEMS chip 20 and the ASIC chip 30 are disposed on the same circuit board 10, and the circuit board 10 is also provided with a device housing 40 that encloses the MEMS chip 20 and the ASIC chip 30.

[0040] The circuit board 10 can be a printed circuit board (PCB) made of materials such as FR-4 and CEM-3, serving as an electrical interconnect and mechanical support. In some embodiments, the circuit board 10 can be a rigid board, a flexible board, or a rigid-flex board to adapt to different installation requirements. The circuit board 10 has metallized through holes and pads 12 for electrical connections, as well as third airflow holes 11 for guiding airflow.

[0041] MEMS chip 20 is the core component of the airflow sensor. In this embodiment, MEMS chip 20 does not have a separate circuit board, but directly uses circuit board 10 as the substrate. This reduces the packaging steps of MEMS chip 20. Compared with the prior art, it reduces the use of one substrate, improves the integration of MEMS chip, and enhances sensitivity and reliability.

[0042] The ASIC chip 30 is used to amplify, filter, convert and so on the weak electric signal outputted by the MEMS chip 20. The ASIC chip 30 can integrate multiple functional modules such as amplifiers, ADCs, MCUs and so on in one chip, and take the circuit board 10 as a substrate. In this way, the MEMS chip 20 and the ASIC chip 30 are integrated on the same circuit board 10, which reduces the use of substrates in the circuit board welding process, reduces repeated welding, reduces the system size, and reduces power consumption.

[0043] The device shell 40 is used to package and protect the MEMS chip 20 and the ASIC chip 30, and can be made of metal, ceramic or plastic and the like. The device shell 40 and the circuit board 10 can be electrically and mechanically connected by means of patch welding, wire bonding and the like. The device shell 40 is provided with a second airflow hole 41, which is communicated with the third airflow hole 11 on the circuit board 10, to guide the airflow into the sensing area of the MEMS chip 20. In some embodiments, the device shell 40 is filled with epoxy resin and the like, further improving the protection level of the chip.

[0044] In a specific embodiment, the MEMS chip 20 and the ASIC chip 30 are first welded on the circuit board 10, and the functional pins of the MEMS chip 20, the functional pins of the ASIC chip 30 and the pads 12 on the PCB are interconnected by gold wires 13. The gold wire bonding process is a mature method of interconnecting chips and interconnecting chips and substrates.

[0045] Specifically, in some embodiments, the diameter of the gold wire 13 can be 15-50 microns, and the bonding process includes ball bonding on the chip pad, wedge bonding on the PCB pad, and then hot-press welding and wire cutting. In other embodiments, the gold wire 13 can also be replaced by aluminum wire, copper wire and the like. The bonding process parameters such as pressure, temperature, time and the like can be adjusted according to the material and size of the pin.

[0046] The application of the wire interconnection technology not only realizes reliable electrical connection, but also provides certain mechanical support and heat dissipation, which is the key to realizing high integration and high reliability of the airflow sensor.

[0047] Embodiment 2

[0048] Based on embodiment 1, as shown in Figure 2 The airflow sensor further includes a protective shell 50 covering the outer periphery of the circuit board 10, and a support ring 60 arranged between the protective shell 50 and the circuit board 10. One end surface of the support ring 60 abuts against the circuit board 10, and the other end surface of the support ring 60 abuts against the end surface of the protective shell 50. The device shell 40 is located in a protective cavity formed between the end surface of the support ring 60, the protective shell 50 and the circuit board 10.

[0049] The protective shell 50 is the first line of defense for the airflow sensor, and can be made of metal materials such as stainless steel, aluminum alloy, or engineering plastics, and has sufficient mechanical strength and corrosion resistance. The protective shell 50 is provided with a plurality of first airflow holes 51 for guiding external airflow into the interior. In some embodiments, the protective shell 50 can be designed in a cylindrical, square, or other suitable shape for installation. In the present embodiment, in order to be consistent with the shape of a general airflow sensor, the end face of the protective shell is circular.

[0050] The support ring 60 plays a supporting and sealing role. On the one hand, the support ring 60 bears the pressure of the protective shell 50 to prevent external forces from directly acting on the internal devices. On the other hand, the support ring 60 forms a labyrinth structure with the mating surfaces of the protective shell 50 and the circuit board 10 to prevent external dust, water vapor, and the like from entering. The support ring 60 can be made of rigid materials such as metal or other plastics to provide good support performance. In some embodiments, the support ring 60 can be designed in a wavy shape, a boss shape, or other special-shaped structures to increase the sealing area.

[0051] In processing, a plurality of electronic components including the MEMS chip 20 and the ASIC chip 30 are first mounted on the circuit substrate, and then the device shell 40 is covered on the circuit substrate by means of soldering or the like, and then the circuit substrate is punched into small circuit boards 10 by a mold. In this way, the circuit substrate can be fixed during the process of installing the electronic components and the device shell, reducing the difficulty of processing. During the installation of the protective shell 50, the support ring can limit the height of the peripheral side of the protective shell, so that the end face of the protective shell 50 and the device shell 40 maintain a certain distance, reducing the possibility of direct contact between the end face of the protective shell 50 and the electronic components or the device shell 40 during installation.

[0052] Embodiment 3

[0053] On the basis of Embodiment 1 or 2, as shown in Figure 2 , Figure 3 the peripheral opening edge of the protective shell 50 is embedded in the side of the circuit board 10 away from the device shell 40 and is fixed. In this connection mode, a stable engagement is formed between the protective shell 50 and the circuit board 10, greatly improving the firmness of the protective shell 50 and ensuring that it will not fall off under vibration or impact.

[0054] Specifically, in some embodiments, the edge of the circumferential opening of the protective shell 50 can be designed as a step matching the thickness of the circuit board 10, and then embedded by means of a tight fit or interference fit. In other embodiments, the edge of the circumferential opening of the protective shell 50 can also be designed as a barb, and clamped by elastic deformation. During embedding, a certain adhesive, such as epoxy resin, anaerobic glue, etc., can also be applied on the mating surface to further enhance the connection reliability.

[0055] Embodiment 4

[0056] On the basis of any one of embodiments 1 to 3, as shown in Figure 3 , Figure 4 The first airflow holes 51 are centrally symmetrically distributed along the center of the end face of the protective shell 50. That is, the first airflow holes 51 are uniformly arranged about the center of the end face, and the included angle of adjacent airflow holes is equal. In some embodiments, the number of centrally symmetric first airflow holes 51 can be 2, 3, 4, 6, 8, etc., and the distribution radius can be 1 / 4, 1 / 3, 1 / 2, etc. of the radius of the end face.

[0057] The centrally symmetric arrangement of the first airflow holes 51 helps to achieve uniform introduction of airflow, avoid airflow bias to one side, and improve measurement accuracy. At the same time, this arrangement also has a certain aesthetic sense in vision, improving the appearance quality of the product. When processing and surface treating the airflow holes, the central symmetry arrangement is also more convenient, which is beneficial to improve the production efficiency.

[0058] Embodiment 5

[0059] On the basis of any one of embodiments 1 to 4, as shown in Figure 4 The end faces of the PCB circuit board 10 and the protective shell 50 are circular, while the end face of the device shell 40 is rectangular. The circular circuit board and shell are conducive to uniform arrangement and coaxial installation, reducing aerodynamic resistance, while the rectangular device shell is convenient for standardized production and batch installation.

[0060] Specifically, in some embodiments, the PCB circuit board 10 can adopt a circular, elliptical, regular polygonal shape, etc., and the protective shell 50 is adapted thereto. In other embodiments, the device shell 40 can adopt a rectangular, square, rectangular shape, etc., or a rounded rectangular shape, etc. The combination of different shapes can take into account the compactness of the airflow sensor structure, the convenience of installation, and the adaptability of production.

[0061] Embodiment 6

[0062] On the basis of any one of embodiments 1 to 5, as shown in Figure 2As shown, the airflow sensor forms a three-stage airflow hole structure. The first stage is the first airflow hole 51 on the end face of the protective shell 50, the second stage is the second airflow hole 41 opened on the device shell 40, and the third stage is the third airflow hole 11 opened on the circuit board 10. The three-stage airflow holes are sequentially connected to form an airflow guiding channel.

[0063] In some embodiments, the size and number of the three-stage airflow holes can be reasonably set according to the flow range, measurement accuracy, etc. For example, the diameter of the first airflow hole 51 can be 2-10 mm, and the number can be 2-100; the diameter of the second airflow hole 41 can be 0.5-2 mm, and the number can be 1-10; the diameter of the third airflow hole 11 can be 0.1-1 mm, and the number can be 1-4. In other embodiments, the three-stage airflow holes can also be set to a variable-diameter structure, such as tapered or gradually expanded, to achieve airflow deceleration or acceleration.

[0064] The arrangement of the multi-stage airflow holes can achieve pre-processing and staged filtering of the airflow, prevent large particles and high humidity gas from directly entering the sensitive area, and improve the measurement stability. At the same time, the airflow flowing in the multi-stage hole channel also forms a certain pressure difference, which helps to improve the measurement sensitivity.

[0065] Embodiment 7

[0066] On the basis of any one of embodiments 1 to 6, as shown in Figures 1-3 The end face of the protective shell 50 is also covered with an oil-proof net 52. The oil-proof net 52 can be made of stainless steel mesh, nylon mesh, Teflon mesh, etc. to block oil stains, dust, etc. to prevent them from blocking the airflow holes or contaminating the inside of the sensor.

[0067] In some embodiments, the oil-proof net 52 and the protective shell 50 are fixedly connected by adhesion, hot melting, buckling, etc. or can be integrally formed by injection molding. In other embodiments, the oil-proof net 52 can be designed to be replaceable for easy cleaning and maintenance. In addition, the mesh size of the oil-proof net 52 can be appropriately set, such as 50-500 microns, to balance the effects of blocking pollution and low resistance. The introduction of the oil-proof net significantly improves the protection level and reliability of the airflow sensor.

[0068] Embodiment 8

[0069] On the basis of any one of embodiments 1 to 7, as shown in Figures 1-2 The side of the PCB circuit board 10 away from the device shell 40 is provided with pins 14, and the pins 14 are respectively electrically connected with different pads 12. The pins 14 serve as the external electrical interface of the airflow sensor, including power pins, ground pins, and output signal pins.

[0070] Specifically, in some embodiments, the pins 14 can be arranged in a single row or multiple rows in a through-hole or surface mount manner. In other embodiments, the pins 14 can also be integrated into a connector, such as a pin connector, a socket connector, etc., for easy mating. In addition, the layout of the pins can be designed as a single-row straight pin, a double-row straight pin, a round pin, etc., which are common industrial standard layouts, to meet the requirements of different installation applications.

[0071] Leading the pins out as an external electrical interface not only facilitates the connection of the airflow sensor with external circuits, but also helps to protect the internal structure.

[0072] Embodiment 9

[0073] On the basis of any one of embodiments 1 to 8, the airflow sensor of the present application can be applied to an electronic atomizer to realize feedback and control of the atomization process.

[0074] Traditional electronic atomizers usually lack detection of airflow parameters, resulting in open-loop control, unstable atomization performance, and poor user experience. The introduction of the airflow sensor of the present application into an electronic atomizer can well make up for this deficiency.

[0075] Specifically, the airflow sensor can be installed in the air inlet channel, air outlet channel, or atomization cavity of the atomizer to monitor the speed and flow rate of the user's inhalation airflow in real time and transmit feedback information to the control circuit. The control circuit adjusts parameters such as heating power and vibration frequency accordingly to optimize the atomization process. In addition, the airflow information can also be displayed to the user through a human-machine interface to enhance interactivity.

[0076] The combination of a small and reliable airflow sensor with an electronic atomizer helps to realize closed-loop control and real-time parameter adaptation, greatly improving the intelligent level and atomization effect of the product and improving the user experience, opening up new space for intelligent applications of electronic atomizers.

[0077] In summary, the present application provides a highly integrated, highly reliable, and low-cost airflow sensor and its application in electronic atomizers. Through innovative design of a hierarchical protective shell, chip-level packaging interconnection process, and airflow channel layout optimization, the present application significantly improves the protection level and usability of the airflow sensor, simplifies the production process, reduces the cost, and at the same time provides an intelligent control means for electronic atomizers, which is a model of new-generation airflow sensor design and application.

[0078] Of course, many other modifications and variations of the present application are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims, the application can be practiced otherwise than as specifically described. Any modifications, equivalent substitutions, improvements, and the like which are apparent to one skilled in the art are intended to be included within the scope of the application. Furthermore, the order of steps described in the processes described above need not be the same in every instance and certain steps can be modified, combined, or omitted in certain instances without departing from the spirit of the application. The numbers and ranges given for the amounts and values are exemplary and can be adjusted as needed for a particular application.

Claims

1. An airflow sensor, characterized in that, The device includes a circuit board (10), a MEMS chip (20), and an ASIC chip (30). The MEMS chip (20) and the ASIC chip (30) are disposed on the same circuit board (10). The circuit board (10) is also provided with a device housing (40) that encloses the MEMS chip (20) and the ASIC chip (30). The side of the circuit board (10) facing away from the device housing (40) is provided with pins (14) that are electrically connected to different pads. The pins (14) include power pins and ground pins. The pins and output pins; the functional pins of the MEMS chip (20), the functional pins of the ASIC chip (30) and the pads (12) on the circuit board (10) are interconnected by gold wires (13); the circuit board (10) is covered with a protective shell (50), and the end face of the protective shell (50) is provided with a plurality of first airflow holes (51), the device housing (40) is provided with second airflow holes (41), and the circuit board (10) is provided with third airflow holes (11) at the position corresponding to the MEMS chip (20).

2. The airflow sensor according to claim 1, characterized in that, A support ring (60) is provided between the protective shell (50) and the circuit board (10). One end face of the support ring (60) abuts against the circuit board (10), and the other end face of the support ring (60) abuts against the end face of the protective shell (50). The device housing (40) is located in the protective cavity formed by the support ring (60), the end face of the protective shell (50), and the circuit board (10).

3. The airflow sensor according to claim 1, characterized in that, The peripheral opening edge of the protective housing (50) is embedded in the side of the circuit board (10) away from the device housing (40) and fixed.

4. The airflow sensor according to claim 1, characterized in that, The first airflow hole (51) is centrally symmetrically distributed along the center of the end face of the protective shell (50).

5. The airflow sensor according to claim 1, characterized in that, The end faces of the circuit board (10) and the protective shell (50) are both circular; the end face of the device housing (40) is rectangular.

6. The airflow sensor according to claim 1, characterized in that, The protective shell (50) is also covered with an oil-proof mesh (52) on its end face.

7. An electronic atomizer, characterized in that, The airflow sensor included in any one of claims 1-6.

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