Device testing device

Abstract

The utility model discloses a device testing device, which comprises a base, a top plate and a middle frame positioned between the base and the top plate, at least three supporting upright posts are positioned between the base and the top plate, the periphery of the middle frame is provided with a mounting plate, each mounting plate is provided with two clamping plates, a detection module positioned on the mounting plate is arranged between the two clamping plates, and the detection module is connected with the top plate through a connecting rod. Two ends of at least two pressing strips pressed on the upper surface of the detection module are respectively connected to the two clamping plates; a plurality of probes are arranged on the detection module, a plurality of supporting arms corresponding to the probes are arranged on the lower surface of the mounting plate, a clamping ring is arranged on each supporting arm, and the probes are embedded into the clamping rings. The device testing device provided by the utility model is convenient for carrying out electrical detection on various semiconductor devices, the application range is expanded, the stability of the probe is improved, the probability of damaging the probe is reduced, and the service life of the testing device is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to a device testing arrangement and belongs to the technical field of semiconductor devices. BACKGROUND

[0002] A semiconductor device is an electronic device with electrical conductivity between a good conductor and an insulator, which uses the special electrical characteristics of semiconductor materials to complete a specific function, thereby realizing the function of changing signals and energy conversion. The existing semiconductor device testing device through the pin is often for detecting one type of device, and the use range is narrow. SUMMARY

[0003] The utility model discloses a device testing arrangement, the device testing arrangement is convenient for the electrical property detection of a plurality of semiconductor devices, expands the use range, improves the stability of the probe simultaneously, reduces the probability of damage to the probe, prolongs the service life of the detection device.

[0004] To achieve the above object, the utility model adopts the technical scheme of a device testing arrangement, which comprises a base, a top plate and an intermediate frame between the base and the top plate, at least three supporting columns are located between the base and the top plate, the intermediate frame with a lifting plate fixed above is slidingly sleeved on the supporting columns, the telescopic rod of a cylinder fixed with the top plate penetrates the top plate and is fixedly connected with the lifting plate,

[0005] The four sides of the intermediate frame are provided with a mounting plate, each mounting plate is provided with two clamping plates, a detection module located on the mounting plate is arranged between the two clamping plates, and at least two pressing strips on the upper surface of the detection module are connected to the two clamping plates at both ends respectively; a plurality of probes are arranged on the detection module, a plurality of supporting arms corresponding to the probes are arranged on the lower surface of the mounting plate, the supporting arm is provided with a clasp, and the probe is embedded in the clasp.

[0006] The further improved scheme in the above technical scheme is as follows:

[0007] 1. In the above scheme, a spring is arranged in the pressing cylinder column between the lifting plate and the base, a pressing column fixed to the lower surface of the lifting plate penetrates the hollow area of the intermediate frame and is embedded in the pressing cylinder column, a protrusion is arranged on the side wall of the lower end of the pressing column, and a stopper is arranged on the upper end face of the pressing cylinder column and located above the protrusion.

[0008] 2. In the above scheme, the edge of the lifting plate is provided with an ear protrusion, and the ear protrusion is connected with the intermediate frame through a clamping column.

[0009] 3. In the above scheme, the lifting plate and the intermediate frame are connected through a clamping column.

[0010] 4. The scheme, the card column is connected to the edge of the lifting plate and the middle frame respectively.

[0011] 5. The scheme, the periphery of the through hole of the top plate is provided with a guide piece, and the air cylinder is fixed in the through hole of the top plate.

[0012] 6. The scheme, the guide piece is located above the top plate.

[0013] 7. The scheme, the lower end surface of the pressing cylinder is provided with a foam pad.

[0014] Due to the use of the above technical scheme, the utility model has the following advantages compared with the prior art:

[0015] 1. The device testing device of the utility model, the four around of the middle frame are provided with an installation plate, each installation plate is provided with 2 clamping plates, a detection module located on the installation plate is arranged between the 2 clamping plates, and at least 2 pressing strips on the upper surface of the detection module are connected to the 2 clamping plates respectively; a plurality of probes are arranged on the detection module, a plurality of support arms corresponding to the probes are arranged on the lower surface of the installation plate, the support arm is provided with a clasp, and the probe is embedded in the clasp; the detection module can be dynamically adjusted according to the test object, so that the electrical property detection of various semiconductor devices is facilitated, the use range is expanded, the stability of the probe is improved, the probability of damage to the probe is reduced, and the service life of the detection device is prolonged.

[0016] 2. The device testing device of the utility model, the middle frame of the lifting plate fixed above is slidingly sleeved on the supporting column, the telescopic rod of the air cylinder fixed with the top plate penetrates the top plate and is fixedly connected with the lifting plate, a spring is arranged in the pressing cylinder column between the lifting plate and the base, a pressing column fixed to the lower surface of the lifting plate penetrates the hollow area of the middle frame and is embedded in the pressing cylinder column, a protrusion is arranged on the lower end portion of the pressing column, and a stop portion located above the protrusion is arranged on the upper end surface of the pressing cylinder column; in the case that the semiconductor device is stably clamped, the plurality of pins of the semiconductor device are automatically detected at the same time, and the detection precision and efficiency are improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall assembly of the utility model;

[0018] Figure 2 It is a schematic diagram of the partial sectional structure of the overall assembly of the utility model;

[0019] Figure 3 It is a schematic diagram of the overall assembly of the utility model Figure 2 The enlarged structure schematic diagram of the position A in the utility model;

[0020] Figure 4 It is a schematic diagram of the overall assembly of the utility model Figure 2 Enlarged structural schematic view at B.

[0021] In the above drawings: 1, base; 2, top plate; 21, through hole; 3, intermediate frame; 31, hollow area; 4, support column; 5, lifting plate; 6, air cylinder; 61, telescopic rod; 7, detection module; 8, probe; 9, pressing column; 91, protruding block; 10, pressing cylinder; 101, stop; 11, spring; 12, rubber pad; 13, clamping column; 14, guide piece; 15, mounting plate; 16, clamping plate; 17, pressing strip; 18, support arm; 19, clamping ring; 20, ear protrusion. DETAILED DESCRIPTION

[0022] The patent can be further clearly understood through the specific embodiments given below, but they are not a limitation on the patent.

[0023] Example 1: A device testing device, comprising: a base 1, a top plate 2 and an intermediate frame 3 located between the base 1 and the top plate 2, at least 3 support columns 4 located between the base 1 and the top plate 2, the intermediate frame 3 with a lifting plate 5 fixed above slidingly fitted on the support columns 4, a telescopic rod 61 of an air cylinder 6 fixed with the top plate 2 penetrating the top plate 2 and fixedly connected with the lifting plate 5,

[0024] The intermediate frame 3 is provided with a mounting plate 15 around it, and each mounting plate 15 is provided with 2 clamping plates 16, a detection module 7 located on the mounting plate 15 is arranged between the 2 clamping plates 16, and at least 2 pressing strips 17 clamped on the upper surface of the detection module 7 are respectively connected to the 2 clamping plates 16; the detection module 7 is provided with a plurality of probes 8, and the lower surface of the mounting plate 15 is provided with a plurality of support arms 18 corresponding to the probes 8, the support arm 18 has a clamping ring 19, and the probe 8 is embedded in the clamping ring 19.

[0025] The edge of the above lifting plate 5 has an ear protrusion 20, and the ear protrusion 20 is connected with the intermediate frame 3 through the clamping column 13.

[0026] The above lifting plate 5 is connected with the intermediate frame 3 through the clamping column 13.

[0027] The above clamping column 13 is connected to the respective edges of the lifting plate 5 and the intermediate frame 3.

[0028] Example 2: A device testing device, comprising: a base 1, a top plate 2 and an intermediate frame 3 located between the base 1 and the top plate 2, at least 3 support columns 4 located between the base 1 and the top plate 2, the intermediate frame 3 with a lifting plate 5 fixed above slidingly fitted on the support columns 4, a telescopic rod 61 of an air cylinder 6 fixed with the top plate 2 penetrating the top plate 2 and fixedly connected with the lifting plate 5,

[0029] The middle frame 3 is provided with an installation plate 15 around, each installation plate 15 is provided with 2 clamping plates 16, a detection module 7 located on the installation plate 15 is arranged between the two clamping plates 16, and at least two pressing strips 17 on the upper surface of the detection module 7 are connected to the two clamping plates 16 respectively; the detection module 7 is provided with a plurality of probes 8, the lower surface of the installation plate 15 is provided with a plurality of supporting arms 18 corresponding to the probes 8, the supporting arm 18 is provided with a clamping ring 19, and the probe 8 is embedded in the clamping ring 19.

[0030] A spring 11 is arranged in the pressing cylinder column 10 between the lifting plate 5 and the base 1, a pressing column 9 fixed to the lower surface of the lifting plate 5 passes through the hollow area 31 of the middle frame 3 and is embedded in the pressing cylinder column 10, the lower end side wall of the pressing column 9 is provided with a protrusion 91, and the upper end surface of the pressing cylinder column 10 is provided with a stop portion 101 located above the protrusion 91;

[0031] The edge of the lifting plate 5 is provided with an ear protrusion 20, and the ear protrusion 20 is connected to the middle frame 3 through the clamping column 13.

[0032] The periphery of the through hole 21 of the top plate 2 is provided with a guide piece 14, and the air cylinder 6 is fixed in the through hole 21 of the top plate 2.

[0033] The guide piece 14 is located above the top plate 2, and the lower end surface of the pressing cylinder column 10 is provided with a foam pad 12.

[0034] The working principle of the patent is as follows: the semiconductor device is placed between the base 1 and the pressing cylinder column 10, the telescopic rod 61 of the air cylinder 6 is extended, the lifting plate 5 is driven to move downward, thereby driving the detection module 7 and the middle frame 3 to move downward, at the same time, the lifting plate 5 presses the pressing column 9 downward, and the spring 11 is contracted, when the detection is completed, the telescopic rod 61 of the air cylinder 6 is retracted, the pressing column 9 is driven to move upward under the pushing of the spring 11, because the lower end side wall of the pressing column 9 is provided with a protrusion 91, and the upper end surface of the pressing cylinder column 10 is provided with a stop portion 101 located above the protrusion 91, the pressing column 9 will not be separated from the pressing cylinder column 10, at this time, the semiconductor device can be taken away from between the base 1 and the pressing cylinder column 10.

[0035] When the device testing device is used, the middle frame 3 of the lifting plate 5 fixed above is slidingly sleeved on the supporting column 4, the telescopic rod 61 of the air cylinder 6 fixed with the top plate 2 penetrates the top plate 2 and is fixedly connected with the lifting plate 5, the spring 11 is arranged in the pressure cylinder column 10 between the lifting plate 5 and the base 1, the pressure column 9 fixed to the lower surface of the lifting plate 5 penetrates the hollow area 31 of the middle frame 3 and is embedded in the pressure cylinder column 10, the lower end side wall of the pressure column 9 is provided with a protruding block 91, and the upper end surface of the pressure cylinder column 10 is provided with a stop portion 101 above the protruding block 91; in the case that the semiconductor device is stably clamped, the semiconductor device is automatically and simultaneously detected, the detection precision and efficiency are improved;

[0036] The design of the two pressing strips and the two clamping plates facilitates replacement of the detection module 7; the lower surface of the mounting plate is provided with a plurality of supporting arms corresponding to the probes, the supporting arm is provided with a clamping ring, the probe is embedded in the clamping ring, the stability of the probe is improved, the probability of damage to the probe is reduced, and the service life of the detection device is prolonged.

[0037] When the device testing device is used, the device testing device is convenient for electrical property detection of various semiconductor devices, expands the use range, improves the stability of the probe, reduces the probability of damage to the probe, prolongs the service life of the detection device, and simultaneously improves the detection precision and efficiency.

[0038] The above embodiment is only for describing the technical concept and characteristics of the utility model, the purpose is to enable people skilled in the art to understand the content of the utility model and to implement it, and cannot limit the protection scope of the utility model. Any equivalent change or modification according to the spirit and essence of the utility model should be covered in the protection scope of the utility model.

Claims

1. A device testing apparatus, characterized in that, include: The base (1), the top plate (2), and the intermediate frame (3) located between the base (1) and the top plate (2), with at least 3 supporting columns (4) located between the base (1) and the top plate (2), the intermediate frame (3) with a lifting plate (5) fixed on top is slidably fitted onto the supporting columns (4), and the telescopic rod (61) of a cylinder (6) fixed to the top plate (2) passes through the top plate (2) and is fixedly connected to the lifting plate (5). The middle frame (3) is provided with a mounting plate (15) around its perimeter. Each mounting plate (15) is provided with two clamping plates (16). A detection module (7) located on the mounting plate (15) is positioned between the two clamping plates (16). At least two pressure strips (17) pressing against the upper surface of the detection module (7) are connected to the two clamping plates (16) at both ends. The detection module (7) is provided with several probes (8). The lower surface of the mounting plate (15) is provided with several support arms (18) corresponding to the probes (8). Each support arm (18) has a retaining ring (19), and the probe (8) is embedded in the retaining ring (19).

2. The device testing apparatus according to claim 1, characterized in that, A spring (11) is provided inside a pressure cylinder column (10) located between the lifting plate (5) and the base (1). A pressure column (9) fixed to the lower surface of the lifting plate (5) passes through the hollow area (31) of the middle frame (3) and is embedded in the pressure cylinder column (10). A protrusion (91) is provided on the lower end side wall of the pressure column (9). A stop part (101) is provided on the upper end face of the pressure cylinder column (10) above the protrusion (91).

3. The device testing apparatus according to claim 1, characterized in that, The edge of the lifting plate (5) has an ear protrusion (20), which is connected to the middle frame (3) by a locking post (13).

4. The device testing apparatus according to claim 1, characterized in that, The lifting plate (5) and the middle frame (3) are connected by a locking post (13).

5. The device testing apparatus according to claim 4, characterized in that, The pin (13) is connected to the edges of the lifting plate (5) and the middle frame (3).

6. The device testing apparatus according to claim 1, characterized in that, A guide plate (14) is provided around the through hole (21) of the top plate (2), and the cylinder (6) is fixed in the through hole (21) of the top plate (2).

7. The device testing apparatus according to claim 6, characterized in that, The guide plate (14) is located above the top plate (2).

8. The device testing apparatus according to claim 2, characterized in that, A foam pad (12) is provided on the lower end face of the pressure cylinder column (10).

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